CN207925451U - A kind of radiator and cooling system - Google Patents
A kind of radiator and cooling system Download PDFInfo
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- CN207925451U CN207925451U CN201721819607.8U CN201721819607U CN207925451U CN 207925451 U CN207925451 U CN 207925451U CN 201721819607 U CN201721819607 U CN 201721819607U CN 207925451 U CN207925451 U CN 207925451U
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Abstract
A kind of radiator of the utility model offer and cooling system, the radiator include：The shell is divided into the piezoelectric fan of the first cavity, the second cavity with being placed in the shell by shell；The piezoelectric fan, including：Piezoelectric vibration source and head end are fixed on the fan blade in the piezoelectric vibration source；The shell is fixed in the piezoelectric vibration source, and the direction of vibration of the fan blade is towards first cavity, second cavity；The end both sides of the fan blade, equipped with being located at first cavity, the first venthole of second cavity, the second venthole；The head end both sides of the fan blade, equipped with being located at first cavity, the first air admission hole of second cavity, the second air admission hole.Radiator provided by the utility model forms two cavitys, fan drives gas to pass through cavity, and to achieve the purpose that heat dissipation, the radiator, small, structure is reliable, long lifespan using piezoelectric fan and shell in the both sides of piezoelectric fan.
Description
Technical field
The utility model is related to technical field of heat dissipation, more particularly to a kind of radiator and cooling system.
Background technology
In the past few decades, semiconductor development is swift and violent, is applied to each electronics field.However, semiconductor work
When making, a large amount of heat is will produce, the temperature of semiconductor chip is made seriously to increase, it is anxious so as to cause semiconductor chip working efficiency
Play declines, and seriously affects the service life of semiconductor chip, so efficient semiconductor packages heat dissipation design is particularly important.
In current semiconductor packages heat dissipation design, the heat dissipation effect of active heat removal radiates much stronger than passive, but one
As do not use active heat removal.One the reason is that semiconductor is used in the application of relative low-power.Another reason is tradition
Mechanical fans be not suitable for semiconductor packages heat dissipation design because its poor reliability, life of product are short.Strong noise and high power
And mechanical fans there are the shortcomings that.
However, with the increase of semiconductor chip power, modern electronic equipment, power is higher and higher, and radiating requirements are got over
Come it is bigger, in order to meet radiating requirements, it is necessary to develop new active heat removal solution.
Therefore, a kind of radiator and cooling system how to be proposed, structure is reliable, long lifespan, low-power consumption, low noise, is this
Field technology personnel technical problem urgently to be resolved hurrily.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of radiator and cooling system, structure is reliable, the service life
It is long, low-power consumption, low noise.Its concrete scheme is as follows：
On the one hand, the utility model provides a kind of radiator, including：It shell and is placed in the shell point in the shell
It is divided into the piezoelectric fan of the first cavity, the second cavity；
The piezoelectric fan, including：Piezoelectric vibration source and head end are fixed on the fan blade in the piezoelectric vibration source；
The shell is fixed in the piezoelectric vibration source, the direction of vibration of the fan blade towards first cavity,
Second cavity；
The end both sides of the fan blade go out equipped be located at first cavity, second cavity first
Stomata, the second venthole；The head end both sides of the fan blade, equipped with being located at first cavity, second cavity
The first air admission hole, the second air admission hole.
Preferably, the vibration frequency in the piezoelectric vibration source is equal to the intrinsic frequency of the fan blade.
Preferably, the end both sides of the fan blade are provided with flank.
Preferably, the end cross section of the fan blade is H-shaped.
Preferably, the fan blade is integrally formed with flank.
Preferably, the fan blade is elastic piece.
Preferably, the shell has streamlined inner surface.
Preferably, the corner of the shell has Fillet Feature.
Preferably, first venthole, second venthole are equipped with unidirectional air outlet valve, first air admission hole, institute
It states the second air admission hole and is equipped with breather cheek valve.
On the other hand, the utility model also provides a kind of cooling system, is applied to semiconductor devices, including：Array is in institute
State N number of any of the above-described kind of radiator of semiconductor devices periphery；
Wherein, the N is positive integer.
The utility model provides a kind of radiator, including：It shell and is placed in the shell shell is divided into the
The piezoelectric fan of one cavity, the second cavity；The piezoelectric fan, including：Piezoelectric vibration source and head end are fixed on the piezoelectricity and shake
The fan blade in dynamic source；The shell is fixed in the piezoelectric vibration source, and the direction of vibration of the fan blade is towards described
One cavity, second cavity；The end both sides of the fan blade, equipped with being located at first cavity, described second
The first venthole, the second venthole of cavity；The head end both sides of the fan blade, equipped be located at first cavity,
The first air admission hole, the second air admission hole of second cavity.Radiator provided by the utility model, using piezoelectric fan and outside
Shell forms two cavitys in the both sides of piezoelectric fan, and fan drives gas to pass through cavity, and radiator shell outlet hole site is set
Meter energy focused airflow, generates faster air velocity, to meet the needs of high power semi-conductor package cooling, the radiator,
Small, structure is reliable, low noise, low-power consumption long lifespan.
The utility model also provides a kind of cooling system, it may have above-mentioned advantageous effect, details are not described herein.
Description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is the embodiments of the present invention, for those of ordinary skill in the art, without creative efforts, also
Other attached drawings can be obtained according to the attached drawing of offer.
Fig. 1 is a kind of structural schematic diagram for radiator that specific embodiment of the present invention provides；
Fig. 2 is the structural schematic diagram of the piezoelectric fan of radiator shown in Fig. 1；
Fig. 3 is the facing structure schematic diagram of radiator shown in Fig. 1；
Fig. 4 is the structural schematic diagram of the piezoelectric fan provided in a kind of specific implementation mode of the utility model；
Fig. 5 is a kind of stereoscopic schematic diagram for the LED light cooling system that specific implementation mode provides of the utility model；
Fig. 6 is the vertical view of LED light cooling system shown in fig. 5.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
It please refers to Fig.1, Fig. 2, Fig. 3, Fig. 1 is that a kind of structure for radiator that specific embodiment of the present invention provides is shown
It is intended to；Fig. 2 is the structural schematic diagram of the piezoelectric fan of radiator shown in Fig. 1；Fig. 3 is the facing structure letter of radiator shown in Fig. 1
Figure.
In a kind of specific implementation mode of the utility model, specific embodiment of the present invention provides a kind of radiator
100, including：The shell is divided into the piezoelectric fan of the first cavity, the second cavity with being placed in the shell by shell 110
120；The piezoelectric fan, including：Piezoelectric vibration source 121 and head end are fixed on the fan blade 122 in the piezoelectric vibration source；Institute
It states piezoelectric vibration source and is fixed on the shell 110, the direction of vibration of the fan blade 122 is towards first cavity 111, institute
State the second cavity 112；The end both sides of the fan blade 122, equipped with being located at first cavity 111, described second
The first venthole 113, the second venthole 114 of cavity 112；The head end both sides of the fan blade 120, equipped with being located at
State the first cavity 111, the first air admission hole 115 of second cavity 112, the second air admission hole 116.
In a specific embodiment, piezoelectric fan includes that piezoelectric vibration source 121 and head end are fixed on the piezoelectric vibration source
Fan blade 122.Piezoelectric effect：Certain dielectrics when being deformed by the effect of external force in a certain direction, inside
Polarization phenomena are will produce, while positive and negative opposite charge occur on its two apparent surfaces.After external force is removed, its meeting again
It is restored to uncharged state, this phenomenon is known as direct piezoelectric effect.When the direction of active force changes, the polarity of charge also with
Change.On the contrary, when applying electric field on polarization of dielectric direction, these dielectrics can also deform, after electric field removes,
Dielectric deformation disappears therewith, and this phenomenon is known as inverse piezoelectric effect.
And piezoelectric fan is exactly according to made of inverse piezoelectric effect.Piezoelectric vibration source generally uses piezoelectric material, Ke Yishi
Inorganic piezoelectric material, such as piezo-electric crystal and piezoelectric ceramics etc., wherein piezo-electric crystal generally refers to piezoelectric single crystal, piezoelectricity pottery
Porcelain then refers to piezoelectricity polycrystal；Can also be organic piezoelectric materials, also known as piezopolymer, as Kynoar (PVDF) is (thin
Film) and using it as other organic piezoelectricity (film) materials of representative etc..
In a specific embodiment, the 120 specified work of piezoelectric fan used in specific embodiment of the present invention
Working frequency is 50HZ, and whole rectangular, the length of fan blade 122, width and thickness is respectively 40mm, 12.7mm and 0.2mm.Wind
The vibration of fan leaf is driven by the piezoelectric vibration source 121 adhered to, can be with the resonance frequency of the amplitude of its 12.7mm.It is horizontal
The first air outlet slit is arranged in top 10mm at 10mm before fan blade tip, and lower part 10mm is arranged the second air and touches
Control.First air admission hole 115, the second air admission hole 116 are rectangular opening, and size is 20mmx 20mm；First venthole 113, second go out
Stomata 114 is all rectangle, and size is 35mmx 5mm.
Specifically, the radiator is using piezoelectric fan 120 as cross-ventilated power, when fan blade 122 moves up
When, air enters the second cavity 112 from the second air admission hole 116, and the air of first cavity 111 of the upside of fan blade 122 is from first
Venthole 113 is pumped out radiator.When fan blade 122 moves down, air enters the first cavity from the first air admission hole 115
111, the air in second cavity 112 of the downside of fan blade 122 is pumped out radiator from the second venthole 114.Experiment measures knot
Fruit shows that the air-flow average speed of two air outlet slits is about 1.6m/s, maximum value 2.06m/s.This forced air cooler is applied to
In great power LED (light emitting diode) package cooling system, relative to passive Natural Heat Convection, convective heat-transfer coefficient increases
375%, LED heat source temperature decrease beyond 36.4 DEG C.It shows in about 75cm2Area on cooling about 1KW ability.Cause
This, the effect of the utility model active heat removal is extraordinary, and service life is long, low noise, low-power consumption.
It further, can be by the piezoelectricity in order to enable the blade of piezoelectric fan can fully absorb the energy of vibration
The vibration frequency of vibration source is equal to the intrinsic frequency of the fan blade.And the vibration frequency in piezoelectric vibration source is shaken with piezoelectricity is applied
The frequency of alternating voltage on dynamic source is consistent.Intrinsic frequency is also referred to as natural frequency (natural frequency).Object is done
When free vibration, the variation of sinusoidal or cosine rule is pressed in displacement at any time, and the frequency of vibration is unrelated with primary condition, and only be
The inherent characteristic of system is related (such as quality, shape, material), referred to as intrinsic frequency, and the correspondence period is known as the natural period.Object
Frequency it is related with its hardness, quality, appearance and size, when it is deformed upon, elastic force makes its recovery.Elastic force is mainly and size
Related with hardness, quality influences its acceleration.When same shape, frequency with high hardness is high, and the big frequency of quality is low.It can pass through
It is consistent with the frequency in piezoelectric vibration source to adjust its intrinsic frequency to adjust shape and coefficient of elasticity of fan blade etc., it can also
The vibration frequency in piezoelectric vibration source is implemented to adjust the frequency for the alternating source being applied on piezoelectric vibration source using frequency converter
Equal to the intrinsic frequency of the fan blade.
Further, in order to reduce resistance of the air stream in shell, the shell can be set with streamline to
Type inner surface.It specifically, in a specific embodiment, can be special using fillet by the corner of the shell inner surface
Sign.So that the inner surface of entire shell reduces the obstruction flowed to air.
The radiator that specific embodiment of the present invention provides, using piezoelectric fan and shell, the two of piezoelectric fan
Side forms two cavitys, and fan drives gas to pass through cavity, and to achieve the purpose that heat dissipation, the radiator is compared with the existing technology
Radiator, small, structure is reliable, long lifespan, fan drive gas pass through cavity, radiator shell outlet hole site is set
Meter energy focused airflow, generates faster air velocity, to meet the needs of high power semi-conductor package cooling, the radiator,
Small, structure is reliable, low noise, low-power consumption long lifespan.
Referring to FIG. 4, Fig. 4 is the structural representation of the piezoelectric fan provided in a kind of specific implementation mode of the utility model
Figure.
On the basis of above-mentioned specific implementation mode, in present embodiment, in order to reduce fan blade in vibration
The side leakage of wind can be provided with flank in the end both sides of the fan blade.It in a specific embodiment, can be by institute
The end cross section for stating fan blade is set as H-shaped, naturally it is also possible to be other shapes, such as respectively trapezoidal up and down.
Specifically, entire fan blade is plate-like, and the first flank 123, the second flank 124 is arranged in the both sides of fan blade.Due to sending
The shape of the air outlet of wind part is H fonts, can be effectively prevented the side leakage of wind, improve the consistency in the direction of wind.It is described
Fan blade is integrally formed with flank, and the fan blade can be elastic piece.
On the basis of above-mentioned specific implementation mode, in present embodiment, in order to enable air admission hole and venthole
It passes in and out air-flow and keeps pure property, reduce turbulent flow.Preferably, it can be equipped in first venthole, second venthole single
To air outlet valve, first air admission hole, second air admission hole are equipped with breather cheek valve.
Fig. 5, Fig. 6 are please referred to, Fig. 5 is a kind of the vertical of LED light cooling system that specific implementation mode provides of the utility model
Body schematic diagram；Fig. 6 is the vertical view of LED light cooling system shown in fig. 5.
Specific embodiment of the present invention also provides a kind of cooling system, is applied to semiconductor devices, including：Array in
N number of any of the above-described kind of radiator of the semiconductor devices periphery；Wherein, the N is positive integer.
In a specific embodiment, the radiator in above-mentioned specific implementation mode can be specifically applied to LED light
In, for high-power LED lamp, at this moment very easy fever just needs to radiate.In this embodiment, LED light is outer
Shell 501 is in infundibulate, and funnel bottom is the bottom of shell 501.Light-emitting LED 504 are internally provided in LED light, is being shone
Radiating fin 503 is provided with around LED504, in light-emitting LED 504 operational heat, heat can be by way of heat transfer
It, can be near radiating fin 503 in order to facilitate the air circulation around radiating fin 503 on conduction to radiating fin 503
Through-hole is set on shell 501.
In the bottom of the LED light, the radiator in above-mentioned specific implementation mode can be set, it is scattered for cold air to be blown to
On hot fin 503.In this embodiment, by the first air admission hole of the radiator in above-mentioned specific implementation mode, second
The bottom of the shell 501 for being set to LED light of air admission hole inwardly is protected the first air admission hole of radiator 502, the second air admission hole
It holds and is connected to outside, the first venthole, the second venthole are connected to 501 inner space of shell of LED etc., due to entire shell
501 be infundibulate, and radiator 502 drives air into after decapsidate 501, will be to the radiating fin 503 being set to inside shell 501
Diffusion, to accelerate the heat dissipation of radiating fin 503.Radiator 502, radiating fin 503 and the structure of shell 501 constitute LED
The cooling system of lamp.Certainly, the radiator in specific embodiment of the present invention can also be applied to the heat dissipation of other structures
In system, particularly, it can be used for heat dissipation of semiconductor applications, such as CPU, control chip etc..
Finally, it is to be noted that, herein, relational terms such as first and second and the like be used merely to by
One entity or operation are distinguished with another entity or operation, without necessarily requiring or implying these entities or operation
Between there are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant meaning
Covering non-exclusive inclusion, so that the process, method, article or equipment including a series of elements includes not only that
A little elements, but also include other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic element of equipment.In the absence of more restrictions, the element limited by sentence "including a ...", is not arranged
Except there is also other identical elements in the process, method, article or apparatus that includes the element.
A kind of radiator provided by the utility model and cooling system are described in detail above, it is used herein
Specific case is expounded the principles of the present invention and embodiment, and the explanation of above example is only intended to help
Understand the method and core concept of the utility model；Meanwhile for those of ordinary skill in the art, according to the utility model
Thought, there will be changes in the specific implementation manner and application range, in conclusion the content of the present specification should not be construed as
Limitations of the present invention.
Claims (10)
1. a kind of radiator, which is characterized in that including：It shell and is placed in the shell shell is divided into the first chamber
The piezoelectric fan of body, the second cavity；
The piezoelectric fan, including：Piezoelectric vibration source and head end are fixed on the fan blade in the piezoelectric vibration source；
The shell is fixed in the piezoelectric vibration source, and the direction of vibration of the fan blade is towards first cavity, described
Second cavity；
The end both sides of the fan blade, equipped be located at first cavity, second cavity the first venthole,
Second venthole；The head end both sides of the fan blade, equipped with being located at the first of first cavity, second cavity
Air admission hole, the second air admission hole.
2. radiator according to claim 1, which is characterized in that the vibration frequency in the piezoelectric vibration source is equal to the wind
The intrinsic frequency of fan leaf.
3. radiator according to claim 1, which is characterized in that the end both sides of the fan blade are provided with flank.
4. radiator according to claim 3, which is characterized in that the end cross section of the fan blade is H-shaped.
5. radiator according to claim 3, which is characterized in that the fan blade is integrally formed with flank.
6. radiator according to claim 1, which is characterized in that the fan blade is elastic piece.
7. radiator according to any one of claims 1 to 6, which is characterized in that the shell has streamlined inner surface.
8. radiator according to claim 5, which is characterized in that the corner of the shell has Fillet Feature.
9. radiator according to any one of claims 1 to 6, which is characterized in that first venthole, described second go out
Stomata is equipped with unidirectional air outlet valve, and first air admission hole, second air admission hole are equipped with breather cheek valve.
10. a kind of cooling system is applied to semiconductor devices, which is characterized in that including：Array is in the semiconductor devices periphery
N number of radiator as described in any one of claim 1 to 9；
Wherein, the N is positive integer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721819607.8U CN207925451U (en) | 2017-12-20 | 2017-12-20 | A kind of radiator and cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721819607.8U CN207925451U (en) | 2017-12-20 | 2017-12-20 | A kind of radiator and cooling system |
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| Publication Number | Publication Date |
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| CN207925451U true CN207925451U (en) | 2018-09-28 |
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| CN201721819607.8U Active CN207925451U (en) | 2017-12-20 | 2017-12-20 | A kind of radiator and cooling system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109950218A (en) * | 2017-12-20 | 2019-06-28 | 广东工业大学 | A kind of radiator and cooling system |
| CN112911112A (en) * | 2021-01-21 | 2021-06-04 | 维沃移动通信有限公司 | Camera module and electronic equipment |
-
2017
- 2017-12-20 CN CN201721819607.8U patent/CN207925451U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109950218A (en) * | 2017-12-20 | 2019-06-28 | 广东工业大学 | A kind of radiator and cooling system |
| CN112911112A (en) * | 2021-01-21 | 2021-06-04 | 维沃移动通信有限公司 | Camera module and electronic equipment |
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