CN109935469A - Printed form conduction composite mortar, capacitor and its manufacturing method - Google Patents
Printed form conduction composite mortar, capacitor and its manufacturing method Download PDFInfo
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- CN109935469A CN109935469A CN201711345088.0A CN201711345088A CN109935469A CN 109935469 A CN109935469 A CN 109935469A CN 201711345088 A CN201711345088 A CN 201711345088A CN 109935469 A CN109935469 A CN 109935469A
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Abstract
The present invention discloses a kind of printed form conduction composite mortar, capacitor and its manufacturing method.The manufacturing method of capacitor includes forming electroconductive polymer layer on the negative pole part of capacitor element；And printed form conduction composite mortar is printed on electroconductive polymer layer, so that the part of the outer rim of negative pole part is arranged in printed form conduction composite mortar at least coated with conductive macromolecule layer.Printed form conduction composite mortar includes conductive material and solvent, and at least 4% solid content, the pH value between 2 to 8 and higher than the viscosity between 500 pools.Whereby, the present invention can effectively promote the electrical property efficiency of capacitor and improve its manufacturing method.
Description
Technical field
The present invention relates to the manufacturing methods of a kind of conductive composite mortar, capacitor and capacitor, more particularly to a kind of print
Brush-type conduction composite mortar, capacitor and its manufacturing method using composite mortar.
Background technique
Capacitor has been widely used for consumer electrical home appliances, computer motherboard and its periphery, power supply unit, has led to
Believe the basic module of product and automobile etc., its main function includes: filtering, bypass, rectification, coupling, decoupling, phase inversion etc..It is
One of indispensable component in electronic product.Capacitor has different kenels, including aluminum according to different material and purposes
Electrolytic capacitor, tantalum matter electrolytic capacitor, laminated ceramic capacitor, thin-film capacitor etc..In the prior art, solid electrolytic capacitor has small
The advantages that size, high capacitance, superior frequency characteristic, and can be used in the decoupling effect of the power circuit of central processing unit
On.Solid electrolytic capacitor is to replace liquid electrolyte as cathode using solid electrolyte, and conducting polymer is based on its height and leads
Electrically, the advantages that manufacturing process is easy has been widely used in the cathode material of solid electrolyte capacitor.
However, the manufacturing method of existing stacked-type solid electrolytic capacitor still have the shortcomings that it is to be solved.
Summary of the invention
Technical problem to be solved by the present invention lies in it is compound to provide a kind of printed form conduction in view of the deficiencies of the prior art
The manufacturing method of slurry, capacitor and capacitor can effectively promote the electrical property efficiency of capacitor and improve its manufacturing method.
In order to solve the above technical problems, a wherein technical solution of the present invention is to provide a kind of printed form
Conductive composite mortar a comprising conductive material and a solvent, wherein the printed form conduction composite mortar has at least
4% solid content, the pH value between 2 to 8 and the viscosity higher than 500 pools.
Further, the printed form conduction composite mortar includes: one or more additives, is led selected from one
Electric auxiliary agent, a pH regulator, an agglutinant, a thickener, an adhesive agent and a crosslinking agent.
Further, the conductive material is the poly- ethylenedioxythiophene-polystyrolsulfon acid modified by emulsifier
Compound.
Further, the thickener be a polyethylene glycol with molecular weight between 1000 to 40000 or
One alkyl cellulose of person.
Another technical solution of the present invention is to provide a kind of capacitor with protective layer comprising at least one
Capacitor element a, wherein negative pole part of at least one capacitor element is coated by an electroconductive polymer layer, and described is led
Electric macromolecule layer is coated by a protective layer so that the electroconductive polymer layer be set to the negative pole part and the protective layer it
Between, and the protective layer is formed by a printed form conduction composite mortar, wherein the printed form conduction composite mortar includes
One conductive material and a solvent, wherein the printed form conduction composite mortar has at least 4% solid content, between 2 to 8
Between pH value and higher than 500 pool between viscosity.
Further, the electroconductive polymer layer is coated completely by the protective layer.
Yet another technology scheme of the present invention is to provide a kind of manufacturing method of capacitor comprising: in an electricity
An electroconductive polymer layer is formed on one negative pole part of container sub-prime；And a printed form conduction composite mortar is printed in described lead
On electric macromolecule layer, so that the printed form conduction composite mortar at least coats the electroconductive polymer layer and is arranged in the cathode
A part of the outer rim in portion.The printed form conduction composite mortar includes a conductive material and a solvent, wherein the printing
Viscosity of the type conduction composite mortar at least 4% solid content, the pH value between 2 to 8 and at least 500 pools.
Further, it in the step of forming the electroconductive polymer layer, may further comprise: a conductive dispersions
It is set on the capacitor element, so that the conductive dispersions of a part insert the yin of the capacitor element
In multiple holes in pole portion；And it dries the conductive dispersions being set on the capacitor element and forms the conduction
Macromolecule layer.
Further, the manufacturing method of the capacitor may further comprise: that drying is printed in the conductive polymer
The printed form conduction composite mortar in sublayer, to form a protective layer.
Further, the conductive dispersions are set on the capacitor element in a manner of impregnation.
Be further understood that feature and technology contents of the invention to be enabled, please refer to below in connection with it is of the invention specifically
Bright and attached drawing, however provided attached drawing is merely provided for reference and description, is not intended to limit the present invention.
Detailed description of the invention
Fig. 1 is the wherein side view of a capacitor applied by printed form conduction composite mortar provided by the embodiment of the present invention
Diagrammatic cross-section；
Fig. 2 be include side elevational cross-section schematic diagram in the capacitor packaging structure of capacitor shown in FIG. 1；
Fig. 3 is the flow chart of the manufacturing method of capacitor provided by the embodiment of the present invention；
Fig. 4 is the side elevational cross-section signal of a wherein step in the manufacturing method of capacitor provided by the embodiment of the present invention
Figure；
Fig. 5 is a wherein schematic top plan view for step shown in Fig. 4；And
Fig. 6 is another schematic top plan view of step shown in Fig. 4.
Specific embodiment
Be below illustrated by particular specific embodiment it is presently disclosed it is related " printed form conduction composite mortar,
Use the capacitor of composite mortar and the manufacturing method of capacitor " embodiment, those skilled in the art can be by this specification
Disclosure of that understands advantages of the present invention and effect.The present invention can be implemented by other different specific embodiments or
Using the various details in this specification may be based on different viewpoints and application, carry out without departing from the spirit of the present invention each
Kind modification and change.In addition, attached drawing of the invention is only simple schematically illustrate, not according to the description of actual size, state in advance.
The relevant technologies content of the invention will be explained in further detail in the following embodiments and the accompanying drawings, but disclosure of that is not to limit
Protection scope of the present invention.
Firstly, please referring to Fig. 1 and Fig. 2.Fig. 1 printed form conduction composite mortar provided by the embodiment of the present invention is applied
A wherein capacitor side elevational cross-section schematic diagram, and Fig. 2 is to include in the capacitor packaging structure of capacitor shown in FIG. 1
Side elevational cross-section schematic diagram.
Specifically, printed form conduction composite mortar provided by the present invention can be applied to leading for the negative pole part N of capacitor 1
In electric layer 102.In Fig. 2, the mutual storehouse of cathode portion N of multiple capacitors 1, and multiple capacitors 1 and conducting bracket 2 and encapsulation
Stacked-type solid electrolytic capacitor encapsulating structure P is collectively formed in colloid 3.
For example, as shown in Figure 1, capacitor 1 may include the oxidation of valve metal paillon 100, cladding 100, valve metal foil
The rubber layer 103 of layer 101, the conductive layer 102 of a part of cladding oxide layer 101, coated with conductive layer 102, and cladding carbon paste
The elargol layer 104 of layer 103.The structure of aforementioned capacitor 1 can be adjusted according to product actual demand.Conductive layer 102 is mainly
Solid electrolyte as capacitor 1.
As shown in Fig. 2, stacked-type solid electrolytic capacitor encapsulating structure P includes the capacitor unit 1 of multiple sequentially storehouses.
In addition, stacked-type solid electrolytic capacitor encapsulating structure P includes conducting bracket 2.Conducting bracket 2 include the first conductive terminal 21 and
The second conductive terminal 22 of a preset distance is separated from each other with the first conductive terminal 21.In addition, it is multiple be sequentially stacked together and
The capacitor unit 1 being electrically connected to each other has first conductive terminal 21 for being electrically connected at corresponding conducting bracket 2
First anode portion P1 and one is electrically connected at the first cathode portion N1 of the second conductive terminal 22 of corresponding conducting bracket 2.Separately
Outside, multiple capacitor units 1 for being sequentially stacked together and being electrically connected to each other can be coated by packing colloid 3, and then shape
At stacked-type solid electrolytic capacitor P.
Hereinafter, mentioned " capacitor element " refers to valve metal paillon 100 or valve in aforementioned capacitor 1
The general name of metal foil 100 and the functional coating (such as oxide layer 101) being disposed thereon.Printed form provided by the present invention
Conductive composite mortar using the capacitor of composite mortar and the manufacturing method of capacitor is on valve metal paillon 100
Material, structure and the manufacturing method of conductive layer 102 improved.
Firstly, printed form conduction composite mortar provided by the present invention includes conductive material and solvent.Conductive material can
To be the material of any solid electrolyte suitable for capacitor.For example, conductive material may include conducting polymer, example
Such as, polyaniline (polyaniline, PAni), polypyrrole (polypyrrole, PPy), polythiophene (polythiophene, PTh)
Or poly- ethylenedioxythiophene-polystyrolsulfon acid compound (PEDOT:PSS).Solvent can be water or organic solvent, such as
Ethyl alcohol.It is of the invention in one embodiment, conductive material be by emulsifier modify poly- ethylenedioxythiophene-polyphenyl
Vinyl sulfonic acid compound.PEDOT:PSS modification can be promoted to the dispersibility and electric characteristics of conductive material by emulsifier.
In the present invention, emulsifier, which can be to be selected from, can be selected from the group as composed by following compounds: polyalcohol,
Cetyl trimethylammonium bromide (CTAB), dodecyl trimethyl ammonium bromide (DTAB), polyethylene glycol mono stearate (DEG
Monostearate), lauryl sodium sulfate (SDS), neopelex (SDBS), oleic acid (Oleic acid) and its
Derivative, glycerin monostearate (glycerol monostearate), Aceonon 300 MO (Polyoxyethylene
Monooleate), polyoxyethylene (10EO) oleyl alcohol ether (P.O.E. (10) o1eyl alcohol), Sorbitan lauric acid
Ester (sorbitan monolaurate), removes Shui Shan at Span 40 (sorbitan monopalmitate)
Pears alcohol monostearate (sorbitan monostearate) removes water sorbierite tristearate (sorbitan
Tristearate), remove water sorbitol monooleate (sorbiatan monooleate), remove water sorbitol sesquioleate
(sorbitan sesquiolate), water sorbitol olein (sorbitan tribleate), polyoxyethylene oxypropylene are removed
Oleate (polyoxyethylene oxypropylene oleate), six stearate of polyoxyethylene sorbitol
The polyoxyethylene esters of (polyoxyethylene sorbitol hexastearate), fatty acid mixed and resin acid
(polyoxyethylene esters of mixed fatty and resin acids), D-glucitol (D-sorbital),
Polyoxyethylene sorbitol lanolin derivative (polyoxyethylene sorbitol lanolin derivative), polyoxy
Vinyl alkyl aryl ether (Polyoxyethylene alkyl aryl ether), polyoxyethylene sorbitol beeswax derivatives
(polyoxyethylene sorbitol beeswax derivative), polyoxyethylene monopalmitate
(Polyoxyethylene monopalmitate), polyethylene glycol monopalmitate (polyoxyethylene glycol
Monopalmitate), polyoxyethylene (20EO) removes water sorbitol olein (Polyoxyethylene oxypropylene
Oleate), tetraethylene glycol monolaurate (tetraethylene glycol monolaurate), polyoxyethylene mono laurate
Ester (polyoxyethylene monolaurate), polyoxyethylene laurel ether (Polyoxyethylene lauryl ether),
Aceonon 300 MO (polyoxyethylene enemonooleate), Aceonon 300 MO
(Polyoxyethylene monooleate), six ethylene glycol monostearates (Hoxaethylene glycol
Monostearate), propylene glycol monostearate (propylene glycol fatty acid ester), polyoxyethylene oxygen
Propylene stearate (Polyoxyethylene oxypropylene stearate), N- cetyl-N-ethylmorpholine base second
Base sodium sulphate (N-cetyl N-ethyl morpholinium ethosulfate), alkylaryl sulfonates (Alkyl aryl
Sulfonate), polyoxypropylene stearate (Polyoxypropylene stearate), polyoxyethylene laurel ether
(polyoxyethylene laurylether), polyoxyethylene octadecanol (polyoxyethylene stearyl
Alcohol), diethylene glycol monolaurate (diethylene glycol monolaurate), remove water sorbitan laurate
(sorbitan monolaurate), Span 40 (sorbitan monopalmitate), ethylene glycol two
Glycidol ether (ethylene glycol diglycidyl ether), polyethyleneglycol diglycidylether
(polyethylene glycol diglycidyl ether), propylene glycol bisglycidyl ether (propanediol
Diglycidyl ether), polypropylene glycol bisglycidyl ether (polypropanediol diglycidyl ether), 1,2,
3- propanetriol-diglycidyl-ether (1,2,3-Propanetriol glycidyl ethers) and butanediol bisglycidyl ether
(butanediol diglycidyl ether).Preferably, emulsifier 21 is polyalcohol.More preferably, emulsifier 21 is poly- second two
Alcohol or polyglycerol.It is worth noting that, in the present invention, the substance with surfactant can be selected as cream
Agent, and the specific type system not subject to the limits of emulsifier.In addition, also can be used simultaneously a variety of different emulsifiers.
In addition, printed form conduction composite mortar can further include one or more additives.Additive is to be selected from
Conductive auxiliary agent, pH regulator, agglutinant, thickener, adhesive agent and crosslinking agent.For example, conductive auxiliary agent can be one kind
High boiling solvent and be ethylene glycol, glycerine, dimethyl sulfoxide (DMSO), D-sorbite or N-Methyl pyrrolidone (NMP).
PH regulator can be ethanol amine, diethanol amine, triethanolamine, dimethylethanolamine, Diamines such as ethylenediamine and propane diamine
Or three amine.PH regulator can be sulfuric acid, nitric acid, acetic acid or p-methyl benzenesulfonic acid.Agglutinant can be various carboxylic acids,
Carboxylic acid quasi polymer or polyacrylic acid.Thickener can be high-molecular-weight poly second of the molecular weight between 1000 to 40000
Glycol or alkyl cellulose.Adhesive agent can be Polyurethane, polyester, polyacrylate or polyvinyl alcohol.Crosslinking agent can be with
It is silane coupling agent.
Printed form conduction composite mortar is at least 4% solid content, the pH value between 2 to 8 and is higher than 500 pools
Viscosity.In other words, the content of the various additives in printed form conduction composite mortar provided by the embodiment of the present invention is
It is adjusted, so that printed form conduction composite mortar has specific physical characteristic.In fact, the print with above-mentioned physical characteristic
Brush-type conduction composite mortar can effectively promote the electric characteristics of conductive layer 102, and can be applicable in well in the fabrication process
In print steps, and protective layer 5 is formed on capacitor element.
Next, please referring to Fig. 3 to Fig. 6.Fig. 3 is the process of the manufacturing method of capacitor provided by the embodiment of the present invention
Figure, Fig. 4 are the side elevational cross-section schematic diagram of a wherein step in the manufacturing method of capacitor provided by the embodiment of the present invention, Fig. 5
For a wherein schematic top plan view for step shown in Fig. 4, and Fig. 6 is another schematic top plan view of step shown in Fig. 4.
Please referring initially to Fig. 3.The present invention also provides a kind of manufacturing methods of capacitor comprising: in the yin of capacitor element
Electroconductive polymer layer (step S100) is formed in the portion of pole；And printed form conduction composite mortar is printed on electroconductive polymer layer
(step S102), so that one of the outer rim of negative pole part is arranged in printed form conduction composite mortar at least coated with conductive macromolecule layer
Point.In particular, used printed form conduction is compound in step s 102 in the manufacturing method of capacitor provided by the present invention
Slurry is the printed form conduction composite mortar with particular physical characteristics that had previously been described.In other words, printed form conduction is multiple
Close viscosity of the slurry at least 4% solid content, the pH value between 2 to 8 and at least 500 pools.In addition, printed form is led
Electric composite mortar can have the solid content less than 25%.
Specifically, in the step s 100, electroconductive polymer layer 4 can be is carried by the way that capacitor element to be impregnated in
It is completed in the container of conductive dispersions.Conductive dispersions may include conductive polymer material, dispersing agent and other function
Property auxiliary agent.The type of conductive polymer material can be identical as the conductive material in aforementioned printed form conduction composite mortar or not
Together.In addition, the dispersing agent in conductive dispersions can be water.The type of other function auxiliary agent is not limited in the present invention
System.
In of the invention in an embodiment, in the step of forming electroconductive polymer layer 4, may further comprise: will be led
Electrodispersion liquid is set on capacitor element, so that the negative pole part N of the conductive dispersions filling capacitor element of a part
In multiple holes；And it dries the conductive dispersions being set on capacitor element and forms electroconductive polymer layer 4.In other words
It says, is to first pass through the mode of impregnation to make a part of conduction in conductive dispersions in manufacturing method provided by the present invention
High molecular material immerse negative pole part N in the fabrication process caused by hole, to improve the impregnation rate of capacitor element.
It is worth noting that, in the present invention, the method for forming electroconductive polymer layer 4 is not limited to dip-coating (dipping)
Mode.For example, in addition to it is above-mentioned directly apply conductive polymer material to negative pole part N other than, electroconductive polymer layer 4 can also be with
It is formed by the in-situ chemical polymerization on negative pole part N.Or chemical polymerization can be first passed through, then the side for passing through dip-coating
Formula forms electroconductive polymer layer 4.
Next, please referring to Fig. 4.Fig. 4 is illustrated in the manufacturing method of capacitor provided by the present invention, is led by printed form
Electric composite mortar is printed in the side elevational cross-section schematic diagram after electroconductive polymer layer 4.In step s 102, the present invention is to utilize printing
Mode and will have full-bodied printed form conduction composite mortar to be printed on electroconductive polymer layer.
As shown in figure 4, capacitor element is arranged on a surface of additional circuit boards C.Capacitor as used herein
Device sub-prime can be the valve metal paillon 100 for having been provided with oxide layer 101.Additional circuit boards C can be by materials such as iron teflons
Made board-like material.
For example, conduction is had been provided on the capacitor element (valve metal thin slice 100) being set on additional circuit boards C
Macromolecule layer 4, and printed form conduction composite mortar is arranged at electroconductive polymer layer 4 to form protective layer 5.In reality of the invention
It applies in example, it is also further after printed form conduction composite mortar is set on electroconductive polymer layer 4 by way of printing
It is printed on electroconductive polymer layer 4 printed form conduction composite mortar, including drying to form protective layer 5.
It is worth noting that, side elevational cross-section schematic diagram shown by Fig. 4 is only displayed in capacitor element (valve metal thin slice
100) printed and formed the structure of protective layer 5 in one of surface.In fact, on a surface of capacitor element
It is formed after protective layer 5, can also form protective layer 5 on another surface of capacitor element by same mode.
It in addition to this, can be by adjusting since in the present invention, protective layer 5 is formed by way of printing
Or changes the shape of the mold of printing and control the model of shape and printing of the formed protective layer 5 on electroconductive polymer layer 4
It encloses.Please refer to shown in Fig. 5 and Fig. 6, Fig. 5 and Fig. 6 respectively complete the different vertical view signals after step shown in Fig. 4
Figure.
Specifically, as shown in figure 5, it is of the invention in one embodiment, the guarantor formed by print steps
Sheath 5 can be the electroconductive polymer layer 4 on the negative pole part N for being completely covered and capacitor element being arranged in.Meanwhile protective layer 5 is complete
The outer rim of the negative pole part N of full cladding capacitor element.
Then, as shown in fig. 6, in another embodiment, the protective layer 5 formed by print steps is also possible to only
It is provided only on the outer rim of the negative pole part N of capacitor element.For example, the conduction on the negative pole part N of capacitor element is set
A part of macromolecule layer 4 is not protected the masking of layer 5.It should be noted, however, that protective layer 5 still completely coats capacitor
The outer rim of the negative pole part N of sub-prime 1.Specifically, in embodiment provided by the present invention, protective layer 5 is at least completely to coat
Three outer rim sides of the negative pole part 3 of capacitor element 1.
Specifically, the difference of Fig. 5 and Fig. 6 essentially consists in the position that the negative pole part N of capacitor element is arranged in protective layer 5
It sets.In fact, this parameter be can according to the manufacturing step of electroconductive polymer layer 4 parameter and be designed.For example, if
It is to be previously formed at the thickness of the electroconductive polymer layer 4 of negative pole part N of capacitor element 1 to have reached scheduled standard, then is being formed
In the step of protective layer 5, protective layer 5 can only coat the outer rim of the negative pole part N of capacitor element 1.In this way, can achieve
Save the effect of manufacturing cost.
By said structure design, protective layer 5 can be arranged on the negative pole part N of capacitor element 1 with sufficiently thick
The layered structure of degree, that is, in the hole for the negative pole part N that the conductive polymer material including a part penetrates into capacitor element 1
Electroconductive polymer layer 4 and protective layer 5, whereby, it can be ensured that the capacitor packaging structure P's including capacitor element is electrically special
Property.Specifically, compared to the capacitor for being not provided with protective layer 5, capacitor provided by the present invention has lower electric leakage
It flows (LC).
It specifically, is to repeat compared to the prior art in order to make the negative pole part N of capacitor element that there is enough thickness
It is coated step and multilayer conductive macromolecule layer is set on negative pole part N, the present invention is directlyed adopt with specific physical
The printed form conduction composite mortar of matter once to form the protective layer 5 with adequate thickness.In this way, which manufacturing cost can be by
It reduces, and manufacture efficiency is also substantially improved.
According to above-mentioned manufacturing method, the present invention also provides a kind of capacitors with protective layer 5 comprising an at least capacitor
Device sub-prime, and the negative pole part N of capacitor element is coated by electroconductive polymer layer 4, and electroconductive polymer layer 4 is by 5 institute of protective layer
Cladding, so that electroconductive polymer layer 4 is set between negative pole part N and protective layer 5.The protective layer of capacitor provided by the present invention
5 are formed by above-mentioned printed form conduction composite mortar.Specifically, printed form conduction composite mortar include conductive material and
Solvent, and the viscosity of the solid content at least 4%, the pH value between 2 to 8 and at least 500 pools.
Selection and use printed form conduction composite mortar in relation to each composition in printed form conduction composite mortar are in electricity
The detailed step and relevant parameter of the manufacturing method of container all as described above, do not illustrate again herein.
The beneficial effect of embodiment
The beneficial effects of the present invention are printed form conduction composite mortar provided by the present invention uses composite mortar
The manufacturing method of capacitor and capacitor, can be by the way that " printed form conduction composite mortar has at least 4% solid content, between 2
PH value between to 8 and the viscosity higher than 500 pools " and " and printed form conduction composite mortar is printed in described conductive high
On molecular layer 4, so that the one of the outer rim of negative pole part N is arranged in printed form conduction composite mortar at least coated with conductive macromolecule layer 4
The technical solution of part ", to promote the efficiency of manufacturing process and promote material layer (the i.e. conducting polymer including conducting polymer
Layer 4 with protective layer 5) covering property and planarization.
Specifically, the present invention is using with particular physical characteristics, such as with specific solid content, pH value and viscosity
Printed form conduction composite mortar come improve it is manufactured made of capacitor electric appliance efficiency and simplify manufacturing process.In addition, this hair
On the bright negative pole part N that capacitor element especially also is arranged in aforementioned printed form conduction composite mortar by the way of printing
On electroconductive polymer layer 4, whereby, the setting area of protective layer 5 is formed by by printed form conduction composite mortar and shape can be with
Shape by changing printing mold adjusts easily, and increases the flexibility ratio of manufacturing process.
In addition to this, the printed form conduction composite mortar with particular physical characteristics is arranged by mode of printing can be true
Protecting the upper surface for being formed by protective layer 5 has excellent planarization, and is well coated on electroconductive polymer layer 4 and capacitor
The outer rim of sub-prime.
Content disclosed above is only preferred possible embodiments of the invention, not thereby limits to right of the invention and wants
The protection scope of book is sought, so all equivalence techniques variations done with description of the invention and accompanying drawing content, are both contained in
In the protection scope of claims of the present invention.
Claims (10)
1. a kind of printed form conduction composite mortar, which is characterized in that the printed form conduction composite mortar includes a conductive material
An and solvent, wherein solid content of the printed form conduction composite mortar at least 4%, the pH value between 2 to 8
And the viscosity higher than 500 pools.
2. printed form conduction composite mortar according to claim 1, which is characterized in that the printed form conduction composite mortar
It may further comprise: one or more additives, be selected from a conductive auxiliary agent, a pH regulator, an agglutinant, a thickening
Agent, an adhesive agent and a crosslinking agent.
3. printed form conduction composite mortar according to claim 1, which is characterized in that the conductive material is through Over emulsfication
Poly- ethylenedioxythiophene-polystyrolsulfon acid compound of agent modification.
4. printed form conduction composite mortar according to claim 2, which is characterized in that the thickener be have between
One polyethylene glycol of the molecular weight between 1000 to 40000 or an alkyl cellulose.
5. a kind of capacitor, which is characterized in that the capacitor includes an at least capacitor element, wherein at least one electricity
One negative pole part of container sub-prime is coated by an electroconductive polymer layer,
And the electroconductive polymer layer is coated by a protective layer so that the electroconductive polymer layer be set to the negative pole part with
Between the protective layer, and the protective layer is formed by a printed form conduction composite mortar, wherein the printed form is conductive
Composite mortar includes a conductive material and a solvent, wherein the printed form conduction composite mortar contains at least 4% consolidate
The viscosity of amount, the pH value between 2 to 8 and at least 500 pools.
6. capacitor according to claim 5, which is characterized in that the electroconductive polymer layer is complete by the protective layer institute
Cladding.
7. a kind of manufacturing method of capacitor, which is characterized in that the manufacturing method of the capacitor includes:
An electroconductive polymer layer is formed on a negative pole part of a capacitor element；And
One printed form conduction composite mortar is printed on the electroconductive polymer layer, so that the printed form conduction composite mortar
At least coat a part that the outer rim of the negative pole part is arranged in the electroconductive polymer layer；
Wherein, the printed form conduction composite mortar includes a conductive material and a solvent, wherein the printed form conduction is multiple
Close viscosity of the slurry at least 4% solid content, the pH value between 2 to 8 and at least 500 pools.
8. the manufacturing method of capacitor according to claim 7, which is characterized in that forming the electroconductive polymer layer
In step, it may further comprise:
One conductive dispersions are set on the capacitor element, so that described in the conductive dispersions filling of a part
In multiple holes of the negative pole part of capacitor element；And
It dries the conductive dispersions being set on the capacitor element and forms the electroconductive polymer layer.
9. the manufacturing method of capacitor according to claim 7, which is characterized in that the manufacturing method of the capacitor also into
One step includes: the printed form conduction composite mortar that drying is printed on the electroconductive polymer layer, to form a protection
Layer.
10. the manufacturing method of capacitor according to claim 8, which is characterized in that the conductive dispersions are to be impregnated with
Mode be set on the capacitor element.
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| CN201711345088.0A CN109935469A (en) | 2017-12-15 | 2017-12-15 | Printed form conduction composite mortar, capacitor and its manufacturing method |
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