CN109251484A - Polymer composite, capacitor packaging structure and its manufacturing method waited - Google Patents
Polymer composite, capacitor packaging structure and its manufacturing method waited Download PDFInfo
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- CN109251484A CN109251484A CN201710563540.4A CN201710563540A CN109251484A CN 109251484 A CN109251484 A CN 109251484A CN 201710563540 A CN201710563540 A CN 201710563540A CN 109251484 A CN109251484 A CN 109251484A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
- C08G61/122—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides
- C08G61/123—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds
- C08G61/126—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule derived from five- or six-membered heterocyclic compounds, other than imides derived from five-membered heterocyclic compounds with a five-membered ring containing one sulfur atom in the ring
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/18—Homopolymers or copolymers of aromatic monomers containing elements other than carbon and hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
- H01G9/0425—Electrodes or formation of dielectric layers thereon characterised by the material specially adapted for cathode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/10—Definition of the polymer structure
- C08G2261/11—Homopolymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G2261/30—Monomer units or repeat units incorporating structural elements in the main chain
- C08G2261/34—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain
- C08G2261/344—Monomer units or repeat units incorporating structural elements in the main chain incorporating partially-aromatic structural elements in the main chain containing heteroatoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention discloses a kind of polymer composite, capacitor packaging structure and its manufacturing methods waited.Manufacturing method comprises the steps of, and emulsifier, 3,4- ethylenedioxythiophene (EDOT) and polystyrolsulfon acid (PSS) are added in solvent, to form mixed solution；And the chemical reaction between 3,4- ethylenedioxythiophene, polystyrolsulfon acid and the emulsifier three in starting mixed solution, to form polymer composite.Polymer composite provided by the present invention can increase the impregnation rate of capacitor cathode when being used for solid-state capacitor, and then promote the piece electrical characteristic of solid-state capacitor.
Description
Technical field
The present invention relates to a kind of polymer composite and its manufacturing method and a kind of capacitor packaging structure and its systems
Method is made, it is high more particularly to a kind of polymer composite for solid-state capacitor and its manufacturing method and a kind of use
The capacitor packaging structure and its manufacturing method of molecular composite material.
Background technique
Capacitor has been widely used for consumer electrical home appliances, computer motherboard and its periphery, power supply unit, has led to
The basic module of product and automobile etc. is interrogated, its main function includes: filtering, bypass, rectification, coupling, decoupling, phase inversion etc..It is
One of indispensable component in electronic product.Capacitor has different kenels, including aluminum according to different material and purposes
Electrolytic capacitor, tantalum matter electrolytic capacitor, laminated ceramic capacitor, thin-film capacitor etc..In the prior art, solid electrolytic capacitor has small
The advantages that size, high capacitance, superior frequency characteristic, and can be used in the decoupling effect of the power circuit of central processing unit
On.Solid electrolytic capacitor is to replace liquid electrolyte as cathode with solid electrolyte, and conducting polymer is based on its height and leads
Electrically, the advantages that manufacturing process is easy has been widely used in the cathode material of solid electrolyte capacitor.
The conducting polymer that can be used for the cathode of solid-state electricity solution includes polyaniline (polyaniline, PAni), polypyrrole
Materials and its derivative such as (polypyrrole, PPy) and polythiophene (polythiophene, PTh).Wherein, PEDOT:PSS is multiple
Closing object has excellent electric conductivity, and compared to other macromolecules, such as PAni and PPy etc., PEDOT:PSS compound have compared with
Low rate of polymerization, therefore the degree of difficulty of polymerization reaction and reduced preparation can be carried out at normal temperature.In addition, PEDOT:PSS is multiple
Object is closed to have more compared to the preferable weatherability of other macromolecules and heat resistance.In addition to this, PEDOT:PSS compound also has
Good dispersion, low production cost, the high grade of transparency and excellent treatability (Processability).Therefore, it uses
PEDOT:PSS compound as electroconductive polymer layer on the negative pole part for forming capacitor raw material for capacitor electrical effects
Promotion be very helpful.
Key parameter during with the negative pole part of the conducting polymers such as PEDOT:PSS compound manufacture capacitor
For impregnation rate.Electrode table must be penetrated into well by being formed by solid electrolyte by conducting polymers such as PEDOT:PSS compounds
The corrosion hole in face to increase the impregnation rate of conducting polymer, and then promotes the capacity of capacitor.Therefore, reduction in need is made
The partial size of the conducting polymers such as the PEDOT:PSS compound for solid electrolyte makes it easier to penetrate into corrosion hole.
Therefore, in the art, still a need to which a kind of polymer composite and its system for solid-state capacitor is provided
Method is made, to reduce the partial size of polymer composite, and then promotes the piece electrical performance of capacitor.
Summary of the invention
In order to solve the above-mentioned technical problem, a wherein embodiment according to the present invention provides a kind of for solid-state capacitor
Polymer composite manufacturing method, it includes the following steps: by an emulsifier, 3,4- ethylenedioxythiophene (EDOT) with
And polystyrolsulfon acid (PSS) is added in a solvent, to form a mixed solution；And the 3,4- in the starting mixed solution
Chemical reaction between ethylenedioxythiophene, polystyrolsulfon acid and the emulsifier three, it is multiple to form the macromolecule
Condensation material.
Further, the emulsifier is selected from by following composed group: polyalcohol, cetyl trimethyl
Ammonium bromide, dodecyl trimethyl ammonium bromide, polyethylene glycol mono stearate, lauryl sodium sulfate, dodecyl benzene sulfonic acid
Sodium, oleic acid and its derivative, glycerin monostearate, Aceonon 300 MO, Brij92, Sorbitan
Laurate, Span 40 remove water sorbitol monostearate, remove water sorbierite tristearate, remove water
Sorbitol monooleate, go water sorbitol sesquioleate, go water sorbitol olein, polyoxyethylene oxypropylene oleate,
Six stearate of polyoxyethylene sorbitol, the polyoxyethylene esters of fatty acid mixed and resin acid, polyoxyethylene sorbitol wool
Rouge derivative, polyoxyethylene alkylaryl ether, polyoxyethylene sorbitol beeswax derivatives, polyoxyethylene monopalmitate, poly- second
Glycol monopalmitate, polyoxyethylene sorbitan trioleate, tetraethylene glycol monolaurate, polyoxyethylene mono laurate
Ester, polyoxyethylene laurel ether, Aceonon 300 MO, Aceonon 300 MO, six ethylene glycol monostearates, propylene glycol
Monostearate, polyoxyethylene oxypropylene stearate, N- cetyl-N-ethylmorpholine base sodium ethylsulfate, alkylaryl
Sulfonate, polyoxyethylene laurel ether, polyoxyethylene octadecanol, diethylene glycol monolaurate, removes water at polyoxypropylene stearate
Sorbitan laurate, Span 40, ethylene glycol diglycidylether, polyethyleneglycol diglycidylether,
The double contractings of propylene glycol bisglycidyl ether, polypropylene glycol bisglycidyl ether, Glycerin glycidol ether and butanediol
Water glycerin ether.
Further, the emulsifier is polyalcohol.
Further, the emulsifier is D-glucitol, polyethylene glycol or polyglycerol.
Further, in the mixed solution, the emulsifier accounts for 20 to 30 weight % of the mixed solution.
Further, the D50 average grain diameter of the polymer composite is between 1 to 25 nanometer.
Further, 3,4- ethylenedioxythiophene, polystyrolsulfon acid and institute in the mixed solution are being originated
Before the step of stating the chemical reaction between emulsifier three, it may further comprise: and an oxidant is added in the mixed solution
In.
According to another embodiment of the present invention, a kind of manufacturing method of capacitor packaging structure is provided, it includes: it is provided to
One negative pole part of a few capacitor, at least one capacitor uses the high score manufactured by manufacturing method as described above
Sub- composite material；And by an encapsulating structure to encapsulate at least one capacitor, wherein be electrically connected at least described in one
The positive pin of the one of capacitor and a cathode foot portions are exposed outside the encapsulating structure.
According to another embodiment of the present invention, a kind of polymer composite is provided, a yin of a capacitor is applied to
Pole portion.The polymer composite includes poly- ethylenedioxythiophene, polystyrolsulfon acid and an emulsifier, wherein described
Emulsifier coats poly- ethylenedioxythiophene and polystyrolsulfon acid.
Further, the emulsifier is selected from by following composed group: polyalcohol, cetyl trimethyl
Ammonium bromide, dodecyl trimethyl ammonium bromide, polyethylene glycol mono stearate, lauryl sodium sulfate, dodecyl benzene sulfonic acid
Sodium, oleic acid and its derivative, glycerin monostearate, Aceonon 300 MO, Brij92, Sorbitan
Laurate, Span 40 remove water sorbitol monostearate, remove water sorbierite tristearate, remove water
Sorbitol monooleate, go water sorbitol sesquioleate, go water sorbitol olein, polyoxyethylene oxypropylene oleate,
Six stearate of polyoxyethylene sorbitol, the polyoxyethylene esters of fatty acid mixed and resin acid, polyoxyethylene sorbitol wool
Rouge derivative, polyoxyethylene alkylaryl ether, polyoxyethylene sorbitol beeswax derivatives, polyoxyethylene monopalmitate, poly- second
Glycol monopalmitate, polyoxyethylene sorbitan trioleate, tetraethylene glycol monolaurate, polyoxyethylene mono laurate
Ester, polyoxyethylene laurel ether, Aceonon 300 MO, Aceonon 300 MO, six ethylene glycol monostearates, propylene glycol
Monostearate, polyoxyethylene oxypropylene stearate, N- cetyl-N-ethylmorpholine base sodium ethylsulfate, alkylaryl
Sulfonate, polyoxyethylene laurel ether, polyoxyethylene octadecanol, diethylene glycol monolaurate, removes water at polyoxypropylene stearate
Sorbitan laurate, Span 40, ethylene glycol diglycidylether, polyethyleneglycol diglycidylether,
The double contractings of propylene glycol bisglycidyl ether, polypropylene glycol bisglycidyl ether, Glycerin glycidol ether and butanediol
Water glycerin ether.
Further, the emulsifier is polyalcohol.
Further, poly- ethylenedioxythiophene is as conductive agent, and polystyrolsulfon acid is as dispersing agent, and the emulsification
Agent is used as conductive auxiliary agent and dispersing agent simultaneously, and the emulsifier accounts for 20 to 30 weight % of the polymer composite.
Further, the D50 average grain diameter of the polymer composite is between 1 to 25 nanometer.
According to another embodiment of the present invention, a kind of capacitor packaging structure is provided, the capacitor packaging structure includes
One negative pole part of an at least capacitor, at least one capacitor uses polymer composite as described above.
Technical way of the invention is, by " including poly- ethylenedioxythiophene, polystyrolsulfon acid and emulsification
The polymer composite of agent " can effectively promote the dispersibility of polymer composite in a solvent, and then reduce macromolecule
The partial size of composite material.In this way, compared to traditional poly- ethylenedioxythiophene-polystyrolsulfon acid macromolecule, the present invention
Polymer composite can more easily insert in the corrosion hole of electrode surface, and then increase capacitor capacity and increase
Into the electric property of capacitor entirety.
Furthermore the present invention is can to make height as one of the composition for forming polymer composite by using emulsifier
Molecular composite material has excellent dispersibility in a solvent, therefore, machine need not be used during making polymer composite
Tool power is stirred, and reduces complex manufacturing process degree and manufacturing process cost whereby.
Be further understood that feature and technology contents of the invention to be enabled, please refer to below in connection with it is of the invention specifically
Bright and attached drawing, however provided attached drawing is merely provided for reference and description, is not intended to limit the present invention.
Detailed description of the invention
Fig. 1 is the wherein side elevational cross-section of a capacitor applied by polymer composite provided by the embodiment of the present invention
Schematic diagram；
Fig. 2 is the side elevational cross-section schematic diagram of a wherein capacitor packaging structure provided by the embodiment of the present invention；
Fig. 3 is the three-dimensional signal of another capacitor applied by polymer composite provided by the embodiment of the present invention
Figure；
Fig. 4 is the side schematic view of another capacitor packaging structure provided by the embodiment of the present invention；
Fig. 5 is the manufacturer provided by a wherein embodiment of the invention for the polymer composite of solid-state capacitor
The flow chart of method；
Fig. 6 is the manufacturer provided by the other embodiment of the present invention for the polymer composite of solid-state capacitor
The flow chart of method；
Fig. 7 is that the structure provided by a wherein embodiment of the invention for the polymer composite of solid-state capacitor is shown
It is intended to；And
Fig. 8 is the structural representation provided by another embodiment of the present invention for the polymer composite of solid-state capacitor
Figure.
Specific embodiment
Be below illustrated by specific specific example it is presently disclosed in relation to the " macromolecule for solid-state capacitor
Composite material, using the capacitor packaging structure of polymer composite and its etc. manufacturing method " embodiment, ability
Field technique personnel can understand advantages of the present invention and effect by content disclosed in this specification.The present invention can pass through other differences
Specific embodiment implemented or applied, the various details in this specification may be based on different viewpoints and application, be not contrary to
From carried out under spirit of the invention it is various modification and change.In addition, attached drawing of the invention is only simple schematically illustrate, not according to reality
The description of border size, first gives explanation.The relevant technologies content of the invention, but institute will be explained in further detail in the following embodiments and the accompanying drawings
The technology scope that disclosure is not intended to limit the invention.All the elements as disclosed below please refer to Fig. 1 to Fig. 8 institute
Show.
Firstly, please referring to Fig. 1 and Fig. 2.Fig. 1 is applied by polymer composite 2 provided by the embodiment of the present invention
The side elevational cross-section schematic diagram of capacitor, and Fig. 2 is the structure of a wherein capacitor packaging structure provided by the embodiment of the present invention
Schematic diagram.Specifically, the conduction that polymer composite 2 provided by the present invention can be applied to the negative pole part N of capacitor 1 is high
In molecular layer 102.In Fig. 2, capacitor 1 is the capacitor unit 42 in stacked-type solid electrolytic capacitor encapsulating structure 4.
For example, as shown in Figure 1, capacitor 1 may include the oxidation of valve metal paillon 100, cladding 100, valve metal foil
The rubber layer 103 of layer 101, the electroconductive polymer layer 102 of a part of cladding oxide layer 101, coated with conductive macromolecule layer 102,
And the elargol layer 104 of cladding rubber layer 103.The structure of aforementioned capacitor 1 can be adjusted according to product actual demand.It is conductive
Solid electrolyte of the macromolecule layer 102 primarily as capacitor 1.
As shown in Fig. 2, stacked-type solid electrolytic capacitor 4 includes the capacitor unit 42 of multiple sequentially storehouses.In addition, heap
Stack-type solid electrolytic capacitor 4 includes conducting bracket 41.Conducting bracket 41 include the first conductive terminal 411 and with the first conducting end
Son 411 is separated from each other the second conductive terminal 412 of a preset distance.In addition, multiple be sequentially stacked together and electrically connect each other
The capacitor unit 42 connect has the first anode of first conductive terminal 411 for being electrically connected at corresponding conducting bracket 41
Portion P1 and one is electrically connected at the first cathode portion N1 of the second conductive terminal 412 of corresponding conducting bracket 41.In addition, passing through
Packing colloid 43 can coat multiple capacitor units 42 for being sequentially stacked together and being electrically connected to each other, and then form storehouse
Type solid electrolytic capacitor 4.
In addition, please referring to Fig. 3 and Fig. 4.Fig. 3 is another applied by polymer composite provided by the embodiment of the present invention
The stereoscopic schematic diagram of one capacitor, and Fig. 4 is the side signal of another capacitor packaging structure provided by the embodiment of the present invention
Figure.In Fig. 3 and Fig. 4, capacitor 1 is the capacitor unit in Winding-type solid electrolytic capacitor encapsulating structure 3.
As shown in figure 4, Winding-type solid electrolytic capacitor encapsulating structure 3 includes: a wound-type module 31, a package assembling
32 and a conductive component 33.Referring to Fig. 3, wound-type module 31 includes a takeup type positive conductive paillon 311, a takeup type
Paillon 313 is isolated in negative conductive paillon 312 and two takeup types.More specifically, paillon 313 is isolated in two takeup types
One of them can be arranged between takeup type positive conductive paillon 311 and takeup type negative conductive paillon 312, and takeup type is just
Both pole conductive foil 311 and takeup type negative conductive paillons 312 one of them two takeup types can be set paillon 313 is isolated
Between.Takeup type isolation paillon 313 can be attached with macromolecule composite wood provided by the present invention by impregnation mode for one kind
The barrier paper of material or paillon made of paper.
Furthermore referring back to Fig. 4, wound-type module 31 can be covered by the inside of package assembling 32.For example, it encapsulates
Component 32 includes a capacitor casing structure 321 (such as aluminum hull or other metal shells) and a bottom end closure structure 322, electricity
Container casing structure 321 has an accommodating space 3210 for being used to accommodate wound-type module 31, and bottom end closure structure 322 is set
It sets in the bottom end of capacitor casing structure 321 to close accommodating space 3210.In addition, package assembling 32 is also possible to by any exhausted
Packaging body made by edge material.
Conductive component 33 includes the first conductive connecting pin 331 and one of a takeup type positive conductive paillon 311 in electrical contact
Second conductive connecting pin 332 of takeup type negative conductive paillon 312 in electrical contact.For example, the first conductive connecting pin 331 has one
It is covered by and buries the first naked of portion 3311 and an exposed outside in package assembling 32 in the first of the inside of package assembling 32
Dew portion 3312, and the second conductive connecting pin 332 have one be covered by package assembling 32 inside second in bury portion 3321 with
And one the exposed outside in package assembling 32 the second exposed portion 322.
Next, please referring to Fig. 5 and Fig. 6, Fig. 5 is the macromolecule that solid-state capacitor is used for provided by the embodiment of the present invention
The flow chart of the manufacturing method of composite material, and Fig. 6 is that wherein an embodiment is provided for solid-state capacitor by the present invention
The flow chart of the manufacturing method of polymer composite.
As shown in Fig. 2, the manufacturer provided by the embodiment of the present invention for the polymer composite of solid-state capacitor
Method, which is comprised the steps of, is added solvent for an emulsifier, 3,4- ethylenedioxythiophene (EDOT) and polystyrolsulfon acid (PSS)
In, to form mixed solution (S100)；And 3,4- ethylenedioxythiophene, polystyrolsulfon acid in the starting mixed solution
And the chemical reaction between the emulsifier three, to form the polymer composite (S102).
Specifically, in the step s 100, emulsifier 21,3,4- ethylenedioxythiophene (EDOT) and polystyrolsulfon acid
(PSS) it is added into a solvent.For example, emulsifier 21 can be selected from the group as composed by following compounds: polyalcohol,
Cetyl trimethylammonium bromide (CTAB), dodecyl trimethyl ammonium bromide (DTAB), polyethylene glycol mono stearate (DEG
Monostearate), lauryl sodium sulfate (SDS), neopelex (SDBS), oleic acid (Oleic acid) and its
Derivative, glycerin monostearate (glycerol monostearate), Aceonon 300 MO (Polyoxyethylene
Monooleate), polyoxyethylene (10EO) oleyl alcohol ether (P.O.E. (10) o1eyl alcohol), Sorbitan lauric acid
Ester (sorbitan monolaurate), removes Shui Shan at Span 40 (sorbitan monopalmitate)
Pears alcohol monostearate (sorbitan monostearate) removes water sorbierite tristearate (sorbitan
Tristearate), remove water sorbitol monooleate (sorbiatan monooleate), remove water sorbitol sesquioleate
(sorbitan sesquiolate), water sorbitol olein (sorbitan tribleate), polyoxyethylene oxypropylene are removed
Oleate (polyoxyethylene oxypropylene oleate), six stearate of polyoxyethylene sorbitol
The polyoxyethylene esters of (polyoxyethylene sorbitol hexastearate), fatty acid mixed and resin acid
(polyoxyethylene esters of mixed fatty and resin acids), polyoxyethylene sorbitol lanolin
Derivative (polyoxyethylene sorbitol lanolin derivative), polyoxyethylene alkylaryl ether
(Polyoxyethylene alkyl aryl ether), polyoxyethylene sorbitol beeswax derivatives (polyoxyethylene
Sorbitol beeswax derivative), polyoxyethylene monopalmitate (Polyoxyethylene
Monopalmitate), polyethylene glycol monopalmitate (polyoxyethylene glycol monopalmitate), polyoxy
Ethylene (20EO) removes water sorbitol olein (Polyoxyethylene oxypropylene oleate), tetraethylene glycol list
Laurate (tetraethylene glycol monolaurate), Vinlub 73 (polyoxyethylene
Monolaurate), polyoxyethylene laurel ether (Polyoxyethylene lauryl ether), Aceonon 300 MO
(polyoxyethylene enemonooleate), Aceonon 300 MO (Polyoxyethylene monooleate),
Six ethylene glycol monostearates (Hoxaethylene glycol monostearate), propylene glycol monostearate
(propylene glycol fatty acid ester), polyoxyethylene oxypropylene stearate (Polyoxyethylene
Oxypropylene stearate), N- cetyl-N-ethylmorpholine base sodium ethylsulfate (N-cetyl N-ethyl
Morpholinium ethosulfate), alkylaryl sulfonates (Alkyl aryl sulfonate), polyoxypropylene stearic acid
Ester (Polyoxypropylene stearate), gathers polyoxyethylene laurel ether (polyoxyethylene laurylether)
Ethylene oxide octadecyl alcolol (polyoxyethylene stearyl alcohol), diethylene glycol monolaurate (diethylene
Glycol monolaurate), remove water sorbitan laurate (sorbitan monolaurate), go water sorbierite list palm
Acid esters (sorbitan monopalmitate), ethylene glycol diglycidylether (ethylene glycol diglycidyl
Ether), the double contractings of polyethyleneglycol diglycidylether (polyethylene glycol diglycidyl ether), propylene glycol
Water glycerin ether (propanediol diglycidyl ether), polypropylene glycol bisglycidyl ether (polypropanediol
Diglycidyl ether), 1,2,3- propanetriol-diglycidyl-ether (1,2,3-Propanetriol glycidyl ethers)
And butanediol bisglycidyl ether (butanediol diglycidyl ether).Preferably, emulsifier 21 is polyalcohol.
More preferably, emulsifier 21 is D-glucitol (D-sorbital), polyethylene glycol or polyglycerol.It is worth noting that, at this
In invention, the substance with surfactant can be selected as emulsifier, and the specific type of emulsifier is not subject to the limits
System.In addition, also can be used simultaneously a variety of different emulsifiers.Solvent can be water or organic solvent, such as ethyl alcohol.
Hold above-mentioned, 3,4- ethylenedioxythiophenes are for carrying out polymerization reaction to form poly- ethylenedioxythiophene-polyphenyl second
One of the reactant of alkene sulfonic acid (PEDOT:PSS) compound 22.Specifically, poly- ethylenedioxythiophene-polystyrolsulfon acid
(poly (3,4-ethylenedioxythiophene): polystyrene, PEDOT:PSS) compound 22 is that two kinds of ions are poly-
It closes object and is formed by mixture.This two kinds of ionomers are respectively kayexalate (Sodium Polystyrene
It Sulfonate), is a kind of sulfonated polystyrene and poly- ethylenedioxythiophene (poly (3,4-
Ethylenedioxythiophene)), it is conjugated polymer based on polythiophene.Aforementioned two kinds of ionomers are formed
One giant molecule salt, in the present invention, referred to as PEDOT:PSS compound 22.
It is worth noting that, in the step s 100, emulsifier 21 and 3,4- ethylenedioxythiophene is injected towards in solvent
Sequence system not subject to the limits.In other words, the addition of emulsifier 21 first can be formed into solution into solvent, then by 3,4- dioxy
Ethylthiophene is added into the solution containing emulsifier 21.Or first 3,4- ethylenedioxythiophene is added into solvent with shape
It is added at solution, then by emulsifier 21 into the solution for containing 3,4- ethylenedioxythiophene.In another embodiment, emulsifier
21 and 3,4- ethylenedioxythiophene is to be added into solvent simultaneously.As shown in fig. 6, being in the present invention wherein an embodiment
First emulsifier 21 is added into solvent to be formed solution (S1001), then 3,4- ethylenedioxythiophene is added to containing emulsification
In the solution of agent 21 (S1002).Finally, polystyrolsulfon acid (PSS) is added in mixed solution (S1003) again.
In the manufacturing process of existing PEDOT:PSS compound 22, if individually by 3,4- ethylenedioxythiophene be added to
In solvent (such as water), 3,4- ethylenedioxythiophenes can form small drop in ethanol, so that the resulting solution
In opaque milky.Opaque solution represents the 3,4- ethylenedioxythiophene drop in ethyl alcohol with biggish partial size.
Therefore, the dispersibility for improvement 3,4- ethylenedioxythiophene in alcohol solvent, the present invention are added before carrying out polymerization reaction
Emulsifier 21, in this way, in the manufacturing method of the polymer composite provided by the present invention for solid-state capacitor
After step S1002, by emulsifier 21,3,4- ethylenedioxythiophene and solvent be formed by mixed solution will have it is translucent or
Transparent clear appearance.This translucent or transparent clear appearance represents the liquid of the 3,4- ethylenedioxythiophene in mixed solution
The partial size of drop is substantially reduced.
It is worth noting that, by emulsifier 21 and 3,4- ethylenedioxythiophene is added in solvent in the present invention
In step (S1001), emulsifier 21 accounts for 0.1 to 30 weight % of mixed solution.Or in step S1001, emulsifier 21 with
The weight ratio of 3,4- ethylenedioxythiophene is 1 ︰ 10 between 10:1.For example, emulsifier 21 and 3,4- ethylenedioxythiophene
Ratio be 1:1.Emulsifier additive amount in aforementioned range is enough to reach dispersion effect, and is unlikely to the height being subsequently formed
Molecular composite material 2 adversely affects.
Hold it is above-mentioned, through the use of emulsifier, it is not necessary to stirring using mechanical force during carrying out coreaction
Mix device, such as stirrer and homogenizer (Homogenizer) etc..However, to accelerate dispersion of the reactant in mixed solution,
Demand can still be regarded and use above-mentioned agitating device.
Next, in step s 102, originate 3,4- ethylenedioxythiophene in mixed solution, polystyrolsulfon acid and
Chemical reaction between emulsifier three, to form polymer composite.
Specifically, oxidant can be added before step S102 to originate 3,4- ethylenedioxythiophene and polyphenyl second
Polymerization reaction between alkene sulfonic acid.As shown in fig. 6, the polymerization between starting 3,4- ethylenedioxythiophene and polystyrolsulfon acid
Before the step of reaction, also comprising step (S101) of one or more oxidants in the mixed solution is added.For example,
Oxidant can be sodium peroxydisulfate or potassium peroxydisulfate.However, present invention system not subject to the limits.
It, can be with the reaction temperature of the system of a successive step polymerization reaction in step S102 please equally refering to Fig. 5 and Fig. 6
Degree, and accelerate reaction to carry out using agitating device depending on demand.After completion of the polymerization reaction, polymer composite can be obtained
2.The time of polymerization reaction can be for by several minutes to 30 hours ranges.However, the time of above-mentioned polymerization reaction is according to reaction
Depending on the parameters such as the additive amount of temperature, the type of oxidant and 3,4- ethylenedioxythiophene and polystyrolsulfon acid, and this hair
Bright system not subject to the limits.
Next, please referring to Fig. 7 and Fig. 8.Fig. 7 and Fig. 8 is provided by the embodiment of the present invention for solid-state capacitor
The structural schematic diagram of polymer composite.As shown in fig. 7, after step S102, obtained polymer composite 2 be by
PEDOT, PSS and emulsifier 21 collectively constitute (PEDOT:PSS: emulsifier complex, include PEDOT unit 221, PPS unit
222 and emulsifier 21).Or as shown in figure 8, PEDOT:PSS compound 22 can be newborn in polymer composite 2
The grafting of agent 21 (emulsifier 21 coats 3,4- ethylenedioxythiophene and polystyrolsulfon acid).However, the present invention is not subject to the limits
System.Whereby, the manufacturing method of the polymer composite provided by the embodiment of the present invention for solid-state capacitor can provide
A kind of polymer composite 2, and polymer composite 2 is PEDOT:PSS: emulsifier is copolymerized.
It is worth noting that, in the present invention, due to being sent out between 3,4- ethylenedioxythiophene and polystyrolsulfon acid
The partial size that polymerization reaction has first passed through emulsifier 21 before and reduced EDOT is given birth to, macromolecule obtained is multiple after polymerization
The partial size of condensation material 2 is also to be substantially reduced.The partial size of polymer composite 2 can be between 1 to 25 nanometer.Citing
For, it carries out the resulting material of polymerization reaction compared to the prior art (D50 average grain diameter is about being not added under emulsifier 21
30 nanometers), the D50 average grain diameter of present invention polymer composite 2 obtained is between 1 to 25 nanometer.Therefore, sharp
Being formed by electroconductive polymer layer with polymer composite 2 of the invention can have higher impregnation rate, and then promote electricity
The capacity of container.
Furthermore, it is worth mentioning at this point that, the present invention in front of polymerization added by emulsifier 21 in addition to can achieve
The effect of polymer composite 2 obtained, can also increase and be formed by polymer composite 2 after fine dispersion reaction
Electroconductive polymer layer conductivity.In other words, emulsifier 21 is to use while providing dispersion effect as conductive auxiliary agent
To promote the piece electrical characteristic of capacitor 1.
After chemical reaction, polymer composite is dissolved in suspension.By centrifuge separation, ion exchange
Film or dialysis film process and after removing the remaining salt ion being likely to be present in suspension, this suspension can be directly as leading
The material of electric macromolecule layer and be formed on the cathode of capacitor 1.For example, it can pass through a film forming manufacturing process for macromolecule
Composite material 2 is formed on the cathode of capacitor 1.It is immersed in specifically, capacitor element can be contained dissolved with macromolecule composite wood
In the solution of material 2, so that electroconductive polymer layer is formed in the surface of capacitor element.
In another embodiment, the suspension containing polymer composite can be coated on electrolytic paper, so that outstanding
Supernatant liquid is adsorbed in electrolytic paper (such as penetrating into the fiber of electrolytic paper).Electrolytic paper can be used as the carrier of capacitor conductive layer,
The mechanical strength of capacitor product is maintained whereby.
Or after abovementioned steps S102, further the product stream containing polymer composite is purified, with
Separate polymer composite.Thus, it can be ensured that the purity of polymer composite.For example, centrifugation can be passed through
At least one of method, dialysis, the column chromatography precipitation method and ion-exchange purify product stream.
After the purification step, homogenous disperse can also be carried out to the polymer composite.For example, can make
With at least one of homogeneous blender, ultrasonic crusher, high pressure homogenizer and ball mill to polymer composite into
Row homogenous disperse.
In addition, the present invention also provides a kind of capacitor packaging structure and its manufacturing methods.Manufacturing method includes: being provided to
A few capacitor, at least negative pole part of a capacitor use the high score as manufactured by the manufacturing method of aforementioned polymer composite
Sub- composite material；And by an encapsulating structure to encapsulate an at least capacitor, wherein be electrically connected at an at least capacitor
One positive pin and a cathode foot portions are exposed outside encapsulating structure.
Fig. 2 and Fig. 4 is please referred to, Fig. 2 is that wherein the side view of a capacitor packaging structure is cutd open provided by the embodiment of the present invention
Face schematic diagram；And Fig. 4 is the side schematic view of another capacitor packaging structure provided by the embodiment of the present invention.Cooperate aforementioned electricity
The manufacturing method of container packaging structure, capacitor 1 can be the capacitor unit 42 in stacked-type solid electrolytic capacitor 4, or
It is the wound-type module 31 in Winding-type solid electrolytic capacitor 3.Encapsulating structure can be in stacked-type solid electrolytic capacitor 4
Packing colloid 43 or Winding-type solid electrolytic capacitor 3 in package assembling 32.All such as about aforementioned mentioned component
Described in the preceding narration for capacitor packaging structure, do not illustrate again herein.
In addition, being formed by capacitor packaging structure then by aforementioned polymer composite 2 to be includes an at least capacitor,
The negative pole part use of an at least capacitor includes emulsifier, 3,4- ethylenedioxythiophene (EDOT) and polystyrolsulfon acid
(PSS) polymer composite 2.Component such as Fig. 2 and figure about the capacitor packaging structure for using polymer composite 2
Described in 4, do not illustrate again herein.
In conclusion the beneficial effects of the present invention are, by " comprising poly- ethylenedioxythiophene, polystyrolsulfon acid with
And the polymer composite 2 " of emulsifier can effectively promote the dispersibility of polymer composite 2 in a solvent, and then drop
The partial size of low polymer composite 2.In this way, compared to traditional poly- ethylenedioxythiophene-polystyrolsulfon acid high score
Son, polymer composite 2 of the invention can more easily be inserted in the corrosion hole of electrode surface, and then increase capacitor
Capacity and promote the whole electric property of capacitor 1.
Furthermore the present invention is can be made by using emulsifier 21 as one of the composition for forming polymer composite 2
Polymer composite 2 in a solvent there is excellent dispersibility therefore need not make during making polymer composite 2
It is stirred with mechanical force, reduces complex manufacturing process degree and manufacturing process cost whereby.
Content disclosed above is only preferred possible embodiments of the invention, not thereby limits to right of the invention and wants
The protection scope of book is sought, so all equivalence techniques variations done with description of the invention and accompanying drawing content, are both contained in
In the protection scope of claims of the present invention.
Claims (14)
1. a kind of manufacturing method of the polymer composite for solid-state capacitor, which is characterized in that described for solid-state electricity
The manufacturing method of the polymer composite of container includes the following steps:
One emulsifier, 3,4- ethylenedioxythiophene and polystyrolsulfon acid are added in a solvent, to form a mixed solution；
And
It originates between 3,4- ethylenedioxythiophene, polystyrolsulfon acid and the emulsifier three in the mixed solution
Chemical reaction, to form the polymer composite.
2. the manufacturing method of the polymer composite according to claim 1 for solid-state capacitor, which is characterized in that
The emulsifier is selected from by following composed group: polyalcohol, cetyl trimethylammonium bromide, dodecyl front three
Base ammonium bromide, polyethylene glycol mono stearate, lauryl sodium sulfate, neopelex, oleic acid and its derivative, list
Tristerin, Brij92, sorbitan monolaurate, removes water sorbierite at Aceonon 300 MO
Monopalmitate removes water sorbitol monostearate, removes water sorbierite tristearate, remove water sorbitol monooleate, remove water
Sorbitol sesquioleate goes water sorbitol olein, polyoxyethylene oxypropylene oleate, polyoxyethylene sorbitol six stearic
It is the polyoxyethylene esters of acid esters, fatty acid mixed and resin acid, polyoxyethylene sorbitol lanolin derivative, polyxyethylated
Aryl ether, polyoxyethylene sorbitol beeswax derivatives, polyoxyethylene monopalmitate, polyethylene glycol monopalmitate, polyoxy second
Alkene removes water sorbitol olein, tetraethylene glycol monolaurate, Vinlub 73, polyoxyethylene laurel ether, gathers
Ethylene oxide monoleate, Aceonon 300 MO, six ethylene glycol monostearates, propylene glycol monostearate, polyoxyethylene
Oxypropylene stearate, N- cetyl-N-ethylmorpholine base sodium ethylsulfate, alkylaryl sulfonates, polyoxypropylene are stearic
Acid esters, polyoxyethylene octadecanol, diethylene glycol monolaurate, removes water sorbitan laurate, removes water polyoxyethylene laurel ether
Sorbierite monopalmitate, ethylene glycol diglycidylether, polyethyleneglycol diglycidylether, propylene glycol bisglycidyl ether,
Polypropylene glycol bisglycidyl ether, Glycerin glycidol ether and butanediol bisglycidyl ether.
3. the manufacturing method of the polymer composite according to claim 2 for solid-state capacitor, which is characterized in that
The emulsifier is polyalcohol.
4. the manufacturing method of the polymer composite according to claim 3 for solid-state capacitor, which is characterized in that
The emulsifier is D-glucitol, polyethylene glycol or polyglycerol.
5. the manufacturing method of the polymer composite according to claim 1 for solid-state capacitor, which is characterized in that
In the mixed solution, the emulsifier accounts for 20 to 30 weight % of the mixed solution.
6. the manufacturing method of the polymer composite according to claim 1 for solid-state capacitor, which is characterized in that
The D50 average grain diameter of the polymer composite is between 1 to 25 nanometer.
7. the manufacturing method of the polymer composite according to claim 1 for solid-state capacitor, which is characterized in that
Originating the change between the 3,4- ethylenedioxythiophene in the mixed solution, polystyrolsulfon acid and the emulsifier three
Before the step of learning reaction, it may further comprise: and an oxidant is added in the mixed solution.
8. a kind of manufacturing method of capacitor packaging structure, which is characterized in that the manufacturing method packet of the capacitor packaging structure
Include the following steps:
An at least capacitor is provided, a negative pole part of at least one capacitor uses manufacturing method as described in claim 1
The manufactured polymer composite；And
By an encapsulating structure to encapsulate at least one capacitor, wherein be electrically connected at the one of at least one capacitor
Positive pin and a cathode foot portions are exposed outside the encapsulating structure.
9. a kind of polymer composite is applied to a negative pole part of a capacitor, which is characterized in that the macromolecule is compound
Material includes:
Poly- ethylenedioxythiophene, polystyrolsulfon acid and an emulsifier, wherein the emulsifier coats poly- ethylenedioxythiophene
And polystyrolsulfon acid.
10. polymer composite according to claim 9, which is characterized in that the emulsifier is selected from by following
Composed group: polyalcohol, cetyl trimethylammonium bromide, dodecyl trimethyl ammonium bromide, polyethyleneglycol are stearic
Acid esters, lauryl sodium sulfate, neopelex, oleic acid and its derivative, glycerin monostearate, polyoxyethylene list
Oleate, sorbitan monolaurate, Span 40, removes water sorbierite list at Brij92
Stearate removes water sorbierite tristearate, removes water sorbitol monooleate, remove water sorbitol sesquioleate, remove Shui Shan
Pears alcohol trioleate, polyoxyethylene oxypropylene oleate, six stearate of polyoxyethylene sorbitol, fatty acid mixed and resin acid
Polyoxyethylene esters, polyoxyethylene sorbitol lanolin derivative, polyoxyethylene alkylaryl ether, polyoxyethylene sorbitol bee
Wax derivative, polyoxyethylene monopalmitate, polyethylene glycol monopalmitate, polyoxyethylene sorbitan trioleate, four
Ethylene glycol monolaurate, Vinlub 73, polyoxyethylene laurel ether, Aceonon 300 MO, polyoxyethylene
Monoleate, six ethylene glycol monostearates, propylene glycol monostearate, polyoxyethylene oxypropylene stearate, N- hexadecane
Base-N-ethylmorpholine base sodium ethylsulfate, alkylaryl sulfonates, polyoxypropylene stearate, polyoxyethylene laurel ether, polyoxy
Ethylene octadecyl alcolol, removes water sorbitan laurate, Span 40, ethylene glycol at diethylene glycol monolaurate
Diglycidyl ether, polyethyleneglycol diglycidylether, propylene glycol bisglycidyl ether, polypropylene glycol bisglycidyl ether, 1,
2,3- propanetriol-diglycidyl-ethers and butanediol bisglycidyl ether.
11. polymer composite according to claim 9, which is characterized in that the emulsifier is polyalcohol.
12. polymer composite according to claim 9, which is characterized in that poly- ethylenedioxythiophene as conductive agent,
Polystyrolsulfon acid is as dispersing agent, and the emulsifier is used as conductive auxiliary agent and dispersing agent simultaneously, and the emulsifier accounts for
20 to 30 weight % of the polymer composite.
13. polymer composite according to claim 9, which is characterized in that the D50 of the polymer composite is flat
Equal partial size is between 1 to 25 nanometer.
14. a kind of capacitor packaging structure, which is characterized in that the capacitor packaging structure includes an at least capacitor, at least
One negative pole part of one capacitor uses polymer composite as claimed in claim 9.
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| CN113410058A (en) * | 2020-03-16 | 2021-09-17 | 钰邦科技股份有限公司 | Capacitor unit and method for manufacturing the same |
| CN113410057A (en) * | 2020-03-16 | 2021-09-17 | 钰邦科技股份有限公司 | Capacitor unit and method for manufacturing the same |
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