CN109933931B - Method for detecting whether back drilling target layer is set correctly - Google Patents
Method for detecting whether back drilling target layer is set correctly Download PDFInfo
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- CN109933931B CN109933931B CN201910217431.6A CN201910217431A CN109933931B CN 109933931 B CN109933931 B CN 109933931B CN 201910217431 A CN201910217431 A CN 201910217431A CN 109933931 B CN109933931 B CN 109933931B
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- 238000005553 drilling Methods 0.000 title claims abstract description 219
- 238000000034 method Methods 0.000 title claims abstract description 67
- 238000003860 storage Methods 0.000 claims abstract description 14
- 230000004044 response Effects 0.000 claims abstract description 9
- 230000006870 function Effects 0.000 claims description 14
- 238000004590 computer program Methods 0.000 claims description 11
- 238000012216 screening Methods 0.000 claims description 11
- 238000001514 detection method Methods 0.000 abstract description 12
- 239000010410 layer Substances 0.000 description 178
- 230000008054 signal transmission Effects 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
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Abstract
The application discloses a method for detecting whether a back drilling target layer is correctly arranged, which can be used for determining a target wiring layer of a drilling hole where a back drilling hole is located in response to an instruction for detecting the back drilling target layer, judging whether a layer adjacent to the back drilling target layer along the back drilling direction is the target wiring layer, if so, judging that the back drilling target layer is correctly arranged, and if not, judging that the back drilling target layer is incorrectly arranged. Therefore, the method can automatically judge whether the back drilling target layer is correctly set according to the target routing layer, avoids the traditional manual detection process, saves time and labor, and remarkably improves the detection efficiency. In addition, the application also provides a device, equipment and a computer readable storage medium for detecting whether the back drilling target layer is correctly arranged, and the function of the device corresponds to the method.
Description
Technical Field
The present application relates to the field of electronics, and in particular, to a method, apparatus, device, and computer readable storage medium for detecting whether a backdrilling target layer is properly set.
Background
The printed circuit board (Printed Circuit Board, PCB) is an important component of physical support and signal transmission of electronic products, and a section of useless hole copper part in a metallized hole (Plated through hole, PTH) in the PCB increases the loss of signal transmission in the PCB, avoids reflection, scattering, delay and the like of high-speed signal transmission, and damages the integrity of the signal transmission, so that a back drilling mode is often used in the industry to reduce the length of the section of hole copper part in the PTH as much as possible so as to lighten the influence of the back drilling mode on the signal transmission of the PCB.
The back drill is a special type of depth control drill, and in the manufacturing of a multi-layer board, it is assumed that 40 layers of boards need to be manufactured at present, and a 1 st layer needs to be connected to a 20 th layer (wherein the 20 th layer is a target routing layer), and the processing mode in the normal case is as follows: the vias were drilled directly first (i.e. drilled through from layer 1 to layer 40) and then Chen Tong so that layer 1 was directly connected to layer 40, since in practice we only need layer 1 to layer 20, and layers 21 to 40 are redundant, we use it to drill it off the back (only from layer 40 to layer 21, where layer 21 is the backing target).
For back drilling, the distance from the outermost end of the useless hole copper to the target routing layer is as short as possible, and the inability to drill through the target routing layer is a key indicator for measuring the back drilling performance. At present, in the design process of a PCB board card, whether the setting of a back drilling target layer is required to be checked correctly or not is often required, the checking work is mainly finished by manpower at present, and when more holes needing back drilling are needed on the PCB board, more time and labor are consumed in the checking work, so that the detection efficiency is lower.
Disclosure of Invention
The application aims to provide a method, a device, equipment and a computer readable storage medium for detecting whether a back drilling target layer is correctly set, which are used for solving the problems that the detection efficiency is lower because the current work for detecting whether the back drilling target layer is correctly set is mainly realized by manpower and the process consumes more time and manpower.
In order to solve the technical problems, the application provides a method for detecting whether a back drilling target layer is correctly arranged, which comprises the following steps:
responding to an instruction for detecting the back drilling target layer, and determining a target wiring layer of a drilling hole where the back drilling hole is located;
judging whether a layer adjacent to the back drilling target layer along the back drilling direction is the target wiring layer;
if yes, judging that the back drilling target layer is set correctly, otherwise, judging that the setting is wrong.
Optionally, the determining, in response to the instruction for detecting the back drilling target layer, the target routing layer of the drill hole where the back drilling hole is located specifically includes:
responding to an instruction for detecting the back drilling target layer, and acquiring drilling information of a plurality of drilling holes on the PCB;
screening target drilling holes to be backdrilled from the plurality of drilling holes according to the drilling information;
and determining a target routing layer of the target borehole.
Optionally, the determining whether the layer adjacent to the backdrilling target layer along the backdrilling direction is the target routing layer specifically includes:
obtaining vertex coordinates of the back drilling hole, and determining the back drilling target layer according to the vertex coordinates;
and judging whether a layer adjacent to the back drilling target layer along the back drilling direction is the target routing layer.
Optionally, after the determining whether the layer adjacent to the backdrilling target layer along the backdrilling direction is the target routing layer, the method further includes:
and if the layer is not the target routing layer, prompting a user to modify the back drilling target layer.
Optionally, the determining, in response to the instruction for detecting the back drilling target layer, the target routing layer of the drill hole where the back drilling hole is located specifically includes:
and in response to an instruction for detecting the back drilling target layer, invoking an target function preset in the wiring tool to determine a target wiring layer of the drilling hole where the back drilling hole is located.
Optionally, the objective function is implemented based on CADENCE AXLSLKILL.
Correspondingly, the application also provides a device for detecting whether the back drilling target layer is correctly arranged, which comprises:
the target routing layer determining module: the method comprises the steps of responding to an instruction for detecting a back drilling target layer, and determining a target wiring layer of a drilling hole where the back drilling hole is located;
the target routing layer judging module: the method comprises the steps of judging whether a layer adjacent to the back drilling target layer along the back drilling direction is the target wiring layer or not;
and the judgment result output module is used for: and the method is used for judging that the back drilling target layer is set correctly when the layer is the target routing layer, or judging that the setting is wrong.
Optionally, the target routing layer determining module specifically includes:
drilling information acquisition unit: the method comprises the steps of responding to an instruction for detecting a back drilling target layer, and acquiring drilling information of a plurality of drilling holes on a PCB;
drilling and screening unit: the target drilling holes are used for screening target drilling holes to be backdrilled from the plurality of drilling holes according to the drilling hole information;
target routing layer determining unit: and the target routing layer is used for determining the target drilling hole.
In addition, the application also provides equipment for detecting whether the back drilling target layer is correctly arranged, which comprises the following steps:
a memory: for storing a computer program;
a processor: for executing the computer program to implement the steps of a method of detecting whether a backdrilling target layer is properly set as described in any of the above.
Finally, the present application also provides a computer readable storage medium having stored thereon a computer program for implementing the steps of a method of detecting whether a backdrilling target layer is properly set as described in any of the above, when the computer program is executed by a processor.
The method for detecting whether the back drilling target layer is correctly arranged can be used for determining the target wiring layer of the drilling hole where the back drilling hole is located in response to the instruction for detecting the back drilling target layer, judging whether the layer adjacent to the back drilling target layer along the back drilling direction is the target wiring layer, if so, judging that the back drilling target layer is correctly arranged, and if not, judging that the arrangement is wrong. Therefore, the method can automatically judge whether the back drilling target layer is correctly set according to the target routing layer, avoids the traditional manual detection process, saves time and labor, and remarkably improves the detection efficiency.
In addition, the application also provides a device, equipment and a computer readable storage medium for detecting whether the back drilling target layer is correctly set, and the function of the device and the equipment corresponds to the method, and the description is omitted herein.
Drawings
For a clearer description of embodiments of the application or of the prior art, the drawings that are used in the description of the embodiments or of the prior art will be briefly described, it being apparent that the drawings in the description below are only some embodiments of the application, and that other drawings can be obtained from them without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of a method for detecting whether a back drilling target layer is set correctly according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a backboard structure in an embodiment of a method for detecting whether a backing target layer is properly disposed according to the present application;
FIG. 3 is a flowchart illustrating a second embodiment of a method for detecting whether a backing drill target layer is properly set;
FIG. 4 is a functional block diagram of an embodiment of an apparatus for detecting whether a backdrilling target layer is properly set according to the present application;
fig. 5 is a schematic structural diagram of an embodiment of an apparatus for detecting whether a back drill target layer is properly set according to the present application.
Detailed Description
The core of the application is to provide a method, a device, equipment and a computer readable storage medium for detecting whether the back drilling target layer is correctly set, so that the aim of automatically detecting whether the back drilling target layer is correctly set is fulfilled, a manual detection process is avoided, and the detection efficiency is remarkably improved.
In order to better understand the aspects of the present application, the present application will be described in further detail with reference to the accompanying drawings and detailed description. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the following, an embodiment of a method for detecting whether a backing drill target layer is properly set is described, referring to fig. 1, where the embodiment includes:
step S101: and responding to the instruction for detecting the back drilling target layer, and determining the target routing layer of the drilling hole where the back drilling hole is located.
The present embodiment aims to determine whether the back drilling parameters are set correctly before back drilling of the physical hardware, specifically, whether the back drilling target layer is set correctly.
The concepts of backdrilling, backdrilling target layer, backdrilling, target routing layer, and backdrilling direction that will appear below are described below: as shown in fig. 2, in the case of manufacturing a PCB board, assuming that the PCB board has 10 layers, a surface layer on one side of the PCB board needs to be provided with a chip (or other device, where the chip is only one possible case), and the chip needs to be connected to the 6 th layer, typically, the processing is that a through hole is directly drilled first (i.e. from the 1 st layer to the 10 th layer), and then the surface side Chen Tong is drilled, so that the 1 st layer is directly connected to the 10 th layer, but since only the 1 st layer is actually required to be connected to the 6 th layer, the 7 th to 10 th layers are redundant, during the signal transmission, the through hole section from the solder surface to the 7 th layer does not actually play any role in linking or transmission, and the existence of the through hole section is easy to cause reflection, scattering, delay, etc. of the signal transmission, so that in order to avoid causing reflection, scattering, delay of the signal transmission, we drill the section from the reverse side (i.e. from the 10 th layer to the 7 th layer). In summary, the back drill is actually to drill out the through hole section that does not play any role in connection or signal transmission, as shown in fig. 2, the back drill target layer refers to the layer farthest from the surface layer of the PCB board among all the back drill layers, the back drill refers to the hole formed after the back drill, the target routing layer refers to the layer farthest from the PCB board among all the layers that do not pass through the back drill, and the back drill direction refers to the travelling direction of the drill bit during the back drill.
Step S102: and judging whether the layer adjacent to the back drilling target layer along the back drilling direction is the target wiring layer, if so, proceeding to step S103, otherwise, proceeding to step S104.
Specifically, the adjacent layers specifically refer to a first layer that appears in the back drilling direction with the back drilling target layer as a starting point, or a layer adjacent to the back drilling target layer. As described above, for the back drilling, the distance from the outermost end of the copper with no hole to the target routing layer is as short as possible, and the inability to drill through the target routing layer is a key indicator for measuring the back drilling performance, so the embodiment determines whether the back drilling target layer is set reasonably according to the above.
Step S103: and judging that the back drilling target layer is correctly arranged.
Step S104: a setting error is determined.
According to the method for detecting whether the back drilling target layer is correctly set or not, the target wiring layer of the drilling hole where the back drilling hole is located can be determined in response to the instruction for detecting the back drilling target layer, whether the layer adjacent to the back drilling target layer along the back drilling direction is the target wiring layer or not is judged, if yes, the back drilling target layer is correctly set, and if not, the setting is wrong. Therefore, the method can automatically judge whether the back drilling target layer is correctly set according to the target routing layer, avoids the traditional manual detection process, saves time and labor, and remarkably improves the detection efficiency.
The second embodiment of the method for detecting whether the back drilling target layer is correctly set according to the present application is implemented based on the first embodiment, and is expanded to a certain extent based on the first embodiment.
Specifically, referring to fig. 3, the second embodiment specifically includes:
step S201: and in response to an instruction for detecting the back drilling target layer, calling a target function preset in the wiring tool to acquire drilling information of a plurality of drilling holes on the PCB.
Specifically, the PCB board includes a plurality of holes, including holes that need to be backed up, as well as holes that do not need to be backed up. The drilling information includes, but is not limited to, information that the drilling needs to be backed up, so that the drilling needing to be backed up can be screened out according to the drilling information in the subsequent process. It should be noted that the objective function is used to perform all the processes from step S201 to step S205, and the setting of the objective function in the wiring tool is merely a preferred implementation provided in the present embodiment, and the present embodiment is not limited thereto specifically. As an alternative embodiment, the objective function is implemented based on a CADENCE AXLSLKILL, which is a development language based on wiring design software.
Step S202: and screening target drilling holes to be backdrilled from the plurality of drilling holes according to the drilling hole information, and determining a first set consisting of the target drilling holes.
Step S203: and traversing each target drilling hole in the first set, and determining a target routing layer of the target drilling hole.
Step S204: and judging whether a layer adjacent to the back drilling target layer of the target drilling hole along the back drilling direction is the target routing layer. If not, the process advances to step S205.
Specifically, the present embodiment may determine the back drilling target layer by acquiring the vertex coordinates of the back drilling.
Step S205: and classifying the target drilling holes into a second set, and prompting a user to modify the back drilling target layer of each target drilling hole in the second set until the second set is empty.
The embodiment also provides a simulation experiment, in which one layer of the board card with back drilling parameters is set, including the back drilling layer, the target routing layer and the number of back drilling holes. The distribution areas of the back drilling holes are quite scattered, the lines of the target line layer comprise back drilling needing and back drilling not needing, if the back drilling holes are manually inspected, the back drilling holes are 607 back drilling holes, if the back drilling holes are inspected according to the minimum 5S time of each network, the back drilling holes are about 1 hour, and the time of 607 times is saved by only 5S when the scheme of the embodiment is applied. In addition, the manual inspection is very easy to miss, and the scheme of the embodiment greatly reduces the workload of PCB wiring design engineers and also greatly improves the design quality of the board card.
In summary, the method for detecting whether the back drilling target layer is correctly set can automatically judge whether the back drilling target layer is correctly set according to the target routing layer, so that the traditional manual detection process is avoided, time and labor are saved, in addition, the misjudgment rate is reduced, and the detection efficiency is remarkably improved.
The following describes an embodiment of a device for detecting whether a back drilling target layer is properly set, and the device for detecting whether the back drilling target layer is properly set and the method for detecting whether the back drilling target layer is properly set described above may be referred to correspondingly.
As shown in fig. 4, the apparatus includes:
target routing layer determination module 401: the method comprises the steps of responding to an instruction for detecting a back drilling target layer, and determining a target wiring layer of a drilling hole where the back drilling hole is located;
target routing layer determination module 402: the method comprises the steps of judging whether a layer adjacent to the back drilling target layer along the back drilling direction is the target wiring layer or not;
the judgment result output module 403: and the method is used for judging that the back drilling target layer is set correctly when the layer is the target routing layer, or judging that the setting is wrong.
As an optional implementation manner, the target routing layer determining module 401 specifically includes:
drilling information acquisition unit: the method comprises the steps of responding to an instruction for detecting a back drilling target layer, and acquiring drilling information of a plurality of drilling holes on a PCB;
drilling and screening unit: the target drilling holes are used for screening target drilling holes to be backdrilled from the plurality of drilling holes according to the drilling hole information;
target routing layer determining unit: and the target routing layer is used for determining the target drilling hole.
The device for detecting whether the back drilling target layer is properly set is used to implement the foregoing method for detecting whether the back drilling target layer is properly set, so that the specific embodiment of the device can be seen from the foregoing example portion of a method for detecting whether the back drilling target layer is properly set, for example, the target routing layer determining module 401, the target routing layer judging module 402, and the judging result outputting module 403, which are respectively used to implement steps S101, S102, S103, and S104 in the foregoing method for detecting whether the back drilling target layer is properly set. Therefore, the detailed description will be omitted herein with reference to the accompanying drawings, which illustrate examples of the respective parts.
In addition, since the device for detecting whether the back drilling target layer is properly set is used to implement the method for detecting whether the back drilling target layer is properly set, the function of the device corresponds to that of the method, and the description thereof is omitted herein.
In addition, the application also provides a device for detecting whether the back drilling target layer is correctly arranged, as shown in fig. 5, comprising:
memory 501: for storing a computer program;
the processor 502: for executing the computer program to implement the steps of a method of detecting whether a backdrilling target layer is properly set as described in any of the above.
Finally, the present application also provides a computer readable storage medium having stored thereon a computer program for implementing the steps of a method of detecting whether a backdrilling target layer is properly set as described in any of the above, when the computer program is executed by a processor.
The device for detecting whether the back drilling target layer is properly set and the computer readable storage medium are used to implement the foregoing method for detecting whether the back drilling target layer is properly set, so that the specific implementation of the device and the computer readable storage medium can be seen from the foregoing example part of the method for detecting whether the back drilling target layer is properly set, and the functions of the device and the computer readable storage medium correspond to the foregoing method, and are not repeated herein.
In this specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, so that the same or similar parts between the embodiments are referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative elements and steps are described above generally in terms of functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software modules may be disposed in Random Access Memory (RAM), memory, read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The method, the device, the equipment and the computer readable storage medium for detecting whether the back drilling target layer is correctly set are described in detail. The principles and embodiments of the present application have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present application and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the application can be made without departing from the principles of the application and these modifications and adaptations are intended to be within the scope of the application as defined in the following claims.
Claims (9)
1. A method of detecting whether a backdrilling target layer is properly positioned, comprising:
responding to an instruction for detecting the back drilling target layer, and determining a target wiring layer of a drilling hole where the back drilling hole is located;
judging whether a layer adjacent to the back drilling target layer along the back drilling direction is the target wiring layer;
if yes, judging that the back drilling target layer is set correctly, otherwise, judging that the back drilling target layer is set incorrectly;
the determining the target routing layer of the borehole where the back drilling hole is located in response to the instruction for detecting the back drilling target layer specifically comprises the following steps:
responding to an instruction for detecting a back drilling target layer, and calling a target function preset in a wiring tool to determine a target wiring layer of a drilling hole where the back drilling hole is located;
the objective function is used to:
acquiring drilling information of a plurality of drilling holes on a PCB;
screening target drilling holes to be backdrilled from a plurality of drilling holes according to the drilling information, and determining a first set composed of the target drilling holes;
traversing each target borehole in the first set, and determining a target routing layer of the target borehole;
and judging whether a layer adjacent to the backdrilling target layer of the target drilling hole along the backdrilling direction is the target routing layer.
2. The method of claim 1, wherein the determining the target routing layer of the borehole in which the backdrilled hole is located in response to the instruction to detect the backdrilled target layer comprises:
responding to an instruction for detecting the back drilling target layer, and acquiring drilling information of a plurality of drilling holes on the PCB;
screening target drilling holes to be backdrilled from the plurality of drilling holes according to the drilling information;
and determining a target routing layer of the target borehole.
3. The method of claim 2, wherein the determining whether a layer adjacent to the backdrilling target layer in a backdrilling direction is the target routing layer comprises:
obtaining vertex coordinates of the back drilling hole, and determining the back drilling target layer according to the vertex coordinates;
and judging whether a layer adjacent to the back drilling target layer along the back drilling direction is the target routing layer.
4. The method of claim 3, further comprising, after said determining whether a layer adjacent to the backdrilling target layer in a backdrilling direction is the target routing layer:
and if the layer is not the target routing layer, prompting a user to modify the back drilling target layer.
5. The method of claim 1, wherein the objective function is implemented based on a CADENCE AXLSLKILL.
6. An apparatus for detecting whether a backdrilling target layer is properly positioned, comprising:
the target routing layer determining module: the method comprises the steps of responding to an instruction for detecting a back drilling target layer, and determining a target wiring layer of a drilling hole where the back drilling hole is located;
the target routing layer judging module: the method comprises the steps of judging whether a layer adjacent to the back drilling target layer along the back drilling direction is the target wiring layer or not;
and the judgment result output module is used for: the method is used for judging that the back drilling target layer is set correctly when the layer is the target wiring layer, otherwise, judging that the setting is wrong;
the target routing layer determining module is specifically configured to: responding to an instruction for detecting a back drilling target layer, and calling a target function preset in a wiring tool to determine a target wiring layer of a drilling hole where the back drilling hole is located; the objective function is used to: acquiring drilling information of a plurality of drilling holes on a PCB; screening target drilling holes to be backdrilled from a plurality of drilling holes according to the drilling information, and determining a first set composed of the target drilling holes; traversing each target borehole in the first set, and determining a target routing layer of the target borehole; and judging whether a layer adjacent to the backdrilling target layer of the target drilling hole along the backdrilling direction is the target routing layer.
7. The apparatus of claim 6, wherein the target routing layer determination module specifically comprises:
drilling information acquisition unit: the method comprises the steps of responding to an instruction for detecting a back drilling target layer, and acquiring drilling information of a plurality of drilling holes on a PCB;
drilling and screening unit: the target drilling holes are used for screening target drilling holes to be backdrilled from the plurality of drilling holes according to the drilling hole information;
target routing layer determining unit: and the target routing layer is used for determining the target drilling hole.
8. An apparatus for detecting whether a backdrilling target layer is properly set, comprising:
a memory: for storing a computer program;
a processor: steps for executing the computer program to implement a method of detecting whether a backdrilling target layer is properly set according to any one of claims 1-5.
9. A computer-readable storage medium, characterized in that the computer-readable storage medium has stored thereon a computer program for implementing the steps of a method of detecting whether a backdrilling target layer is properly set according to any of claims 1-5 when executed by a processor.
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| CN110502848B (en) * | 2019-08-27 | 2023-09-01 | 京信网络***股份有限公司 | Method, device, equipment and storage medium for deleting back drilling holes in PCB design drawing |
| CN111257723B (en) * | 2020-01-12 | 2022-06-21 | 苏州浪潮智能科技有限公司 | Back drilling inspection method, system, equipment and medium |
| CN112328554B (en) * | 2020-11-23 | 2022-09-13 | 迈普通信技术股份有限公司 | Method and device for generating secondary drilling file, electronic equipment and storage medium |
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|---|---|
| CN109933931A (en) | 2019-06-25 |
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