CN113352397B - Drilling method, system, device, equipment and storage medium for multilayer board - Google Patents
Drilling method, system, device, equipment and storage medium for multilayer board Download PDFInfo
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- CN113352397B CN113352397B CN202110726667.XA CN202110726667A CN113352397B CN 113352397 B CN113352397 B CN 113352397B CN 202110726667 A CN202110726667 A CN 202110726667A CN 113352397 B CN113352397 B CN 113352397B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/16—Perforating by tool or tools of the drill type
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F2210/00—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products
- B26F2210/08—Perforating, punching, cutting-out, stamping-out, severing by means other than cutting of specific products of ceramic green sheets, printed circuit boards and the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
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- Forests & Forestry (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The application relates to a drilling method, a system, a device, equipment and a storage medium of a multilayer board, wherein the method comprises the steps of determining an initial positioning hole drilled on the multilayer board for the first time; taking the initial positioning hole drilled for the first time as a coordinate origin, and establishing a coordinate system of the multilayer board; determining coordinates of holes to be drilled on the multilayer board in a coordinate system based on a preset first drilling interval, a second drilling interval and coordinates of initial positioning holes drilled for the first time, wherein the first drilling interval indicates a distance between two adjacent positioning holes with the same vertical coordinate, and the second drilling interval indicates a distance between two adjacent positioning holes with the same horizontal coordinate; and controlling the drilling equipment to drill the multilayer board according to the coordinates of the to-be-drilled holes. Since the coordinates of the holes to be drilled can be determined, the drilling apparatus can sequentially drill holes in the multi-layer board based on the coordinates.
Description
Technical Field
The present disclosure relates to the field of printed circuit boards, and in particular, to a method, a system, a device, equipment, and a storage medium for drilling a multilayer board.
Background
The printed circuit board is a carrier of a control circuit on the electronic equipment and is an important electrical device on the electronic equipment. In mass production of printed circuit boards, it is often necessary to drill holes in a plurality of boards simultaneously, specifically, to fix each bakelite board with a pin machine, then to find a place where holes are not drilled in the bakelite board, and to randomly determine an area from the place where holes are not drilled.
When the existing drilling scheme is adopted for drilling, the electric wood board cannot be reasonably utilized because the drilling is carried out irregularly.
Disclosure of Invention
The application provides a drilling method, a drilling system, a drilling device, a drilling equipment and a drilling storage medium for a multilayer board, which are used for solving the problem that a bakelite board cannot be reasonably utilized in the related technology.
In a first aspect, a method for drilling a multi-layer board is provided, comprising:
determining an initial positioning hole drilled for the first time on the multilayer board;
establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin;
determining coordinates of holes to be drilled on the multi-layer board under the coordinate system based on a preset first drilling interval, a second drilling interval and coordinates of the initial positioning holes to be drilled for the first time, wherein the first drilling interval indicates a distance between two adjacent positioning holes with the same vertical coordinate, and the second drilling interval indicates a distance between two adjacent positioning holes with the same horizontal coordinate;
and controlling the drilling equipment to drill the multilayer board according to the coordinates of the to-be-drilled holes.
Optionally, determining the initial pilot hole first drilled in the multiwall sheet comprises:
identifying a region sprayed with a preset code on the multilayer board;
and determining the area as the initial positioning hole drilled for the first time.
Optionally, determining the coordinates of the holes to be drilled on the multi-layer board in the coordinate system based on the preset first hole drilling interval, second hole drilling interval and the coordinates of the initial positioning holes to be drilled for the first time, including:
determining coordinates on the multi-layer board for indicating the initial locating holes in each set of locating holes based on the ordinate of the initial locating holes drilled for the first time and the second drilling interval;
determining any one initial positioning hole as a target positioning hole, and determining the coordinates of each positioning hole which is positioned in the same row with the target positioning hole on the multilayer board based on the abscissa of the target positioning hole and the first drilling interval;
and determining the coordinates of each positioning hole in the same row with the target positioning hole as the coordinates of a drilling hole to be drilled on the multilayer board.
Optionally, determining coordinates on the multi-layer board for indicating the initial locating holes in each set of locating holes based on the ordinate of the initial locating holes drilled for the first time and the second drilling pitch, including:
obtaining an ordinate of at least one point based on the ordinate and the second borehole spacing;
acquiring the dimension of the multilayer board in the longitudinal axis direction of the coordinate system;
determining an ordinate of a last point of the multiwall sheet in the longitudinal axis direction based on the dimensions;
screening target points from the at least one point whose ordinate is not greater than the ordinate of the last point based on the ordinate of the at least one point;
and determining the coordinates of the target point as the coordinates of the initial positioning holes in each row of positioning holes.
Optionally, determining coordinates of each positioning hole on the multilayer board in the same row as the target positioning hole based on the abscissa of the target positioning hole and the first drill hole pitch includes:
determining an abscissa of at least one point based on the abscissa of the target locating hole and the first borehole spacing;
acquiring the dimension of the multilayer board in the transverse axis direction of the coordinate system;
determining an abscissa of a last point of the multi-layer board in the transverse axis direction based on the dimension;
screening target points from the at least one point whose abscissa is not greater than the abscissa of the last point based on the abscissa of the at least one point;
and determining the coordinates of the target point as the coordinates of each positioning hole which is positioned in the same row with the target positioning hole on the multilayer board.
Optionally, controlling a drilling device to drill the multilayer board according to the coordinates of the to-be-drilled hole, including:
classifying the drill holes to be drilled according to the coordinates of the drill holes to be drilled to obtain at least one drill hole set, wherein the drill holes in each drill hole set have the same ordinate;
and controlling the drilling equipment to drill the multilayer board according to the drilling sets in the at least one drilling set one by one in the order of the ordinate from small to large.
In a second aspect, there is provided a drilling system comprising:
multilayer board, drilling device and drilling equipment of multilayer board;
the drilling device of the multilayer board is used for determining an initial positioning hole drilled on the multilayer board for the first time; establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin; determining coordinates of holes to be drilled on the multi-layer board under the coordinate system based on a preset first drilling interval, a second drilling interval and coordinates of the initial positioning holes to be drilled for the first time, wherein the first drilling interval indicates a distance between two adjacent positioning holes with the same vertical coordinate, and the second drilling interval indicates a distance between two adjacent positioning holes with the same horizontal coordinate; and controlling the drilling equipment to drill the multilayer board according to the coordinates of the to-be-drilled holes.
In a third aspect, there is provided a drilling apparatus for a multiwall sheet, comprising:
the first determining unit is used for determining an initial positioning hole drilled for the first time on the multilayer board;
the establishing unit is used for establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin;
a second determining unit configured to determine coordinates of a hole to be drilled on the multilayer board in the coordinate system based on a preset first drill hole pitch indicating a distance between two adjacent positioning holes having the same ordinate, a second drill hole pitch indicating a distance between two adjacent positioning holes having the same abscissa, and coordinates of the first drilled initial positioning hole;
and the control unit is used for controlling the drilling equipment to drill the multilayer board according to the coordinates of the to-be-drilled holes.
An electronic device is provided, comprising: the device comprises a processor, a memory and a communication bus, wherein the processor and the memory are communicated with each other through the communication bus;
the memory is used for storing a computer program;
the processor is configured to execute the program stored in the memory, and implement the drilling method of the multilayer board according to the first aspect.
In a fifth aspect, a computer readable storage medium is provided, storing a computer program which, when executed by a processor, implements the method for drilling a multiwall sheet according to the first aspect.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages: according to the technical scheme provided by the embodiment of the application, the initial positioning hole drilled for the first time on the multilayer board is determined; taking the initial positioning hole drilled for the first time as a coordinate origin, and establishing a coordinate system of the multilayer board; determining coordinates of holes to be drilled on the multilayer board in a coordinate system based on a preset first drilling interval, a second drilling interval and coordinates of initial positioning holes drilled for the first time, wherein the first drilling interval indicates a distance between two adjacent positioning holes with the same vertical coordinate, and the second drilling interval indicates a distance between two adjacent positioning holes with the same horizontal coordinate; and controlling the drilling equipment to drill the multilayer board according to the coordinates of the to-be-drilled holes. Since the coordinates of the holes to be drilled can be determined, the drilling apparatus can sequentially drill holes in the multi-layer board based on the coordinates.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
In order to more clearly illustrate the embodiments of the invention or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to a person skilled in the art that other drawings can be obtained from these drawings without inventive effort.
FIG. 1 is a schematic flow chart of a drilling method for a multi-layer board according to an embodiment of the present application;
FIG. 2 is a schematic flow chart of a method for drilling a multi-layer board according to an embodiment of the present application;
FIG. 3 is a schematic structural view of a drilling device for a multi-layer board according to an embodiment of the present application;
FIG. 4 is a schematic structural diagram of a drilling system according to an embodiment of the present application;
fig. 5 is a schematic structural diagram of an electronic device in an embodiment of the present application.
Detailed Description
For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present application based on the embodiments herein.
It should be noted that the terms "first," "second," and the like in the description and claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the present application described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The embodiment of the application provides a drilling method of a multilayer board, which can be applied to any electronic equipment, as shown in fig. 1, and comprises the following steps:
and 101, determining an initial positioning hole drilled on the multilayer board for the first time.
In the application, the initial positioning hole for the first drilling can be any drilling hole drilled on the multi-layer board, namely, a drilling hole can be randomly drilled on the multi-layer board as the initial positioning hole for the first drilling. Typically will be in the upper left, upper right, lower left or lower right corner of the multiwall sheet.
In order to be able to identify the initial pilot hole on the multiwall sheet, a pre-set code may be sprayed on the initial pilot hole drilled, and the first initial pilot hole drilled is identified by identifying the area of the multiwall sheet sprayed with the pre-set code.
And 102, establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin.
It should be appreciated that when the initial pilot hole that is first drilled is the origin of coordinates, the coordinates of the initial pilot hole are (0, 0).
Taking the initial locating hole drilled for the first time as an example in the upper left corner of the multiwall sheet, the transverse and longitudinal axes of the multiwall sheet coordinate system established at this time may be along the directions in which the two edges wrap the upper left corner.
And step 103, determining the coordinates of the holes to be drilled on the multilayer board in a coordinate system based on the preset first drilling interval, the second drilling interval and the coordinates of the initial positioning holes to be drilled for the first time.
Wherein the first borehole spacing indicates a distance between two adjacent positioning holes having the same ordinate and the second borehole spacing indicates a distance between two adjacent positioning holes having the same abscissa.
In application, the first and second borehole spacings may be artificially set empirically.
In application, when determining the coordinates of a borehole to be drilled in a multiwall sheet, this can be achieved in two ways:
in the first mode, the coordinates of the initial positioning holes in each row of positioning holes in the longitudinal axis direction of the coordinate system are determined based on the ordinate of the initial positioning holes drilled for the first time and the second drilling interval, and then the coordinates of the holes to be drilled on the multilayer board are determined based on the coordinates of the initial positioning holes in each row of positioning holes.
In particular, referring to fig. 2, step 103 may include the following steps:
Defining the second hole pitch as y, the ordinate of the first drilled pilot hole is (0, 0), and then the coordinate of the pilot hole in the row of pilot holes closest to the first drilled pilot hole is (0, y).
In applications, since the size of the multilayer plate is generally limited, the coordinates of the initial positioning holes in each set of positioning holes are determined in combination with the size of the multilayer plate in order to save the amount of calculation.
Specifically, obtaining an ordinate of at least one point based on the ordinate and the second borehole spacing; acquiring the dimension of the multilayer board in the longitudinal axis direction of a coordinate system; determining the ordinate of the last point of the multilayer board in the longitudinal axis direction based on the dimensions; screening target points with the ordinate of not more than the ordinate of the last point from the at least one point based on the ordinate of the at least one point; and determining the coordinates of the target point as the coordinates of the initial locating holes in each row of locating holes.
Defining the first hole pitch as x and the coordinates of the target positioning hole as (0, y), then the coordinates of one positioning hole which is in the same row as the target positioning hole and closest to the target positioning hole is (x, y).
In applications, since the size of the multilayer plate is generally limited, the coordinates of the initial positioning holes in each set of positioning holes are determined in combination with the size of the multilayer plate in order to save the amount of calculation.
Specifically, determining an abscissa of at least one point based on an abscissa of the target locating hole and the first borehole spacing; acquiring the dimension of the multilayer board in the transverse axis direction of a coordinate system; determining the abscissa of the last point of the multilayer board in the transverse axis direction based on the size; screening target points with the abscissa not larger than the abscissa of the last point from the at least one point based on the abscissa of the at least one point; and determining the coordinates of the target point as the coordinates of each positioning hole which is positioned in the same row with the target positioning hole on the multi-layer board.
And 203, determining the coordinates of each positioning hole in the same row as the target positioning hole as the coordinates of a drilling hole to be drilled on the multilayer board.
And determining the coordinates of the initial positioning holes in each row of positioning holes in the transverse axis direction of the coordinate system based on the abscissa of the initial positioning holes drilled for the first time and the first drilling interval, and then determining the coordinates of the holes to be drilled on the multilayer board based on the coordinates of the initial positioning holes in each row of positioning holes.
This procedure is similar to the procedure in the first mode, and the detailed description will not be repeated.
And 104, controlling the drilling equipment to drill the multilayer board according to the coordinates of the to-be-drilled holes.
In order to improve the drilling efficiency, when drilling the multiwall sheet, the multiwall sheet may be drilled in a row unit.
Specifically, classifying the drill holes to be drilled according to the coordinates of the drill holes to be drilled to obtain at least one drill hole set, wherein the drill holes in each drill hole set have the same ordinate; and controlling the drilling equipment to drill holes on the multilayer board according to the sequence from the small ordinate to the large ordinate one by one according to each drilling set in at least one drilling set.
Since the boreholes in a borehole set have the same ordinate, the boreholes in the same borehole set lie in the same row in the direction of the abscissa axis.
In use, after a row of holes has been drilled in a multiwall sheet according to one set of holes, the drilling apparatus is moved to another row according to coordinates in such a way that the multiwall sheet is drilled one by one according to each set of holes.
In other embodiments, the multi-layer board may also be drilled in units of holes in the same row in the longitudinal direction, which will not be described here.
According to the technical scheme provided by the embodiment of the application, the initial positioning hole drilled for the first time on the multilayer board is determined; taking the initial positioning hole drilled for the first time as a coordinate origin, and establishing a coordinate system of the multilayer board; determining coordinates of holes to be drilled on the multilayer board in a coordinate system based on a preset first drilling interval, a second drilling interval and coordinates of initial positioning holes drilled for the first time, wherein the first drilling interval indicates a distance between two adjacent positioning holes with the same vertical coordinate, and the second drilling interval indicates a distance between two adjacent positioning holes with the same horizontal coordinate; and controlling the drilling equipment to drill the multilayer board according to the coordinates of the to-be-drilled holes. Since the coordinates of the holes to be drilled can be determined, the drilling apparatus can sequentially drill holes in the multi-layer board based on the coordinates.
Based on the same conception, the embodiment of the present application provides a drilling device for a multi-layer board, and the specific implementation of the device may be referred to the description of the embodiment of the method, and the repetition is omitted, as shown in fig. 3, where the device mainly includes:
a first determining unit 301, configured to determine an initial positioning hole drilled for the first time on the multilayer board;
the establishing unit 302 is configured to establish a coordinate system of the multi-layer board by using the initial positioning hole drilled for the first time as a coordinate origin;
a second determining unit 303 for determining coordinates of holes to be drilled on the multi-layer board under a coordinate system based on a preset first drill hole pitch indicating a distance between two adjacent positioning holes having the same ordinate, a second drill hole pitch indicating a distance between two adjacent positioning holes having the same abscissa, and coordinates of the first drilled initial positioning holes;
and the control unit 304 is used for controlling the drilling equipment to drill the multilayer board according to the coordinates of the to-be-drilled holes.
Alternatively, the first determining unit 301 is configured to:
identifying a region sprayed with a preset code on the multilayer board;
the area is determined as the initial pilot hole that was first drilled.
Alternatively, the second determining unit 303 is configured to:
determining coordinates on the multi-layer board for indicating the initial positioning holes in each set of positioning holes based on the ordinate of the initial positioning holes drilled for the first time and the second drilling interval;
determining any one initial positioning hole as a target positioning hole, and determining the coordinates of each positioning hole which is positioned in the same row with the target positioning hole on the multilayer board based on the abscissa of the target positioning hole and the first drilling interval;
and determining the coordinates of each positioning hole in the same row as the target positioning hole as the coordinates of a drilling hole to be drilled on the multilayer board.
Alternatively, the second determining unit 303 is configured to:
obtaining an ordinate of the at least one point based on the ordinate and the second borehole spacing;
acquiring the dimension of the multilayer board in the longitudinal axis direction of a coordinate system;
determining the ordinate of the last point of the multilayer board in the longitudinal axis direction based on the dimensions;
screening target points with the ordinate of not more than the ordinate of the last point from the at least one point based on the ordinate of the at least one point;
and determining the coordinates of the target point as the coordinates of the initial locating holes in each row of locating holes.
Alternatively, the second determining unit 303 is configured to:
determining an abscissa of at least one point based on the abscissa of the target locating hole and the first borehole spacing;
acquiring the dimension of the multilayer board in the transverse axis direction of a coordinate system;
determining the abscissa of the last point of the multilayer board in the transverse axis direction based on the size;
screening target points with the abscissa not larger than the abscissa of the last point from the at least one point based on the abscissa of the at least one point;
and determining the coordinates of the target point as the coordinates of each positioning hole which is positioned in the same row with the target positioning hole on the multi-layer board.
Optionally, the control unit 304 is configured to:
classifying the holes to be drilled according to the coordinates of the holes to be drilled to obtain at least one drilling set, wherein the holes in each drilling set have the same ordinate;
and controlling the drilling equipment to drill holes on the multilayer board according to the sequence from the small ordinate to the large ordinate one by one according to each drilling set in at least one drilling set.
Based on the same concept, the embodiment of the present application provides a drilling system, and the specific implementation of the system may be referred to the description of the embodiment of the method, and the repetition is omitted, as shown in fig. 4, where the system mainly includes:
a multiwall sheet 401, a multiwall sheet drilling device 402, and a drilling apparatus 403;
Based on the same conception, the embodiment of the application also provides an electronic device, as shown in fig. 5, which mainly includes: processor 501, memory 502 and communication bus 503, wherein processor 501 and memory 502 accomplish the communication between each other through communication bus 503. The memory 502 stores a program executable by the processor 501, and the processor 501 executes the program stored in the memory 502 to implement the following steps:
determining an initial positioning hole drilled for the first time on the multilayer board;
taking the initial positioning hole drilled for the first time as a coordinate origin, and establishing a coordinate system of the multilayer board;
determining coordinates of holes to be drilled on the multilayer board in a coordinate system based on a preset first drilling interval, a second drilling interval and coordinates of initial positioning holes drilled for the first time, wherein the first drilling interval indicates a distance between two adjacent positioning holes with the same vertical coordinate, and the second drilling interval indicates a distance between two adjacent positioning holes with the same horizontal coordinate;
and controlling the drilling equipment to drill the multilayer board according to the coordinates of the to-be-drilled holes.
The communication bus 503 mentioned in the above electronic device may be a peripheral component interconnect standard (Peripheral Component Interconnect, abbreviated to PCI) bus or an extended industry standard architecture (Extended Industry Standard Architecture, abbreviated to EISA) bus, or the like. The communication bus 503 may be divided into an address bus, a data bus, a control bus, and the like. For ease of illustration, only one thick line is shown in fig. 5, but not only one bus or one type of bus.
The memory 502 may include random access memory (Random Access Memory, simply RAM) or may include non-volatile memory (non-volatile memory), such as at least one disk memory. Optionally, the memory may also be at least one memory device located remotely from the aforementioned processor 501.
The processor 501 may be a general-purpose processor, including a central processing unit (Central Processing Unit, CPU), a network processor (Network Processor, NP), a digital signal processor (Digital Signal Processing, DSP), an application specific integrated circuit (Application Specific Integrated Circuit, ASIC), a Field programmable gate array (Field-Programmable Gate Array, FPGA), or other programmable logic device, discrete gate or transistor logic device, or discrete hardware components.
In a further embodiment of the present application, there is also provided a computer readable storage medium having stored therein a computer program which, when run on a computer, causes the computer to perform the method of drilling a multiwall sheet described in the above embodiments.
In the above embodiments, it may be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented in software, may be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer instructions are loaded and executed on a computer, the processes or functions described in accordance with the embodiments of the present application are produced in whole or in part. The computer may be a general purpose computer, a special purpose computer, a computer network, or other programmable apparatus. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, by a wired (e.g., coaxial cable, optical fiber, digital Subscriber Line (DSL)), or wireless (e.g., infrared, microwave, etc.) means from one website, computer, server, or data center to another. The computer readable storage medium may be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. that contains an integration of one or more available media. The usable medium may be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape, etc.), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid state disk), etc.
It should be noted that in this document, relational terms such as "first" and "second" and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing is only a specific embodiment of the invention to enable those skilled in the art to understand or practice the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. A method of drilling a multi-layer board, comprising:
determining an initial positioning hole drilled for the first time on the multilayer board;
establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin;
determining coordinates of holes to be drilled on the multi-layer board under the coordinate system based on a preset first drilling interval, a second drilling interval and coordinates of the initial positioning holes to be drilled for the first time, wherein the first drilling interval indicates a distance between two adjacent positioning holes with the same vertical coordinate, and the second drilling interval indicates a distance between two adjacent positioning holes with the same horizontal coordinate;
controlling drilling equipment to drill the multilayer board according to the coordinates of the to-be-drilled holes;
the initial positioning hole drilled for the first time is any drilled hole drilled on the multilayer board;
the determining the coordinates of the holes to be drilled on the multi-layer board under the coordinate system based on the preset first hole drilling interval, the second hole drilling interval and the coordinates of the initial positioning holes to be drilled for the first time comprises the following steps:
determining coordinates on the multi-layer board for indicating the initial locating holes in each set of locating holes based on the ordinate of the initial locating holes drilled for the first time and the second drilling interval;
determining any one initial positioning hole as a target positioning hole, and determining the coordinates of each positioning hole which is positioned in the same row with the target positioning hole on the multilayer board based on the abscissa of the target positioning hole and the first drilling interval;
determining the coordinates of each positioning hole in the same row with the target positioning hole as the coordinates of a drilling hole to be drilled on the multilayer board;
wherein, according to the coordinate of the drilling hole to be drilled, the drilling equipment is controlled to drill the multilayer board, and the method comprises the following steps: classifying the drill holes to be drilled according to the coordinates of the drill holes to be drilled to obtain at least one drill hole set, wherein the drill holes in each drill hole set have the same ordinate; and controlling the drilling equipment to drill the multilayer board according to the drilling sets in the at least one drilling set one by one in the order of the ordinate from small to large.
2. The method of claim 1, wherein determining the initial pilot hole first drilled in the multiwall sheet comprises:
identifying a region sprayed with a preset code on the multilayer board;
and determining the area as the initial positioning hole drilled for the first time.
3. The method of claim 1, wherein determining coordinates on the multiwall sheet for indicating initial pilot holes in each set of pilot holes based on the ordinate of the first drilled initial pilot holes and the second borehole spacing comprises:
obtaining an ordinate of at least one point based on the ordinate and the second borehole spacing;
acquiring the dimension of the multilayer board in the longitudinal axis direction of the coordinate system;
determining an ordinate of a last point of the multiwall sheet in the longitudinal axis direction based on the dimensions;
screening target points from the at least one point whose ordinate is not greater than the ordinate of the last point based on the ordinate of the at least one point;
and determining the coordinates of the target point as the coordinates of the initial positioning holes in each row of positioning holes.
4. The method of claim 1, wherein determining coordinates of each locating hole on the multiwall sheet that is in the same row as the target locating hole based on the abscissa of the target locating hole and the first borehole spacing comprises:
determining an abscissa of at least one point based on the abscissa of the target locating hole and the first borehole spacing;
acquiring the dimension of the multilayer board in the transverse axis direction of the coordinate system;
determining an abscissa of a last point of the multi-layer board in the transverse axis direction based on the dimension;
screening target points from the at least one point whose abscissa is not greater than the abscissa of the last point based on the abscissa of the at least one point;
and determining the coordinates of the target point as the coordinates of each positioning hole which is positioned in the same row with the target positioning hole on the multilayer board.
5. A drilling system, comprising:
multilayer board, drilling device and drilling equipment of multilayer board;
the drilling device of the multilayer board is used for determining an initial positioning hole drilled on the multilayer board for the first time; establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin; determining coordinates of holes to be drilled on the multi-layer board under the coordinate system based on a preset first drilling interval, a second drilling interval and coordinates of the initial positioning holes to be drilled for the first time, wherein the first drilling interval indicates a distance between two adjacent positioning holes with the same vertical coordinate, and the second drilling interval indicates a distance between two adjacent positioning holes with the same horizontal coordinate; controlling drilling equipment to drill the multilayer board according to the coordinates of the to-be-drilled holes;
wherein, according to the coordinate of the drilling hole to be drilled, the drilling equipment is controlled to drill the multilayer board, and the method comprises the following steps: classifying the drill holes to be drilled according to the coordinates of the drill holes to be drilled to obtain at least one drill hole set, wherein the drill holes in each drill hole set have the same ordinate; and controlling the drilling equipment to drill the multilayer board according to the drilling sets in the at least one drilling set one by one in the order of the ordinate from small to large.
6. Drilling equipment of multiply wood, characterized in that includes:
the first determining unit is used for determining an initial positioning hole drilled for the first time on the multilayer board;
the establishing unit is used for establishing a coordinate system of the multilayer board by taking the initial positioning hole drilled for the first time as a coordinate origin;
a second determining unit configured to determine coordinates of a hole to be drilled on the multilayer board in the coordinate system based on a preset first drill hole pitch indicating a distance between two adjacent positioning holes having the same ordinate, a second drill hole pitch indicating a distance between two adjacent positioning holes having the same abscissa, and coordinates of the first drilled initial positioning hole;
the control unit is used for controlling the drilling equipment to drill the multilayer board according to the coordinates of the to-be-drilled holes;
the first determining unit is configured to:
the initial positioning hole drilled for the first time is any drilled hole drilled on the multilayer board;
the second determining unit is configured to:
the determining the coordinates of the holes to be drilled on the multi-layer board under the coordinate system based on the preset first hole drilling interval, the second hole drilling interval and the coordinates of the initial positioning holes to be drilled for the first time comprises the following steps:
determining coordinates on the multi-layer board for indicating the initial locating holes in each set of locating holes based on the ordinate of the initial locating holes drilled for the first time and the second drilling interval;
determining any one initial positioning hole as a target positioning hole, and determining the coordinates of each positioning hole which is positioned in the same row with the target positioning hole on the multilayer board based on the abscissa of the target positioning hole and the first drilling interval;
determining the coordinates of each positioning hole in the same row with the target positioning hole as the coordinates of a drilling hole to be drilled on the multilayer board;
wherein, according to the coordinate of the drilling hole to be drilled, the drilling equipment is controlled to drill the multilayer board, and the method comprises the following steps: classifying the drill holes to be drilled according to the coordinates of the drill holes to be drilled to obtain at least one drill hole set, wherein the drill holes in each drill hole set have the same ordinate; and controlling the drilling equipment to drill the multilayer board according to the drilling sets in the at least one drilling set one by one in the order of the ordinate from small to large.
7. An electronic device, comprising: the device comprises a processor, a memory and a communication bus, wherein the processor and the memory are communicated with each other through the communication bus;
the memory is used for storing a computer program;
the processor is configured to execute the program stored in the memory to implement the drilling method of the multilayer board according to any one of claims 1 to 4.
8. A computer readable storage medium storing a computer program, characterized in that the computer program, when executed by a processor, implements the method of drilling a multiwall sheet according to any of claims 1-4.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP3805945B2 (en) * | 1999-10-15 | 2006-08-09 | 株式会社ムラキ | Reference hole drilling machine |
| JP2009276096A (en) * | 2008-05-12 | 2009-11-26 | Seiko Precision Inc | Substrate deformation recognition method, substrate deformation recognition device, and substrate deformation recognition program |
| CN104325174B (en) * | 2014-10-09 | 2017-12-01 | 梅州市志浩电子科技有限公司 | Printed circuit board drilling-hole positioning device and method |
| CN105407640A (en) * | 2015-10-29 | 2016-03-16 | 北大方正集团有限公司 | Circuit board hole drilling method |
| CN106455365A (en) * | 2016-09-22 | 2017-02-22 | 广东工业大学 | On-line adaptive PCB board drilling method |
| CN107486892B (en) * | 2017-09-29 | 2020-03-27 | 广东兴达鸿业电子有限公司 | PCB drilling positioning method |
| CN110839321B (en) * | 2018-08-17 | 2021-11-16 | 深南电路股份有限公司 | PCB back drilling processing equipment and processing method thereof |
| CN210298208U (en) * | 2019-02-20 | 2020-04-10 | 深圳市强达电路有限公司 | Measuring tool for quickly pinning PCB (printed circuit board) bakelite plate |
| CN111859846B (en) * | 2020-06-21 | 2022-08-23 | 苏州浪潮智能科技有限公司 | Method, system, equipment and medium for comparing negative films of PCBs (printed Circuit boards) |
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