CN113391187B - Method, system and device for detecting standard of wiring throughput of circuit board - Google Patents
Method, system and device for detecting standard of wiring throughput of circuit board Download PDFInfo
- Publication number
- CN113391187B CN113391187B CN202010177010.8A CN202010177010A CN113391187B CN 113391187 B CN113391187 B CN 113391187B CN 202010177010 A CN202010177010 A CN 202010177010A CN 113391187 B CN113391187 B CN 113391187B
- Authority
- CN
- China
- Prior art keywords
- target
- wiring
- standard
- flow
- line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
The application discloses a standard detection method for wiring traffic of a circuit board, which is used for obtaining the line width condition of all wires corresponding to any line sequence network on the circuit board; calculating the maximum flux of the target wire according to the line width condition of any target wire in all wires; judging whether the maximum through flow of the target routing is smaller than the corresponding routing through flow reaching scalar; if the current flow of the target wiring is smaller than the current flow of the target wiring, determining that the current flow of the target wiring does not reach the standard; if the current flow of the target wiring is not smaller than the current flow of the target wiring, the current flow of the target wiring is determined to reach the standard. The application can detect whether the through flow of all the wirings on the circuit board meets the through flow requirement, thereby avoiding the condition that the through flow of the wirings does not reach the standard due to the lack of thickening or thickening of the wirings, and further improving the design quality of the wirings. The application also discloses a standard detection system and device for the wiring and the traffic flow of the circuit board, and the standard detection system and device have the same beneficial effects as the standard detection method.
Description
Technical Field
The application relates to the field of circuit board design, in particular to a method, a system and a device for detecting the standard of the wiring traffic of a circuit board.
Background
Along with the design space of the circuit board becoming smaller, the situation that the line width is too thin often occurs when the power wiring is arranged on the circuit board, and the thinner the line width is, the larger the line impedance is, so that the line through-flow (the current allowable throughput) is easily caused to be substandard. At present, the wiring design on the circuit board is to judge whether the wiring flux is up to standard through manual inspection, specifically after the wiring of the circuit board is completed, the designer marks all the wirings corresponding to the same flux requirement, screens out the wirings with the flux not up to standard, and thickens the wirings with the flux not up to standard so as to lead the flux to reach the standard. However, the types of power supplies on the circuit board are more than one, the through-flow requirements of the wire sequence networks corresponding to different power supplies on the wiring are generally different, and the wire sequence networks are distributed over the whole circuit board, so that the situation that the wiring is leaked and thickened or is insufficient in thickness is easily caused by manual inspection, and finally, the through-flow problem or the voltage drop risk is caused, thereby influencing the design quality of the wiring.
Therefore, how to provide a solution to the above technical problem is a problem that a person skilled in the art needs to solve at present.
Disclosure of Invention
The application aims to provide a standard detection method, a system and a device for the routing traffic of a circuit board, which can detect whether the traffic of all the routing on the circuit board meets the traffic requirement, thereby avoiding the condition that the routing traffic is not standard due to the lack of thickening or insufficient thickening of the routing, and further improving the routing design quality.
In order to solve the technical problems, the application provides a standard detection method for the wiring traffic of a circuit board, which comprises the following steps:
acquiring line width conditions of all wires corresponding to any line sequence network on a circuit board;
calculating the maximum flux of the target wire according to the line width condition of the target wire; wherein the target wire is any wire among all wires;
judging whether the maximum through flow of the target wiring is smaller than the corresponding wiring through flow reaching scalar;
if yes, determining that the through flow of the target wiring does not reach the standard;
if not, determining that the traffic flow of the target wiring reaches the standard.
Preferably, the process of obtaining the line width condition of all the wires corresponding to any line-sequence network on the circuit board includes:
acquiring all wiring, via holes and components corresponding to any line-sequence network on a circuit board;
taking the components and the via holes as dividing nodes, and acquiring a wiring profile of a target wiring between the via holes or components connected with any dividing node;
and determining the line width minimum value of the target line based on the line profile.
Preferably, the process of obtaining the trace profile of the target trace between the via holes or the components connected with any partition node includes:
acquiring turning points of target routing among the through holes or components connected with any dividing node;
each turning point is connected in pairs to obtain a turning point connecting line;
and reserving a connecting line tangent to the edge of the target routing in the turning point connecting lines to obtain the routing profile of the target routing.
Preferably, the process of determining the line width minimum value of the target trace based on the trace profile includes:
according to the signal trend of the target wire, two dividing nodes connected with the target wire are correspondingly used as a starting point and an ending point of the target wire;
starting from the starting point, respectively obtaining turning points of a clockwise region and turning points of a counterclockwise region along the routing profile according to the clockwise direction and the counterclockwise direction until reaching the ending point;
connecting each turning point of the anticlockwise region with all turning points of the clockwise region respectively to obtain a region turning point connecting line;
and taking the length of the shortest connecting line in the region turning point connecting lines as the line width minimum value of the target wiring.
Preferably, the process of determining the line width minimum value of the target trace based on the trace profile includes:
according to the signal trend of the target wire, two dividing nodes connected with the target wire are correspondingly used as a starting point and an ending point of the target wire;
starting from the starting point, respectively obtaining turning points of a clockwise region and turning points of a counterclockwise region along the routing profile according to the clockwise direction and the counterclockwise direction until reaching the ending point;
connecting the turning points of the clockwise region in pairs to obtain a turning point connecting line of the clockwise region;
and respectively connecting the turning points of the anticlockwise region with turning points of all clockwise regions or extension lines thereof to form vertical lines, and taking the length of the shortest vertical line in all vertical lines positioned in the wiring outline as the minimum line width value of the target wiring.
Preferably, the process of calculating the maximum throughput of the target trace according to the line width of the target trace includes:
calculating the relation imax=k×t from the throughput 0.44 ×A 0.725 Calculating the maximum throughput of the target wiring; wherein K is a preset derating parameter, T is a preset maximum allowable temperature rise of the through-flow path, a is a cross-sectional area of the through-flow path, and a=a line width minimum value corresponding to the through-flow path×the wiring thickness.
Preferably, the standard reaching detection method further comprises the following steps:
finding out via routing wires passing through the via layer change routing from all the routing wires, and obtaining the number of the vias corresponding to the via routing wires;
multiplying the number of the through holes by a preset single-through hole flux to obtain the total through hole flux of the through hole routing;
judging whether the total through flow of the via hole is smaller than the corresponding wiring through flow of the via hole by a scalar;
if yes, determining that the total through flow of the via hole wiring does not reach the standard;
if not, determining that the total through flow of the via hole wiring reaches the standard.
Preferably, the standard reaching detection method further comprises the following steps:
and generating standard detection information containing the positions of the target routing with the total through-flow rate of the through holes which are not standard and the via routing with the total through-flow rate of the through holes which are not standard according to the standard detection result of the through-flow rate of the routing of the circuit board.
In order to solve the technical problem, the application also provides a standard detection system for the wiring traffic of the circuit board, which comprises:
the acquisition module is used for acquiring line width conditions of all the wires corresponding to any line sequence network on the circuit board;
the calculation module is used for calculating the maximum flux of the target wire according to the line width condition of the target wire; wherein the target wire is any wire among all wires;
the judging module is used for judging whether the maximum through flow of the target wiring is smaller than the corresponding wiring through flow reaching scalar; if yes, executing a module which does not reach the standard; if not, executing the standard module;
the substandard module is used for determining that the flux of the target wiring is substandard;
and the standard reaching module is used for determining that the through flow of the target wiring reaches the standard.
In order to solve the technical problem, the application also provides a standard detection device for the wiring traffic of the circuit board, which comprises:
a memory for storing a computer program;
and the processor is used for realizing the standard detection method of the wiring traffic of any circuit board when executing the computer program.
The application provides a standard detection method for the wiring traffic of a circuit board, which is used for obtaining the line width condition of all wires corresponding to any line sequence network on the circuit board; calculating the maximum flux of the target wire according to the line width condition of any target wire in all wires; judging whether the maximum through flow of the target routing is smaller than the corresponding routing through flow reaching scalar; if the current flow of the target wiring is smaller than the current flow of the target wiring, determining that the current flow of the target wiring does not reach the standard; if the current flow of the target wiring is not smaller than the current flow of the target wiring, the current flow of the target wiring is determined to reach the standard. Therefore, the application can detect whether the through flow of all the wires on the circuit board meets the through flow requirement, thereby avoiding the condition that the through flow of the wires does not reach the standard due to the missing or insufficient thickening of the wires, and further improving the design quality of the wires.
The application also provides a standard detection system and device for the wiring and the traffic flow of the circuit board, and the standard detection system and device have the same beneficial effects as the standard detection method.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following description will briefly explain the background art and the drawings required to be used in the embodiments, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of a method for detecting the standard of the wiring traffic of a circuit board according to an embodiment of the present application;
fig. 2 is a specific flowchart of a method for detecting the standard of the wiring throughput of a circuit board according to an embodiment of the present application;
FIG. 3 is a schematic diagram of a trace profile according to an embodiment of the present application;
FIG. 4 is a plot of turning points of a trace profile according to an embodiment of the present application;
FIG. 5 is a diagram illustrating a trace profile of a trace according to an embodiment of the present application;
fig. 6 is a schematic structural diagram of a standard detection system for the wiring throughput of a circuit board according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of a standard detection device for the wiring throughput of a circuit board according to an embodiment of the present application.
Detailed Description
The core of the application is to provide a standard detection method, a system and a device for the wiring through flow of a circuit board, which can detect whether the through flow of all the wirings on the circuit board meets the through flow requirement, thereby avoiding the condition that the wiring through flow is not standard due to the lack of thickening or insufficient thickening of the wirings and further improving the wiring design quality.
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Along with the design space of the circuit board becoming smaller, the situation that the line width is too thin often occurs when the power wiring is arranged on the circuit board, and the thinner the line width is, the larger the wiring impedance is, so that the wiring flux is easy to be caused to be substandard. The routing throughput refers to the amount of current allowed to pass through the routing, and the larger the routing impedance is, the smaller the routing throughput is. The judgment basis of whether the wiring through-flow reaches the standard is as follows: whether the maximum current allowed to pass through the wire is smaller than the corresponding wire through flow reaching scalar of the wire, if yes, the wire through flow does not reach the standard; if not, the routing traffic reaches the standard.
At present, the wiring design on the circuit board is to judge whether the wiring flux reaches the standard through manual inspection, specifically after the wiring of the circuit board is completed, the designer marks all the wirings corresponding to the same flux requirement, screens out the wirings with the flux not reaching the standard, and thickens the wirings with the flux not reaching the standard so as to lead the flux to reach the standard. However, the types of power supplies on the circuit board are more than one (such as 3.3V and 1.5V), the through-flow requirements of the wire sequence networks corresponding to different power supplies on the wiring are generally different, and the wire sequence networks are distributed over the whole circuit board, so that the situation that the wiring is leaked and thickened or is insufficient in thickness is easily caused by manual inspection, and finally, the through-flow problem or the voltage drop risk is caused, thereby influencing the design quality of the wiring. A standard detection method, system and device for the through-flow of wiring of a circuit board are beneficial to rapidly detecting the wiring with the through-flow not reaching the standard, and improve the monitoring efficiency, thereby achieving the purpose of ensuring the design quality of the wiring.
Referring to fig. 1, fig. 1 is a flowchart of a method for detecting the standard of the routing throughput of a circuit board according to an embodiment of the present application.
The standard detection method for the wiring traffic of the circuit board comprises the following steps:
step S1: and acquiring the line width condition of all the wiring corresponding to any line sequence network on the circuit board.
Specifically, the types of power supplies on the circuit board are generally more than one, and the through-flow requirements of the wire sequence networks corresponding to different power supplies on the wires are generally different, so that the application respectively carries out standard detection on the through-flow of the wires of the different wire sequence networks on the circuit board so as to detect all the wires which do not meet the through-flow requirements on the circuit board.
For any line sequence network, the line width conditions of all the wires corresponding to the line sequence network are obtained, and the line width of the wires is related to the line traffic, so that the standard detection of the line traffic is convenient to follow.
Step S2: and calculating the maximum throughput of the target wiring according to the line width condition of the target wiring.
It should be noted that, the target trace in the step S2 is any one of all traces corresponding to the line-sequential network in the step S1.
Specifically, the impedance of the wire on the circuit board is inversely proportional to the wire width, when the wire width of the wire is reduced, the impedance of the part of the wire is increased, so that the through-flow of the part of the wire is reduced, otherwise, when the wire width of the wire is increased, the impedance of the part of the wire is reduced, so that the through-flow of the part of the wire is increased, and the through-flow of the wire has a certain positive correlation with the wire width.
More specifically, the maximum through flow of the wire is considered to determine the wire current carrying capacity, and the standard reaching detection of the wire current carrying capacity is to judge whether the maximum through flow of the wire reaches the corresponding wire current reaching scalar, and it can be understood that if the maximum through flow of the wire is smaller than the corresponding wire current reaching scalar, the defect of insufficient wire current carrying capacity is indicated, and the wire needs to be optimized, namely the wire current carrying capacity is not up to standard; and if the maximum through flow of the wiring is not less than the corresponding through flow of the wiring to reach the scalar, indicating that the through flow of the wiring reaches the standard.
Based on the above, after the line width condition of the target wire is obtained, the application specifically determines the maximum through flow of the target wire according to the corresponding relation of the line widths of the through flow so as to judge whether the through flow of the target wire meets the standard or not for the follow-up judgment.
Step S3: judging whether the maximum through flow of the target routing is smaller than the corresponding routing through flow reaching scalar; if yes, executing step S4; if not, step S5 is performed. Step S4: and determining that the flux of the target wiring does not reach the standard. Step S5: and determining that the through flow of the target wiring reaches the standard.
Specifically, based on the trace through-flow standard reaching judgment principle described in step S2, after the maximum through-flow of the target trace is obtained, the present application compares the maximum through-flow of the target trace with the corresponding trace through-flow standard reaching amount thereof to judge whether the maximum through-flow of the target trace is smaller than the corresponding trace through-flow reaching scalar thereof. If the maximum through flow of the target wire is smaller than the corresponding wire through flow reaching a scalar, determining that the through flow of the target wire does not reach the standard; and if the maximum through flow of the target routing is not less than the corresponding routing through flow reaching a scalar, determining that the through flow of the target routing reaches the standard.
It should be noted that, the through-flow requirements of different power supplies are different, that is, the values of the routing through-flow scalar corresponding to different wire-sequence networks are different, so the application can set the configuration table for representing the routing through-flow scalar corresponding to different wire-sequence networks one by one in advance, and the purpose is to obtain the routing through-flow scalar corresponding to the wire-sequence network where the target routing is located from the configuration table before step S3.
In addition, the circuit board of the application is specifically a PCB (Printed Circuit Board ) board, and the wiring on the board is usually a circuit laid by copper sheets.
The application provides a standard detection method for the wiring traffic of a circuit board, which is used for obtaining the line width condition of all wires corresponding to any line sequence network on the circuit board; calculating the maximum flux of the target wire according to the line width condition of any target wire in all wires; judging whether the maximum through flow of the target routing is smaller than the corresponding routing through flow reaching scalar; if the current flow of the target wiring is smaller than the current flow of the target wiring, determining that the current flow of the target wiring does not reach the standard; if the current flow of the target wiring is not smaller than the current flow of the target wiring, the current flow of the target wiring is determined to reach the standard. Therefore, the application can detect whether the through flow of all the wires on the circuit board meets the through flow requirement, thereby avoiding the condition that the through flow of the wires does not reach the standard due to the missing or insufficient thickening of the wires, and further improving the design quality of the wires.
Based on the above embodiments:
referring to fig. 2, fig. 2 is a specific flowchart of a method for detecting the standard of the routing throughput of a circuit board according to an embodiment of the present application.
As an optional embodiment, the process of obtaining the line width condition of all the traces corresponding to any line-sequential network on the circuit board includes:
step S11: acquiring all wiring, via holes and components corresponding to any line-sequence network on a circuit board;
step S12: taking the components and the through holes as dividing nodes, and acquiring the wiring outline of a target wiring between the through holes or the components connected with any dividing node;
step S13: and determining the line width minimum value of the target line based on the line profile.
Specifically, the current paths on the circuit board start from the components on the circuit board, and one current path of the components has two conditions: the multi-path wiring is connected to a plurality of component terminals; only one route is connected to one component end. And the wiring of the components has the following conditions: 1) The wiring starts from the component, when other via holes are blocked, the wiring needs to be bypassed, if the wiring is not bypassed, a hole can be dug on the wiring by taking the via hole as the center and taking the size of the bonding pad as the reference so as to separate the wiring from the via hole; 2) The wiring starts from the component, and when other components are encountered, the wiring needs to be bypassed or through holes are drilled for layer-changing; 3) The wiring starts from the component, and when other wirings are met, the wirings need to be drilled with through holes and replaced by layers. Therefore, the application can divide the wiring on the circuit board into a plurality of sections of wiring by taking the components and the via holes as dividing nodes so as to respectively acquire the line width condition of the plurality of sections of wiring.
Based on this, for any line-sequential network, the present application obtains all the traces, vias and components corresponding to the line-sequential network, and then uses the components and vias as dividing nodes to obtain the trace profile of the trace (referred to as a target trace) between the vias or components connected with any dividing node (component or via), as shown in fig. 3. The wiring profile of the target wiring is obtained because the wiring profile of the target wiring can reflect the line width condition of the target wiring so as to analyze the line width condition of the target wiring according to the wiring profile of the target wiring.
More specifically, the current capacity of the trace depends on the minimum line width of the trace, that is, the maximum current allowed to pass by the minimum line width of the trace is the maximum current of the trace, so if the maximum current of the target trace is to be obtained, the minimum line width of the target trace needs to be determined based on the trace profile of the target trace, and then the maximum current of the target trace is determined according to the corresponding relationship of the line widths of the current.
It should be noted that, the present application specifically starts from a starting component corresponding to a certain line-sequence network, and sequentially obtains the wiring profile of the multi-section wiring according to the trend of the current path of the line-sequence network until all the current paths of the line-sequence network are traversed.
As an alternative embodiment, the process of obtaining the trace profile of the target trace between the via holes or the components connected with any partition node includes:
acquiring turning points of target routing among the through holes or components connected with any dividing node;
each turning point is connected in pairs to obtain a turning point connecting line;
and reserving a line tangent to the edge of the target line in the turning point lines to obtain the line profile of the target line.
Specifically, the routing profile of the target routing can be obtained by sequentially connecting all turning points of the target routing, so that all turning points of the target routing can be obtained to obtain the routing profile of the target routing. More specifically, the specific acquisition mode of the trace profile of the target trace is as follows: and obtaining all turning points of the target line, then connecting the turning points in pairs, namely sequentially cycling each turning point of the target line, and connecting each turning point with all other turning points to obtain a turning point connecting line. It can be understood that the turning point connecting line tangent to the edge of the target line is the line profile of the target line, so that the application reserves the connecting line tangent to the edge of the target line in the turning point connecting lines, and deletes the other turning point connecting lines which do not meet the tangent requirement, thereby obtaining the line profile (a closed graph) of the target line.
Alternatively, the specific acquisition mode of the trace profile of the target trace may also be: and (3) acquiring all turning points of the target line, taking one of the turning points as an initial turning point, then sequentially circulating each turning point of the target line, and connecting the turning point of the previous inquiry with the turning point of the next inquiry until the initial turning point is inquired again, so as to obtain the line profile of the target line.
More specifically, the application can establish a mathematical coordinate system on the circuit board, and aims to acquire the coordinates of each turning point of the target trace, and then carry out turning point connection based on the coordinates of each turning point.
As an alternative embodiment, the process of determining the line width minimum value of the target trace based on the trace profile includes:
according to the signal trend of the target routing, the two dividing nodes connected with the target routing are correspondingly used as the starting point and the end point of the target routing;
starting from the starting point, respectively obtaining turning points of the clockwise region and turning points of the anticlockwise region according to the clockwise direction and anticlockwise direction along the routing profile until reaching the end point;
connecting each turning point of the anticlockwise region with all turning points of the clockwise region respectively to obtain a region turning point connecting line;
and taking the length of the shortest connecting line in the region turning point connecting lines as the line width minimum value of the target wiring.
Specifically, the first way to determine the minimum value of the line width of the line based on the line profile is: 1) The starting point and the end point of the target line are determined according to the signal trend of the target line, specifically, the starting point of the signal is taken as the starting point of the target line in two dividing nodes (components or through holes) connected with the target line, and the other dividing node is taken as the end point of the target line. 2) Starting from the starting point of the target trace, on one hand, acquiring turning points of a clockwise region along the trace outline of the target trace in a clockwise direction until reaching the end point of the target trace; on the other hand, the turning point of the counterclockwise region is acquired along the trace outline of the target trace in the counterclockwise direction until the end point of the target trace is reached. 3) And sequentially cycling each turning point of the anticlockwise region, and connecting each turning point of the anticlockwise region with all turning points of the clockwise region to obtain a region turning point connecting line so as to take out the shortest connecting line in the region turning point connecting line corresponding to each turning point of the anticlockwise region. 4) And comparing the shortest connecting lines corresponding to the turning points in the anticlockwise area one by one, and taking out the shortest connecting line in the shortest connecting lines, wherein the length of the shortest connecting line is the minimum line width of the target wiring.
For example, the routing profile shown in fig. 3 is subjected to turning point partitioning to obtain turning points of the region B (clockwise region) and turning points of the region a (anticlockwise region) shown in fig. 4, one of the turning points of the region a is taken out and connected with all the turning points of the region B to obtain four connecting lines shown in fig. 5, the shortest connecting line of the four connecting lines is taken out, the other turning points of the region a and all the turning points of the region B are taken out again to connect, the shortest connecting line is taken out, and finally the shortest connecting lines are compared to obtain a shortest connecting line, wherein the length of the shortest connecting line is the minimum value of the routing line width shown in fig. 3.
It should be noted that, the area turning point connection is obtained according to the above rule, because any two turning point connections of the clockwise area are the same side of the two dividing nodes connected with respect to the target trace, that is, are not paths through which signals flow, as is the same side of a circuit, and are counterclockwise areas, that is, only the connection between the clockwise area and the counterclockwise area forms the width of the current path, as is the width of a circuit.
As an alternative embodiment, the process of determining the line width minimum value of the target trace based on the trace profile includes:
according to the signal trend of the target routing, the two dividing nodes connected with the target routing are correspondingly used as the starting point and the end point of the target routing;
starting from the starting point, respectively obtaining turning points of the clockwise region and turning points of the anticlockwise region according to the clockwise direction and anticlockwise direction along the routing profile until reaching the end point;
connecting turning points of the clockwise region in pairs to obtain a turning point connecting line of the clockwise region;
and respectively connecting the turning points of the anticlockwise region to the turning points of all the clockwise regions or the extension lines of the turning points, and taking the length of the shortest vertical line in all the vertical lines positioned inside the wiring outline as the minimum value of the line width of the target wiring.
Specifically, the second way to determine the minimum value of the line width of the line based on the line profile is: 1) The start point and the end point of the target trace are determined (the same as the first mode, the present application is not repeated here). 2) Starting from the starting point of the target trace, the turning point of the clockwise region and the turning point of the anticlockwise region are correspondingly acquired along the trace outline according to the clockwise direction and the anticlockwise direction respectively until the ending point of the target trace is reached (the method is the same as the first mode and the application is not repeated here). 3) And connecting the turning points of the clockwise region in pairs, namely sequentially cycling each turning point of the clockwise region, and connecting each turning point with all other turning points of the clockwise region to obtain a turning point connecting line of the clockwise region. 4) And sequentially cycling each turning point of the anticlockwise region, and taking a vertical line from each turning point of the anticlockwise region to a connecting line of turning points of all clockwise regions or an extension line thereof so as to take out the shortest vertical line positioned inside the routing profile from the vertical lines corresponding to each turning point of the anticlockwise region. 5) And comparing the shortest vertical lines corresponding to the turning points of the anticlockwise region one by one, and taking out the shortest line segment in the shortest vertical lines, wherein the length of the shortest line segment is the minimum line width value of the target wiring.
In addition, in the second mode of determining the minimum value of the wiring line width, the following operation steps may be replaced by the steps of: taking one turning point from the anticlockwise region, taking a vertical line from the turning point to a connecting line of any two points or an extension line of the connecting line of any two points in the clockwise region, taking out the shortest vertical line positioned inside the wiring outline in all vertical lines corresponding to the turning point, traversing all turning points in the anticlockwise region, and obtaining the shortest vertical line corresponding to all turning points in the anticlockwise region one by one.
It should be noted that, regarding which mode is selected to determine the minimum value of the line width, the present application is not particularly limited herein, and depends on the actual situation.
As an optional embodiment, the process of calculating the maximum throughput of the target trace according to the line width of the target trace includes:
calculating the relation imax=k×t from the throughput 0.44 ×A 0.725 Calculating the maximum flux of the target wiring; wherein K is a preset derating parameter, T is a preset maximum allowable temperature rise of the through-flow path, a is a cross-sectional area of the through-flow path, and a=a line width minimum value corresponding to the through-flow path×the wiring thickness.
Specifically, the present application sets the through-flow calculation relational expression to imax=k×t in advance 0.44 ×A 0.725 Wherein K is a preset derating parameter, specifically, the K value of the surface layer wiring is 0.048, and the K value of the inner layer wiring is 0.024; t is the maximum allowable temperature rise of a preset through flow path, and particularly 10 is preferable; a is the cross-sectional area of the through-flow path, and is obtained by multiplying the minimum line width value corresponding to the through-flow path by the thickness of the wiring (fixed value). Based on the above, the maximum through flow Imax of the target trace can be calculated according to the through flow calculation relation after the line width minimum value of the target trace is obtained.
As an alternative embodiment, the method for detecting the standard reaching the standard further comprises:
finding out via routing wires passing through the via layer-changing routing from all the routing wires, and obtaining the number of the vias corresponding to the via routing wires;
multiplying the number of the through holes by a preset single through hole flux to obtain the total through hole flux of the through hole routing;
judging whether the total through flow of the via hole is smaller than the corresponding wiring through flow of the via hole by a scalar;
if yes, determining that the total through flow of the via routing does not reach the standard;
if not, determining that the total through flow of the via hole wiring reaches the standard.
Further, the wirings of different layers on the circuit board are connected through the via holes provided with copper, and generally, the current value which can be passed by one via hole on the circuit board can be measured through a current through tool at most through 1A current, and the current value is used as the single via hole through flow. It can be seen that the total throughput at the wire connection of the different layers depends on the number of vias, i.e. the total throughput at the wire connection of the different layers = the number of vias x the single via throughput.
The total through flow at the connection part of the wires of different layers also meets the through flow requirement of the corresponding wires, so the application adopts the technical means that: for any line-sequential network, finding out the line passing through the via layer change (called via line) from all the lines corresponding to the line-sequential network; for any via routing, obtaining the number of the vias corresponding to the via routing, and multiplying the number of the vias by the single via throughput to obtain the total via throughput of the via routing; judging whether the total through flow of the via hole wiring is smaller than the corresponding wiring through flow of the via hole wiring to a scalar; if the total through-hole flow of the through-hole wiring is smaller than the total through-hole flow of the through-hole wiring, the total through-hole flow of the through-hole wiring is determined to be not up to the standard, namely the number of the through-holes corresponding to the through-hole wiring is insufficient, and the through-holes are required to be increased; if the total through flow of the via is not smaller than the standard through flow, the total through flow of the via is determined to reach the standard, and the via is not required to be added.
Therefore, the application can detect whether the total through flow of the through holes of all the through hole wires on the circuit board meets the through flow requirement, thereby avoiding the condition that the total through flow of the through holes of the through hole wires does not reach the standard due to insufficient through holes, and further improving the design quality of the wires.
As an alternative embodiment, the method for detecting the standard reaching the standard further comprises:
and generating standard detection information containing the positions of the target routing with the total through flow of the through holes which are not standard and the via routing with the total through flow which is not standard according to the standard detection result of the through flow of the routing of the circuit board.
Furthermore, the application can set the position identification number for identifying the position of the wiring for all the wirings on the circuit board in advance, and aims to generate standard detection information containing the position identification numbers of the standard-insufficient wirings according to the determined target wirings with standard-insufficient through flow and the via wirings with standard-insufficient total through flow after the standard-insufficient detection results of the wiring through flow of the circuit board are obtained, so as to be convenient for a designer to find the standard-insufficient wirings and modify the standard-insufficient wirings.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a standard detection system for the routing throughput of a circuit board according to an embodiment of the present application.
This circuit board wiring traffic flow's detecting system that reaches standard includes:
the acquisition module 1 is used for acquiring line width conditions of all wires corresponding to any line sequence network on the circuit board;
the calculating module 2 is used for calculating the maximum flux of the target wire according to the line width condition of the target wire; wherein the target wire is any wire in all wires;
the judging module 3 is used for judging whether the maximum through flow of the target routing is smaller than the corresponding routing through flow reaching scalar; if yes, executing the module 4 which does not reach the standard; if not, executing the standard reaching module 5;
a module 4 which is not up to standard and is used for determining that the flux of the target routing is not up to standard;
and the standard reaching module 5 is used for determining that the through flow of the target wiring reaches the standard.
The description of the standard reaching detection system provided by the application refers to the embodiment of the standard reaching detection method, and the application is not repeated here.
Referring to fig. 7, fig. 7 is a schematic structural diagram of a standard detection device for the routing throughput of a circuit board according to an embodiment of the present application.
This circuit board wiring traffic flow's detection device that reaches standard includes:
a memory 6 for storing a computer program;
and the processor 7 is used for realizing the step of the standard detection method of the wiring traffic of any circuit board when executing the computer program.
The description of the standard-reaching detection device provided by the application refers to the embodiment of the standard-reaching detection method, and the application is not repeated here.
In the description, each embodiment is described in a progressive manner, and each embodiment is mainly described by the differences from other embodiments, so that the same similar parts among the embodiments are mutually referred. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative elements and steps are described above generally in terms of functionality in order to clearly illustrate the interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The principles and embodiments of the present application have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present application and its core ideas. It will be apparent to those skilled in the art that various changes and modifications can be made to the present application without departing from the principles of the application, and such changes and modifications fall within the scope of the appended claims.
It should also be noted that in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
Claims (7)
1. A method for detecting the standard of the wiring flux of a circuit board is characterized by comprising the following steps:
acquiring line width conditions of all wires corresponding to any line sequence network on a circuit board;
the process for obtaining the line width condition of all the wires corresponding to any line sequence network on the circuit board comprises the following steps:
acquiring all wiring, via holes and components corresponding to any line-sequence network on a circuit board;
taking the components and the via holes as dividing nodes, and acquiring a wiring profile of a target wiring between the via holes or components connected with any dividing node;
the process for obtaining the wiring profile of the target wiring between the through holes or the components connected with any dividing node comprises the following steps:
acquiring turning points of target routing among the through holes or components connected with any dividing node;
each turning point is connected in pairs to obtain a turning point connecting line;
reserving a connecting line tangent to the edge of the target wire in the turning point connecting lines to obtain a wire outline of the target wire;
determining a line width minimum value of the target line based on the line profile;
the process of determining the line width minimum value of the target trace based on the trace profile comprises the following steps:
according to the signal trend of the target wire, two dividing nodes connected with the target wire are correspondingly used as a starting point and an ending point of the target wire;
starting from the starting point, respectively obtaining turning points of a clockwise region and turning points of a counterclockwise region along the routing profile according to the clockwise direction and the counterclockwise direction until reaching the ending point;
connecting each turning point of the anticlockwise region with all turning points of the clockwise region respectively to obtain a region turning point connecting line;
taking the length of the shortest connecting line in the region turning point connecting lines as the line width minimum value of the target wiring;
calculating the maximum flux of the target wire according to the line width condition of the target wire; wherein the target wire is any wire among all wires;
judging whether the maximum through flow of the target wiring is smaller than the corresponding wiring through flow reaching scalar;
if yes, determining that the through flow of the target wiring does not reach the standard;
if not, determining that the traffic flow of the target wiring reaches the standard.
2. The method for detecting the standard reaching of the routing throughput of the circuit board according to claim 1, wherein the process of determining the line width minimum value of the target routing based on the routing profile comprises the following steps:
according to the signal trend of the target wire, two dividing nodes connected with the target wire are correspondingly used as a starting point and an ending point of the target wire;
starting from the starting point, respectively obtaining turning points of a clockwise region and turning points of a counterclockwise region along the routing profile according to the clockwise direction and the counterclockwise direction until reaching the ending point;
connecting the turning points of the clockwise region in pairs to obtain a turning point connecting line of the clockwise region;
and respectively connecting the turning points of the anticlockwise region with turning points of all clockwise regions or extension lines thereof to form vertical lines, and taking the length of the shortest vertical line in all vertical lines positioned in the wiring outline as the minimum line width value of the target wiring.
3. The method for detecting the standard reaching of the through flow of the wiring of the circuit board according to claim 1, wherein the process for calculating the maximum through flow of the target wiring according to the line width condition of the target wiring comprises the following steps:
calculating the relation imax=k×t from the throughput 0.44 ×A 0.725 Calculating the maximum throughput of the target wiring; wherein K is a preset derating parameter, T is a preset maximum allowable temperature rise of the through-flow path, a is a cross-sectional area of the through-flow path, and a=a line width minimum value corresponding to the through-flow path×the wiring thickness.
4. A method for detecting the standard of the wiring traffic of a circuit board according to any one of claims 1 to 3, wherein the method for detecting the standard further comprises:
finding out via routing wires passing through the via layer change routing from all the routing wires, and obtaining the number of the vias corresponding to the via routing wires;
multiplying the number of the through holes by a preset single-through hole flux to obtain the total through hole flux of the through hole routing;
judging whether the total through flow of the via hole is smaller than the corresponding wiring through flow of the via hole by a scalar;
if yes, determining that the total through flow of the via hole wiring does not reach the standard;
if not, determining that the total through flow of the via hole wiring reaches the standard.
5. The method for detecting the standard of the wiring traffic of the circuit board according to claim 4, wherein the method for detecting the standard further comprises:
and generating standard detection information containing the positions of the target routing with the total through-flow rate of the through holes which are not standard and the via routing with the total through-flow rate of the through holes which are not standard according to the standard detection result of the through-flow rate of the routing of the circuit board.
6. A standard detection system of circuit board wiring flux, its characterized in that includes:
the acquisition module is used for acquiring line width conditions of all the wires corresponding to any line sequence network on the circuit board;
the acquisition module is specifically used for acquiring all wires, through holes and components corresponding to any line-sequence network on the circuit board; taking the components and the via holes as dividing nodes, and acquiring a wiring profile of a target wiring between the via holes or components connected with any dividing node; determining a line width minimum value of the target line based on the line profile; the process for obtaining the wiring profile of the target wiring between the through holes or the components connected with any dividing node comprises the following steps: acquiring turning points of target routing among the through holes or components connected with any dividing node; each turning point is connected in pairs to obtain a turning point connecting line; reserving a connecting line tangent to the edge of the target wire in the turning point connecting lines to obtain a wire outline of the target wire; the process of determining the line width minimum value of the target trace based on the trace profile comprises the following steps: according to the signal trend of the target wire, two dividing nodes connected with the target wire are correspondingly used as a starting point and an ending point of the target wire; starting from the starting point, respectively obtaining turning points of a clockwise region and turning points of a counterclockwise region along the routing profile according to the clockwise direction and the counterclockwise direction until reaching the ending point; connecting each turning point of the anticlockwise region with all turning points of the clockwise region respectively to obtain a region turning point connecting line; taking the length of the shortest connecting line in the region turning point connecting lines as the line width minimum value of the target wiring;
the calculation module is used for calculating the maximum flux of the target wire according to the line width condition of the target wire; wherein the target wire is any wire among all wires;
the judging module is used for judging whether the maximum through flow of the target wiring is smaller than the corresponding wiring through flow reaching scalar; if yes, executing a module which does not reach the standard; if not, executing the standard module;
the substandard module is used for determining that the flux of the target wiring is substandard;
and the standard reaching module is used for determining that the through flow of the target wiring reaches the standard.
7. A standard detection device of circuit board wiring traffic volume, its characterized in that includes:
a memory for storing a computer program;
a processor for implementing the steps of the method for detecting the standard reaching of the routing traffic of the circuit board according to any one of claims 1 to 5 when executing the computer program.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010177010.8A CN113391187B (en) | 2020-03-13 | 2020-03-13 | Method, system and device for detecting standard of wiring throughput of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010177010.8A CN113391187B (en) | 2020-03-13 | 2020-03-13 | Method, system and device for detecting standard of wiring throughput of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113391187A CN113391187A (en) | 2021-09-14 |
| CN113391187B true CN113391187B (en) | 2023-09-15 |
Family
ID=77616412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010177010.8A Active CN113391187B (en) | 2020-03-13 | 2020-03-13 | Method, system and device for detecting standard of wiring throughput of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113391187B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117391036B (en) * | 2023-12-12 | 2024-03-12 | 苏州元脑智能科技有限公司 | Printed circuit board simulation method, device, equipment and storage medium |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6534872B1 (en) * | 1998-10-13 | 2003-03-18 | Sun Microsystems, Inc. | Apparatus and system with increased signal trace routing options in printed wiring boards and integrated circuit packaging |
| CN1519569A (en) * | 2003-01-21 | 2004-08-11 | 英业达股份有限公司 | Method for checking linewidth of power wire in wiring overall arrangement |
| CN1916915A (en) * | 2005-08-19 | 2007-02-21 | 鸿富锦精密工业（深圳）有限公司 | Method for improving resistance of via hole |
| CN101442880A (en) * | 2008-10-24 | 2009-05-27 | 浪潮电子信息产业股份有限公司 | Conversion method for layer-exchange hole-through conductive capability in PCB |
| AU2008329649A1 (en) * | 2007-11-30 | 2009-06-04 | U.S. Bank National Association | Control system arrangements and methods for disparate network systems |
| CN104427788A (en) * | 2013-09-10 | 2015-03-18 | 上海空间电源研究所 | Through hole setting method and structure of multi-layer power printed circuit board for power supply controller |
-
2020
- 2020-03-13 CN CN202010177010.8A patent/CN113391187B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6534872B1 (en) * | 1998-10-13 | 2003-03-18 | Sun Microsystems, Inc. | Apparatus and system with increased signal trace routing options in printed wiring boards and integrated circuit packaging |
| CN1519569A (en) * | 2003-01-21 | 2004-08-11 | 英业达股份有限公司 | Method for checking linewidth of power wire in wiring overall arrangement |
| CN1916915A (en) * | 2005-08-19 | 2007-02-21 | 鸿富锦精密工业（深圳）有限公司 | Method for improving resistance of via hole |
| AU2008329649A1 (en) * | 2007-11-30 | 2009-06-04 | U.S. Bank National Association | Control system arrangements and methods for disparate network systems |
| CN101442880A (en) * | 2008-10-24 | 2009-05-27 | 浪潮电子信息产业股份有限公司 | Conversion method for layer-exchange hole-through conductive capability in PCB |
| CN104427788A (en) * | 2013-09-10 | 2015-03-18 | 上海空间电源研究所 | Through hole setting method and structure of multi-layer power printed circuit board for power supply controller |
Non-Patent Citations (3)
| Title |
|---|
| 多电源配电网络的布线与优化;李宏意等;《电气开关》;20191015;全文 * |
| 潘永雄.电子线路CAD实用教程 基于Altium Designer平台.西安电子科技大学出版社,2016,第264-267页. * |
| 自动布局布线及验证研究;王兆勇;《微处理机》;20080215;全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113391187A (en) | 2021-09-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108169112B (en) | Circuit board corrosion monitoring method and device and environmental corrosion monitoring method and device | |
| CN113391187B (en) | Method, system and device for detecting standard of wiring throughput of circuit board | |
| EP3172007B1 (en) | Method of determining a sequence of drilling holes using a two level traveling salesman problem (tsp) | |
| US6643839B1 (en) | Determining an optimum wiring pattern and component placement scheme for a printed wiring board | |
| CN109933931B (en) | Method for detecting whether back drilling target layer is set correctly | |
| JP2018004267A (en) | Mounted structure and mounted base board for shunt resistor | |
| CN101964008B (en) | Wiring design assisting apparatus and wiring design assisting method | |
| CN114357932B (en) | Signal line wiring method, device, equipment and readable storage medium | |
| CN110135082B (en) | Method for avoiding via hole by copper sheet on negative film layer in PCB design | |
| CN105550460A (en) | Electronic circuit board wiring assessment method and apparatus | |
| US20070118823A1 (en) | Method and system for automatically checking traces in segments | |
| TWI246138B (en) | Method for checking via density in IC layout | |
| CN106908713A (en) | A kind of decision method of wiring board internal layer circuit short circuit reason | |
| CN106872790A (en) | A kind of method and system for detecting via loss | |
| CN108333496B (en) | Rapid test method for precision capability of flying probe machine capacitance method | |
| CN116546750A (en) | Automatic copper drawing method for PCB | |
| CN109061435A (en) | A kind of detection device and method of back drill working ability | |
| CN215379335U (en) | PCB impedance test structure and PCB | |
| CN109446613A (en) | A kind of method and system automaticly inspecting bending cabling | |
| CN107908873B (en) | Method and device for checking high-speed line across reference planes | |
| CN111967218A (en) | Method and system for checking routing length | |
| CN109994393B (en) | Method, device and equipment for calculating compensation value of measuring point | |
| CN109271666B (en) | Method and system for calculating break kout area length of signal line | |
| CN114004193B (en) | Identification method and related device for tin-plating risk of PCB | |
| US8327313B2 (en) | Re-routing method for circuit diagram |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |