CN109910400B - Tape casting preparation method of microwave composite dielectric plate and prepared microwave composite dielectric plate - Google Patents
Tape casting preparation method of microwave composite dielectric plate and prepared microwave composite dielectric plate Download PDFInfo
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Abstract
The invention discloses a tape casting preparation method of a microwave composite dielectric plate, which relates to the technical field of microwave composite dielectric plates and is provided based on the problems of high cost and high pollution of the existing microwave composite dielectric plate impregnation process, and the method comprises the following steps: (1) preparing a casting film glue solution; (2) casting; (3) conveying and drying; (4) demolding; (5) post-treatment; (6) matching the lamination; the invention also provides a microwave composite dielectric plate prepared by the preparation method; the invention has the beneficial effects that: the prepared microwave composite dielectric plate core plate is a homogeneous system, the ceramic powder is uniformly distributed in the PTFE matrix, the dielectric property is good in isotropy, and the copper foil adhesive force is high; the preparation method is simple, avoids sewage collection, treatment and discharge of the dipping process, is green and energy-saving, and meets the requirement of environmental protection.
Description
Technical Field
The invention relates to the technical field of microwave composite dielectric slabs, in particular to a tape casting preparation method of a microwave composite dielectric slab and the prepared microwave composite dielectric slab.
Background
With the development of electronic information products toward high speed, multiple functions, large capacity, portability and low consumption, the conventional FR4 (epoxy resin) substrate cannot meet the use requirements, and is gradually replaced by a microwave composite dielectric substrate with high speed and high reliability. The Polytetrafluoroethylene (PTFE) material has the advantages of low loss, stable dielectric constant, high chemical stability, low water absorption, good weather resistance and the like, and the microwave composite dielectric plate taking the PTFE material as the base material is widely applied to high-frequency bands such as airborne, satellite-borne, missile-borne and ship-borne at the wave band of 300 MHz-40 GHz and severe installation conditions.
Although PTFE has excellent electrical properties, the PTFE has low glass transition temperature (Tg), poor rigidity and insufficient mechanical strength, so that the processing conditions are very harsh, and the use reliability of the microwave composite medium is seriously influenced. Therefore, adding a glass fiber reinforced material to the PTFE substrate is one of the solutions to solve the above problems. At present, the PTFE-based microwave composite dielectric plate commodity at home and abroad mainly comprises two types of micro glass fiber, glass fiber cloth and ceramic powder, and the main preparation method of the glass fiber reinforced microwave composite dielectric plate is a wet impregnation process, namely a method for manufacturing glass fiber varnished cloth by impregnating the glass fiber cloth with PTFE emulsion and then superposing and hot-pressing the glass fiber varnished cloth. The impregnation method mainly uses a vertical impregnator. The height of the vertical impregnator is more than 10m, the heat dissipation and heat transfer are considered, the setting height of a factory building is about 20m generally, and the requirement on the factory building setting is very high. The gum dipping process of the vertical gum dipping machine also relates to the multi-step roller conveying and thickness measuring functions, and the equipment is complex and has large investment. In addition, a large amount of waste water is generated in the processes of pretreatment of raw materials, mixing and preparation of glue solution, discharge of waste glue solution and the like, and the waste water can be normally discharged after secondary treatment. With the improvement of the environmental protection degree, the process has to be provided with a complicated flow to meet the urban environmental protection requirement, and the manufacturing cost is high.
Therefore, the problem to be solved at present is to find a preparation method of the PTFE-based microwave composite dielectric plate, which has the advantages of simple and convenient process, low cost, cleanness, environmental protection and excellent and stable performance.
Disclosure of Invention
The invention solves the technical problem that the existing microwave composite dielectric plate impregnation process has the problems of high cost and high pollution.
The invention adopts the following technical scheme to solve the technical problems:
the invention provides a tape casting preparation method of a microwave composite dielectric slab, which comprises the following steps:
(1) preparing a casting film glue solution;
(2) casting: placing the casting film glue solution prepared in the step (1) into a casting machine to obtain a casting film;
(3) conveying and drying: drying the casting film obtained in the step (2) through a drying oven;
(4) demolding: cooling the casting film obtained in the step (3) to room temperature to obtain a microwave composite dielectric film;
(5) and (3) post-treatment: carrying out plasma activation treatment on the microwave composite dielectric film obtained in the step (4);
(6) and (3) lamination matching: and (4) overlapping and matching the microwave composite dielectric film treated in the step (5) with a fluororesin film as a basic unit, overlapping, respectively placing metal foils on the top layer and the bottom layer after overlapping, and performing vacuum lamination in a high-temperature laminating machine to obtain the microwave composite dielectric plate.
Preferably, the casting film glue solution is prepared from the following raw materials in parts by weight: 100 parts of PTFE emulsion solid, 1-10 parts of fluororesin modifier, 100-400 parts of micron-sized ceramic powder, 0.1-4 parts of surface modifier, 0.08-5 parts of hydrolysis solvent, 0.5-15 parts of auxiliary agent and 50-100 parts of solvent.
Preferably, the preparation method of the casting film glue solution comprises the following steps:
(a) pretreatment of raw materials: pretreating and hydrolyzing a coupling agent by using a hydrolysis solvent, adding ceramic powder, and placing the mixture in a ball mill;
(b) and (3) wet mixing: adding the materials, the solvent, the auxiliary agent, the PTFE emulsion and the fluororesin modifier in the ball mill into a high-shear stirring kettle, and stirring at the temperature of 60-80 ℃.
Preferably, the knife edge of the casting machine is heated to 30-70 ℃, the casting film glue solution prepared in the step (1) is transferred to a storage tank of the casting machine, and the storage tank is heated to 30-70 ℃.
Preferably, the temperature of the drying oven is 130-170 ℃, and the drying time is 0.5-3 h.
Preferably, the microwave composite dielectric film is cut into 1.1m × 1.3m slices before the microwave composite dielectric film is subjected to the plasma activation treatment.
Preferably, the condition of the plasma activation treatment is N2：H2The flow rate is between 800 and 1200mL/min, the power is between 1600 and 2200W, and the treatment time is between 35 and 70 min.
Preferably, the metal foil is made of one or more of copper, brass, aluminum, and nickel.
Preferably, the fluororesin film is one or a mixture of polytetrafluoroethylene, perfluoroalkoxy resin and fluorinated ethylene propylene.
Preferably, the fluororesin film has a thickness of 0.0013mm to 0.02 mm.
Preferably, the conditions for performing the vacuum pressing in the high-temperature laminator are as follows: 350-390 ℃ and 25-100 Kg/cm2And (5) performing hot pressing for 2-10 hours.
Preferably, the hydrolysis solvent is one or more of water, dichloromethane, ethanol, acetone, propylene glycol methyl ether and xylene.
Preferably, the surface modifier is a silane coupling agent, and the silane coupling agent is one or more of Z-6030, Z-6020, Z-6040, Z-6124, Z-6011, Z-6076 and Z-6032.
Preferably, the particle size of the micron-sized ceramic powder is 0.1-30 μm.
Preferably, the micron-sized ceramic powder is SiO2、TiO2、Al2O3、CaTiO3、SrTiO3、BaTiO3One or more of AlN, BN and SiC.
Preferably, the particle size of the particles in the PTFE emulsion is 0.1-1 μm.
Preferably, the fluororesin modifier is one or a mixture of more of fluorinated ethylene propylene, perfluoroalkoxy resin, ethylene-tetrafluoroethylene copolymer and ethylene-chlorotrifluoroethylene copolymer.
Preferably, the solvent is one or more of water, 1, 2-propylene glycol, dichloromethane, ethanol, acetone and the like.
Preferably, the auxiliary agent is one or a mixture of several of formic acid, polyetherimide and polyacrylamide.
Preferably, the ball milling time in the step (a) is 1-2 h.
Preferably, the stirring time of the high shear stirring kettle in the step (b) is 30-120 min, and the stirring speed is 300-500 r/min.
The invention also provides a microwave composite dielectric plate prepared by the preparation method.
The invention has the beneficial effects that:
(1) the microwave composite medium copper-clad plate core plate prepared by the invention is a homogeneous system, the ceramic powder is uniformly distributed in the PTFE matrix, the dielectric property is good in isotropy, and the copper foil adhesive force is high;
(2) the microwave composite dielectric plate has a simple formula in the preparation process, almost no wastewater is generated, the sewage collection, treatment and discharge of the impregnation process are avoided, only a small amount of gas is generated in the sintering and hot pressing processes in the process, the waste gas collection and treatment are basically not needed, the environment is protected, the energy is saved, and the environment-friendly requirement is met;
(3) the preparation process equipment of the microwave composite dielectric plate has small occupied area, mature equipment manufacture, simple and quick process route and easily controlled conditions; the preparation cost is low, the manpower and the financial resources are saved, and the product quality is stable.
Drawings
FIG. 1 is a flow chart of the manufacturing process of the present invention;
Detailed Description
The invention will be described in further detail below with reference to the drawings and examples of the specification.
Test materials, reagents, instruments and the like used in the following examples are commercially available unless otherwise specified.
Example 1
Table 1 shows the contents of the components in examples 2 to 4:
example 2
According to the content of each component in the table of the example 1, the microwave composite dielectric plate is prepared, which comprises the following steps:
(1) adding a hydrolytic solvent into a coupling agent Z-6040, uniformly stirring, and melting SiO2Adding into a ball mill together, and stirring for 1h in the ball mill at 60 ℃;
(2) cooling to room temperature, adding all materials, water, an auxiliary agent, Polytetrafluoroethylene (PTFE) emulsion and Fluorinated Ethylene Propylene (FEP) in a ball mill into a high-speed shearing stirring kettle, stirring at the speed of 300r/min for 30min at the temperature of 60 ℃, and setting a vacuum defoaming mode to obtain a casting film glue solution; wherein the fluororesin modifier can improve the bonding force, the micron-sized ceramic powder is used for reinforcing the filler, the water dissolving agent is used for matching the coupling reaction, the auxiliary agent is used for the viscosity stability of the glue solution, and the solvent is used for the viscosity adjustment of the glue solution;
(3) heating the knife edge of a casting machine to 40 ℃, transferring the casting film glue solution to a storage tank of the casting machine, heating the storage tank to 40 ℃, controlling the width of a knife edge seam to be 0.3mm, the gap between knife belts to be 0.3mm and the running speed to be 2.5m/min, allowing the mixed solution to flow into the casting knife edge, starting the casting machine after the knife edge is fully filled, and scraping a flat film on a stainless steel belt;
(4) enabling the casting film obtained in the step (3) to pass through a drying oven under the transmission of a stainless steel belt, and turning on an air blower of the drying oven, wherein the temperature is set to be 130 ℃, and the time is 0.5 h;
(5) cooling the casting film obtained in the step (4) for 10min to obtain a uniform casting film with the thickness of 0.025mm and a smooth surface, removing the casting film from the stainless steel belt, and preparing a continuous film by using an automatic winding machine;
(6) cutting the microwave continuous composite dielectric film obtained in the step (5) into slices of 1.1m multiplied by 1.3 m;
(7) subjecting the front and back surfaces of the sheet obtained in the step (6) to plasma activationTreatment (Guohua GH-PM14) with gas ratio (N)2：H2) The flow is 0.4, the flow is 800mL/min, the power is 1600W, and the time is 35 min;
(8) placing a 0.013mm PTFE film on each of the upper and lower sides of the sheet processed in step (7), stacking 5 sheets with the above as basic unit, respectively placing electrolytic copper foil on the top and bottom layers, and vacuum laminating in a high temperature laminator (Burkle) at 380 deg.C and 50Kg/cm2And (5) performing hot pressing for 5 hours to obtain the microwave composite dielectric plate.
Example 3
According to the content of each component in the table of the example 1, the microwave composite dielectric plate is prepared, which comprises the following steps:
(1) adding a hydrolytic solvent into the coupling agents Z-6040 and Z-6124, uniformly stirring, and melting SiO2、TiO2Adding into a ball mill together, and stirring in the ball mill at 70 ℃ for 1.5 h;
(2) cooling to room temperature, adding all materials in the ball mill, water, an auxiliary agent, Polytetrafluoroethylene (PTFE) emulsion and perfluoroalkoxy resin (PFA) into a high-speed shearing stirring kettle, stirring at the speed of 400r/min for 60min at 70 ℃, and setting a vacuum defoaming mode to obtain a casting film glue solution; wherein the fluororesin modifier can improve the bonding force, the micron-sized ceramic powder is used for reinforcing the filler, the water dissolving agent is used for matching the coupling reaction, the auxiliary agent is used for the viscosity stability of the glue solution, and the solvent is used for the viscosity adjustment of the glue solution;
(3) heating the knife edge of a casting machine to 50 ℃, transferring the casting film glue solution to a storage tank of the casting machine, heating the storage tank to 50 ℃, controlling the width of a knife edge seam to be 0.3mm, the gap between knife belts to be 0.4mm and the running speed to be 2.6m/min, allowing the mixed solution to flow into the casting knife edge, starting the casting machine after the knife edge is fully filled, and scraping a flat film on a stainless steel belt;
(4) enabling the casting film obtained in the step (3) to pass through a drying oven under the transmission of a stainless steel belt, and turning on an air blower of the drying oven, wherein the temperature is set to be 150 ℃ and the time is 1 h;
(5) cooling the casting film obtained in the step (4) for 10min to obtain a uniform casting film with the thickness of 0.03mm and a smooth surface, removing the casting film from the stainless steel belt, and preparing a continuous film by using an automatic winding machine;
(6) cutting the microwave continuous composite dielectric film obtained in the step (5) into slices of 1.1m multiplied by 1.3 m;
(7) subjecting the front and back surfaces of the sheet obtained in step (6) to plasma activation treatment (Kowa GH-PM14) under a gas ratio (N)2：H2) 0.6, 1000mL/min of flow, 1800W of power and 45min of time;
(8) placing PFA films with the thickness of 0.013mm on the upper side and the lower side of the sheet processed in the step (7) respectively, using the PFA films as basic units to laminate 9 sheets, respectively placing electrolytic copper foils on the top layer and the bottom layer after lamination, and performing vacuum lamination in a high-temperature laminator (Burkle) under the lamination conditions of 390 ℃ and 70Kg/cm2And (5) performing hot pressing for 2 hours to obtain the microwave composite dielectric plate.
Example 4
According to the content of each component in the table of the example 1, the microwave composite dielectric plate is prepared, which comprises the following steps:
(1) adding a hydrolytic solvent into the coupling agent Z-6124, uniformly stirring, and mixing with BaTiO3Adding into a ball mill together, and stirring in the ball mill at 80 ℃ for 2 h;
(2) cooling to room temperature, adding all materials in the ball mill, a solvent (the volume ratio of water to ethanol is 8:2), an auxiliary agent, Polytetrafluoroethylene (PTFE) emulsion and ethylene-tetrafluoroethylene copolymer (ETFE) into a high-speed shearing stirring kettle, stirring at 80 ℃ for 90min at the speed of 500r/min, and setting a vacuum defoaming mode to obtain a casting film glue solution; wherein the fluororesin modifier can improve the bonding force, the micron-sized ceramic powder is used for reinforcing the filler, the water dissolving agent is used for matching the coupling reaction, the auxiliary agent is used for the viscosity stability of the glue solution, and the solvent is used for the viscosity adjustment of the glue solution;
(3) heating the knife edge of a casting machine to 60 ℃, transferring the casting film glue solution to a storage tank of the casting machine, heating the storage tank to 60 ℃, controlling the width of a knife edge seam to be 0.4mm, the gap between knife belts to be 0.4mm and the running speed to be 2.5m/min, allowing the mixed solution to flow into the casting knife edge, starting the casting machine after the knife edge is fully filled, and scraping a flat film on a stainless steel belt;
(4) enabling the casting film obtained in the step (3) to pass through a drying oven under the transmission of a stainless steel belt, and turning on an air blower of the drying oven, wherein the temperature is set to be 160 ℃ and the time is 2 hours;
(5) cooling the casting film obtained in the step (4) for 30min to obtain a uniform casting film with the thickness of 0.05mm and a smooth surface, removing the casting film from the stainless steel belt, and preparing a continuous film by using an automatic winding machine;
(6) cutting the microwave continuous composite dielectric film obtained in the step (5) into slices of 1.1m multiplied by 1.3 m;
(7) subjecting the front and back surfaces of the sheet obtained in step (6) to plasma activation treatment (Kowa GH-PM14) under a gas ratio (N)2：H2) 0.7, flow 1100mL/min, power 2000W, time 60 min;
(8) placing FEP films with the thickness of 0.013mm on the upper side and the lower side of the sheet processed in the step (7) respectively, using the FEP films as basic units to laminate 7 sheets, respectively placing electrolytic copper foils on the top layer and the bottom layer after lamination, and performing vacuum lamination in a high-temperature laminator (Burkle) under the lamination conditions of 370 ℃ and 100Kg/cm2And (5) performing hot pressing for 5 hours to obtain the microwave composite dielectric plate.
Example 5
According to the content of each component in the table of the example 1, the microwave composite dielectric plate is prepared, which comprises the following steps:
(1) adding a hydrolytic solvent into the coupling agents Z-6124 and Z-6030, uniformly stirring, and melting SiO2、Al2O3Adding the rutile TiO into a ball mill, and stirring for 2 hours in the ball mill at the temperature of 90 ℃;
(2) after cooling to room temperature, adding all materials in the ball mill, a solvent (the volume ratio of water to ethanol is 8:2), an auxiliary agent, Polytetrafluoroethylene (PTFE) emulsion, ethylene-tetrafluoroethylene copolymer (ETFE) and Fluorinated Ethylene Propylene (FEP) into a high-speed shearing stirring kettle, stirring at 80 ℃ at a speed of 500r/min for 120min, and setting a vacuum defoaming mode to obtain a casting film glue solution; wherein the fluororesin modifier can improve the bonding force, the micron-sized ceramic powder is used for reinforcing the filler, the water dissolving agent is used for matching the coupling reaction, the auxiliary agent is used for the viscosity stability of the glue solution, and the solvent is used for the viscosity adjustment of the glue solution;
(3) heating a knife edge of a casting machine to 90 ℃, transferring casting film glue solution to a storage tank of the casting machine, heating the storage tank to 90 ℃, controlling the width of a knife edge seam to be 0.5mm, the gap between knife belts to be 0.4mm and the running speed to be 2.0m/min, allowing the mixed solution to flow into the casting knife edge, starting the casting machine after the knife edge is fully filled, and scraping a flat film on a stainless steel belt;
(4) enabling the casting film obtained in the step (3) to pass through a drying oven under the transmission of a stainless steel belt, and turning on an air blower of the drying oven, wherein the temperature is set to be 170 ℃ and the time is 3 hours;
(5) cooling the casting film obtained in the step (4) for 40min to obtain a uniform casting film with the thickness of 0.1mm and a smooth surface, removing the casting film from the stainless steel belt, and preparing a continuous film by using an automatic winding machine;
(6) cutting the microwave continuous composite dielectric film obtained in the step (5) into slices of 1.1m multiplied by 1.3 m;
(7) subjecting the front and back surfaces of the sheet obtained in step (6) to plasma activation treatment (Kowa GH-PM14) under a gas ratio (N)2：H2) 0.8, flow rate 1200mL/min, power 2200W, time 70 min;
(8) superposing the sheets treated in the step (7) by 3 sheets, respectively placing a 0.013mm PTFE film on the superposed top layer and bottom layer, placing electrolytic copper foils on the upper and lower layers, and vacuum laminating in a high temperature laminator (Burkle) at 385 deg.C and 100Kg/cm2And (5) performing hot pressing for 5 hours to obtain the microwave composite dielectric plate.
Example 6
The microwave composite dielectric sheets and commercial products prepared in examples 2 to 5 were measured by the following methods: the dielectric constant and the dielectric loss are tested according to the IPC-TM-6502.5.5.5 clamped microstrip line test method, the linear thermal expansion coefficient of the X, Y, Z axis is measured according to the IPC-TM-6502.4.41, and the stripping resistance of the microwave composite dielectric plate is measured according to the IPC-6502.4.8.
Table 2 shows the test results of the microwave composite dielectric plate in examples 2 to 5:
from table 2, the microwave composite dielectric plate prepared by the invention overcomes the defects of insufficient rigidity and easy deformation after long-term use of PTFE through the dispersion structure of the ceramic powder in the PTFE medium, and can be prepared into the microwave composite dielectric plate with any dielectric constant of high, medium and low by compounding various ceramic powders. Compared with the foreign series products of the comparative examples 1 to 3, the casting method of the invention has mature process, simple equipment and cheap operation, obviously reduces the requirements on equipment and operation compared with the comparative example which uses the calendaring equipment with customized processing and complicated operation, reduces the equipment manufacturing cost and the maintenance cost by 50 percent, shortens the production period of plate manufacture by 30 percent, has similar properties of the composite substrate, and is a manufacturing method of the high-performance microwave composite dielectric plate with low cost and excellent performance.
The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above examples, and various process schemes having no substantial difference from the concept of the present invention are within the protection scope of the present invention.
Claims (7)
1. A tape casting preparation method of a microwave composite dielectric slab is characterized by comprising the following steps: the method comprises the following steps:
(1) preparing a casting film glue solution; the casting film glue solution is prepared from the following raw materials in parts by weight: 100 parts of PTFE emulsion solid, 1-10 parts of fluororesin modifier, 100-400 parts of micron-sized ceramic powder, 0.1-4 parts of surface modifier, 0.08-5 parts of hydrolysis solvent, 0.5-15 parts of auxiliary agent and 50-100 parts of solvent; the fluororesin modifier is one or more of polyfluorinated ethylene propylene, perfluoroalkoxy resin, ethylene-tetrafluoroethylene copolymer and ethylene-chlorotrifluoroethylene copolymer; the surface modifier is a coupling agent;
the preparation method of the casting film glue solution comprises the following steps:
(a) pretreatment of raw materials: pretreating and hydrolyzing a coupling agent by using a hydrolysis solvent, adding ceramic powder, and placing the mixture in a ball mill;
(b) and (3) wet mixing: adding the materials, the solvent, the auxiliary agent, the PTFE emulsion and the fluororesin modifier in the ball mill into a high-shear stirring kettle, and stirring at the temperature of 60-80 ℃;
(2) casting: placing the casting film glue solution prepared in the step (1) into a casting machine to obtain a casting film;
(3) conveying and drying: drying the casting film obtained in the step (2) through a drying oven;
(4) demolding: cooling the casting film obtained in the step (3) to room temperature to obtain a microwave composite dielectric film;
(5) and (3) post-treatment: carrying out plasma activation treatment on the microwave composite dielectric film obtained in the step (4);
(6) and (3) lamination matching: and (4) overlapping and matching the microwave composite dielectric film treated in the step (5) with a fluororesin film as a basic unit, overlapping, respectively placing metal foils on the top layer and the bottom layer after overlapping, and performing vacuum lamination in a high-temperature laminating machine to obtain the microwave composite dielectric plate.
2. The casting preparation method of the microwave composite dielectric plate as claimed in claim 1, wherein: the hydrolysis solvent is one or more of water, dichloromethane, ethanol, acetone, propylene glycol methyl ether and xylene.
3. The casting preparation method of the microwave composite dielectric plate as claimed in claim 1, wherein: the micron-sized ceramic powder is SiO2、TiO2、Al2O3、CaTiO3、SrTiO3、BaTiO3One or more of AlN, BN and SiC.
4. The casting preparation method of the microwave composite dielectric plate as claimed in claim 1, wherein: the condition of the plasma activation treatment is N2：H2The flow rate is between 800 and 1200mL/min, the power is between 1600 and 2200W, and the treatment time is between 35 and 70 min.
5. The casting preparation method of the microwave composite dielectric plate as claimed in claim 1, wherein: the fluororesin film is compounded by one or more of polytetrafluoroethylene, perfluoroalkoxy resin and fluorinated ethylene propylene.
6. The casting preparation method of the microwave composite dielectric plate as claimed in claim 1, wherein: the conditions for vacuum lamination in the high-temperature laminator were: 350-390 ℃ and 25-100 Kg/cm2And (5) performing hot pressing for 2-10 hours.
7. A microwave composite dielectric slab prepared by the casting method of any one of claims 1 to 6.
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| CN111546718B (en) * | 2020-04-15 | 2022-04-29 | 中国电子科技集团公司第三十八研究所 | Preparation method of microwave composite dielectric plate and prepared microwave composite dielectric plate |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003005444A2 (en) * | 2001-06-29 | 2003-01-16 | Siemens Aktiengesellschaft | Ceramic-filled polymer substrate for using in high frequency technology |
| CN102838906A (en) * | 2011-06-20 | 2012-12-26 | 刘建林 | Fluoropolymer coating solution and weather-resistant coating obtained therefrom |
| CN103408775A (en) * | 2013-07-20 | 2013-11-27 | 北京化工大学 | Preparation method of flexible composite dielectric material with high dielectric constant and low dielectric loss |
| CN106113802A (en) * | 2016-08-16 | 2016-11-16 | 中国电子科技集团公司第三十八研究所 | A kind of preparation method of the microwave copper-clad plate reducing Z axis thermal coefficient of expansion |
| CN108724900A (en) * | 2018-05-29 | 2018-11-02 | 中国电子科技集团公司第三十八研究所 | A kind of preparation method of dry method microwave complex media plate |
| CN108794941A (en) * | 2018-07-03 | 2018-11-13 | 西南交通大学 | A kind of high-dielectric constant inorganic/organic composite material film and preparation method thereof |
-
2019
- 2019-04-12 CN CN201910292180.8A patent/CN109910400B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003005444A2 (en) * | 2001-06-29 | 2003-01-16 | Siemens Aktiengesellschaft | Ceramic-filled polymer substrate for using in high frequency technology |
| CN102838906A (en) * | 2011-06-20 | 2012-12-26 | 刘建林 | Fluoropolymer coating solution and weather-resistant coating obtained therefrom |
| CN103408775A (en) * | 2013-07-20 | 2013-11-27 | 北京化工大学 | Preparation method of flexible composite dielectric material with high dielectric constant and low dielectric loss |
| CN106113802A (en) * | 2016-08-16 | 2016-11-16 | 中国电子科技集团公司第三十八研究所 | A kind of preparation method of the microwave copper-clad plate reducing Z axis thermal coefficient of expansion |
| CN108724900A (en) * | 2018-05-29 | 2018-11-02 | 中国电子科技集团公司第三十八研究所 | A kind of preparation method of dry method microwave complex media plate |
| CN108794941A (en) * | 2018-07-03 | 2018-11-13 | 西南交通大学 | A kind of high-dielectric constant inorganic/organic composite material film and preparation method thereof |
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