CN107172821A - The method for manufacturing cover clad laminate of 2.2≤Dk of one kind ＜ 6.5 - Google Patents

The method for manufacturing cover clad laminate of 2.2≤Dk of one kind ＜ 6.5 Download PDF

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Publication number
CN107172821A
CN107172821A CN201710480977.1A CN201710480977A CN107172821A CN 107172821 A CN107172821 A CN 107172821A CN 201710480977 A CN201710480977 A CN 201710480977A CN 107172821 A CN107172821 A CN 107172821A
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CN
China
Prior art keywords
copper
powder
ceramic powder
clad
preparation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710480977.1A
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Chinese (zh)
Inventor
高绍兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANHUI SHENGHONG ELECTRONIC Co Ltd
Lujiang County Dian Yang Electronic Materials Co Ltd
Original Assignee
ANHUI SHENGHONG ELECTRONIC Co Ltd
Lujiang County Dian Yang Electronic Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ANHUI SHENGHONG ELECTRONIC Co Ltd, Lujiang County Dian Yang Electronic Materials Co Ltd filed Critical ANHUI SHENGHONG ELECTRONIC Co Ltd
Priority to CN201710480977.1A priority Critical patent/CN107172821A/en
Publication of CN107172821A publication Critical patent/CN107172821A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]

Abstract

The invention discloses the method for manufacturing cover clad laminate of 2.2≤Dk of one kind ＜ 6.5, the appropriate powder of selection dielectric constant and polytetrafluoroethylene (PTFE) powder are used as raw material, blank is configured to by forming and sintering, blank is lathed plate and can obtain base material, is the copper-clad plate that 2.2≤Dk ＜ 6.5 are made by the two-sided use vacuum hot-pressing coating foil of base material.2.2≤Dk ＜ 6.5 produced by the present invention copper-clad plate product dielectric loss is low, simple with manufacture craft, the advantage of energy-conserving and environment-protective.

Description

The method for manufacturing cover clad laminate of 2.2≤Dk of one kind ＜ 6.5
Technical field
It is specifically the method for manufacturing cover clad laminate of 2.2≤Dk of one kind ＜ 6.5 the present invention relates to method for manufacturing cover clad laminate field.
Background technology
Copper-clad plate is baseplate material essential when pcb board makes, and it is typically by base material single or double coating foil structure Into.2.2≤Dk of prior art（Dielectric constant）The copper-clad plates of ＜ 6.5 are to utilize low-k powder doping ptfe emulsion Resin, is mixed into glue by powder and ptfe emulsion, glue is coated uniformly on glass fabric to drying obtained Bonding sheet, then the techniques such as bonding sheet double-side copper-applying hot pressing are made.It is bigger than normal due to applying loss in manufacturing process Glass fabric, the dielectric loss of the obtained copper-clad plate products of 2.2≤Dk ＜ 6.5 is bigger than normal, and use glass fabric its life High energy consumption is produced, and environmental pollution can be brought.
The content of the invention is existing to solve it is an object of the invention to provide the method for manufacturing cover clad laminate of 2.2≤Dk of one kind ＜ 6.5 Product dielectric loss made from the method for manufacturing cover clad laminate of technology 2.2≤Dk of kind ＜ 6.5 is big and the problem of environmental pollution.
In order to achieve the above object, the technical solution adopted in the present invention is：1st, the copper-clad plate systems of 2.2≤Dk of one kind ＜ 6.5 Make method, it is characterised in that：Comprise the following steps：
（1）, ceramic powder using low dielectric constant and high Q value and polytetrafluoroethylene (PTFE) powder as raw material, and by ceramic powder and Polytetrafluoroethylene (PTFE) powder is well mixed；
（2）, by step（1）Well mixed powder is processed into blank through forming and sintering；
（3）, by step（2）Process obtained blank and be lathed plate, you can obtain the base of the copper-clad plates of 2.2≤Dk of making ＜ 6.5 Material.
（4）, by step（3）Obtained base material double-side copper-applying covers copper using the obtained 2.2≤Dk ＜'s 6.5 of vacuum hot-pressing Plate.
The preparation method of the described copper-clad plate base materials of 2.2≤Dk ＜ 6.5, it is characterised in that：Step（1）In, ceramic powder Dielectric constant requirement be 6 to 30, ceramic powder be silica, aluminum oxide, titanium dioxide mixture, their mass fraction Respectively：Silica 40-70%, aluminum oxide 10-30%, titanium dioxide are surplus；The Q values ＞ 10000 of ceramic powder.
The preparation method of the described copper-clad plate base materials of 2.2≤Dk ＜ 6.5, it is characterised in that：Step（1）In, ceramic powder Mass ratio with polytetrafluoroethylene (PTFE) powder is 1:9 to 4:6.
The preparation method of the described copper-clad plate base materials of 2.2≤Dk ＜ 6.5, it is characterised in that：Step（1）In, polytetrafluoroethyl-ne The particle diameter of alkene powder is capable of the particle diameter of burden ceramic powder.
The preparation method of the described copper-clad plate base materials of 2.2≤Dk ＜ 6.5, it is characterised in that：Step（2）In：Pressed during shaping Power requirement is 100kg/cm2, molding time be 50h；380 DEG C of sintering temperature, sintering time 50h.
The preparation method of the described copper-clad plate base materials of 2.2≤Dk ＜ 6.5, it is characterised in that：Step（3）Middle blank is lathed After plate, thickness of slab is in 0.5-9mm, and turning device therefor is peeler.
The preparation method of the described copper-clad plate base materials of 2.2≤Dk ＜ 6.5, it is characterised in that：Using turning, vacuum hotpressing side Formula makes the copper-clad plates of 2.2≤Dk ＜ 6.5.
The present invention mixes the ceramic powder and polytetrafluoroethylene (PTFE) powder of low dielectric constant and high Q value, through forming and sintering rear car It is whittled into the plate of various thickness, thickness of slab can be achieved from 0.5-9mm, this plate is made 2.2 using vacuum hot-pressing two-sided deposited copper foil≤ Dk ＜ 6.5 copper-clad plate.Present invention process strengthens copper-clad plate rigidity without using glass fabric, and glass fabric gluing is not used Roasting procedure, is damaged without using the copper-clad plate product medium of loss glass fabric bigger than normal, therefore obtained 2.2≤Dk ＜ 6.5 Consumption is low, simple with manufacture craft, the advantage of energy-conserving and environment-protective.
Embodiment
The method for manufacturing cover clad laminate of 2.2≤Dk of one kind ＜ 6.5, comprises the following steps：
（1）, ceramic powder using low dielectric constant and high Q value and polytetrafluoroethylene (PTFE) powder as raw material, and by ceramic powder and Polytetrafluoroethylene (PTFE) powder is well mixed；
（2）, by step（1）Well mixed powder is processed into blank through forming and sintering；
（3）, by step（2）Process obtained blank and be lathed plate, you can obtain the base of the copper-clad plates of 2.2≤Dk of making ＜ 6.5 Material.
（4）, by step（3）Obtained base material double-side copper-applying covers copper using the obtained 2.2≤Dk ＜'s 6.5 of vacuum hot-pressing Plate.
Step（1）In, the dielectric constant requirement of ceramic powder is 6 to 30, and ceramic powder is silica, aluminum oxide, two Titania mixture, their mass fraction is respectively：Silica 40-70%, aluminum oxide 10-30%, titanium dioxide are surplus； The Q values ＞ 10000 of ceramic powder
Step（1）In, the mass ratio of ceramic powder and polytetrafluoroethylene (PTFE) powder is 1:9 to 4:6.
Step（1）In, the particle diameter of polytetrafluoroethylene (PTFE) powder is capable of the particle diameter of burden ceramic powder.
Step（2）In：Pressure requirements are 100kg/cm during shaping2, molding time be 50h；380 DEG C of sintering temperature, sintering Time 50h.
Step（3）Middle blank is lathed after plate, and thickness of slab is in 0.5-9mm, and turning device therefor is peeler.

Claims (7)

1. the method for manufacturing cover clad laminate of 2.2≤Dk of one kind ＜ 6.5, it is characterised in that：Comprise the following steps：
（1）, ceramic powder using low dielectric constant and high Q value and polytetrafluoroethylene (PTFE) powder as raw material, and by ceramic powder and Polytetrafluoroethylene (PTFE) powder is well mixed；
（2）, by step（1）Well mixed powder is processed into blank through forming and sintering；
（3）, by step（2）Process obtained blank and be lathed plate, you can obtain the base of the copper-clad plates of 2.2≤Dk of making ＜ 6.5 Material；
（4）, by step（3）2.2≤Dk ＜ 6.5 copper-clad plate is made using vacuum hot-pressing for obtained base material double-side copper-applying.
2. the preparation method of the copper-clad plates of 2.2≤Dk ＜ 6.5 according to claim 1, it is characterised in that：Step（1）In, pottery The dielectric constant requirement of ceramic powder is 6 to 30, and ceramic powder is silica, aluminum oxide, titanium dioxide mixture, their matter Measuring number is respectively：Silica 40-70%, aluminum oxide 10-30%, titanium dioxide are surplus；The Q values ＞ 10000 of ceramic powder.
3. the preparation method of the copper-clad plates of 2.2≤Dk ＜ 6.5 according to claim 1, it is characterised in that：Step（1）In, pottery The mass ratio of ceramic powder and polytetrafluoroethylene (PTFE) powder is 1:9 to 4:6.
4. the preparation method of the copper-clad plates of 2.2≤Dk ＜ 6.5 according to claim 1, it is characterised in that：Step（1）In, gather The particle diameter of tetrafluoroethene powder is capable of the particle diameter of burden ceramic powder.
5. the preparation method of the copper-clad plates of 2.2≤Dk ＜ 6.5 according to claim 1, it is characterised in that：Step（2）In：Into Pressure requirements are 100kg/cm during type2, molding time be 50h；380 DEG C of sintering temperature, sintering time 50h.
6. the preparation method of the copper-clad plates of 2.2≤Dk ＜ 6.5 according to claim 1, it is characterised in that：Step（3）Middle base Truck is whittled into after plate, and thickness of slab is in 0.5-9mm, and equipment used in turning is peeler.
7. the preparation method of the copper-clad plates of 2.2≤Dk ＜ 6.5 according to claim 1, it is characterised in that：Using turning, very Empty hot pressing mode makes the copper-clad plates of 2.2≤Dk ＜ 6.5.
CN201710480977.1A 2017-06-22 2017-06-22 The method for manufacturing cover clad laminate of 2.2≤Dk of one kind ＜ 6.5 Pending CN107172821A (en)

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CN201710480977.1A CN107172821A (en) 2017-06-22 2017-06-22 The method for manufacturing cover clad laminate of 2.2≤Dk of one kind ＜ 6.5

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Application Number Priority Date Filing Date Title
CN201710480977.1A CN107172821A (en) 2017-06-22 2017-06-22 The method for manufacturing cover clad laminate of 2.2≤Dk of one kind ＜ 6.5

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108501488A (en) * 2018-05-18 2018-09-07 吴东建 A kind of high-frequency high-speed copper-clad plate and preparation method thereof
CN108901130A (en) * 2018-05-18 2018-11-27 吴东建 A kind of high-frequency high-speed flexibility coat copper plate and preparation method thereof
CN110564085A (en) * 2019-09-20 2019-12-13 天津市天塑滨海氟塑料制品有限公司 Manufacturing method of PTFE ceramic modified substrate film for high-performance circuit board
WO2022007069A1 (en) * 2020-07-09 2022-01-13 瑞声声学科技(深圳)有限公司 Method for preparing composite dielectric copper-clad laminate, and printed circuit board
CN114851646A (en) * 2022-05-20 2022-08-05 江苏泰氟隆科技有限公司 Thin PTFE high-frequency copper-clad plate and manufacturing process thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101003439A (en) * 2006-11-09 2007-07-25 中国矿业大学 Ion implantation of cupper, nickel as pretreatment technique for electroless copper on surface of ceramics
CN102260378A (en) * 2011-05-06 2011-11-30 广东生益科技股份有限公司 Composite material, high-frequency circuit board manufactured therefrom and manufacturing method of high-frequency circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101003439A (en) * 2006-11-09 2007-07-25 中国矿业大学 Ion implantation of cupper, nickel as pretreatment technique for electroless copper on surface of ceramics
CN102260378A (en) * 2011-05-06 2011-11-30 广东生益科技股份有限公司 Composite material, high-frequency circuit board manufactured therefrom and manufacturing method of high-frequency circuit board

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108501488A (en) * 2018-05-18 2018-09-07 吴东建 A kind of high-frequency high-speed copper-clad plate and preparation method thereof
CN108901130A (en) * 2018-05-18 2018-11-27 吴东建 A kind of high-frequency high-speed flexibility coat copper plate and preparation method thereof
CN110564085A (en) * 2019-09-20 2019-12-13 天津市天塑滨海氟塑料制品有限公司 Manufacturing method of PTFE ceramic modified substrate film for high-performance circuit board
WO2022007069A1 (en) * 2020-07-09 2022-01-13 瑞声声学科技(深圳)有限公司 Method for preparing composite dielectric copper-clad laminate, and printed circuit board
CN114851646A (en) * 2022-05-20 2022-08-05 江苏泰氟隆科技有限公司 Thin PTFE high-frequency copper-clad plate and manufacturing process thereof

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Application publication date: 20170915

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