CN109890129B

CN109890129B - Display device

Info

Publication number: CN109890129B
Application number: CN201910232081.0A
Authority: CN
Inventors: 黄阿海
Original assignee: Xiamen Tianma Microelectronics Co Ltd
Current assignee: Xiamen Tianma Microelectronics Co Ltd
Priority date: 2019-03-26
Filing date: 2019-03-26
Publication date: 2020-05-12
Anticipated expiration: 2039-03-26
Also published as: CN109890129A

Abstract

The application provides a display device for reducing the bounce of an FPC. The display device includes: a display panel including a driving chip; the flexible printed circuit board comprises a main body part and a bulge part, wherein the main body part comprises a binding region, the binding region comprises a plurality of gold fingers which are arranged along a first direction, the flexible printed circuit board is electrically connected with the driving chip through the binding region, and the bulge part is arranged on at least one side edge of the main body part and comprises exposed copper; and the conductive part at least partially covers the driving chip and is grounded through the exposed copper.

Description

Display device

Technical Field

The application relates to the technical field of display, in particular to a display device.

Background

A Thin Film Transistor (TFT) glass substrate of a display device is provided with a driver Integrated Circuit (driver IC). During the use of the display device, a large amount of contact static electricity and air static electricity are accumulated in the display device. If static electricity is not discharged in time, the driving chip may be damaged.

At present, in order to discharge static electricity accumulated in a display device, a structure of a conventional display device is designed as follows: a piece of conductive cloth is attached to the driving chip, extends to a Flexible Printed Circuit (FPC) and then is grounded, and therefore static electricity is released through grounding of the conductive cloth.

However, in the existing arrangement structure, due to the existence of the conductive cloth, the bounce at the bending part of the FPC is increased, which may cause the bending part of the FPC to bounce, and further cause the display device to display abnormally.

Disclosure of Invention

The application provides a display device for reducing the bounce of an FPC.

An embodiment of the application provides a display device, including:

a display panel including a driving chip;

the flexible printed circuit board comprises a main body part and a bulge part, wherein the main body part comprises a binding region, the binding region comprises a plurality of gold fingers which are arranged along a first direction, the flexible printed circuit board is electrically connected with the driving chip through the binding region, and the bulge part is arranged on at least one side edge of the main body part and comprises exposed copper;

and the conductive part at least partially covers the driving chip and is grounded through the exposed copper.

In the above scheme, the bulge part is additionally arranged on any side edge of the main body part of the flexible printed circuit board, the bulge part comprises exposed copper, the conductive part is grounded through the exposed copper, and compared with a mode that the conductive part directly covers the exposed copper of the bending area in the prior art, the scheme can relatively reduce the bending part of the conductive part, so that the bounce of the FPC can be reduced, and the quality of the display device is improved. In addition, in the above-mentioned solution, since the main body portion is not covered by the conductive portion, the probability of the conductive portion being wrinkled can be reduced, which is beneficial to improving the stability of the antistatic capability of the display device. And, add the boss on the arbitrary side of the main part of flexible printed circuit board, can improve the flexibility that the boss set up, be convenient for satisfy different users' demand.

Drawings

Fig. 1 is a schematic diagram of a display device provided in the prior art before a conductive cloth is disposed;

fig. 2 is a schematic diagram of a display device provided in the prior art after a conductive cloth is disposed;

FIG. 3 is a schematic diagram of a cross section AA of the display device shown in FIG. 2 according to the prior art;

fig. 4 is a schematic diagram of a display device provided in an embodiment of the present application before a conductive portion is disposed;

fig. 5 is a schematic diagram illustrating a display device according to an embodiment of the present disclosure after a conductive portion is disposed thereon;

fig. 6 is a schematic diagram of a BB cross section of the display device in fig. 5 according to an embodiment of the present disclosure;

fig. 7 is a first schematic structural diagram of a display device according to an embodiment of the present disclosure;

fig. 8 is a schematic structural diagram of the display device shown in fig. 7 after a conductive portion is disposed thereon according to an embodiment of the present disclosure;

fig. 9 is a second schematic structural diagram of a display device according to an embodiment of the present application;

fig. 10 is a schematic structural diagram of the display device shown in fig. 9 after a conductive portion is disposed thereon according to an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of a display device provided in the embodiment of the present application;

fig. 12 is a schematic structural diagram of the display device shown in fig. 9 after a conductive portion is disposed thereon according to an embodiment of the present disclosure;

fig. 13 is a fourth schematic structural diagram of a display device according to an embodiment of the present application;

fig. 14 is a schematic structural view of the display device shown in fig. 13 according to the embodiment of the present application after a conductive portion is disposed;

fig. 15 is a schematic structural diagram of a display device according to an embodiment of the present application;

fig. 16 is a schematic view of the display device shown in fig. 15 according to the embodiment of the present application after a conductive portion is disposed;

fig. 17 is a sixth schematic structural view of a display device according to an embodiment of the present application;

fig. 18 is a schematic view of the display device shown in fig. 17 provided in the embodiment of the present application after a conductive portion is disposed;

fig. 19 is a seventh schematic structural diagram of a display device according to an embodiment of the present application;

fig. 20 is a schematic view of the display device shown in fig. 19 according to the embodiment of the present application after a conductive portion is disposed.

Detailed Description

In order to better understand the technical solutions provided by the embodiments of the present application, the following detailed description is made with reference to the drawings and specific embodiments.

For the convenience of understanding the technical solutions in the present application, the prior art related to the present application is described below.

Referring to fig. 1, fig. 1 is a schematic diagram of a display device in the prior art before a conductive cloth is not disposed, the display device including a Thin Film Transistor (TFT) substrate 140, a Color Filter (CF) substrate 150, a driving chip 110, and a flexible printed circuit board 120. The flexible printed circuit board 120 includes a bonding region 121, a bending region 122, and a device region 123.

Specifically, in order to discharge the static electricity of the display device, please continue to refer to fig. 1, the device region 123 is generally further provided with exposed copper 130. Referring to fig. 2, fig. 2 is a schematic diagram of the display device shown in fig. 1 after the conductive cloth 200 is added and the flexible printed circuit board 120 is bent. To more clearly illustrate the hierarchical relationship among the structures, referring to fig. 3, fig. 3 shows a schematic structural diagram of a cross section of the display device AA in fig. 2, the CF substrate 150 is disposed on the TFT substrate 140, the driving chip 110 is disposed on the TFT substrate 140, and the flexible printed circuit board 120 is electrically connected to the driving chip 110 through the bonding region 121. The conductive cloth 200 covers the driving chip 110, is attached to the exposed copper 130 of the device region 123, and is grounded through the exposed copper 130. The static electricity in the display device can be discharged through the conductive cloth 200 and the exposed copper 130 in sequence.

In fig. 3, a portion of the flexible printed circuit board 120 is bent to the back of the backlight assembly 300 and contacts the backlight assembly 300, the conductive part 200 attached to the flexible printed circuit board 120 is also bent, and the existence of the conductive cloth 200 increases the bounce of the bent area 122 of the bent flexible printed circuit board 120, which easily causes the flexible printed circuit board 120 to bounce, thereby causing the display device to display an abnormal display. The bounce force may be understood as a force to restore an original state after the FPC is bent.

In view of the above, referring to fig. 4, fig. 4 is a schematic structural diagram illustrating the display device before the main body 424 is bent. The display device includes a display panel and a flexible printed circuit board 420. The flexible printed circuit board 420 includes a body portion 424 and a bump portion 426. The body portion 424 includes a bonding region 421. The flexible printed circuit board 420 is electrically connected to the driving chip 410 through the bonding region 421. The binding region 421 includes a plurality of gold fingers 425 arranged along the first direction, the number of the gold fingers 425 may be set according to actual requirements, and the number of the gold fingers 425 is not limited in this embodiment of the application. A boss 426 is disposed on at least one side of the body portion 424, the boss 426 including exposed copper 427.

To more clearly illustrate the structure of the display device, please refer to fig. 5, in which fig. 5 is a schematic diagram after the conductive portion 500 is disposed and the main body portion 424 is bent, and since the main body portion 424 is partially bent, only the main body portion 424 is illustrated in fig. 5. The conductive part 500 covers at least a part of the driving chip 410.

To more clearly illustrate the display devices shown in fig. 4 and 5, please refer to fig. 6, in which fig. 6 is a schematic diagram of a BB cross section of the display device shown in fig. 5, the display panel further includes a TFT substrate 440 and a CF substrate 450. The CF substrate 450 is disposed opposite to the TFT substrate 440, and the liquid crystal is sandwiched between the CF substrate 450 and the TFT substrate 440, and the driving chip 410 is disposed on the TFT substrate 440. In fig. 6, a part of the main body portion 424 is bent to the back of the backlight assembly 600 and contacts the backlight assembly 600. Of course, other structures are also included on the display panel, and will not be described in detail herein. It should be noted that fig. 6 exemplifies that the thickness of the convex portion 426 is the same as that of the exposed copper 427, but actually, the thickness of the convex portion 426 may be larger than that of the exposed copper 427.

In order to explain the specific meaning of the thickness, referring to fig. 6, the thickness of the protrusion 426 shown in fig. 6 can be understood as the width W1 of the protrusion 426 shown in fig. 6, and the thickness of the body portion 426 can be understood as the width W2 of the body portion 426 shown in fig. 6.

Specifically, the number of the driving chips 410 may be one or more, and only one driving chip 410 is provided in fig. 4 as an example, but the number of the driving chips 410 is not limited in practice. The conductive part 500 at least covers part of the driving chip 410 can be understood as: if the display device includes only one driving chip 410, the conductive part 500 at least partially overlaps the driving chip 410 in a direction perpendicular to a plane of the TFT substrate; if the display device includes a plurality of chips, the conductive portion 500 at least partially overlaps any one of the driving chips 410 in a direction perpendicular to a plane of the TFT substrate. In other words, the conductive part 500 needs to be in contact with each driver chip 410, so that the static electricity on any driver chip 410 can be conducted out through the conductive part 500.

The body portion 424 has a plurality of sides and the protrusion 426 may be disposed on any one or more sides of the body portion 424. The number of the projections 426 is one or more, and one projection 426 is exemplified in fig. 4 to 6, but the number of the projections 426 is not limited in practice. When the number of the protruding portions 426 is plural, the protruding portions 426 may be provided all on one side of the main body portion 424, or may be provided dispersed on several sides of the main body portion 424. When the number of the protrusions 426 is plural, the structure of the plural protrusions 426 may be the same, and the size of the plural protrusions 426 may be the same. The sizes of the plurality of protrusions 426 may not be exactly the same according to actual conditions.

In the embodiment of the present application, the protrusion 426 is additionally disposed on the main body 424 of the flexible printed circuit board 420, the conductive portion 500 at least covers a portion of the driving chip 410, and then the conductive portion is grounded through the exposed copper 427 on the protrusion 426, so that static electricity on the driving chip 410 is discharged, and the anti-static capability of the display device is realized. In the embodiment of the present application, since the conductive part 500 is grounded through the protrusion 426 on the side of the main body 424, when the flexible printed circuit board 420 is bent, the conductive part 500 does not need to be bent, thereby solving the problem of the prior art that the bounce force of the flexible printed circuit board is too large due to the addition of the conductive cloth, and improving the quality of the flexible printed circuit board.

Since the conductive portion 500 is grounded through the exposed copper 427 on the bump 426, the shape of the conductive portion 500 varies depending on the position where the bump 426 is provided. The following describes different arrangements of the protruding portion 426 with reference to the drawings.

The first method comprises the following steps:

the protrusion 426 is disposed on at least one of the first, second, and third side edges of the binding region 421. The first side is the side of the bonding region 421 closest to the driver chip 410, and generally the first side is the side of the bonding region 421 along the first direction. The second side edge and the third side edge are two opposite side edges in the first direction.

Specifically, the structures and the connection relationships of the driving chip 410 and the main body portion 424, and the connection relationship between the flexible printed circuit board 420 and the display panel may refer to the foregoing discussion, and are not described herein again. When the number of the convex portions 426 is one, the convex portions 426 may be provided on any one of the first side, the second side, and the third side. When the number of the protruding portions 426 is two or more, in order to facilitate the connection between the conductive portion 500 and the protruding portions 426, all of the protruding portions 426 may be disposed on any one of the first side, the second side, and the third side, or in order to share the load of each side, the protruding portions 426 of the protruding portions 426 may be disposed on any two or three of the first side, the second side, and the third side in a dispersed manner.

The following describes the structure of the display device according to the embodiments of the present application, which includes, but is not limited to, the following two (a1, a 2).

A1, when there is one protrusion 426, please continue to refer to fig. 4, the protrusion 426 is disposed on the first side. The first side edge is the edge shown as a in fig. 4.

In the embodiment of the present application, since the first side is relatively closest to the driving chip 410, the conductive portion 500 is to be in contact with the protrusion 426, and the material of the conductive portion 500 is less, compared to the way that the conductive portion 500 needs to cover the main body portion 424 in the prior art, the material of the conductive portion 500 can be saved in the display panel in the embodiment of the present application, so that the cost of the display device can be relatively reduced.

In order to avoid the additional protrusion 426 affecting the connection between the main body 424 and the display panel, the protrusion 426 may be disposed on a side line other than the alignment mark line on the first side.

Specifically, referring to fig. 4, in order to determine the position for conveniently binding the main body 424 and the display panel at the later stage, alignment marks are generally disposed on the first side of the main body 424, and the alignment marks are m and n in fig. 4. The protrusion 426 may be disposed on the edge line except the alignment mark and the gold finger 425 on the first edge.

A2, when the number of the protruding parts 426 is two, the two protruding parts 426 are the same distance from the driving chip 410.

Specifically, the two protruding portions 426 are disposed at the same distance from the driving chip 410. Regarding the structure and connection relationship of the driving chip 410 and the main body portion 424, the connection relationship between the flexible printed circuit board 420 and the display panel can refer to the above discussion, and will not be described herein again.

Two protrusions 426 are disposed on the main body 424, and on the one hand, the two protrusions 426 can make the electrostatic discharge effect better. On the other hand, the two protruding portions 426 are located at the same distance from the driving chip 410, so that the conductive portion 500 can be easily connected to the two protruding portions 426.

The number of the protruding portions 426 is two, and the two protruding portions 426 are located at the same distance from the driving chip 410, and may be arranged differently, including but not limited to the following two (the first structure and the second structure):

the first structure is as follows:

the display device includes two protrusions 426. The two bumps 426 are located at the same distance from the driving chip 410, and both of the two bumps 426 are disposed on the first side.

Specifically, referring to fig. 7, the flexible printed circuit board 420 of the display device includes two protruding portions 426. To facilitate the distinction of the two bosses 426 in the figures, one of the two bosses 426 is designated a first boss 710 and the other of the two bosses 426 is designated a second boss 720. The first and second protruding

portions

710 and 720 are disposed on the first side and symmetrically distributed along the first side with respect to the driving chip 410. The first and

second bump parts

710 and 720 have the same distance from the driving chip 410.

Referring to fig. 8, fig. 8 is a schematic structural diagram of the display device shown in fig. 7 after the conductive part 500 is added. When two convex portions 426 are provided, the conductive portion 500 is grounded through the first convex portion 710 and the second convex portion 720 at the same time.

Of course, in order to avoid the additional protrusion 426 affecting the connection between the main body 424 and the display panel, the two protrusions 426 may be disposed on the edge lines of the first side except for the alignment mark and the gold finger 425. For the alignment mark lines, reference may be made to the foregoing discussion, and the details are not repeated here.

In the embodiment of the present application, the first bump 710 and the second bump 720 are both disposed on the first side, and since the first side is closer to the driver chip 410, the material of the conductive portion 500 can be saved. The distances between the first protruding part 710 and the second protruding part 720 and the driving chip 410 are the same, so that static electricity on the driving chip 410 can be discharged from the first protruding part 710 and the second protruding part 720 relatively uniformly, which is beneficial to increasing the rate of discharging static electricity.

The second structure is as follows:

the display device includes two protrusions 426. The distance from the first bump 710 to the driver chip 410 is the same as the distance from the second bump 720 to the driver chip 410, and the first bump 710 and the second bump 720 are disposed on different sides of the bonding region 421.

Specifically, referring to fig. 9, fig. 9 is a schematic structural diagram of a display device, in which a first protrusion 710 of a flexible printed circuit board 420 of the display device is disposed on a second side edge, and a second protrusion 720 is disposed on a third side edge. The second side is shown as b in fig. 9 and the third side is shown as c in fig. 9.

Referring to fig. 10, fig. 10 is a schematic structural view of the display device shown in fig. 9 after adding the conductive part 500, in which the conductive part 500 covers the driving chip 410 and is grounded through the first bump 710 and the second bump 720. The orthographic projection of the conductive part 500 on the plane of the display panel is not overlapped with the orthographic projection of the main body part 424 on the plane of the display panel, and it can be understood that the conductive part 500 bypasses the main body part 424 and is connected with the first convex part 710 and the second convex part 720.

In the embodiment of the present application, the first protruding portion 710 is disposed on the second side, the second protruding portion 720 is disposed on the third side, the two protruding portions 426 are dispersed on the two sides, and the two protruding portions 426 are equidistant from the driving chip 410, so that the static electricity on the driving chip 410 can be uniformly discharged from the two protruding portions 426.

And the second method comprises the following steps:

the protruding portions 426 are disposed on one or more sides of the bending region 422 opposite to each other along the first direction, and an orthogonal projection of the conductive portion 500 on a plane of the display panel does not overlap an orthogonal projection of the main portion 424 on the plane of the display panel. The bending region 422 is connected to the bonding region 421 and located on a side of the bonding region 421 away from the driving chip 410, which can be understood as that the bending region 422 is farther away from the driving chip 410 relative to the bonding region 421. After the bending region 422 is bent, the relative position relationship between the bending region 422 and the bonding region 421 may be changed, and in this application, the bending region 422 is farther from the driving chip 410 relative to the bonding region 421, which is described with reference to the main body portion 424 before the bending is performed.

Specifically, regarding the structure and connection relationship of the driving chip 410 and the main body portion 424, the connection relationship between the flexible printed circuit board 420 and the display panel may refer to the contents discussed above, and will not be described herein again. The bending region 422 may include a plurality of sides, but some sides of the bending region 422 may be connected to the binding region 421, and the protrusions 426 provided on one or more sides of the bending region 422 in the embodiment of the present application opposite to each other in the first direction may avoid affecting the connection between the bending region 422 and the binding region 421. The fact that the orthographic projections of the binding regions 421 on the plane of the display panel are not overlapped means that the orthographic projections of the binding regions 421 on the plane of the display panel are not projected when the bending regions 422 of the main body portion 424 are not bent. The orthographic projection of the conductive part 500 on the plane of the display panel is not overlapped with the orthographic projection of the binding area 421 on the plane of the display panel, and it can be understood that the conductive part 500 bypasses the main body part 424, and the grounding of the convex part 426 is realized.

In the embodiment of the present application, another structure of the display device provided with the protruding portion 426 is provided. When the conductive part 500 releases static electricity, the area of the conductive part 500 is reduced, and the bent portion of the conductive part 500 is reduced, so that the bounce of the bent area 422 can be reduced, and the quality of the flexible printed circuit board 420 is improved.

In the embodiment of the present application, since there may be more than one side of the bending region 422 and the number of the protrusions 426 may be arbitrary, there are many ways to arrange the protrusions 426 at the bending region 422, which will be exemplified below.

For example, referring to fig. 11, fig. 11 is a schematic structural diagram of a display device according to an embodiment of the present disclosure, in which the number of the protruding portions 426 is one, and the protruding portions are disposed on one side of the bending region 422.

Specifically, referring to fig. 12, fig. 12 is a schematic diagram illustrating the display device shown in fig. 11 after adding a conductive part. The conductive portion 500 is wound around the side of the body portion 424, attached to the bump 426, and grounded via the bump.

For example, referring to fig. 13, fig. 13 is a schematic structural diagram of a display device according to an embodiment of the present disclosure, in which the number of the protruding portions 426 is two, and distances from the two protruding portions 426 to the driving chip 410 are equal.

Specifically, the first protrusion 710 is disposed on the fourth side of the bending region 422, and the second protrusion 720 is disposed on the fifth side of the bending region 422. The fourth side and the fifth side are two opposite sides along the first direction, the fourth side is a line segment shown as e in fig. 13, and the fifth side is a line segment shown as f in fig. 13. Referring to fig. 14, the conductive portion 500 bypasses the main body portion 424 to make contact with the first bump 710 and the second bump 720, so as to be grounded through the exposed copper of the first bump 710 and the exposed copper of the second bump 720.

In the embodiment of the present application, two protruding portions 426 are provided, so that the antistatic effect of the display device is better.

And the third is that:

the protruding portions 426 are disposed on one or more side edges of the device region 423 opposite along the first direction, and an orthogonal projection of the conductive portion 500 on a plane of the display panel does not overlap an orthogonal projection of the main body portion 424 on the plane of the display panel.

The body portion 424 includes a bonding region 421, a bending region 422, and a device region 423. The bending region 422 is located on a side of the bonding region 421 away from the driving chip 410, which can be understood as that the bending region 422 is farther away from the driving chip 410 relative to the bonding region 421. The device region 423 is located on a side of the bending region 422 away from the driving chip 410, and it can be understood that the device region 423 is farther away from the driving chip 410 relative to the bending region 422. The bending region 422 is farther from the driving chip 410 than the bonding region 421, and the main body 424 is referred to before bending. The device region 423 located on the side of the bending region 422 away from the driving chip 410 is described with reference to the main body 424 before bending.

Specifically, regarding the structure and connection relationship of the driving chip 410 and the main body portion 424, the connection relationship between the flexible printed circuit board 420 and the display panel may refer to the contents discussed above, and will not be described herein again. The device region 423 may include a plurality of sides, but some of the sides of the device region 423 may be connected to the bending region 422, and the protrusions 426 in this embodiment are disposed on one or more sides opposite to each other along the first direction, so as to avoid affecting the connection between the bending region 422 and the device region 423. The orthographic projection of the binding region 421 and the bending region 422 on the plane of the display panel refers to the orthographic projection of the binding region 421 and the bending region 422 on the plane of the display panel under the condition that the bending region 422 of the main body portion 424 is not bent.

Before the bending region 422 is not bent, the orthographic projection of the conductive part 500 on the plane of the display panel is not overlapped with the orthographic projection of the binding region 421 and the bending region 422 on the plane of the display panel. In the embodiment of the present application, the orthographic projection of the conductive portion 500 on the plane of the display panel does not overlap with the orthographic projection of the bonding region 421 and the bending region 422 on the plane of the display panel, which means that the conductive portion 500 bypasses the main body portion 424 and is grounded through the exposed copper 427 on the protrusion 426.

For example, referring to fig. 15, fig. 15 is a schematic structural diagram of a display device according to an embodiment of the present disclosure, in which the number of the protruding portions 426 is one, and the protruding portions are disposed on one side of the device region 423.

Specifically, referring to fig. 16, fig. 16 is a schematic diagram illustrating the display device shown in fig. 15 after adding a conductive part. The conductive portion 500 is attached to the bump 426 by passing around the side of the body portion 424, and is grounded via the bump 426.

For example, referring to fig. 17, fig. 17 is a schematic structural diagram of a display device according to an embodiment of the present disclosure, in which the number of the protruding portions 426 is two, and distances from the two protruding portions 426 to the driving chip 410 are equal.

Specifically, the first bump 710 is disposed on the sixth side of the device region 423, and the second bump 720 is disposed on the seventh side of the device region 423. The sixth side and the fifth side are two opposite sides along the first direction, the sixth side is a line segment shown as g in fig. 17, and the seventh side is a line segment shown as f in fig. 17. Referring to fig. 18, the conductive portion 500 bypasses the main body portion 424 and is grounded through the first protrusion 710 and the second protrusion 720. Static electricity in the display device is discharged by exposing copper (not specifically illustrated) through the conductive portion 500 and the first bump portion 710 in sequence. Or static electricity in the display device is discharged by exposing copper (not specifically illustrated) through the conductive portion 500 and the second protruding portion 720 in sequence.

And fourthly:

the number of protrusions 426 is at least two, at least one protrusion 426 is disposed in the bonding region 421, and at least one protrusion 426 is disposed in the bending region 422 and/or the device region 423.

Specifically, regarding the structure and connection relationship of the driving chip 410 and the main body portion 424, the connection relationship between the flexible printed circuit board 420 and the display panel may refer to the contents discussed above, and will not be described herein again. When the protrusion 426 is provided in plurality, some of the plurality of protrusions 426 may be provided on the bonding region 421, and other of the plurality of protrusions 426 may be optionally provided on the bending region 422, and/or the device region 423. The protrusion 426 is disposed in different regions of the main body 424, so that the load of the main body 424 can be dispersed, which is beneficial to improving the structural stability of the display device. And the convex parts 426 are distributed, the static electricity in each area of the flexible printed circuit board 420 can be discharged by the convex parts 426 in each area of the flexible printed circuit board 420.

For example, referring to fig. 19, the number of the protrusions 426 is two, the first protrusion 710 is disposed on the first side of the bonding region 421, and the second protrusion 720 is disposed on the sixth side of the device region 423. Referring to fig. 20, the conductive portion 500 bypasses the main body portion 424 and contacts the first protrusion 710 and the second protrusion 720, and static electricity is discharged through the exposed copper of the first protrusion 710 and the exposed copper of the second protrusion 720.

As an example, in any of the embodiments discussed above with reference to fig. 4-20, the conductive portion 500 may be a conductive cloth or a copper foil. The conductive fabric is made of fiber fabric as base material, and the pre-treated electroplated metal coating has metal characteristic. The conductive cloth and the copper foil have low hardness, and can prevent the conductive part 500 from pressing other parts. Of course, the conductive portion 500 may also adopt other conductive film layer structures, which are not listed in the embodiment of the present application.

As an example, in any of the embodiments discussed above with reference to fig. 4-20, the orthogonal projection of the protrusion 426 onto the plane of the display panel is a polygon.

Specifically, the shape of the projection 426 may be arbitrary. The projection of the protrusion 426 on a plane is, for example, rectangular, pentagonal, or the like. The shape of the protrusion 426 may be set according to practical situations, and is not particularly limited in the embodiments of the present application.

As an example, in any of the embodiments discussed above with reference to fig. 4-20, the area of the projection 426 projected onto the plane of the display panel is greater than or equal to the area of the exposed copper 427 projected onto the plane of the display panel.

Specifically, all of the protruding portions 426 may be exposed copper 427, or a part of the protruding portions 426 may be exposed copper 427. When all of the protruding portions 426 are exposed copper 427, the area of the protruding portions 426 is the area of the exposed copper 427, and the areas of the protruding portions 426 and the exposed copper 427 are the same. When the portion in the convex portion 426 is the open copper 427, the area of the convex portion 426 is larger than the area of the open copper 427. The bare copper 427 may be located anywhere in the raised portion 426. In order to save as much material as possible for the conductive cloth 500, the exposed copper 427 may be disposed on the bump 426 near the driving chip 410.

As an example, in any of the embodiments discussed in fig. 4-20, the film structure of the protrusion 426 may be the same as that of the main body 424, and the exposed copper 427 on the protrusion 426 may be formed by removing the protective film in the protrusion 426. In this arrangement, the thickness of the exposed copper 427 is generally less than the thickness of the raised portion 426. The thickness can be referred to the above discussion and will not be described in detail here.

Alternatively, the exposed copper 427 may be soldered to the boss 426. In this arrangement, the thickness of the exposed copper 427 may be equal to or less than the thickness of the convex portion 426. The thickness can be referred to the above discussion and will not be described in detail here.

As an example, in any of the embodiments discussed above with respect to fig. 4-20, the thickness of the protrusion 426 is less than or equal to the thickness of the body portion 424. The thickness can be referred to the above discussion and will not be described in detail here.

It should be noted that the grounding in the foregoing may be the connection of the exposed copper 427 through other conductive structures in the display device, the grounding through other conductive structures, such as a backlight bezel in the display device, etc.

It should be noted that, in the embodiments discussed above, the display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Other essential components of the display device are understood by those skilled in the art, and are not described herein or should not be construed as limiting the present application.

While some embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all alterations and modifications as fall within the scope of the application.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.

Claims

1. A display device, comprising:

a display panel including a driving chip;

2. The display device according to claim 1, wherein the convex portion is provided on at least one of the first side, the second side, and the third side;

the first side edge is a side edge of the binding region close to the driver chip, and the second side edge and the third side edge are two side edges of the binding region opposite to each other along the first direction.

3. The display device according to claim 2, wherein the number of the convex portions is two and the distance from the driving chip is the same.

4. The display device according to claim 1, wherein the main body portion includes a bending region connected to the bonding region and located on a side of the bonding region away from the driving chip;

the protruding portion is arranged on at least one side edge of the bending area opposite to the bending area along the first direction, and the orthographic projection of the conductive portion on the plane where the display panel is located is not overlapped with the orthographic projection of the binding area on the plane where the display panel is located.

5. The display device according to claim 1, wherein the main body portion includes a bending region and a device region;

the bending region is connected with the binding region and is positioned on one side of the binding region, which is far away from the driving chip, and the device region is connected with the bending region and is arranged on one side of the bending region, which is far away from the driving chip;

the protruding portion is arranged on at least one side edge of the device area opposite to the device area along the first direction, and the orthographic projection of the conductive portion on the plane where the display panel is located is not overlapped with the orthographic projection of the binding area and the device area on the plane where the display panel is located.

6. The display device according to claim 1, wherein the conductive portion is a conductive cloth or a copper foil.

7. The display device according to claim 1, wherein an orthogonal projection of the projection portion on a plane on which the display panel is located is a polygon.

8. The display device according to any one of claims 1 to 5, wherein a thickness of the convex portion is less than or equal to a thickness of the main body portion.

9. The display device of claim 8, wherein an orthographic area of the protrusion on the plane of the display panel is greater than or equal to an orthographic area of the copper exposure on the plane of the display panel.