CN109445213B - Display panel and display device - Google Patents

Display panel and display device Download PDF

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Publication number
CN109445213B
CN109445213B CN201811524146.0A CN201811524146A CN109445213B CN 109445213 B CN109445213 B CN 109445213B CN 201811524146 A CN201811524146 A CN 201811524146A CN 109445213 B CN109445213 B CN 109445213B
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China
Prior art keywords
display panel
connecting part
display
array substrate
opposite substrate
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CN201811524146.0A
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Chinese (zh)
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CN109445213A (en
Inventor
魏晓丽
赖国昌
吴树茂
周秀峰
沈柏平
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Xiamen Tianma Microelectronics Co Ltd
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Xiamen Tianma Microelectronics Co Ltd
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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1345Conductors connecting electrodes to cell terminals
    • G02F1/13458Terminal pads
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136204Arrangements to prevent high voltage or static electricity failures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/131Interconnections, e.g. wiring lines or terminals

Abstract

The invention discloses a display panel and a display device, comprising: the display device comprises a display area and a non-display area arranged around the display area; further comprising: the array substrate comprises at least one first circuit area, the first circuit area and the display area are arranged along a first direction, and the first circuit area comprises a plurality of first bonding pads; an opposite substrate, wherein the first circuit area is arranged close to the opposite substrate in the first direction; the conductive connecting part is positioned in the non-display area and comprises a first connecting part, a second connecting part and a third connecting part, the first connecting part is arranged on one side surface of the array substrate close to the opposite substrate, the second connecting part is electrically connected with the opposite substrate, and the second connecting part is electrically connected with the first connecting part through the third connecting part; an orthographic projection of the conductive connection portion and an orthographic projection of the first pad do not overlap on a plane perpendicular to the first direction. Compared with the prior art, the electrostatic charges on the opposite substrate can be led out through the conductive connecting part, and the display effect is improved.

Description

Display panel and display device
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel and a display device.
Background
With the continuous development of display technology, display screens are widely applied to electronic products such as mobile phones, computers, vehicle-mounted display devices and the like, and great convenience is provided for life and work of people. However, under the promotion of market competition, more and more people favor the display screen with lighter weight, higher screen occupation ratio and better display effect.
The display screen mainly comprises an array substrate and an opposite substrate, wherein electrostatic charges are easily generated inside the display screen and gathered on the opposite substrate in the manufacturing and using processes of the display screen, when the electrostatic charges are accumulated to a certain degree, an electrostatic field is generated, the electrostatic field can interfere with an electric field inside the display panel, and the display abnormality of the display screen is easily caused.
At present, two methods are mainly used for eliminating the electrostatic field, one is to reduce the electrostatic source, but because the range of the electrostatic source is wide and the control difficulty is large, the accumulation amount of electrostatic charges in the display screen is difficult to reduce to a greater extent; the other is to adopt an anti-static circuit to lead out the static charges accumulated on the opposite substrate, but the arrangement of the circuit in the display screen is troublesome, the difficulty of the process is high, and the popularization in the display industry is difficult.
Disclosure of Invention
In view of the above, the present invention provides a display panel and a display device, so as to reduce the accumulation of electrostatic charges in the display panel and make the display panel have a better display effect.
The present invention provides a display panel, comprising: the display device comprises a display area and a non-display area arranged around the display area; the display panel further includes: the array substrate comprises at least one first circuit area, the first circuit area and the display area are arranged along a first direction, and the first circuit area comprises a plurality of first bonding pads; the array substrate comprises an opposite substrate, a first circuit area and a second circuit area, wherein the opposite substrate and the array substrate are oppositely arranged in the direction vertical to the array substrate, and the first circuit area is close to the opposite substrate in the first direction; the conductive connecting part is positioned in the non-display area and comprises a first connecting part, a second connecting part and a third connecting part; the first connecting part is arranged on one side surface of the array substrate close to the opposite substrate, the second connecting part is electrically connected with the opposite substrate, and the second connecting part is electrically connected with the first connecting part through the third connecting part; an orthographic projection of the conductive connection portion and an orthographic projection of the plurality of first pads do not overlap on a plane perpendicular to the first direction.
In addition, the invention also provides a display device which comprises the display panel provided by the invention.
Compared with the prior art, the display panel and the display device provided by the invention at least realize the following beneficial effects:
through being close to the opposite direction base plate setting with first circuit district on the first direction, can reduce the width of non-display area on the first direction, improve display panel's screen and account for the ratio to more be favorable to realizing comprehensive screen design. The conductive connecting part is arranged in the non-display area, on one hand, the conductive connecting part does not occupy the space of the display area, and the display effect is prevented from being influenced; on the other hand, the electrostatic charges on the opposite substrate can be led out through the conductive connecting part, and the accumulation amount of the electrostatic charges on the opposite substrate is reduced, so that the interference degree of an electrostatic field on an electric field in the display panel can be effectively reduced, and the display effect is improved. Meanwhile, the orthographic projection of the conductive connecting part on the plane perpendicular to the first direction and the orthographic projection of the first bonding pad are not overlapped, the short circuit risk caused by the fact that the conductive connecting part and the first bonding pad are electrically connected in the manufacturing and using processes of the display panel can be effectively prevented, and the yield of the display panel is favorably improved, and the service life of the display equipment is prolonged.
Of course, it is not necessary for any product in which the present invention is practiced to specifically achieve all of the above-described technical effects simultaneously.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic plan view of a display panel according to an embodiment of the present invention;
FIG. 2 is an enlarged view of the area P1 in FIG. 1;
FIG. 3 is a schematic cross-sectional view taken along line C-C of FIG. 2;
FIG. 4 is a schematic view of another enlarged structure of the area P1 in FIG. 1;
FIG. 5 is a schematic cross-sectional view taken along line D-D of FIG. 4;
FIG. 6 is a schematic diagram of a planar structure of another display panel according to an embodiment of the present invention;
FIG. 7 is an enlarged view of the area P2 in FIG. 6;
FIG. 8 is a schematic view of a cross-sectional view taken along the line E-E in FIG. 7;
fig. 9 is a schematic plan view illustrating a display panel according to another embodiment of the present invention;
FIG. 10 is a schematic view of a cross-sectional view taken along the direction F-F in FIG. 9;
Fig. 11 is a schematic plan view illustrating a display panel according to another embodiment of the present invention;
FIG. 12 is an enlarged view of the area P3 in FIG. 11;
FIG. 13 is a schematic view of a cross-sectional view taken along the line G-G in FIG. 12;
FIG. 14 is a schematic view of another cross-sectional structure taken along the direction G-G in FIG. 12;
FIG. 15 is a schematic view of a further cross-sectional view taken along the line G-G in FIG. 12;
fig. 16 is a schematic plan view illustrating an array substrate according to an embodiment of the present invention;
fig. 17 is a schematic plan view of another array substrate according to an embodiment of the present invention;
fig. 18 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
Referring to fig. 1, fig. 2 and fig. 3 in combination, the present invention provides a display panel, including: a display area AA and a non-display area BB provided around the display area AA; the display panel further includes: the array substrate 10, the array substrate 10 includes at least one first circuit area 20, the first circuit area 20 and the display area AA are arranged along a first direction x, the first circuit area 20 includes a plurality of first pads 21; an opposite substrate 30, in a direction perpendicular to the array substrate 10, the opposite substrate 30 and the array substrate 10 are oppositely disposed, and in a first direction x, the first circuit region 20 is disposed close to the opposite substrate 30; and a conductive connection part 40, the conductive connection part 40 being located in the non-display area BB, and the conductive connection part 40 including a first connection part 41, a second connection part 42, and a third connection part 43; the first connection portion 41 is disposed on a side surface of the array substrate 10 close to the opposite substrate 30, the second connection portion 42 is electrically connected to the opposite substrate 30, and the second connection portion 42 is electrically connected to the first connection portion 41 through the third connection portion 43; on a plane M perpendicular to the first direction x, an orthogonal projection of the conductive connection portion 40 and an orthogonal projection of the plurality of first pads 21 do not overlap.
It should be noted that, in order to more intuitively illustrate the technical solution of the present embodiment, other film layer structures are not illustrated in fig. 1 and fig. 3; meanwhile, in order to facilitate distinguishing the first connection portion 41, the second connection portion 42, and the third connection portion 43 of the conductive connection portion 40, the three are filled with different patterns.
In this embodiment, the display panel may be a liquid crystal display panel, and a liquid crystal layer (not shown) is located between the array substrate 10 and the opposite substrate 30; of course, the display panel may also be an organic light emitting display panel, and this embodiment does not specifically limit this. The display area AA of the display panel is mainly used for displaying pictures, the parts of the display panel except the display area AA are non-display areas BB, the non-display areas BB are not used for displaying pictures, and usually, the display panel is provided with a circuit, a circuit board and other structures for driving or detecting picture display.
The first circuit areas 20 and the display area AA are arranged along the first direction x, that is, the first circuit areas 20 are located in the non-display area BB, the number of the first circuit areas 20 may be set according to actual situations, and this embodiment only takes the setting of one first circuit area 20 as an example for description. Specifically, the first circuit area 20 may be bound to a flexible printed circuit board, a printed circuit board, and other devices through the first pad 21, so that the flexible printed circuit board, the printed circuit board, and other devices may directly provide corresponding driving or testing signals for the circuit, the circuit board, and other structures through the first pad 21. Because the first circuit area 20 is disposed at a position close to the opposite substrate 30, it is beneficial to reduce the width of the non-display area BB in the first direction x, and also can reduce the frame size of the display panel, thereby being beneficial to improving the screen occupation ratio of the display panel and improving the visual effect.
The second connection portion 42 of the conductive connection portion 40 is electrically connected to the opposite substrate 30, and the electrostatic charges generated by the display panel in the manufacturing or using process are changed from being originally accumulated on the opposite substrate 30 to being led out through the second connection portion 42, so that the electrostatic charges are difficult to form an electrostatic field at the opposite substrate 30, the interference of the electrostatic field on the electric field inside the display panel can be effectively reduced, and the image display quality of the display device is ensured. There are various electrical connection manners between the second connection portion 42 and the opposite substrate 30, for example, the second connection portion 42 and the opposite substrate 30 are closely attached to one side thereof, or a conductive component may be additionally provided to achieve electrical connection therebetween, but this embodiment is not limited thereto.
Meanwhile, the second connection portion 42 is electrically connected to the first connection portion 41 through the third connection portion 43, so that the electrostatic charges can be further conducted from the second connection portion 42 to the first connection portion 41 through the third connection portion 43, and the interference of the internal electric field of the display panel due to the excessive electrostatic charges accumulated on the second connection portion 42 is prevented. Due to the existence of the third connection parts 43, the number, size and position of the third connection parts 43 can be set at appropriate positions on the surface of the array substrate 10 according to practical situations, so that the layout of the display panel lines is more flexible and convenient.
The first connecting portion 41, the second connecting portion 42, and the third connecting portion 43 may be made of the same material, and they may be integrally formed, or they may be different, that is, they may be separately manufactured and then electrically connected, and the electrical connection manner between the three may be the same as the electrical connection manner between the second connecting portion 42 and the opposite substrate 30; moreover, since the first connection portion 41 is located on the surface of the array substrate 10 in the non-display area BB, the electrostatic charges conducted to the first connection portion 41 can be directly released through structures such as an anti-static circuit and a ground line inside the display panel, or a corresponding electrostatic charge releasing circuit can be additionally provided, but the present embodiment is not limited thereto.
The first pad 21 is usually not covered with an insulating layer at least partially on its surface for the purpose of bonding with a flexible wiring board, a printed circuit board, or the like by a bonding process. On a plane M perpendicular to the first direction x, the orthographic projection of the conductive connecting portion 40 and the orthographic projection of any one of the first bonding pads 21 are not overlapped, and at the moment, the conductive connecting portion 40 can better avoid the first bonding pad 21 no matter in the manufacturing process or the using process, so that the short circuit risk caused by the electric connection of the conductive connecting portion 40 and the first bonding pad 21 is effectively reduced, and the first circuit area 20 is prevented from being partially failed by the first bonding pad 21. In fig. 2, since the plane M is perpendicular to the first direction x, the plane M is also perpendicular to the plane of the base substrate 10, and the plane M is a straight line when viewed from the visual point of the visual plan view.
The opposite substrate 30 may be a color film substrate with a color resistor, and at this time, the display area AA may display a color image; of course, the opposite substrate 30 may also be a protective cover plate without color resistance, and the display area AA may display a black-and-white picture at this time, which is not limited in this embodiment.
The display panel provided by the embodiment at least has the following technical effects:
through being close to the opposite direction base plate setting with first circuit district on the first direction, can reduce the width of non-display area on the first direction, improve display panel's screen and account for the ratio to more be favorable to realizing comprehensive screen design. The conductive connecting part is arranged in the non-display area, on one hand, the conductive connecting part does not occupy the space of the display area, and the display effect is prevented from being influenced; on the other hand, the electrostatic charges on the opposite substrate can be led out through the conductive connecting part, and the accumulation amount of the electrostatic charges on the opposite substrate is reduced, so that the interference degree of an electrostatic field on an electric field in the display panel can be effectively reduced, and the display effect is improved. Meanwhile, the orthographic projection of the conductive connecting part on the plane perpendicular to the first direction and the orthographic projection of the first bonding pad are not overlapped, the short circuit risk caused by the fact that the conductive connecting part and the first bonding pad are electrically connected in the manufacturing and using processes of the display panel can be effectively prevented, and the yield of the display panel is favorably improved, and the service life of the display equipment is prolonged.
In some alternative embodiments, please refer to fig. 2 and fig. 3 in combination, the material of the conductive connection portion 40 includes silver paste. That is, the material of the first connection portion 41, the second connection portion 42, and the third connection portion 43 in the conductive connection portion 40 may be silver paste only, or may be a combination of silver paste and materials such as adhesive and resin to improve the resistance of silver paste to external force.
Specifically, in order to realize the electrical connection between the conductive connection portion 40 and the opposite substrate 30, the second connection portion 42 may be formed by directly coating silver paste on the opposite substrate 30 on the side close to the first connection portion 41, and the first connection portion 41 and the third connection portion 43 may also be formed by this coating. Because on the plane M perpendicular to the first direction x, the orthographic projection of the conductive connecting part 40 and the orthographic projection of the first bonding pad 21 are not overlapped, failure conditions such as short circuit and the like caused by the fact that the silver colloid overflows to the first bonding pad 21 and is electrically connected with the first bonding pad 21 in the coating process can be prevented, and the yield of the display panel is further improved.
Alternatively, as shown in fig. 2 and fig. 3, the material of the conductive connection portion 40 may also include a metal, a metal oxide, or other materials with better conductive performance. When the material of the conductive connection part 40 includes a metal, the metal may be at least one of molybdenum and aluminum; when the material of the conductive connection portion 40 includes a metal oxide, the metal oxide may be at least one of indium tin oxide, indium zinc oxide, tin oxide, and indium oxide, which is not particularly limited in this embodiment.
Optionally, as shown in fig. 4 and fig. 5, in a direction perpendicular to the plane of the array substrate 10, an orthogonal projection of the second connection portion 42 and an orthogonal projection of the opposite substrate 30 are at least partially overlapped, and at this time, a proper amount of silver paste may be coated on a surface of the opposite substrate 30 on a side away from the array substrate 10 to serve as a part of the second connection portion 42, so that a contact area between the conductive connection portion 40 and the opposite substrate 30 may be increased, and a conductive capability of the conductive connection portion 40 may be improved.
In some optional embodiments, please refer to fig. 6, fig. 7 and fig. 8 in combination, the display panel further includes a first polarizer 50, the first polarizer 50 is located on a side of the opposite substrate 30 away from the array substrate 10, and an adhesive 31 is disposed between the first polarizer 50 and the opposite substrate 30; the second connection portion 42 is electrically connected to the first polarizer 50.
In this embodiment, the first polarizer 50 may be attached to a side surface of the opposite substrate 30 away from the array substrate 10 by the adhesive 31, and an electrical connection manner between the first polarizer 50 and the second connection portion 42 may be the same as an electrical connection manner between the second connection portion 42 and the opposite substrate 30, which is not described herein again. So that the electrostatic charges accumulated on the first polarizer 50 can be conducted to the first connection portion 41 through the second connection portion 42 via the third connection portion 43, and in order to improve the conductivity of the second connection portion 42, the orthographic projection of the second connection portion 42 in the direction perpendicular to the plane of the array substrate 10 may at least partially overlap with the orthographic projection of the first polarizer 50 and the counter substrate 30.
Optionally, as shown in fig. 8, the adhesive 31 is doped with conductive particles; second connection portion 42 is electrically connected to adhesive 31.
In this embodiment, the bonding glue 31 is doped with conductive particles, that is, the bonding glue 31 has a certain conductive performance, and since the bonding glue 31 is electrically connected to the second connection portion 42, the electrostatic charges gathered on the first polarizer 50 and the opposite substrate 30 can be further conducted to the second connection portion 42 through the bonding glue 31, and the bonding glue 31 is located between the first polarizer 50 and the opposite substrate 30, so that a larger bonding area can be provided, which is beneficial to improving the efficiency of deriving the electrostatic charges.
The electrical connection between the second connection portion 42 and the adhesive 31 may also be the same as the electrical connection between the second connection portion 42 and the opposite substrate 30, and this embodiment is not described herein again.
In some alternative embodiments, please refer to fig. 9 and 10 in combination, the array substrate further includes a second circuit area 60, the second circuit area 60 and the display area AA are arranged along the first direction x and are disposed away from the opposite substrate 30; wherein the second line region 60 includes a plurality of second pads 61;
the array substrate 10 includes a metal layer 11, an insulating layer 12, and a transparent conductive layer 13; the metal layer 11 includes a plurality of first pads 21 and a plurality of second pads 61; the insulating layer 12 is located on one side of the metal layer 11 close to the opposite substrate 30, and the insulating layer 12 includes a plurality of through holes 121; the transparent conductive layer 13 is located on one side of the insulating layer 12 close to the opposite substrate 30, and the transparent conductive layer 13 includes a plurality of first transparent conductive parts 131 and a plurality of second transparent conductive parts 132, the first transparent conductive parts 131 are electrically connected to the first pads 21 through the through holes 121, and the second transparent conductive parts 132 are electrically connected to the second pads 61 through the through holes 121.
In this embodiment, the second circuit area 60 may be bound to a flexible printed circuit board, a printed circuit board, and other devices through the second pad 61, so that the flexible printed circuit board, the printed circuit board, and other devices may directly provide corresponding driving or testing signals for the circuit, the circuit board, and other structures through the second pad 61. Because the second circuit area 60 is disposed far away from the opposite substrate 30 in the first direction x, the conductive connection portion 40 can better avoid the second pad 61 no matter in the manufacturing or using process, thereby effectively reducing the risk of short circuit caused by the electrical connection between the conductive connection portion 40 and the second pad 61, and preventing the second circuit area 60 from having a failure of part of the second pad 61. The size, number and positional relationship with the first pads 21 in the direction perpendicular to the first direction x of the second pads 61 in the second line area 60 may be set according to practical situations, and the present embodiment does not specifically limit this.
The insulating layer 12 is located on one side of the metal layer 11 close to the opposite substrate 30, the transparent conductive layer 13 is located on one side of the insulating layer 12 close to the opposite substrate 30, and the first transparent conductive part 131 and the second transparent conductive part 132 are respectively electrically connected with the first pad 21 and the second pad 61 through the via hole 121, so that the first pad 21 and the second pad 61 can be bound with devices such as a flexible printed circuit board and a printed circuit board through the transparent conductive layer 13, the surface of the pad does not need to be exposed in the air, the failure condition of the pad caused by corrosion or rust and the like is effectively prevented, and the service life of the pad is prolonged.
It should be noted that, in order to more intuitively illustrate the technical solution of the present embodiment, the film layer structure such as the transparent conductive layer 13 is not shown in the plan view shown in fig. 9; meanwhile, other film layer structures are not shown in the cross-sectional view shown in fig. 10, and it is understood that the array substrate 10 shown in fig. 10 may further include a substrate 14, a buffer layer 15 and other film layers, which is not particularly limited in this embodiment, wherein the buffer layer 15 may effectively prevent foreign matters such as moisture and dust remaining on the substrate 14 from affecting the film layers such as the metal layer 11 and the insulating layer 12, so as to reduce a failure rate of the display panel in the manufacturing and using processes.
Optionally, referring to fig. 11, 12 and 13, at least one of the second transparent conductive parts 132 is a third transparent conductive part 133; the first connection portion 41 and the third transparent conductive portion 133 are electrically connected. It should be noted that, in order to more intuitively illustrate the technical solution of the present embodiment, the film layer structure such as the pad is not shown in the plan view shown in fig. 11.
In the present embodiment, in order to lead out and discharge the electrostatic charges accumulated on the first connection portion 41, a third transparent conductive portion 133 may be provided in the vicinity thereof; since the second transparent conductive portions 132 are electrically connected to the second pads 61, that is, the second transparent conductive portions 132 may be disposed away from the opposite substrate 30 in the first direction x, so that at least one second transparent conductive portion 132 may be disposed as a third transparent conductive portion 133 without affecting the first circuit region 20, and at this time, the size and the specific film structure of the third transparent conductive portion 133 may be the same as or different from those of the second transparent conductive portions 132, which is not limited in this embodiment.
The first connecting portion 41 is disposed on a side surface of the array substrate 10 close to the opposite substrate 30, that is, the material of the third transparent conductive portion 133 may be the same as that of the first connecting portion 41, or may be different from that of the first connecting portion 41; moreover, there are many ways of electrical connection between the two, as compared with the electrical connection between the second connection portion 42 and the opposite substrate 30; in addition, in the direction perpendicular to the plane of the array substrate 10, there may be no overlap between the orthographic projection of the third transparent conductive portion 133 and the orthographic projection of the first connecting portion 41, for example, as shown in fig. 13, there may also be at least a partial overlap region to improve the efficiency of the electrostatic charge conduction from the first connecting portion 41 to the third transparent conductive portion 133, but the embodiment does not specifically limit this.
Optionally, as shown in fig. 14, in a direction perpendicular to the plane of the array substrate 10, an orthogonal projection of the third transparent conductive part 133 overlaps an orthogonal projection of the at least two through holes 121, that is, the third transparent conductive part 133 may be electrically connected to the second pad 61 through the at least two through holes 121, so that a path for conducting electrostatic charges from the third transparent conductive part 133 to the second pad 61 may be increased, which is beneficial to improving the efficiency of electrostatic discharge.
In this embodiment, the number of the second pads 61 electrically connected to the third transparent conductive parts 133 may be one, that is, at least two through holes 121 are directly formed on the insulating layer 12 between the second pads 61 and the third transparent conductive parts 133; of course, the number of the second pads 61 electrically connected to the third transparent conductive parts 133 may be two or more, and this embodiment does not specifically limit this, and only the example of fig. 14 will be described.
Specifically, in fig. 14, in the direction perpendicular to the plane of the array substrate 10, the orthographic projection of the third transparent conductive part 133 and the orthographic projection of the two through holes 121 overlap, and there are two second pads 61, and each second pad 61 is electrically connected to the third transparent conductive part 133 through one through hole 121.
Optionally, referring to fig. 15, at least one of the second pads 61 is a third pad 62; in a direction perpendicular to the plane of the array substrate 10, an orthogonal projection of the third pad 62 overlaps an orthogonal projection of the at least two through holes 121, that is, the third pad 62 may be electrically connected to the third transparent conductive part 133 through the at least two through holes 121.
In this embodiment, at least one second bonding pad 61 is a third bonding pad 62, that is, the second bonding pad 61 and the third bonding pad 62 are made of the same material in the same layer, and compared with other second bonding pads 61, the size of the third bonding pad 62 can be larger, which is beneficial to reducing the difficulty of the bonding pad manufacturing process; on the other hand, it is possible to increase a path of the electrostatic charges conducted from the third transparent conductive part 133 to the second pad 61 and improve the electrostatic discharge capability of the second pad 61, thereby improving the antistatic performance of the display device.
In some alternative embodiments, referring to fig. 16, the array substrate 10 further includes a first edge S extending along the first direction x; in the second direction y, the minimum distance between the first edge S and the first pad 21 is L1, and the length of the second connection portion 42 is L2; wherein L1 is less than or equal to L2, and the second direction y is perpendicular to the first direction x; the first connection portion 41 is located on a side of the first line area 20 away from the first edge S.
Specifically, the minimum distance L1 between the first edge S and the first pad 21 in the second direction y, that is, the distance between the first pad 21 closest to the first edge S and the first edge S in the second direction y, will not be described in detail later. At this time, since the length L2 of the second connection portion 42 is greater than or equal to L1, in order to reduce the risk of short circuit caused by the electrical connection between the conductive connection portion 40 and the first pad 21, the first connection portion 41 may be disposed on the side of the first line region 20 away from the first edge S, and it is sufficient to ensure that the orthographic projection of the conductive connection portion 40 and the orthographic projection of the plurality of first pads 21 do not overlap on a plane perpendicular to the first direction x.
In this embodiment, since the first circuit area 20 is closer to the first edge S in the second direction y, the first circuit area 20 may be set as a test circuit area, and devices such as a flexible printed circuit board and a printed circuit board for testing may provide test signals for the first pad 21 of the first circuit area 20, so that the performance of the display panel may be determined according to the display condition of the display panel. After the test is finished, separating the devices such as the flexible circuit board and the printed circuit board for the test from the display panel, and if the test result shows that the performance of the display panel is good, binding the devices such as the flexible circuit board and the printed circuit board for the display with the bonding pad which is not used for the test on the display panel; if the test result shows that the performance of the display panel is poor, the display panel can be reworked and repaired, and the manufacturing efficiency of the display panel is improved.
It should be noted that there are two edges adjacent to the display area AA in the second direction y and extending along the first direction x, and the first edge S may be any one of the two edges, which is not limited in this embodiment.
Optionally, referring to fig. 17, the array substrate 10 further includes a first edge S extending along the first direction x; in the second direction y, the minimum distance between the first edge S and the first pad 21 is L1, and the length of the second connection portion 42 is L2; wherein L1 > L2, the second direction y is perpendicular to the first direction x; the first connection portion 41 is located on a side of the first line area 20 close to the first edge S.
In the present embodiment, in the second direction y, since the minimum distance L1 between the first edge S and the first pad 21 is greater than the length L2 of the second connection portion 42, the non-display area BB between the first edge S and the first line area 20 has enough space to dispose the conductive connection portion 40, and the display panel has better antistatic performance through the conductive connection portion 40.
Optionally, referring to fig. 18, the first edge S includes at least one first special-shaped sub-edge S1; the first connecting portion 41 includes at least one second irregularly shaped sub-edge S2, and the shape of the second irregularly shaped sub-edge S2 is the same as the shape of the first irregularly shaped sub-edge S1.
In this embodiment, the number of the first special-shaped sub-edges S1 may be set as one or more according to practical situations, and the shape of the first special-shaped sub-edge S1 may also be set as a zigzag shape, a curve shape, and the like according to practical situations, which is not limited in this embodiment. At this time, the first connecting portion 41 may form the second irregularly shaped sub-edge S2 having the same shape as the first irregularly shaped sub-edge S1, on one hand, the area occupied by the first connecting portion 41 in the non-display area BB may be increased, and the conductivity of the conductive connecting portion 40 may be improved; on the other hand, the first connecting portion 41 may be disposed as close to the first irregularly shaped sub-edge S1 as possible, so as to reduce the influence of the first connecting portion 41 on the circuit arrangement in the non-display area BB.
The invention also provides a display device which comprises the display panel provided by the invention.
Referring to fig. 18, a display device 200 of the present embodiment includes the display panel 100 according to any one of the above embodiments of the present invention. Fig. 18 illustrates the display device 200 by taking a mobile phone as an example. It should be understood that the display device 200 provided in the embodiment of the present invention may also be a tablet computer, a television, a vehicle-mounted display, or other display devices with a display function, and the present invention is not limited thereto. The display device provided in the embodiment of the present invention has the beneficial effects of the display panel provided in the embodiment of the present invention, and specific reference may be made to the specific description of the display panel in each of the above embodiments, which is not repeated herein.
As can be seen from the above embodiments, the display panel and the display device provided by the present invention at least achieve the following beneficial effects:
through being close to the opposite direction base plate setting with first circuit district on the first direction, can reduce the width of non-display area on the first direction, improve display panel's screen and account for the ratio to more be favorable to realizing comprehensive screen design. The conductive connecting part is arranged in the non-display area, on one hand, the conductive connecting part does not occupy the space of the display area, and the display effect is prevented from being influenced; on the other hand, the electrostatic charges on the opposite substrate can be led out through the conductive connecting part, and the accumulation amount of the electrostatic charges on the opposite substrate is reduced, so that the interference degree of an electrostatic field on an electric field in the display panel can be effectively reduced, and the display effect is improved. Meanwhile, the orthographic projection of the conductive connecting part on the plane perpendicular to the first direction and the orthographic projection of the first bonding pad are not overlapped, the short circuit risk caused by the fact that the conductive connecting part and the first bonding pad are electrically connected in the manufacturing and using processes of the display panel can be effectively prevented, and the yield of the display panel is favorably improved, and the service life of the display equipment is prolonged.
Although some specific embodiments of the invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples
Are intended to be illustrative only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.

Claims (11)

1. A display panel, comprising: the display device comprises a display area and a non-display area arranged around the display area; characterized in that the display panel comprises:
the array substrate comprises at least one first circuit area, the first circuit area and the display area are arranged along a first direction, and the first circuit area comprises a plurality of first bonding pads;
the array substrate comprises an opposite substrate, a first circuit area and a second circuit area, wherein the opposite substrate and the array substrate are oppositely arranged in the direction perpendicular to the array substrate, and the first circuit area is close to the opposite substrate in the first direction;
the conductive connecting part is positioned in the non-display area and comprises a first connecting part, a second connecting part and a third connecting part; the first connecting part is arranged on one side surface of the array substrate close to the opposite substrate, the second connecting part is electrically connected with the opposite substrate, and the second connecting part is electrically connected with the first connecting part through the third connecting part;
On a plane perpendicular to the first direction, an orthographic projection of the conductive connecting part and an orthographic projection of the plurality of first pads do not overlap;
the display panel further comprises a first polaroid, the first polaroid is positioned on one side, far away from the array substrate, of the opposite substrate, and an adhesive is arranged between the first polaroid and the opposite substrate;
the second connection portion is electrically connected to the first polarizer.
2. The display panel according to claim 1,
the material of the conductive connecting part comprises silver adhesive.
3. The display panel according to claim 1,
conductive particles are doped in the bonding glue;
the second connecting portion is electrically connected with the bonding glue.
4. The display panel according to claim 1,
the array substrate further comprises a second circuit area, and the second circuit area and the display area are arranged along the first direction and are far away from the opposite substrate; wherein the second line region includes a plurality of second pads;
the array substrate comprises a metal layer, an insulating layer and a transparent conducting layer;
the metal layer includes the plurality of first pads and the plurality of second pads;
The insulating layer is positioned on one side of the metal layer close to the opposite substrate and comprises a plurality of through holes;
the transparent conducting layer is located on one side, close to the opposite substrate, of the insulating layer and comprises a plurality of first transparent conducting parts and a plurality of second transparent conducting parts, the first transparent conducting parts are electrically connected with the first bonding pads through the through holes, and the second transparent conducting parts are electrically connected with the second bonding pads through the through holes.
5. The display panel according to claim 4,
at least one of the second transparent conductive portions is a third transparent conductive portion;
the first connecting portion and the third transparent conductive portion are electrically connected.
6. The display panel according to claim 5,
in a direction perpendicular to the plane of the array substrate, an orthographic projection of the third transparent conductive part and an orthographic projection of at least two of the through holes are overlapped.
7. The display panel according to claim 4,
at least one of the second pads is a third pad;
in a direction perpendicular to the plane of the array substrate, an orthogonal projection of the third pad overlaps an orthogonal projection of at least two of the through holes.
8. The display panel according to claim 1,
the array substrate further comprises a first edge extending along the first direction;
in a second direction, a minimum distance between the first edge and the first pad is L1, and a length of the second connection part is L2; wherein L1 ≦ L2, the second direction being perpendicular to the first direction;
the first connecting portion is located on one side, away from the first edge, of the first circuit area.
9. The display panel according to claim 1,
the array substrate further comprises a first edge extending along the first direction;
in a second direction, a minimum distance between the first edge and the first pad is L1, and a length of the second connection part is L2; wherein L1 > L2, the second direction is perpendicular to the first direction;
the first connecting portion is located on one side of the first circuit area close to the first edge.
10. The display panel according to claim 9,
the first edge comprises at least one first profiled sub-edge;
the first connecting part comprises at least one second special-shaped sub-edge, and the shape of the second special-shaped sub-edge is the same as that of the first special-shaped sub-edge.
11. A display device characterized by comprising the display panel according to any one of claims 1 to 10.
CN201811524146.0A 2018-12-13 2018-12-13 Display panel and display device Active CN109445213B (en)

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CN114093248A (en) * 2020-07-31 2022-02-25 京东方科技集团股份有限公司 Tiled display unit, tiled display device and manufacturing method thereof

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