CN109831874A - A method of solving the upper PAD of the quick-fried oil of welding resistance - Google Patents
A method of solving the upper PAD of the quick-fried oil of welding resistance Download PDFInfo
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- CN109831874A CN109831874A CN201910129653.2A CN201910129653A CN109831874A CN 109831874 A CN109831874 A CN 109831874A CN 201910129653 A CN201910129653 A CN 201910129653A CN 109831874 A CN109831874 A CN 109831874A
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- fried oil
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Abstract
The invention discloses the method for the upper PAD of quick-fried oil of solution welding resistance a kind of, solder mask is filled in the hole for needing consent on production plate；Production plate is toasted, the solder mask in hole is solidified；Nog plate processing is carried out to the surface of production plate；Then is producing the surface silk-screen solder mask of plate and solidifying.The method of the present invention solves the defect problem of the upper PAD of quick-fried oil, reduces product rejection rate, improves the yields of wiring board, and reduce production cost.
Description
Technical field
The present invention relates to printed wiring board manufacture technology fields, and in particular to a method of solve the upper PAD of the quick-fried oil of welding resistance.
Background technique
In the manufacturing process of assist side, it has been found that many clients have special requirement, i.e., via hole are done welding resistance green oil
Consent process, but according to corresponding finishing analysis, the relationship between via hole and windowing PAD mainly have following three kinds: via hole with open
Window PAD intersection；Via hole and windowing PAD are tangent；Via hole and windowing PAD are non-intersecting also nontangential.
The common defect of technology appears in silk-screen welding resistance process at present: consent does spacer screen using aluminium flake drilling before welding resistance, uses
In the hole of plugging green oil required for solder mask is filled in by semi-automatic silk-screen machine consent mode, then pass through precuring, then silk
Print face oil, then after precuring, exposure development, then heat cure.In last curing process, the green oil in hole is in heated feelings
Under condition, volatilization and thermal expansion will do it, then the green oil in hole just comes up at aperture, and spreads to surrounding, or even overflows
On upper neighbouring welding resistance windowing PAD, appearance is not only influenced, the soldering reliability of product is also impacted to cause functional issues, in
It is product to reject state, needs to scrap disposition.
The defect problem of the quick-fried upper PAD of oil also annoyings the production plant of many PCB, brings product to hand over prolonging for phase to company
It misses, the rising of manufacturing cost and being unsatisfied with for client.
Summary of the invention
It is an object of the invention to overcome existing technological deficiency, provide the method for the upper PAD of quick-fried oil of solution welding resistance a kind of,
This method solve the defect problems of the upper PAD of quick-fried oil, reduce product rejection rate, improve the yields of wiring board, and reduce
Production cost.
The quick-fried oily method for going up PAD of welding resistance is solved in order to solve the above-mentioned technical problems, the present invention provides a kind of, including following
Step:
Solder mask is filled in S1, the hole for needing consent on production plate；
S2, production plate is toasted, solidifies the solder mask in hole；
S3, nog plate processing is carried out to the surface of production plate；
S4, it is then producing the surface silk-screen solder mask of plate and is solidifying.
Further, before step S1, consent aluminium flake is first made, needs consent in corresponding production plate specially on aluminium flake
Drilling processing is carried out at position, is then filled solder mask to production plate in such a way that silk-screen prints by the consent aluminium flake
On need in the hole of consent.
Further, in step S2, baking is divided into six stages progress:
First stage: it is toasted 30 minutes at 55 DEG C ± 5 DEG C；
Second stage: it is toasted 30 minutes at 65 DEG C ± 5 DEG C；
Phase III: it is toasted 30 minutes at 75 DEG C ± 5 DEG C；
Fourth stage: it is toasted 30 minutes at 75 DEG C ± 5 DEG C；
5th stage: it is toasted 30 minutes at 95 DEG C ± 5 DEG C；
6th stage: it is toasted 30 minutes at 110 DEG C ± 5 DEG C.
Further, in step S3, using abrasive belt grinding remove circuit surface because baking when it is quick-fried oil due to be stained with welding resistance oil
Ink.
Further, in step S4, production plate surface silk-screen solder mask after, and successively by precuring, exposure,
Development and heat cure processing, make solder mask be solidified into solder mask.
Further, the production plate is the multilayer for being press-fitted together as one core material and outer copper foil by prepreg
Plate, and multi-layer board has been subjected to drilling, heavy copper, electric plating of whole board and outer-layer circuit production process.
Compared with prior art, the invention has the following beneficial effects:
The present invention is first single after filling solder mask in the hole for needing consent on production plate by optimization technique production procedure
Solely the solder mask of consent is toasted, baking quick-fried oily problem caused by recycling nog plate to remove because of drying-plate later, then again
Silk-screen produces the ink of plate surface, solves the defect problem of the upper PAD of quick-fried oil, reduces product rejection rate, improve wiring board
Yields, and reduce production cost；It, in this way can be will be in hole and after consent when drying-plate by the way of ladder-elevating temperature
While solder mask solidifies, there is the phenomenon of quick-fried oil in the solder mask reduced in hole, to layers of copper when reducing later period nog plate
Losing quantity, and efficiency when can be improved nog plate.
Specific embodiment
In order to more fully understand technology contents of the invention, below in conjunction with specific embodiment to technical side of the invention
Case is described further and illustrates.
Embodiment
The present embodiment provides the production methods of PCB a kind of, including the method for solving the upper PAD of the quick-fried oil of welding resistance, specific work
Skill is as follows:
(1), sawing sheet: outputing core plate by jigsaw size 520mm × 620mm, core thickness 0.8mm, outer copper foil with a thickness of
1OZ。
(2) internal layer circuit production (negative film technique): inner figure transfer is coated on core plate photosensitive with vertical application machine
Film, 8 μm of the film thickness monitoring of light-sensitive surface are completed on core plate using Full-automatic exposure machine with 5-6 lattice exposure guide rule (21 lattice exposure guide rule)
Internal layer circuit exposure, it is developed, inner line figure is formed on core plate；Internal layer etching, the core plate after exposure development is etched
Internal layer circuit out, it is 3mil that internal layer line width, which measures,；Internal layer AOI, then check internal layer circuit opens short circuit, route notch, route
The defects of pin hole, defective to scrap processing, flawless product goes out to downstream.
(3), press: core plate crosses vertical blackening process, and core plate and outer copper foil are then superimposed on one with prepreg in advance
(specific plate-laying sequence is copper foil, prepreg, core plate, prepreg, copper foil from top to bottom) is played, is then selected according to plate Tg
Lamination appropriate presses superimposed sheet, forms production plate.
(4), it drills: being drilled on production plate according to borehole data using the mode of machine drilling.
(5), heavy copper: one layer of thin copper is deposited by way of chemical reaction on hole wall, is provided for subsequent electric plating of whole board
Basis, backlight test 10 grades, and the heavy copper thickness in hole is 0.5 μm.
(6), according to the principle of electrochemical reaction, upper one layer of copper electric plating of whole board: is electroplated on the basis of heavy copper.
(7), outer-layer circuit (positive blade technolgy) is made: outer graphics transfer, it is luxuriant and rich with fragrance using Full-automatic exposure machine and positive route
Woods completes outer-layer circuit exposure with 5-7 lattice exposure guide rule (21 lattice exposure guide rule) on production plate, developed, is formed on production plate
Outer-layer circuit figure；Outer graphics plating, the then copper facing and tin plating respectively on production plate, copper facing is the electricity with 1.0-2.2ASD
Face copper thickness is plated to 1OZ by current density electric plating of whole board 150min, and tin plating is that 10min is electroplated with the current density of 1.2ASD, and tin is thick
3-5μm；Then film is successively moved back again, etches and move back tin, etches outer-layer circuit on production plate；Outer layer AOI, uses automated optical
Detection system detects whether outer-layer circuit has the defects of open circuit, notch, not clean, short-circuit etching by the comparison with CAM data.
(8), consent: first making consent aluminium flake, needs to carry out at the position of consent in corresponding production plate specially on aluminium flake
Drilling processing is then filled solder mask in such a way that silk-screen prints by the consent aluminium flake to needing consent on production plate
Kong Zhong；
(9), baking sheet: production plate is toasted, the solder mask in hole is solidified；Baking be specifically divided into six stages into
Row: the first stage is to toast 30 minutes at 55 DEG C ± 5 DEG C；Second stage is to toast 30 minutes at 65 DEG C ± 5 DEG C；Third rank
Section is to toast 30 minutes at 75 DEG C ± 5 DEG C；Fourth stage is to toast 30 minutes at 75 DEG C ± 5 DEG C；5th stage was 95
It is toasted 30 minutes at DEG C ± 5 DEG C；6th stage was to toast 30 minutes at 110 DEG C ± 5 DEG C；Among the above, using being stepped up temperature
The baking process of degree, while solidifying the solder mask in hole, there is the phenomenon of quick-fried oil in the solder mask reduced in hole, drops
The problem of PAD causes plate to scrap on low solder mask.
(10) nog plate: using abrasive belt grinding remove route and the surface PAD when the baking quick-fried oil due to the solder mask that is stained with；This
Even if sample has a degree of quick-fried oily phenomenon in ink plugging and after baking sheet, but can be by the nog plate process of the welding resistance pre-treatment
One step solves the problems, such as brought by quick-fried oil, so that it is guaranteed that the soldering reliability of PAD.
(11), welding resistance, silk-screen character: after the surface silk-screen solder mask of production plate, and successively by precuring, exposure
Light, development and heat cure processing, make solder mask be solidified into solder mask；Specifically, using the white face wire mark brush TOP solder mask,
The face TOP character adds " UL label ", so that one layer of coating prevents from producing between route when welding on the route and substrate for being not required to welding
Raw bridge joint provides the protective layer of permanent electric circumstance and resist chemical, while playing aesthetic appeal.
(12), electrical testing: testing the electrically conducting performance of production board, this plate uses test method are as follows: flying probe.
(13), it forms: according to the prior art and pressing design requirement gong shape, PCB is made in the +/- 0.05mm of external form tolerance.
(14), FQC: according to customs inspection standard and our company test stone, checking PCB appearance, such as it is defective and
Shi Xiuli guarantees to provide excellent quality control for client.
(15), FQA: taking a sample test appearance, hole copper thickness, thickness of dielectric layers, green oil thickness, internal layer copper thickness of PCB etc. again is
The no requirement for meeting client.
(16), it packs: according to the manner of packing and packaging quantity of customer requirement, packaging being sealed to PCB, and be allowed to dry
Drying prescription and humidity card, then shipment.
It is verified by actual production, the technique production procedure after optimizing by the method for the invention can effectively reduce because of consent
Ink occurs plate scrap problem caused by quick-fried oily phenomenon in baking, the yields of wiring board is improved, by the yields of wiring board
It is increased to 94% or so from original 85%, to reduce production cost.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above embodiments is only applicable to help to understand this
The principle of inventive embodiments；At the same time, for those skilled in the art, according to an embodiment of the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (6)
1. a kind of method for solving the upper PAD of the quick-fried oil of welding resistance, which comprises the following steps:
Solder mask is filled in S1, the hole for needing consent on production plate；
S2, production plate is toasted, solidifies the solder mask in hole；
S3, nog plate processing is carried out to the surface of production plate；
S4, it is then producing the surface silk-screen solder mask of plate and is solidifying.
2. the method according to claim 1 for solving the upper PAD of the quick-fried oil of welding resistance, which is characterized in that before step S1, first make
Consent aluminium flake needs to carry out drilling processing at the position of consent in corresponding production plate specially on aluminium flake, then utilizes the consent
Aluminium flake fills solder mask in such a way that silk-screen prints into the hole for needing consent on production plate.
3. the method according to claim 1 for solving the upper PAD of the quick-fried oil of welding resistance, which is characterized in that in step S2, baking is divided into
Six stages carry out:
First stage: it is toasted 30 minutes at 55 DEG C ± 5 DEG C；
Second stage: it is toasted 30 minutes at 65 DEG C ± 5 DEG C；
Phase III: it is toasted 30 minutes at 75 DEG C ± 5 DEG C；
Fourth stage: it is toasted 30 minutes at 75 DEG C ± 5 DEG C；
5th stage: it is toasted 30 minutes at 95 DEG C ± 5 DEG C；
6th stage: it is toasted 30 minutes at 110 DEG C ± 5 DEG C.
4. the method according to claim 1 for solving the upper PAD of the quick-fried oil of welding resistance, which is characterized in that in step S3, using abrasive band
Nog plate remove circuit surface when baking quick-fried oil due to the solder mask that is stained with.
5. the method according to claim 1 for solving the upper PAD of the quick-fried oil of welding resistance, which is characterized in that in step S4, in production plate
Surface silk-screen solder mask after, and successively by precuring, exposure, development and heat cure processing, be solidified into solder mask
Solder mask.
6. the method according to claim 1 for solving the upper PAD of the quick-fried oil of welding resistance, which is characterized in that the production plate is by half
The multi-layer board that core material and outer copper foil are press-fitted together as one by cured sheets, and multi-layer board has been subjected to drilling, heavy copper, electric plating of whole board
With outer-layer circuit production process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910129653.2A CN109831874A (en) | 2019-02-21 | 2019-02-21 | A method of solving the upper PAD of the quick-fried oil of welding resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910129653.2A CN109831874A (en) | 2019-02-21 | 2019-02-21 | A method of solving the upper PAD of the quick-fried oil of welding resistance |
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| CN109831874A true CN109831874A (en) | 2019-05-31 |
Family
ID=66864068
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| CN201910129653.2A Pending CN109831874A (en) | 2019-02-21 | 2019-02-21 | A method of solving the upper PAD of the quick-fried oil of welding resistance |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110225660A (en) * | 2019-03-25 | 2019-09-10 | 珠海崇达电路技术有限公司 | A kind of production method of high thermal conductivity thickness copper base |
| CN110730565A (en) * | 2019-09-17 | 2020-01-24 | 沪士电子股份有限公司 | PCB capable of realizing half plug hole in stepped groove and manufacturing method thereof |
| CN114245575A (en) * | 2021-11-16 | 2022-03-25 | 龙南骏亚电子科技有限公司 | Design method of PCB resistance welding zigzag circuit board |
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| CN103687334A (en) * | 2013-12-02 | 2014-03-26 | 深圳市景旺电子股份有限公司 | Method for solving problem of oil bleeding of anti-welding plug hole in single-side windowed PCB (printed circuit board) |
| CN104349607A (en) * | 2013-07-31 | 2015-02-11 | 深圳崇达多层线路板有限公司 | Processing method of resistance welding plugged hole of circuit board |
| CN104427767A (en) * | 2013-08-27 | 2015-03-18 | 江苏同昌电路科技有限公司 | Circuit board manufacturing process and resin hole plugging process |
| CN105101662A (en) * | 2015-07-22 | 2015-11-25 | 深圳崇达多层线路板有限公司 | Fabrication method for high-aspect rate copper-thickness printed circuit board (pcb) solder mask |
| CN107124826A (en) * | 2017-06-20 | 2017-09-01 | 广州兴森快捷电路科技有限公司 | Improve the method for wiring board welding resistance consent bleed |
| CN107124827A (en) * | 2017-06-29 | 2017-09-01 | 珠海杰赛科技有限公司 | A kind of pcb board processing technology |
| CN108055776A (en) * | 2017-11-09 | 2018-05-18 | 建业科技电子（惠州）有限公司 | A kind of improvement welding resistance consent oil spilling production method |
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| CN104349607A (en) * | 2013-07-31 | 2015-02-11 | 深圳崇达多层线路板有限公司 | Processing method of resistance welding plugged hole of circuit board |
| CN104427767A (en) * | 2013-08-27 | 2015-03-18 | 江苏同昌电路科技有限公司 | Circuit board manufacturing process and resin hole plugging process |
| CN103687334A (en) * | 2013-12-02 | 2014-03-26 | 深圳市景旺电子股份有限公司 | Method for solving problem of oil bleeding of anti-welding plug hole in single-side windowed PCB (printed circuit board) |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110225660A (en) * | 2019-03-25 | 2019-09-10 | 珠海崇达电路技术有限公司 | A kind of production method of high thermal conductivity thickness copper base |
| CN110730565A (en) * | 2019-09-17 | 2020-01-24 | 沪士电子股份有限公司 | PCB capable of realizing half plug hole in stepped groove and manufacturing method thereof |
| CN114245575A (en) * | 2021-11-16 | 2022-03-25 | 龙南骏亚电子科技有限公司 | Design method of PCB resistance welding zigzag circuit board |
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Application publication date: 20190531 |