CN110636718B - Manufacturing method of PCB - Google Patents
Manufacturing method of PCB Download PDFInfo
- Publication number
- CN110636718B CN110636718B CN201911046609.1A CN201911046609A CN110636718B CN 110636718 B CN110636718 B CN 110636718B CN 201911046609 A CN201911046609 A CN 201911046609A CN 110636718 B CN110636718 B CN 110636718B
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- Prior art keywords
- film material
- inner layer
- manufacturing
- circuit pattern
- board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a manufacturing method of a PCB, and relates to the manufacturing technology of printed circuit boards. The manufacturing method comprises the following steps: manufacturing an inner layer circuit pattern on the daughter board; pasting a film material on the inner layer circuit pattern; overlapping the daughter board with a prepreg and other daughter boards, and pressing into a multilayer board; grooving holes in the multilayer board, and exposing at least one part of the film material pressed on the inner layer; and soaking the multilayer board in a liquid medicine, and removing the membrane material. In the invention, one surface of an inner layer circuit pattern of the PCB is pasted by a soluble film material, and the film material is dissolved after lamination, so that the inner layer circuit is positioned in a built-in cavity to replace a high-loss resin medium layer, thereby reducing the signal transmission loss; meanwhile, the cavities can be manufactured in different inner layers according to the circuit distribution design, diversification of PCB products is facilitated, the PCB structure is suitable for more product requirements, and the periphery of the cavity is provided with enough supporting design, so that the capacity of resisting external pressure of the cavity can be enhanced.
Description
Technical Field
The invention relates to a manufacturing technology of a printed circuit board, in particular to a manufacturing method of a PCB.
Background
With the rapid development of the 5G technology, the frequency of signal transmission is higher and higher, and for PCB products, how to reduce the transmission loss of high-speed and high-frequency signals is an important research topic in the industry. In the prior art, for example, low-loss plates are selected, and the surface of a pipeline is treated by using low-roughness liquid medicine. However, when the upper and lower layers of the inner circuit are covered by the dielectric layers, the signal loss of the PCB manufactured by the prior art is still large, which cannot meet the requirements of wireless radio frequency products above 70GHz, and is not favorable for receiving and transmitting signals.
Disclosure of Invention
The invention aims to provide a manufacturing method of a PCB, which is characterized in that one side of a high-frequency signal transmission inner layer circuit of the PCB is manufactured in a built-in cavity to replace a high-loss resin medium layer, so that the signal transmission loss can be reduced.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method of fabricating a PCB, comprising:
manufacturing an inner layer circuit pattern on the daughter board;
pasting a film material on the inner layer circuit pattern;
overlapping the daughter board with a prepreg and other daughter boards, and pressing into a multilayer board;
grooving holes in the multilayer board, and exposing at least one part of the film material pressed on the inner layer;
and soaking the multilayer board in a liquid medicine, and removing the membrane material.
The projection of the slotted hole on the pasting plane of the film material is overlapped with at least one part of the pasting area of the film material, and the opening depth of the slotted hole is greater than the distance from the opening of the slotted hole to the pasting plane of the film material;
the slotted hole is a through groove, a blind groove, a through hole or a blind hole.
Wherein, paste the coating film material on the inlayer circuit figure, include:
the inner layer circuit pattern comprises a high-frequency signal circuit;
and pasting a film material on the high-frequency signal circuit.
Wherein, paste the coating film material on the high frequency signal circuit, include:
and cutting the film material according to the shape of the high-frequency signal line, so that the film material at least completely covers the high-frequency signal line.
Wherein, will daughter board and prepreg, other daughter boards coincide, and pressfitting is the multiply wood, includes:
placing a prepreg outside the pasting area of the membrane material on the daughter board;
and laminating the other daughter boards to form the multilayer board.
Wherein the thickness of the film material is equal to that of the prepreg.
Further, after the multi-layer board is laminated, the method further comprises:
and drilling the multilayer board, performing hole metallization treatment, and manufacturing an outer layer circuit pattern.
Further, after the inner layer circuit pattern is manufactured on the daughter board, the method further includes:
and carrying out surface treatment on the inner layer circuit pattern.
Wherein the membrane material is a high-temperature-resistant organic membrane; the liquid medicine is alkaline liquid medicine capable of dissolving the organic film.
Further, after removing the film material, the method further comprises:
and closing the opening of the slotted hole.
The invention has the beneficial effects that:
one side of an inner layer circuit pattern of the PCB is a conventional medium, the other side of the inner layer circuit pattern of the PCB is pasted by a soluble film material, and the film material is dissolved after lamination, so that the inner layer circuit is positioned in a built-in cavity to replace a high-loss resin medium layer, and the signal transmission loss is reduced; meanwhile, the cavities can be manufactured in different inner layers according to the circuit distribution design, diversification of PCB products is facilitated, the PCB structure is suitable for more product requirements, and the periphery of the cavity is provided with enough supporting design, so that the capacity of resisting external pressure of the cavity can be enhanced.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a PCB according to an embodiment of the present invention.
Fig. 2 is a top view of a daughter board provided by an embodiment of the present invention.
Fig. 3 is a cross-sectional view of a multilayer board provided by an embodiment of the present invention.
In the figure: 1-a daughter board; 2-inner layer circuit pattern; 3-a membrane material; 4-a slot; 5-a cavity; 6-a multilayer board; 7-prepreg.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments.
The embodiment provides a method for manufacturing a PCB, which is suitable for manufacturing a PCB including a high-frequency signal transmission line, and can form a cavity on one surface of the high-frequency signal transmission line to reduce the loss of signal transmission in a medium.
Fig. 1 is a flowchart of a method for manufacturing a PCB according to an embodiment of the present invention. As shown in fig. 1, the manufacturing method includes the following steps:
s11, an inner layer circuit pattern is formed on the daughter board.
The daughter board includes a single or multiple layer core board. As shown in fig. 2, when the inner layer circuit pattern 2 is formed on the daughter board 1 by a conventional method, attention needs to be paid to a process method for reducing the surface roughness of the circuit and to perform surface treatment on the inner layer circuit pattern 2. The surface treatment includes gold plating and other oxidation resistance treatments.
And S12, attaching a film material on the inner layer circuit pattern.
The inner layer circuit pattern 2 comprises a high-frequency signal circuit which has the characteristics of oxidation resistance and low loss. In this embodiment, a film material 3 is mainly attached to the high-frequency signal line.
Further, before the attaching, the film 3 may be cut according to the shape of the high-frequency signal line, and the film 3 needs to at least completely cover the high-frequency signal line, but the coverage of the film 3 on other areas should be reduced, so that the cavity formed in the subsequent step only has the area of the high-frequency signal line.
And S13, overlapping the daughter board with a prepreg and other daughter boards, and pressing into a multilayer board.
As shown in fig. 3, a prepreg 7 is placed on the daughter board 1 outside the attaching area of the film material 3, and after other daughter boards 1 are stacked, the daughter boards are pressed into a multilayer board 6, and the prepreg 7 is cured to form a dielectric layer, which can provide sufficient support for a cavity formed subsequently.
The thickness of the prepreg 7 is selected according to the requirements of the plate thickness and the medium thickness, the thickness of the membrane material 3 is determined according to the thickness of the prepreg 7, and the thickness of the membrane material 3 is at least equal to the thickness of the prepreg 7.
Further, after the multi-layer board 6 is laminated, the method further includes: and drilling the multilayer board 6, performing hole metallization treatment to realize interlayer interconnection, manufacturing an outer layer circuit pattern, performing surface treatment on the outer layer circuit pattern, and the like.
And S14, forming a slot on the multilayer board, and exposing at least one part of the film material pressed on the inner layer.
And (3) grooving holes 4 in the multilayer board 6, wherein the slotted holes 6 can be through grooves, blind grooves, through holes or blind holes. The projection of the slotted hole 4 on the pasting plane of the film material 3 is overlapped with at least one part of the pasting area of the film material 3, and the opening depth of the slotted hole 4 is larger than the distance from the opening of the slotted hole 3 to the pasting plane of the film material 3. That is, after the slot 4 is opened, one side surface or one surface of the film 3 is exposed.
And S15, soaking the multilayer board in a liquid medicine, and removing the membrane material.
If the membrane material 3 is a high-temperature-resistant organic membrane, the liquid medicine is alkaline liquid medicine capable of dissolving the organic membrane. After the membrane material 3 is removed, a cavity 5 is formed at the position of the original membrane material 3.
Further, after the membrane material 3 is removed, the opening of the slot 4 can be closed according to the design requirement of the product, so that external pollutants are prevented from entering the cavity 5, and the cleanness of the inside of the cavity 5 is ensured. Preferably, the cavity 5 is closed and then made into a vacuum state.
In the embodiment, one surface of a high-frequency signal circuit of the PCB is a conventional medium, the other surface of the high-frequency signal circuit is pasted by a soluble film material, and the film material is dissolved after lamination, so that one surface of the circuit is a built-in cavity to replace a high-loss resin medium layer, and the signal transmission loss can be reduced; meanwhile, the cavities can be manufactured in different inner layers according to the circuit distribution design, so that diversification of PCB products is facilitated, and the PCB structure is suitable for more product requirements; and the periphery of the cavity is provided with enough supporting design, so that the capacity of resisting the external pressure of the cavity can be enhanced.
The technical principle of the present invention is described above in connection with specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without inventive effort, which would fall within the scope of the present invention.
Claims (7)
1. A method for manufacturing a PCB is characterized by comprising the following steps:
manufacturing an inner layer circuit pattern on the daughter board;
pasting a film material on the inner layer circuit pattern;
overlapping the daughter board with a prepreg and other daughter boards, and pressing into a multilayer board;
grooving holes in the multilayer board, and exposing at least one part of the film material pressed on the inner layer;
soaking the multilayer board in a liquid medicine, and removing the membrane material;
after removing the membrane material, the method further comprises the following steps:
closing the opening of the slot;
attaching a film material on the inner layer circuit pattern, comprising:
the inner layer circuit pattern comprises a high-frequency signal circuit;
pasting a film material on the high-frequency signal circuit;
a coating material is attached to the high-frequency signal line, and the coating material comprises:
and cutting the film material according to the shape of the high-frequency signal line, so that the film material at least completely covers the high-frequency signal line.
2. The method of manufacturing according to claim 1, wherein:
the projection of the slotted hole on the pasting plane of the film material is overlapped with at least one part of the pasting area of the film material, and the opening depth of the slotted hole is greater than the distance from the opening of the slotted hole to the pasting plane of the film material;
the slotted hole is a through groove, a blind groove, a through hole or a blind hole.
3. The manufacturing method according to claim 1, wherein the step of laminating the daughter board with the prepreg and other daughter boards and pressing the laminated board into a multilayer board comprises the following steps:
placing a prepreg outside the pasting area of the membrane material on the daughter board;
and laminating the other daughter boards to form the multilayer board.
4. The method of manufacturing according to claim 3, wherein:
the thickness of the film material is equal to that of the prepreg.
5. The method of manufacturing a multilayer sheet according to claim 1 or 3, further comprising, after the laminating the multilayer sheet:
and drilling the multilayer board, performing hole metallization treatment, and manufacturing an outer layer circuit pattern.
6. The method of claim 1, further comprising, after forming the inner layer circuit pattern on the daughter board:
and carrying out surface treatment on the inner layer circuit pattern.
7. The method of manufacturing according to claim 1, wherein:
the membrane material is a high-temperature-resistant organic membrane;
the liquid medicine is alkaline liquid medicine capable of dissolving the organic film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911046609.1A CN110636718B (en) | 2019-10-30 | 2019-10-30 | Manufacturing method of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911046609.1A CN110636718B (en) | 2019-10-30 | 2019-10-30 | Manufacturing method of PCB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110636718A CN110636718A (en) | 2019-12-31 |
| CN110636718B true CN110636718B (en) | 2021-01-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911046609.1A Active CN110636718B (en) | 2019-10-30 | 2019-10-30 | Manufacturing method of PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110636718B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113675569B (en) * | 2020-05-15 | 2023-04-21 | 大富科技(安徽)股份有限公司 | Communication equipment and coupler thereof |
Citations (9)
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|---|---|---|---|---|
| JPH06275957A (en) * | 1993-03-22 | 1994-09-30 | Hitachi Chem Co Ltd | Manufacture of wiring board using coaxial line |
| US5548099A (en) * | 1994-09-13 | 1996-08-20 | Martin Marietta Corporation | Method for making an electronics module having air bridge protection without large area ablation |
| US6064118A (en) * | 1997-04-18 | 2000-05-16 | Nec Corporation | Multilevel interconnection structure having an air gap between interconnects |
| CN102143647A (en) * | 2010-11-25 | 2011-08-03 | 聚信科技有限公司 | Circuit board and manufacturing method thereof |
| CN105636341A (en) * | 2016-01-01 | 2016-06-01 | 广州兴森快捷电路科技有限公司 | PCB with hollow cavity structure and manufacturing method therefor |
| CN106604557A (en) * | 2017-01-18 | 2017-04-26 | 东莞森玛仕格里菲电路有限公司 | Manufacturing method for blind groove with pattern at bottom part |
| CN108541150A (en) * | 2018-07-11 | 2018-09-14 | 北大方正集团有限公司 | Manufacturing method, pcb board and the terminal of pcb board |
| CN109862704A (en) * | 2019-04-02 | 2019-06-07 | 生益电子股份有限公司 | A kind of PCB production method and PCB containing buried via hole |
| CN109862718A (en) * | 2019-04-02 | 2019-06-07 | 生益电子股份有限公司 | A kind of method for processing through hole and PCB that hole wall layers of copper is disconnected in designated layer |
-
2019
- 2019-10-30 CN CN201911046609.1A patent/CN110636718B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06275957A (en) * | 1993-03-22 | 1994-09-30 | Hitachi Chem Co Ltd | Manufacture of wiring board using coaxial line |
| US5548099A (en) * | 1994-09-13 | 1996-08-20 | Martin Marietta Corporation | Method for making an electronics module having air bridge protection without large area ablation |
| US6064118A (en) * | 1997-04-18 | 2000-05-16 | Nec Corporation | Multilevel interconnection structure having an air gap between interconnects |
| CN102143647A (en) * | 2010-11-25 | 2011-08-03 | 聚信科技有限公司 | Circuit board and manufacturing method thereof |
| CN105636341A (en) * | 2016-01-01 | 2016-06-01 | 广州兴森快捷电路科技有限公司 | PCB with hollow cavity structure and manufacturing method therefor |
| CN106604557A (en) * | 2017-01-18 | 2017-04-26 | 东莞森玛仕格里菲电路有限公司 | Manufacturing method for blind groove with pattern at bottom part |
| CN108541150A (en) * | 2018-07-11 | 2018-09-14 | 北大方正集团有限公司 | Manufacturing method, pcb board and the terminal of pcb board |
| CN109862704A (en) * | 2019-04-02 | 2019-06-07 | 生益电子股份有限公司 | A kind of PCB production method and PCB containing buried via hole |
| CN109862718A (en) * | 2019-04-02 | 2019-06-07 | 生益电子股份有限公司 | A kind of method for processing through hole and PCB that hole wall layers of copper is disconnected in designated layer |
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| Publication number | Publication date |
|---|---|
| CN110636718A (en) | 2019-12-31 |
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