CN109834406B - Light metal joining method and joining filler therefor - Google Patents
Light metal joining method and joining filler therefor Download PDFInfo
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- CN109834406B CN109834406B CN201711205315.XA CN201711205315A CN109834406B CN 109834406 B CN109834406 B CN 109834406B CN 201711205315 A CN201711205315 A CN 201711205315A CN 109834406 B CN109834406 B CN 109834406B
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Abstract
The invention relates to a light metal jointing filler, which is formed by uniformly mixing light metal powder and silver powder by a solvent; wherein the powder particle size of the light metal powder is micron-sized, and the powder particle size of the silver powder is nano-sized or sub-micron-sized; the metal bonding method of the invention coats the light metal bonding filler on the joint of two light metal parts to be bonded; and hot-pressing the two to-be-bonded light metal parts to ensure that the silver powder is sintered and adhered to the surfaces of the light metal powder and the two to-be-bonded light metal parts, and the silver powder is condensed to complete bonding of the two to-be-bonded metal parts. The light metal joining method of the light metal joining filler provided by the invention can perform metal joining by low-temperature heating in the environment of normal atmospheric pressure and simultaneously reduce the filler cost of low-temperature joining.
Description
Technical Field
The present invention relates to a metal bonding method and a bonding filler thereof, and more particularly, to a low temperature bonding method for light metal and a bonding filler thereof.
Background
At present, the bonding filler of light metal, taking aluminum alloy as an example, can be divided into brazing filler and nano silver paste.
The brazing filler needs to be subjected to metal bonding at a bonding temperature of 580-600 ℃ under a vacuum condition or a protective atmosphere, the cost of welding materials is low (0.5-1.5 NTD/g), however, the bonding temperature is high, deformation of a bonded metal part is easily caused, the cost of shaping after welding is increased, the bonding temperature is quite close to the melting point of a base material, and the requirement on the precision of the manufacturing process is high.
The bonding temperature of the nano silver paste can be performed in an atmospheric pressure environment of 300 ℃ or lower, but the cost of the nano silver paste is high (>100NTD/g), which is a limitation in use.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a method for joining light metals and a joining filler therefor, which can reduce the cost and can perform low-temperature joining.
In order to achieve the above object, the present invention provides a light metal joint filler formed by uniformly mixing light metal powder and silver powder with a solvent;
wherein the powder particle size of the light metal powder is micron-sized, and the powder particle size of the silver powder is nano-sized or sub-micron-sized; the density of the light metal powder is less than 5g/cm3。
Further, the particle size of the silver powder is 10-500 nm.
Further, the particle size of the light metal powder is 5-500 μm.
Further, the weight percentages of the silver powder and the light metal powder are respectively as follows: 2-50 wt% of silver powder and 50-98 wt% of light metal powder.
Further, the light metal powder is aluminum powder.
Further, the aluminum powder has a particle size of 5 to 500 μm.
Further, the weight percentages of the silver powder and the aluminum powder are respectively as follows: 2-50 wt% of silver powder and 50-98 wt% of aluminum powder.
The invention also discloses a metal bonding method, which comprises the following steps:
coating any one of the light metal jointing fillers on the joint of two light metal parts to be jointed; and hot-pressing the two to-be-bonded light metal parts to ensure that the silver powder is sintered and adhered to the surfaces of the light metal powder and the two to-be-bonded light metal parts, and the silver powder is condensed to complete bonding of the two to-be-bonded metal parts.
Further, the low-temperature heating is a heating mode of 200-400 ℃.
Furthermore, the hot pressing is to apply a bonding pressure of 2-10 MPa to the metals to be bonded under vacuum or atmospheric pressure.
The invention has the following beneficial effects:
the metal bonding method and the bonding filler thereof can carry out metal bonding by low-temperature heating in the environment of normal atmospheric pressure, thereby avoiding the deformation of the metal piece caused by the bonding of the bonding metal piece when meeting high temperature; meanwhile, the filler cost of low-temperature bonding is effectively reduced by controlling the proportion of the components.
Drawings
FIG. 1 is a schematic composition diagram of a metal joint filler in accordance with the present invention;
FIG. 2A is a schematic view of the application of the metal joint filler of the present invention;
FIG. 2B is a second schematic diagram of the application of the metal joint filler of the present invention;
FIG. 3 is a flow chart of a metal bonding method according to the present invention.
Wherein the content of the first and second substances,
1-a metal joint filler; a 1-silver powder; a 2-light metal powder; 2A-a first metal piece; 2B-a second metal piece; b-a solvent; h-heating; p-pressurization; s1-metal bonding method; s11-12.
Detailed Description
Other features and advantages of the present invention will be further illustrated by the following examples, which are intended to be illustrative only and not limiting.
The main problems to be solved by the invention are the metal part deformation problem and the high cost problem of the high-temperature bonding of the brazing filler and the nano silver paste used by the existing bonding filler of the light metal; the invention provides a metal jointing filler which can reduce the cost and can carry out low-temperature jointing.
In order to solve the above problems, the present invention provides a metal joint filler 1 applied to the joint between metal members, as shown in fig. 1, comprising: the silver powder comprises silver powder A1, light metal powder A2 and solvent B, wherein the solvent B uniformly mixes the light metal powder A2 with silver powder A1, the particle size of silver particles of the silver powder A1 is nano-scale or submicron scale, the particle size of light metal particles of the light metal powder A2 is micron scale, and the density of the light metal powder is lower than 5g/cm 3。
In one embodiment, the particle size of the silver powder A1 is 10-500 nm.
In one embodiment, the particle size of the light metal powder A2 is 5-500 μm.
In one embodiment, the weight percentages of the silver powder a1 and the light metal powder a2 are: 2-50 wt% of silver powder and 50-98 wt% of light metal powder.
In one embodiment, the light metal powder a2 is aluminum powder.
In the above embodiment, the aluminum powder has a particle size of 5 to 500 μm.
In the above embodiment, the weight percentages of the silver powder a1 and the aluminum powder are respectively: 2-50 wt% of silver powder and 50-98 wt% of aluminum powder.
That is, the present invention provides a low-operation-temperature metal joint filler 1, wherein the metal joint filler 1 is composed of silver powder A1, light metal powder A2 (such as aluminum powder) and solvent B, wherein the particle size of the silver powder A1 is between 10nm and 500nm, and the proportion is between 2 wt% and 50 wt%; the particle size of the light metal powder A2 is between 5 and 500 mu m, and the proportion is between 50 and 98 weight percent. The solvent B can be alcohols, especially multi-carbon compounds such as terpineol, so that the silver powder A1 and the light metal powder A2 can be fully and uniformly mixed.
Referring to fig. 2A and 2B, fig. 2A is a first schematic application diagram of the metal joint filler of the present invention, and fig. 2B is a second schematic application diagram of the metal joint filler of the present invention, as shown in the drawings, the present invention is suitable for metal joint of non-structural members of light metals, for example, joint between a first metal member 2A (e.g., an aluminum alloy heat dissipation base plate) and a second metal member 2B (e.g., an aluminum alloy heat dissipation fin).
When the metal joint filler 1 of the present invention is applied to joint metal pieces, as shown in fig. 2A, the metal joint filler 1 is coated on the joint where the first metal piece 2A (aluminum alloy heat dissipation base plate) and the second metal piece 2B (aluminum alloy heat dissipation fins) are to be joined, and then, when the first metal piece 2A and the second metal piece 2B are joined, an environment of low-temperature heating H and pressurizing P is provided.
In this embodiment, the heating is performed at a low temperature of 200-400 ℃ and a pressure of 2-10 MPa is applied.
That is, in the metal joining by the metal joining filler 1 according to the present invention, the two metals to be joined (the first metal member 2A and the second metal member 2B) are hot-pressed by the heating H and pressing P processes, the solvent B in the metal joining filler 1 is vaporized, and the nano or sub-micron silver powder a1 reaches the melting point to form surface melting, and further, the surface melting adheres to the light metal powder a2 and the metals to be joined (the first metal member 2A and the second metal member 2B), and the light metal powder a2 remains in a solid state and eliminates voids between the metal powders; after cooling, the silver metal is solidified and is jointed with two metal parts to be jointed, so that the two jointed metal parts can form good metal combination and have good shear strength performance. The experimental data are shown in table 1 below:
TABLE 1
That is, the present invention also discloses a metal bonding method S1, as shown in fig. 3, including:
step S11: coating the light metal joint filler on the joint of two light metal parts to be jointed; and
step S12: and hot-pressing the two to-be-bonded light metal parts to ensure that the silver powder is sintered and adhered to the surfaces of the light metal powder and the two to-be-bonded light metal parts, and the silver powder is condensed to complete bonding of the two to-be-bonded metal parts.
Compared with a hard welding combination process, the invention can be operated at lower joint temperature, the temperature required by light metal hard welding is low, and by taking aluminum alloy joint as an example, the joint temperature (200-400 ℃) of the invention is lower than the temperature (580 ℃) of the traditional aluminum alloy hard welding process, so that the process cost and the shaping cost of a workpiece after welding are saved, the joint temperature is lower than the melting point of a base metal by more than 200 ℃, the operation under a vacuum environment is not required, the requirement on process accuracy is low, and the equipment investment cost is reduced; compared with the nano silver paste bonding process, the material cost (about 5NTD/g) required by the invention is far lower than the cost (>100NTD/g) of the full nano silver metal paste due to the doping of the aluminum metal powder.
In summary, the metal bonding method and the bonding filler thereof disclosed in the present invention can perform metal bonding by low temperature heating in an environment of normal atmospheric pressure, thereby avoiding the deformation of the metal member when the bonding metal member is bonded at high temperature; meanwhile, the filler cost of low-temperature bonding is effectively reduced by controlling the proportion of the components.
In summary, the above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, so that all equivalent changes made in the description and drawings of the present invention should be included in the scope of the present invention.
Claims (6)
1. A light metal jointing filler is formed by uniformly mixing light metal powder and silver powder by a solvent;
the method is characterized in that the particle size of the light metal powder is 5-500 mu m, and the particle size of the silver powder is submicron;
the weight percentages of the silver powder and the light metal powder are respectively as follows: 2-6 wt% of silver powder and 94-98 wt% of light metal powder.
2. The light metal joint filler according to claim 1, wherein the silver powder has a particle size of 400 to 500 nm.
3. The light metal joint filler of claim 1, wherein the light metal powder is aluminum powder.
4. A light metal joining method, comprising:
applying the light metal jointing filler according to any one of claims 1 to 3 to the joint of two light metal parts to be jointed;
and hot-pressing the two to-be-bonded light metal parts to ensure that the silver powder is sintered and adhered to the surfaces of the light metal powder and the two to-be-bonded light metal parts, and the silver powder is condensed to complete bonding of the two to-be-bonded metal parts.
5. The light metal joining method according to claim 4, wherein the temperature of the hot pressing is 200 ℃ to 400 ℃.
6. The light metal bonding method according to claim 4, wherein the hot pressing is performed under vacuum or atmospheric pressure with a bonding pressure of 2 to 10MPa applied to the metals to be bonded.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711205315.XA CN109834406B (en) | 2017-11-27 | 2017-11-27 | Light metal joining method and joining filler therefor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711205315.XA CN109834406B (en) | 2017-11-27 | 2017-11-27 | Light metal joining method and joining filler therefor |
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| CN109834406A CN109834406A (en) | 2019-06-04 |
| CN109834406B true CN109834406B (en) | 2022-01-18 |
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Citations (8)
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| JP2007319896A (en) * | 2006-05-31 | 2007-12-13 | Honda Motor Co Ltd | Method for joining aluminum-based members |
| JP2010234401A (en) * | 2009-03-31 | 2010-10-21 | Dowa Metaltech Kk | Brazing filler metal, method for joining brazing filler metal, and substrate joined with brazing filler metal |
| JP2011240406A (en) * | 2010-03-15 | 2011-12-01 | Dowa Electronics Materials Co Ltd | Bonding material and bonding method using the same |
| CN103406685A (en) * | 2011-11-02 | 2013-11-27 | 兰州大学 | One-dimensional tin and silver binary nanometer welding flux for micrometer/nanometer welding |
| CN103639614A (en) * | 2013-12-04 | 2014-03-19 | 马鑫 | Nanoscale/micron size particle mixing type lead-free solder paste with size effect and manufacturing method thereof |
| WO2016038965A1 (en) * | 2014-09-10 | 2016-03-17 | 富士電機株式会社 | Metal material and electronic component in which same is used |
| CN107175433A (en) * | 2017-04-19 | 2017-09-19 | 天津大学 | A kind of preparation method of low sintering tin dope nano mattisolda |
| CN107350663A (en) * | 2017-08-30 | 2017-11-17 | 桂林电子科技大学 | Liquid metal enhancing base nano mattisolda thermal interfacial material and preparation method thereof |
-
2017
- 2017-11-27 CN CN201711205315.XA patent/CN109834406B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007319896A (en) * | 2006-05-31 | 2007-12-13 | Honda Motor Co Ltd | Method for joining aluminum-based members |
| JP2010234401A (en) * | 2009-03-31 | 2010-10-21 | Dowa Metaltech Kk | Brazing filler metal, method for joining brazing filler metal, and substrate joined with brazing filler metal |
| JP2011240406A (en) * | 2010-03-15 | 2011-12-01 | Dowa Electronics Materials Co Ltd | Bonding material and bonding method using the same |
| CN103406685A (en) * | 2011-11-02 | 2013-11-27 | 兰州大学 | One-dimensional tin and silver binary nanometer welding flux for micrometer/nanometer welding |
| CN103639614A (en) * | 2013-12-04 | 2014-03-19 | 马鑫 | Nanoscale/micron size particle mixing type lead-free solder paste with size effect and manufacturing method thereof |
| WO2016038965A1 (en) * | 2014-09-10 | 2016-03-17 | 富士電機株式会社 | Metal material and electronic component in which same is used |
| CN107175433A (en) * | 2017-04-19 | 2017-09-19 | 天津大学 | A kind of preparation method of low sintering tin dope nano mattisolda |
| CN107350663A (en) * | 2017-08-30 | 2017-11-17 | 桂林电子科技大学 | Liquid metal enhancing base nano mattisolda thermal interfacial material and preparation method thereof |
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| CN109834406A (en) | 2019-06-04 |
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