CN201098923Y - Die cutting tool for flexible circuit board - Google Patents
Die cutting tool for flexible circuit board Download PDFInfo
- Publication number
- CN201098923Y CN201098923Y CNU2007203066453U CN200720306645U CN201098923Y CN 201098923 Y CN201098923 Y CN 201098923Y CN U2007203066453 U CNU2007203066453 U CN U2007203066453U CN 200720306645 U CN200720306645 U CN 200720306645U CN 201098923 Y CN201098923 Y CN 201098923Y
- Authority
- CN
- China
- Prior art keywords
- flexible circuit
- upper substrate
- die cutting
- die
- uniwafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007203066453U CN201098923Y (en) | 2007-11-27 | 2007-11-27 | Die cutting tool for flexible circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2007203066453U CN201098923Y (en) | 2007-11-27 | 2007-11-27 | Die cutting tool for flexible circuit board |
Publications (1)
Publication Number | Publication Date |
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CN201098923Y true CN201098923Y (en) | 2008-08-13 |
Family
ID=39935454
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2007203066453U Expired - Fee Related CN201098923Y (en) | 2007-11-27 | 2007-11-27 | Die cutting tool for flexible circuit board |
Country Status (1)
Country | Link |
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CN (1) | CN201098923Y (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102595796A (en) * | 2012-03-09 | 2012-07-18 | 昆山亿富达电子有限公司 | Bent flexible circuit board device and production process thereof |
CN102581877A (en) * | 2012-02-15 | 2012-07-18 | 欧朗科技(苏州)有限公司 | Device for splitting and cutting small-sized circuit board |
CN103273536A (en) * | 2013-05-17 | 2013-09-04 | 莆田市城厢区星华电子模具有限公司 | Upper die of circuit board punching die |
CN103846967A (en) * | 2012-11-30 | 2014-06-11 | 富葵精密组件(深圳)有限公司 | Blanking die |
CN103991104A (en) * | 2014-05-28 | 2014-08-20 | 广州美维电子有限公司 | Prepreg windowing device and method of soft and hard combined circuit board |
CN104325509A (en) * | 2014-11-26 | 2015-02-04 | 成都尚明工业有限公司 | Combined type rib cutting convex mold |
CN104802220A (en) * | 2015-04-27 | 2015-07-29 | 深圳市远达明反光器材有限公司 | Machining method of flexible solar panel, equipment and solar spike |
CN108463057A (en) * | 2018-04-09 | 2018-08-28 | 昆山振顺电子科技有限公司 | A kind of grading stamp system of wiring board |
-
2007
- 2007-11-27 CN CNU2007203066453U patent/CN201098923Y/en not_active Expired - Fee Related
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102581877A (en) * | 2012-02-15 | 2012-07-18 | 欧朗科技(苏州)有限公司 | Device for splitting and cutting small-sized circuit board |
CN102595796B (en) * | 2012-03-09 | 2014-10-29 | 昆山亿富达电子有限公司 | Bent flexible circuit board device and production process thereof |
CN102595796A (en) * | 2012-03-09 | 2012-07-18 | 昆山亿富达电子有限公司 | Bent flexible circuit board device and production process thereof |
CN103846967B (en) * | 2012-11-30 | 2016-01-06 | 富葵精密组件(深圳)有限公司 | Blanking die |
CN103846967A (en) * | 2012-11-30 | 2014-06-11 | 富葵精密组件(深圳)有限公司 | Blanking die |
CN103273536B (en) * | 2013-05-17 | 2015-12-23 | 莆田市城厢区星华电子模具有限公司 | The patrix of wiring board die cutting die |
CN103273536A (en) * | 2013-05-17 | 2013-09-04 | 莆田市城厢区星华电子模具有限公司 | Upper die of circuit board punching die |
CN103991104A (en) * | 2014-05-28 | 2014-08-20 | 广州美维电子有限公司 | Prepreg windowing device and method of soft and hard combined circuit board |
CN104325509A (en) * | 2014-11-26 | 2015-02-04 | 成都尚明工业有限公司 | Combined type rib cutting convex mold |
CN104325509B (en) * | 2014-11-26 | 2016-08-17 | 成都尚明工业有限公司 | A kind of combined type rib cutting punch mold |
CN104802220A (en) * | 2015-04-27 | 2015-07-29 | 深圳市远达明反光器材有限公司 | Machining method of flexible solar panel, equipment and solar spike |
CN108463057A (en) * | 2018-04-09 | 2018-08-28 | 昆山振顺电子科技有限公司 | A kind of grading stamp system of wiring board |
CN108463057B (en) * | 2018-04-09 | 2020-05-19 | 昆山振顺电子科技有限公司 | Progressive punching system for circuit board |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Xiamen HTH Electronics Co., Ltd. Assignor: Li Min Contract fulfillment period: 2009.7.1 to 2017.11.26 Contract record no.: 2009351000050 Denomination of utility model: Die cutting tool for flexible circuit board Granted publication date: 20080813 License type: Exclusive license Record date: 20090721 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.7.1 TO 2017.11.26; CHANGE OF CONTRACT Name of requester: XIAMEN HUANTIANHUA ELECTRONICS CO., LTD. Effective date: 20090721 |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080813 Termination date: 20161127 |