CN109688713B - Dry film hole covering equipment and dry film hole covering method - Google Patents
Dry film hole covering equipment and dry film hole covering method Download PDFInfo
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- CN109688713B CN109688713B CN201910095220.XA CN201910095220A CN109688713B CN 109688713 B CN109688713 B CN 109688713B CN 201910095220 A CN201910095220 A CN 201910095220A CN 109688713 B CN109688713 B CN 109688713B
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- dry film
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses dry film hole covering equipment and a dry film hole covering method, wherein the dry film hole covering equipment comprises a conveying device, a film pasting device, a hot pressing device and a pressurizing device, wherein the conveying device is used for conveying a substrate; the film pasting device is used for pasting a dry film on the substrate, the hot pressing device is used for hot pressing the dry film on the substrate, and the film pasting device and the hot pressing device are sequentially arranged in the conveying direction of the substrate; the pressurizing device is used for pressurizing the hot-pressing device and is arranged corresponding to the hot-pressing device. Because the dry film lid hole equipment that this application provided is equipped with pressure device, pressure device corresponds hot press unit sets up, consequently pressure device can improve hot press unit to the pressure of base plate, and then can improve the cohesion of dry film and base plate face to can avoid finger size to diminish.
Description
Technical Field
The invention relates to the field of printed circuit boards, in particular to dry film hole covering equipment and a dry film hole covering method.
Background
The circuit forming Process of the circuit board can be roughly divided into a tent Process (dry film hole covering method), a Semi-additive Process (Semi-additive method) and a Modified Semi-additive Process (Modified Semi-additive method), wherein the dry film hole covering method is suitable for a PCB (printed circuit board), an FPC (flexible printed circuit) flexible board, an HDI (high density interconnect) board and the like, and the general flow of the dry film hole covering method is as follows: film pressing → exposure → development → etching → film stripping, and after the above process, the pad (commonly known as finger in the industry) can be formed. Because the pressfitting power of current dry film lid hole equipment is not enough, when leading to the press mold, dry film and base plate cohesion are not enough, can etch the copper below the dry film at the etching process, and this can cause the finger size to diminish, the problem that does not satisfy customer's requirement appears even.
Disclosure of Invention
The invention mainly aims to provide dry film hole covering equipment, which aims to improve the binding force of a dry film and a substrate and avoid the finger size from becoming small.
In order to achieve the above object, the dry film hole capping apparatus according to the present invention comprises: a transfer device for transferring the substrate; the film sticking device is used for sticking a dry film on the substrate; the hot-pressing device is used for hot-pressing the dry film on the substrate, and the film sticking device and the hot-pressing device are sequentially arranged in the conveying direction of the substrate; and the pressurizing device is used for pressurizing the hot-pressing device and is arranged corresponding to the hot-pressing device.
Preferably, the hot-pressing device comprises two hot-pressing rollers which are oppositely arranged and a first lifting device which is used for driving the two hot-pressing rollers to move in the opposite direction or in the opposite direction; and a hot-pressing gap for hot-pressing the substrate and the dry film is formed between the two hot-pressing rollers.
Preferably, the first lifting device comprises two cylinders which are respectively arranged at two axial ends of the two hot pressing rollers.
Preferably, the pressing device comprises two opposite pressing rollers and a second lifting device for driving the two pressing rollers to move towards or away from each other; each pressure roller corresponds to one hot pressing roller.
Preferably, the pressure roller is disposed corresponding to a middle portion of the heat and pressure roller.
Preferably, the axial length of the pressure roller is 1/8 to 1/3 of the axial length of the heat and pressure roller.
Preferably, the axial length of the pressure roller is 1/4 times the axial length of the heat and pressure roller.
Preferably, the axial length of the hot press roller is 800mm, and the axial length of the pressure roller is 200 mm.
Preferably, the dry film hole covering equipment further comprises a rear pressing device, and the hot pressing device and the rear pressing device are sequentially arranged in the moving direction of the substrate.
Preferably, the back pressing device comprises two back pressing rollers which are arranged oppositely and a third lifting device which is used for driving the two back pressing rollers to move in the opposite direction or in the opposite direction, and a back pressing gap which is used for re-pressing the substrate and the dry film is formed between the two back pressing rollers.
The invention also provides a dry film hole covering method, which adopts the dry film hole covering equipment, and the dry film hole covering equipment comprises:
a transfer device for transferring the substrate; the film sticking device is used for sticking a dry film on the substrate; the hot-pressing device is used for hot-pressing the dry film on the substrate, and the film sticking device and the hot-pressing device are sequentially arranged in the conveying direction of the substrate; and the pressurizing device is used for pressurizing the hot-pressing device and is arranged corresponding to the hot-pressing device.
Preferably, the dry film aperturing method comprises the steps of: providing a copper-clad substrate; attaching a dry film on the copper surface of the copper-clad substrate; pressing a film to make the dry film attached to the copper surface; exposing and developing to transfer a designed pattern onto the dry film; and etching, namely removing the copper surface which is not covered by the dry film.
The dry film hole covering equipment provided by the invention comprises a conveying device, a film pasting device, a hot pressing device and a pressurizing device, wherein the conveying device is used for conveying a substrate; the film pasting device is used for pasting a dry film on the substrate, the hot pressing device is used for hot pressing the dry film on the substrate, and the film pasting device and the hot pressing device are sequentially arranged in the conveying direction of the substrate; the pressurizing device is used for pressurizing the hot-pressing device and is arranged corresponding to the hot-pressing device. Because the dry film cover hole equipment that this application provided is equipped with pressure device, pressure device corresponds hot press unit sets up, therefore pressure device can improve hot press unit to the pressure of base plate, and then can improve the cohesion of dry film and base plate face, consequently in follow-up etching process, can avoid dry film and face cohesion not enough to can avoid in the etching process, get rid of the copper face of dry film below, consequently can avoid the finger size to diminish.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural view of a dry film hole-covering apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart of a dry film via-filling method according to an embodiment of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | |
300 | |
| 100 | Hot-pressing |
400 | |
| 200 | First lifting device |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a dry film hole covering device which can prevent finger size from becoming small.
In an embodiment of the present invention, as shown in fig. 1, the dry film hole capping apparatus includes a conveying device (not shown), a film attaching device (not shown), a hot pressing device, and a pressing device, wherein the driving device is used for conveying the substrate 10; the film pasting device is used for pasting a dry film on the substrate 10, the hot pressing device is used for hot pressing the dry film on the substrate 10, and the film pasting device and the hot pressing device are sequentially arranged in the conveying direction of the substrate 10; the pressurizing device is used for pressurizing the hot-pressing device and is arranged corresponding to the hot-pressing device.
Because the dry film cover hole equipment that this application provided is equipped with pressure device, pressure device corresponds hot press unit sets up, therefore pressure device can improve hot press unit to base plate 10's pressure, and then can improve the cohesion of dry film and base plate 10 face, consequently in follow-up etching process, can avoid dry film and face cohesion not enough to can avoid in the etching process, get rid of the copper face of dry film below, consequently can avoid the finger size to diminish. Experiments show that after the dry film hole covering equipment provided by the application is adopted, the size of fingers is improved by at least 2 micrometers compared with the prior art.
Further, with continued reference to fig. 1, the structure of the hot press apparatus will now be described in detail. In this embodiment, the hot pressing device includes two hot pressing rollers 100 disposed oppositely and a first lifting device 200 for driving the two hot pressing rollers 100 to move in opposite directions or in opposite directions; a hot pressing gap for hot pressing the substrate 10 and the dry film is formed between the two hot pressing rollers 100.
Specifically, in this embodiment, the first lifting device 200 includes two first cylinders respectively disposed at two axial ends of the hot press roller 100, and the two hot press rollers 100 include the upper hot press roller 100 and the lower hot press roller 100 which are disposed at an interval, the first cylinders are used for controlling the upper hot press roller 100 and the lower hot press roller 100 to move in opposite directions or move in opposite directions, and when the upper hot press roller 100 and the lower hot press roller 100 move in opposite directions to a hot press gap, the substrate 10 can be pressed, so that the dry film is combined with the substrate 10.
Further, referring to fig. 1, the structure of the pressurizing device will now be described. The pressing device comprises two opposite pressing rollers 300 and a second lifting device for driving the two pressing rollers 300 to move towards or away from each other; each of the pressure rollers 300 is disposed corresponding to one of the heat and pressure rollers 100.
In a preferred embodiment, the pressure roller 300 is disposed corresponding to the middle of the heat and pressure roller 100 in order to keep the pressure at the two ends of the heat and pressure roller 100 consistent with the pressure at the middle position of the heat and pressure roller 100, considering that the two ends of the heat and pressure roller 100 are connected to the first lifting device 200, and thus the pressure at the middle of the heat and pressure roller 100 is likely to be insufficient. It should be noted that the second lifting device includes two second air cylinders respectively disposed at two axial ends of the two pressing rollers 300.
Further, in the present embodiment, the axial length of the pressure roller 300 is 1/8 to 1/3 of the axial length of the heat and pressure roller 100. Preferably, the axial length of the pressure roller 300 is 1/4 of the axial length of the heat and pressure roller 100. Specifically, in the present embodiment, the axial length of the hot press roller 100 is 800mm, and the axial length of the pressure roller 300 is 200 mm.
Further, in order to further improve the bonding force between the dry film and the substrate 10, in an embodiment of the present application, the dry film hole capping device further includes a post-pressing device (not shown), and the hot pressing device and the post-pressing device are sequentially disposed in the moving direction of the substrate 10, that is: the rear pressing device is arranged on the rear side of the hot pressing device, so that the substrate 10 after hot pressing by the hot pressing device can be pressed for the second time by the rear pressing device, and the bonding force between the dry film and the substrate 10 can be further improved.
Specifically, in this embodiment, the back pressure device includes two back pressure rollers disposed opposite to each other and a third lifting device for driving the two back pressure rollers to move in opposite directions or in opposite directions, and a back pressure gap for re-pressing the substrate 10 and the dry film is formed between the two back pressure rollers.
The invention also provides a dry film hole covering method which is completed by adopting the dry film hole covering equipment. The specific structure of the dry film hole covering device refers to the above embodiments, and since the dry film hole covering method provided by the present application adopts all technical solutions of all the above embodiments, all beneficial effects brought by the technical solutions of the above embodiments are at least achieved, and are not described in detail herein.
Further, as shown in fig. 2, the dry film hole covering method includes the steps of: step 1: providing a copper-clad substrate 10; and step 3: attaching a dry film to the copper surface of the copper-clad substrate 10; and 4, step 4: pressing a film to make the dry film attached to the copper surface; and 5: exposing and developing to transfer a designed pattern onto the dry film; step 6: etching to remove the copper surface uncovered by the dry film; thus, a finger can be formed on the copper-clad substrate 10. It should be noted that the dry film hole capping apparatus further includes an etching device and a developing device, so that steps 5 and 6 can be completed.
Further, the dry film hole covering method is carried out in the step 3: before attaching a dry film on the copper surface of the copper-clad substrate 10, the method further comprises: step 2: and the pretreatment is used for cleaning the copper surface and roughening the copper surface, so that the binding force between the dry film and the copper surface can be increased.
Further, the dry film hole covering method is performed in the step 6: etching, after the step of removing the copper surface not covered by the dry film, the method further comprises: and 7: and removing the film, wherein the film is used for removing the residual dry film on the copper surface.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The utility model provides a dry film lid hole equipment, its characterized in that, dry film lid hole equipment includes:
a transfer device for transferring the substrate;
the film sticking device is used for sticking a dry film on the substrate;
the hot-pressing device is used for hot-pressing the dry film on the substrate, and the film sticking device and the hot-pressing device are sequentially arranged in the conveying direction of the substrate; the hot-pressing device comprises two hot-pressing rollers which are oppositely arranged and a first lifting device which is used for driving the two hot-pressing rollers to move in the opposite direction or in the opposite direction; a hot pressing gap for hot pressing the substrate and the dry film is formed between the two hot pressing rollers; the first lifting device comprises two cylinders which are respectively arranged at two axial ends of the two hot pressing rollers; and
the pressurizing device is used for pressurizing the hot-pressing device and is arranged corresponding to the hot-pressing device; the pressurizing device comprises two pressurizing rollers which are oppositely arranged and a second lifting device which is used for driving the two pressurizing rollers to move oppositely or back to back; each pressure roller is arranged corresponding to one hot pressing roller; the pressure roller is arranged corresponding to the middle part of the hot pressing roller.
2. The dry film aperturing apparatus of claim 1, wherein the axial length of the pressure roller is 1/8 to 1/3 of the axial length of the heat and pressure roller.
3. The dry film aperturing apparatus of claim 2, wherein the axial length of the pressure roller is 1/4 times the axial length of the heat and pressure roller.
4. The dry film aperturing apparatus of claim 3, wherein the hot press roll has an axial length of 800mm and the pressure roll has an axial length of 200 mm.
5. The dry film via capping device of any of claims 1 to 4, further comprising a post-pressing device, wherein the hot pressing device and the post-pressing device are sequentially disposed in a moving direction of the substrate.
6. The dry film aperturing apparatus of claim 5, wherein the back press comprises two opposing back press rollers and a third lift device for driving the back press rollers toward or away from each other, wherein a back press gap is formed between the back press rollers for re-pressing the substrate and the dry film.
7. A dry film hole capping method using the dry film hole capping apparatus according to any one of claims 1 to 6.
8. The dry film aperturing method of claim 7, comprising the steps of:
providing a copper-clad substrate;
attaching a dry film on the copper surface of the copper-clad substrate;
pressing a film to make the dry film attached to the copper surface;
exposing and developing to transfer a designed pattern onto the dry film; and the number of the first and second groups,
and etching to remove the copper surface uncovered by the dry film.
9. The dry film aperturing method of claim 8, wherein in said step: before attaching a dry film on the copper surface of the copper-clad substrate, the method further comprises the following steps:
and pre-treating to roughen the copper surface to increase the binding force between the dry film and the copper surface.
10. The dry film aperturing method of claim 8, wherein in said step: etching, after the step of removing the copper surface not covered by the dry film, the method further comprises:
and removing the film, wherein the film is used for removing the residual dry film on the copper surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910095220.XA CN109688713B (en) | 2019-01-30 | 2019-01-30 | Dry film hole covering equipment and dry film hole covering method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910095220.XA CN109688713B (en) | 2019-01-30 | 2019-01-30 | Dry film hole covering equipment and dry film hole covering method |
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| Publication Number | Publication Date |
|---|---|
| CN109688713A CN109688713A (en) | 2019-04-26 |
| CN109688713B true CN109688713B (en) | 2021-09-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910095220.XA Active CN109688713B (en) | 2019-01-30 | 2019-01-30 | Dry film hole covering equipment and dry film hole covering method |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009218466A (en) * | 2008-03-12 | 2009-09-24 | Sumitomo Metal Mining Co Ltd | Sheet laminator and laminating method |
| CN204566673U (en) * | 2015-01-22 | 2015-08-19 | 广东仕诚塑料机械有限公司 | A kind of heating printing device of film |
| CN108811328A (en) * | 2018-05-08 | 2018-11-13 | 广东思沃精密机械有限公司 | Film laminator press mold temperature automatic adjustment equipment and automatic adjusting method |
| CN209693182U (en) * | 2019-01-30 | 2019-11-26 | 无锡深南电路有限公司 | Dry film cap bore equipment |
-
2019
- 2019-01-30 CN CN201910095220.XA patent/CN109688713B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009218466A (en) * | 2008-03-12 | 2009-09-24 | Sumitomo Metal Mining Co Ltd | Sheet laminator and laminating method |
| CN204566673U (en) * | 2015-01-22 | 2015-08-19 | 广东仕诚塑料机械有限公司 | A kind of heating printing device of film |
| CN108811328A (en) * | 2018-05-08 | 2018-11-13 | 广东思沃精密机械有限公司 | Film laminator press mold temperature automatic adjustment equipment and automatic adjusting method |
| CN209693182U (en) * | 2019-01-30 | 2019-11-26 | 无锡深南电路有限公司 | Dry film cap bore equipment |
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|---|---|
| CN109688713A (en) | 2019-04-26 |
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