CN109671678B - Chip packaging structure and electronic equipment - Google Patents
Chip packaging structure and electronic equipment Download PDFInfo
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- CN109671678B CN109671678B CN201811479211.2A CN201811479211A CN109671678B CN 109671678 B CN109671678 B CN 109671678B CN 201811479211 A CN201811479211 A CN 201811479211A CN 109671678 B CN109671678 B CN 109671678B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/86—Secure or tamper-resistant housings
- G06F21/87—Secure or tamper-resistant housings by means of encapsulation, e.g. for integrated circuits
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Software Systems (AREA)
- Computer Security & Cryptography (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Storage Device Security (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention provides a chip packaging structure and electronic equipment, wherein the chip packaging structure comprises: the electronic chip is provided with a plurality of first pins; the printed circuit board is provided with a packaging area corresponding to the electronic chip, a plurality of second pins which correspond to the first pins and are electrically connected with the first pins are arranged in the packaging area, and the second pins comprise a plurality of password transmission pins; and the protection bulges are arranged in the packaging area and between the second pins so as to protect the secret password transmission pins. The invention has the advantage of improving the safety of the chip packaging structure.
Description
Technical Field
The present invention relates to the field of electronic circuit technologies, and in particular, to a chip package structure and an electronic device.
Background
In the prior art, a security chip is arranged on a printed circuit board inside an electronic device such as a bank teller machine, the security chip is connected with the printed circuit board, a user inputs a password by pressing a button of the bank teller machine, and a password input signal is transmitted to the printed circuit board through the security chip to be checked and the like.
Disclosure of Invention
The invention mainly aims to provide a chip packaging structure and electronic equipment, and aims to solve the problem of potential safety hazard caused by chip packaging in the prior art.
In order to achieve the above object, the present invention provides a chip package structure, including: the electronic chip is provided with a plurality of first pins; the printed circuit board is provided with a packaging area corresponding to the electronic chip, a plurality of second pins which correspond to the first pins and are electrically connected with the first pins are arranged in the packaging area, and the second pins comprise a plurality of password transmission pins; and the protection bulges are arranged in the packaging area and between the second pins so as to protect the secret password transmission pins.
Preferably, a plurality of the protection bulges are at least arranged around each password transmission pin in a surrounding mode.
Preferably, the number of the protection bulges annularly arranged around the password transmission pin is at least 4.
Preferably, the second pins are arranged in an array, and the plurality of protection protrusions are annularly arranged on the inner side of the second pin at the outermost ring so that the connecting line of the plurality of adjacent protection protrusions surrounds all the plurality of secret code transmission pins.
Preferably, the second pins are arranged in an array, and the protection protrusion is arranged at the center of a rectangle formed by connecting lines of the adjacent 4 second pins.
Preferably, the protection bump includes a pad disposed on the printed circuit board and solder paste soldered on the pad.
Preferably, the protection protrusion is a cylinder and/or a cone.
Preferably, the second pin is a circular electrical contact, the diameter of the circular electrical contact is 0.4 mm, and the distance between adjacent circular electrical contacts in the same row or column is 0.45 mm.
Preferably, the projection of the protection projection on the printed circuit board is a circular projection, and the diameter of the circular projection is 1/5-4/5 of the diameter of the circular electric contact.
In addition, in order to achieve the above object, the present application also provides an electronic device including the chip package structure as described above.
According to the invention, the protection bulge is arranged in the packaging area and between the second pins and is convexly arranged on the printed circuit board, when an illegal person such as a hacker tries to pass a conductive material such as a metal wire through a gap between the printed circuit board and the electronic chip and contacts the secret password transmission pin to steal user privacy such as account password information of a user bank, the protection bulge has a blocking effect on the conductive material such as the metal wire, so that the conductive material such as the metal wire cannot be inserted into the gap to contact the secret password transmission pin, the protection effect on the secret password transmission pin is achieved, and the safety of the chip packaging structure is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a chip package structure according to an embodiment of the invention;
FIG. 2 is a schematic structural diagram of an electronic chip according to an embodiment of the invention;
FIG. 3 is a schematic structural diagram of a printed circuit board according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of another embodiment of a chip package structure according to the present invention;
FIG. 5 is a schematic structural diagram of another embodiment of a printed circuit board of the present invention;
FIG. 6 is a schematic structural diagram of a printed circuit board according to yet another embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a printed circuit board according to another embodiment of the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 1-4, a chip package structure 100 according to the present invention includes: the electronic chip comprises an electronic chip 10, wherein a plurality of first pins 11 are arranged on the electronic chip 10; a printed circuit board 20, wherein a package region 21 corresponding to the electronic chip 10 is disposed on the printed circuit board 20, a plurality of second pins 22 corresponding to and electrically connected to the first pins 11 are disposed in the package region 21, and the second pins 22 include a plurality of secret code transmission pins 221; a plurality of protection bumps 23, the protection bumps 23 are disposed in the package region 21 and between the second pins 22 to protect the secret token transmission pin 221.
In this embodiment, the electronic chip 10 is preferably a security chip, and the electronic chip 10 is packaged in the packaging region 21 of the printed circuit board 20 and electrically connected to the printed circuit board 20, so as to implement signal transmission between the electronic chip 10 and the printed circuit board 20. Specifically, the bottom of the electronic chip 10 facing the printed circuit board 20 is provided with a plurality of first pins 11, preferably, the first pins 11 are arranged in an array, so that the plurality of first pins 11 are arranged in order and fit a universal packaging form; specifically, a plurality of second pins 22 corresponding to and electrically connected to the first pins 11 are disposed on the package region 21 of the printed circuit board 20 corresponding to the electronic chip 10, and the first pins 11 correspond to the second pins 22 one to one, or the number of the second pins 22 is greater than that of the first pins 11, and the redundant second pins 22 can be reserved for use, so that signal transmission between the electronic chip 10 and the printed circuit board 20 is realized through the electrical connection relationship between the first pins 11 and the second pins 22. Specifically, the second pin 22 includes a plurality of secret code transmission pins 221, and the secret code transmission pins 221 are used for transmitting privacy information of the user, such as bank account password information and the like.
Referring to fig. 4, a gap 30 is formed between the edge of the electronic chip 10 and the printed circuit board 20, and the gap 30 is generated during the process of assembling the electronic chip 10 to the printed circuit board 20 and has a certain width, for example, the width of the gap 30 is 0.15 mm. In the embodiment of the present invention, at least a plurality of protection bumps 23 are disposed around the pin 221, the protection bumps 23 are disposed in the package region 21 and between the second pins 22, and the protection bumps 23 are formed by protruding from the surface of the printed circuit board 20, and have a certain height relative to the printed circuit board 20, for example, the height of the protection bumps 23 is equal to the width of the gap 30 and is 0.15mm, or the height of the protection bumps 23 is slightly smaller or higher than the width of the gap 30, for example, the height of the protection bumps 23 is 0.1-0.2 mm.
In summary, in the invention, the protection protrusion 23 is disposed in the package region 21 and between the second pins 22, and the protection protrusion 23 is protruded on the printed circuit board 20, when an illegal person such as a hacker tries to pass a conductive material such as a metal wire through the gap 30 between the printed circuit board 20 and the electronic chip 10 to contact the secret password transmission pin 221 to steal user privacy such as account password information of a user bank, the protection protrusion 23 blocks the conductive material such as the metal wire, so that the conductive material such as the metal wire cannot be inserted into the gap 30 to contact the secret password transmission pin 221, thereby protecting the secret password transmission pin 221 and improving the security of the chip package structure 100.
Preferably, referring to fig. 3, the second pins 22 are arranged in an array, and the plurality of protection protrusions 23 are annularly disposed on the inner side of the outermost second pin 22, so that the connection line of the plurality of adjacent protection protrusions 23 surrounds all of the plurality of password transmission pins 221.
In this embodiment, the second pins 22 are arranged in an array to form rows of pins and columns of pins, and a connection line between the second pins 22 in the outermost row forms a rectangle, it can be understood that a connection line between the second pins 22 in the second row and the second column from outside to inside also forms a rectangle, and so on, a plurality of rectangles with different areas converging toward the center of the package region 21 will be formed in the package region 21.
In this embodiment, the plurality of protection protrusions 23 are annularly disposed on the inner side of the outermost second pin 22, that is, the plurality of protection protrusions 23 are disposed between the outermost rectangle formed by the second pin 22 and the second rectangle, and the connection lines between the plurality of protection protrusions 23 also form a rectangle (the dotted line portion in fig. 3), and the connection lines between a plurality of adjacent protection protrusions 23 surround all of the plurality of dense transmission pins 221, so that the plurality of protection protrusions 23 play a role in protecting the dense transmission pins 221 in both the row direction and the column direction.
It can be understood that, referring to fig. 5, the plurality of protection protrusions 23 may be formed not only between the outermost rectangle and the second-turn rectangle formed by the second leads 22, but also between the rectangles formed by any two second leads 22, or the protection protrusions 23 may be formed between the rectangles formed by adjacent second leads 22, so as to improve the protection level.
Preferably, referring to fig. 6, the second pins 22 are arranged in an array, and the protection protrusion 23 is disposed at a central position of a rectangle formed by connecting lines of 4 adjacent second pins 22.
In this embodiment, the second pins 22 are arranged in two rows and two columns, and the connection line of the second pins 22 can form a rectangle, and the protection protrusion 23 is arranged at the center of the rectangle, or at the intersection of two diagonal lines of the rectangle; since the second pins 22 are generally circular electrical contacts, and the distance between adjacent second pins 22 in the row direction or the column direction is smaller than the distance between two diagonal lines of the rectangle, the protection protrusion 23 is disposed at the center of the rectangle. The distance occupied by the protection bump 23 on the printed circuit board 20 can be increased, and even the projection of the protection bump 23 in the row direction or the column direction can coincide with the second pin 22, in this case, the protection bump 23 extends to the interval area between two second pins 22 in the same row or the same column.
Further, the protection protrusion 23 is disposed at the center of the rectangle, that is, the same protection protrusion 23 is disposed between the rows and the columns, and the protection protrusion 23 just blocks the passage between the rows and the passages between the columns for the metal wires to pass through, and simultaneously blocks the passage between the columns and the passages between the rows for the metal wires to pass through, thereby preventing the conductive materials such as the metal wires from contacting the dense transmission pins 221.
Preferably, referring to fig. 7, a plurality of the protection protrusions 23 are at least annularly disposed around each of the password transmission pins 221.
In this embodiment, the plurality of protection protrusions 23 are at least annularly arranged around each secret code transmission pin 221, so as to protect the secret code transmission pins 221 in each direction, and prevent an illegal person such as a hacker from making common sense contact with the secret code transmission pins 221 in a plurality of directions.
Preferably, referring to fig. 7, the number of the protection protrusions 23 annularly disposed around the password transmission pin 221 is at least 4.
In this embodiment, when the second pins 22 (including the multiple secret transmission pins 221) are arranged in an array, it is only necessary to set 4 protection protrusions around each secret transmission pin 221 to prevent the metal wires in the row direction or the column direction from reaching the channels of the secret transmission pins 221, for example, 14 secret transmission pins 221 are provided corresponding to 14 keys of a bank card cash dispenser, at this time, 4 protection protrusions 23 are annularly provided around the 14 secret transmission pins 221, which can play a role of protection in the row direction and the column direction, at this time, the protection protrusions 23 may not be provided at the positions of other non-secret transmission pins 221, thereby reducing the consumables used for forming the protection protrusions 23, and simplifying the generation process.
Preferably, the protection bump 23 includes a pad disposed on the printed circuit board 20 and solder paste soldered on the pad.
In this embodiment, the protection bump 23 is formed together with the second lead 22 formed on the printed circuit board 20, a pad of the protection bump 23 is formed in the same process of forming the second lead 22, and then the protection bump 23 is formed by soldering solder paste on the pad. Preferably, the protection protrusion 23 is a cylinder and/or a cone.
Preferably, the second pin 22 is a circular electrical contact, the diameter of the circular electrical contact is 0.4 mm, and the distance between adjacent circular electrical contacts in the same row or column is 0.45 mm.
In this embodiment, the diameter of the circular electrical contact is 0.4 mm, which increases the contact area with the first pin 11 and improves the stability of the electrical connection between the second pin 22 and the first pin 11; meanwhile, the distance between the adjacent circular electrical contacts in the same row or the same column is 0.45 mm, if the first pin 11 is also a circular electrical contact with a diameter of 0.4 mm, at this time, the diameter of the first pin 11 is smaller than the distance between the adjacent second pins 22, at this time, it can be prevented that the same first pin 11 is bridged between two adjacent second pins 22 to cause short circuit, and meanwhile, the distance between the adjacent circular electrical contacts is 0.45 mm, so that the protection protrusion 23 has a sufficiently large placement space.
Preferably, the projection of the protection protrusion 23 on the printed circuit board 20 is a circular projection, and the diameter of the circular projection is 1/5-4/5 of the diameter of the circular electrical contact.
In this embodiment, the projection of the protection bump 23 on the printed circuit board 20 is a circular projection, that is, no matter what shape the solder paste on the pad is, at least the pad is a circular pad, the solder paste and the projection of the solder paste on the printed circuit board 20 are also necessarily circular projections, and the diameter of the circular projection is 1/5-4/5 of the diameter of the circular electrical contact, that is, the circular projection is smaller than the area of the circular electrical contact (the second pin 22), when the protection bump 23 is disposed at the center of the rectangle formed by the connection lines of the second pins 22, the protection bump 23 does not contact with the surrounding second pins 22, so as to avoid short circuit between the protection bump 23 and the second pin 22, and the protection bump 23 can play a role in protection in the row direction and the column direction.
In addition, to achieve the above object, the present application also provides an electronic device including the chip package structure 100 as described above.
In this embodiment, the electronic device includes, but is not limited to, a bank teller machine, and since the electronic device includes the chip package structure 100, the electronic device at least has the beneficial effects of the chip package structure 100, and details are not repeated herein.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A chip package structure, comprising:
the electronic chip is provided with a plurality of first pins;
the printed circuit board is provided with a packaging area corresponding to the electronic chip, a plurality of second pins which correspond to the first pins and are electrically connected with the first pins are arranged in the packaging area, and the second pins comprise a plurality of password transmission pins;
and the protection bulges are arranged in the packaging area and between the second pins so as to protect the secret password transmission pins.
2. The chip package structure according to claim 1, wherein a plurality of the protection bumps are disposed around at least each of the cryptogra phic transfer pins.
3. The chip package structure according to claim 2, wherein the number of the protection bumps arranged around the periphery of the password transmission pin is at least 4.
4. The chip package structure according to claim 1, wherein the second pins are arranged in an array, and the plurality of protection bumps are annularly disposed on an inner side of the outermost second pin so that a connection line of a plurality of adjacent protection bumps surrounds all the plurality of secret code transmission pins.
5. The chip package structure according to claim 1, wherein the second pins are arranged in an array, and the protection protrusion is disposed at a center of a rectangle formed by connecting lines of 4 adjacent second pins.
6. The chip package structure according to any one of claims 1 to 5, wherein the protection bump comprises a pad disposed on the printed circuit board and solder paste soldered on the pad.
7. The chip package structure according to any one of claims 1 to 5, wherein the protection protrusion is a cylinder and/or a cone.
8. The chip package structure according to any one of claims 1 to 5, wherein the second pin is a circular electrical contact, the diameter of the circular electrical contact is 0.4 mm, and the distance between adjacent circular electrical contacts in the same row or column is 0.45 mm.
9. The chip package structure according to claim 8, wherein the projection of the protection bump on the printed circuit board is a circular projection, and the diameter of the circular projection is 1/5-4/5 of the diameter of the circular electrical contact.
10. An electronic device comprising the chip packaging structure according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811479211.2A CN109671678B (en) | 2018-12-05 | 2018-12-05 | Chip packaging structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811479211.2A CN109671678B (en) | 2018-12-05 | 2018-12-05 | Chip packaging structure and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN109671678A CN109671678A (en) | 2019-04-23 |
| CN109671678B true CN109671678B (en) | 2020-09-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811479211.2A Active CN109671678B (en) | 2018-12-05 | 2018-12-05 | Chip packaging structure and electronic equipment |
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| CN (1) | CN109671678B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113987991B (en) * | 2021-09-29 | 2022-09-27 | 展讯半导体(南京)有限公司 | Signal transmission device and electronic equipment |
| CN115052420B (en) * | 2022-06-17 | 2024-01-19 | 河南驰诚电气股份有限公司 | Circuit board for electronic circuit lamination design and design method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203503049U (en) * | 2013-09-10 | 2014-03-26 | 深圳市九思泰达技术有限公司 | Novel anti-spying code keyboard and anti-spying structure thereof |
| CN106339700A (en) * | 2016-10-19 | 2017-01-18 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and manufacturing method thereof and electronic equipment |
| JP2017151845A (en) * | 2016-02-26 | 2017-08-31 | 沖電気工業株式会社 | Input device |
-
2018
- 2018-12-05 CN CN201811479211.2A patent/CN109671678B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203503049U (en) * | 2013-09-10 | 2014-03-26 | 深圳市九思泰达技术有限公司 | Novel anti-spying code keyboard and anti-spying structure thereof |
| JP2017151845A (en) * | 2016-02-26 | 2017-08-31 | 沖電気工業株式会社 | Input device |
| CN106339700A (en) * | 2016-10-19 | 2017-01-18 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and manufacturing method thereof and electronic equipment |
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| CN109671678A (en) | 2019-04-23 |
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