CN109671678A - A kind of chip-packaging structure and electronic equipment - Google Patents
A kind of chip-packaging structure and electronic equipment Download PDFInfo
- Publication number
- CN109671678A CN109671678A CN201811479211.2A CN201811479211A CN109671678A CN 109671678 A CN109671678 A CN 109671678A CN 201811479211 A CN201811479211 A CN 201811479211A CN 109671678 A CN109671678 A CN 109671678A
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- Prior art keywords
- pin
- chip
- protection
- packaging structure
- circuit board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/86—Secure or tamper-resistant housings
- G06F21/87—Secure or tamper-resistant housings by means of encapsulation, e.g. for integrated circuits
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Software Systems (AREA)
- Computer Security & Cryptography (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Storage Device Security (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The present invention provides a kind of chip-packaging structure and electronic equipment, chip-packaging structure includes: electronic chip, and multiple first pins are provided on the electronic chip；Printed circuit board is provided with packaging area corresponding with the electronic chip on the printed circuit board, and setting is multiple corresponding with first pin in the packaging area and the second pin that is electrically connected, and the second pin includes that multiple secret orders transmit pin；Multiple protection protrusions, the protection protrusion are set in the packaging area and are set between the second pin to protect secret order transmission pin.The present invention has the advantages that improve chip-packaging structure safety.
Description
Technical field
The present invention relates to electronic circuit technology field, in particular to a kind of chip-packaging structure and electronic equipment.
Background technique
In the prior art, it is provided with safety chip on the printed circuit board inside electronic equipment such as bank ATM, safety
Chip is connect with printed circuit board, and user carries out Password Input, Password Input signal warp by the button of pressing bank ATM
Safety chip is sent to printed circuit board and carries out the operation such as verifying, still, due between safety chip transmission and printed circuit board
There are larger gap, hacker can steal the encrypted message of bank-user by the larger gap, lead to privacy of user and property
There are major safety risks.
Summary of the invention
The main object of the present invention is to provide a kind of chip-packaging structure and electronic equipment, it is intended to solve prior art core
Piece encapsulation is collected together the security risk the problem of.
To achieve the above object, a kind of chip-packaging structure proposed by the present invention, comprising: electronic chip, the electronics core
On piece is provided with multiple first pins；Printed circuit board is provided on the printed circuit board corresponding with the electronic chip
Packaging area, setting is multiple corresponding with first pin in the packaging area and the second pin that is electrically connected, and described the
Two pins include multiple secret order transmission pins；Multiple protection protrusions, the protection protrusion are set in the packaging area and set
It is placed between the second pin to protect secret order transmission pin.
Preferably, multiple protection protrusions are at least located on the surrounding of each secret order transmission pin.
Preferably, the protection protrusion for being located on the surrounding of the secret order transmission pin is at least 4.
Preferably, the second pin is arranged in array, and multiple protection protruding rings are set to the second pin of outmost turns
Inside so that the line of multiple adjacent protection protrusions surrounds all multiple secret orders and transmits pins.
Preferably, the second pin is arranged in array, and is formed by rectangle in the line of 4 adjacent second pins
The protection protrusion is arranged in center.
Preferably, the protection protrusion includes the pad being set on the printed circuit board and is welded in the pad
On tin cream.
Preferably, the protection protrusion is in cylinder and/or cone.
Preferably, the second pin is circular electric contact point, and the diameter of the circular electric contact point is 0.4 millimeter, Tong Hanghuo
Spacing between the adjacent circular electric contact point of person's same column is 0.45 millimeter.
Preferably, it is described protection protrusion the printed circuit board the circular projection that is projected as, the circular projection it is straight
Diameter is the 1/5-4/5 of the circular electric contact point diameter.
In addition, to achieve the above object, the application also proposes a kind of electronic equipment, including chip package as described above
Structure.
The present invention is by being arranged the protection protrusion, the protection in the packaging area, between the second pin
Protrusion is convexly equipped on the printed circuit board, when the lawless peoples such as hacker attempt the conductive materials such as wire passing through the printing
Gap between circuit board and the electronic chip contacts the secret order transmission pin and steals user's Bank Account Number encrypted message etc.
When privacy of user, the protection protrusion plays barrier effect to conductive materials such as wires, makes the conductive materials such as wire can not
It is inserted into the gap and touches secret order transmission pin, to play protective action to secret order transmission pin, improve described
The safety of chip-packaging structure.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The structure shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of one embodiment of chip-packaging structure of the present invention；
Fig. 2 is the structural schematic diagram of one embodiment of electronic chip of the present invention；
Fig. 3 is the structural schematic diagram of one embodiment of printed circuit board of the present invention；
Fig. 4 is the structural schematic diagram of another embodiment of one embodiment of chip-packaging structure of the present invention；
Fig. 5 is the structural schematic diagram of another embodiment of printed circuit board of the present invention；
Fig. 6 is the structural schematic diagram of printed circuit board another embodiment of the present invention；
Fig. 7 is the structural schematic diagram of the another embodiment of printed circuit board of the present invention.
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiments of the present invention, instead of all the embodiments.Base
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
His embodiment, shall fall within the protection scope of the present invention.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute is only used in the embodiment of the present invention
In explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, if should
When particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being related to " first ", " second " etc. in the present invention is used for description purposes only, and should not be understood as referring to
Show or imply its relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " are defined as a result,
Two " feature can explicitly or implicitly include at least one of the features.In addition, the technical solution between each embodiment can
It to be combined with each other, but must be based on can be realized by those of ordinary skill in the art, when the combination of technical solution occurs
Conflicting or cannot achieve when, will be understood that the combination of this technical solution is not present, also not the present invention claims protection model
Within enclosing.
Please refer to Fig. 1-4, a kind of chip-packaging structure 100 proposed by the present invention, comprising: electronic chip 10, the electronics
Multiple first pins 11 are provided on chip 10；Printed circuit board 20 is provided with and the electronics on the printed circuit board 20
The corresponding packaging area 21 of chip 10, setting is multiple corresponding with first pin 11 in the packaging area 21 and is electrically connected
Second pin 22, and the second pin 22 includes that multiple secret orders transmit pin 221；Multiple protection protrusions 23, the protection are convex
Rise 23 be set in the packaging area 21 and be set between the second pin 22 with to the secret order transmit pin 221 into
Row protection.
In the present embodiment, the electronic chip 10 is preferably safety chip, and the electronic chip 10 is packaged in the print
It is electrically connected in the packaging area 21 of printed circuit board 20 with the printed circuit board 20, to realize electronic chip 10 and printed circuit board
Signal transmission between 20.Specifically, the bottom of the electronic chip 10 towards the printed circuit board 20 is provided with multiple
One pin 11, it is preferable that first pin 11 is arranged in array, so that multiple first pin 11 is uniform, adapting universal
Packing forms；Specifically, multiple and institute is provided on the packaging area 21 of the corresponding electronic chip 10 of the printed circuit board 20
The second pin 22 that the first pin 11 is corresponding and is electrically connected is stated, the first pin 11 is corresponded with second pin 22, alternatively, second
Than the first pin more than 11, extra second pin 22 can give over to spare the quantity of pin 22, pass through first pin 11 and second
Electrical connection between pin 22 realizes that the signal between electronic chip 10 and the printed circuit board 20 transmits.Specifically,
The second pin 22 includes that multiple secret orders transmit pin 221, and the secret order transmission pin 221 is used for transmission the privacy letter of user
Breath, such as bank account encrypted message.
Wherein, it refering to Fig. 4, is formed between 10 edge of electronic chip and the printed circuit board 20 and has the gap 30, it should
Gap 30 generates and has one fixed width, such as the gap 30 during the electronic chip 10 is assembled into printed circuit board 20
Width is 0.15 millimeter.The embodiment of the present invention multiple protection protrusions 23 of setting at least around secret order transmission pin 221,
Protection protrusion 23 is arranged in the packaging area 21, and is set between multiple second pins 22, and the protection
Protrusion 23 is formed from 20 surface projection of printed circuit board, and the relatively described printed circuit board 20 has certain altitude, such as the protection
The height of protrusion 23 is equal to 30 width of gap, and the height for 0.15mm or the protection protrusion 23 is wider than the gap 30
Spend it is smaller or slightly higher, such as the protection protrusion 23 height be 0.1-0.2mm.
In conclusion the present invention is by being arranged the protection in the packaging area 21, between the second pin 22
Protrusion 23, the protection protrusion 23 are convexly equipped on the printed circuit board 20, when the lawless peoples such as hacker are attempted wire etc.
Gap 30 of the conductive material across the printed circuit board 20 and the electronic chip 10 contacts the secret order transmission pin
221 when stealing the privacy of user such as user's Bank Account Number encrypted message, and the conductive materials such as raised 23 pairs of wires of the protection play
Barrier effect makes the conductive materials such as wire that can not be inserted into the gap 30 and touches secret order transmission pin 221, thus to described
Secret order transmission pin 221 plays protective action, improves the safety of the chip-packaging structure 100.
Preferably, refering to Fig. 3, the second pin 22 is arranged in array, and multiple protection protrusions 23 are located on outermost
The inside of the second pin 22 of circle is so that the line of multiple adjacent protection protrusions 23 surrounds all multiple secret orders and transmits pin
221。
In the present embodiment, the second pin 22 is arranged in array, and forms the row pin of multirow and the column pin of multiple row,
Line between multiple second pins 22 of outmost turns forms rectangle, it will be understood that from outside to inside, along the second row of number and secondary series
Multiple second pins 22 between line also form rectangle, and so on, will be formed in the packaging area 21 multiple to institute
State the different rectangle of multiple areas that the center of packaging area 21 is gathered.
In the present embodiment, multiple protection protrusions 23 are located on the inside of the second pin 22 of outmost turns, that is, more
Between the rectangle that a protection protrusion 23 is set to the rectangle of the outmost turns of the formation of second pin 22 and suitable number second encloses, and should
Line between multiple protection protrusions 23 is also formed rectangle (dotted portion in Fig. 3), the line of multiple adjacent protection protrusions 23
All multiple secret orders transmission pins 221 are surrounded, in this way, multiple protection raised 23 is in the row direction and column direction is to described close
Transmission pin 221 is enabled to play protective action.
It is appreciated that the multiple protection protrusion 23 can not only be formed in the outermost of the formation of second pin 22 refering to Fig. 5
Between the rectangle of circle and the rectangle enclosed along number second, also it can be set between the rectangle that any two second pin 22 is formed,
Alternatively, the protection protrusion 23 is respectively provided between the rectangle that adjacent second pin 22 is formed, to improve degree of protection.
Preferably, refering to Fig. 6, the second pin 22 is arranged in array, in the line institute of 4 adjacent second pins 22
The protection protrusion 23 is arranged in the center of the rectangle of formation.
In the present embodiment, the second pin 22 is divided into two rows and is divided into two column, and this second pin 22 connects
Line can be formed rectangle, and the protection protrusion 23 is set to the center of the rectangle, is set to the square in other words
Two cornerwise intersection positions of shape；Due to the generally circular in cross section electric contact of the second pin 22, in the row direction or arrange
On direction, the distance between adjacent second pin 22 is less than two cornerwise distances of the rectangle, therefore by the protection
Protrusion 23 is set to the center of the rectangle.It can increase what the protection protrusion 23 was occupied in the printed circuit board 20
Distance, even, the protection protrusion 23 is in the row direction or the projection of column direction can be overlapped with the second pin 22, this
When, which extends to the interval region between colleague or two second pins 22 of same column.
Further, the protection protrusion 23 is set to the center of the rectangle, that is, the same protection is convex
Rise 23 be both set to just it is capable be also disposed between the column and the column between row, the protection protrusion 23 is just blocked capable and row
Between the channel passed through for wire, meanwhile, the channel passed through for wire between the column and the column is blocked, to prevent wire
Equal conductive materials touch secret order transmission pin 221.
Preferably, refering to Fig. 7, multiple protection protrusions 23 are at least located on each secret order transmission pin 221
Surrounding.
In the present embodiment, multiple protection protrusions 23 are at least located on the four of each secret order transmission pin 221
Week avoids the lawless peoples such as hacker in multiple sides to play protective action to secret order transmission pin 221 in all directions
Upward common sense touches the secret order transmission pin 221.
Preferably, refering to Fig. 7, the protection protrusion 23 for being located on the surrounding of the secret order transmission pin 221 is at least 4.
In the present embodiment, when the second pin 22 (wherein, including multiple secret orders transmit pin 221) is arranged in array
When, it is only necessary to protect 4 protrusions in the setting of the surrounding of each secret order transmission pin 221, can prevent from blocking line direction or
Wire on person's column direction reaches the channel of the secret order transmission pin 221, for example, 14 of corresponding bank card cash dispenser are pressed
Key is provided with 14 secret orders transmission pins 221, at this point, to set 4 protection convex for ring around 14 secret orders transmission pins 221
23 are played, protective action can be played on line direction and column direction, at this point, the position of other non-secret order transmission pins 221 can
To be not provided with the protection protrusion 23, thus reduce to form consumptive material used in protection protrusion 23, meanwhile, simplify and generates technique.
Preferably, the protection protrusion 23 includes the pad being set on the printed circuit board 20 and is welded in described
Tin cream on pad.
In the present embodiment, it during forming second pin 22 on the printed circuit board 20, is formed together
The protection protrusion 23 forms the pad of the protection protrusion 23 in the same technique for forming the second pin 22, then leads to
It crosses the welding tin cream on the pad and forms the protection protrusion 23.Preferably, the protection protrusion 23 is in cylinder and/or cone
Body.
Preferably, the second pin 22 is circular electric contact point, and the diameter of the circular electric contact point is 0.4 millimeter, colleague
Or the spacing between the adjacent circular electric contact point of same column is 0.45 millimeter.
In the present embodiment, the diameter of the circular electric contact point is 0.4 millimeter, is increased and the contact of first pin 11
Area improves the stability that second pin 22 is electrically connected with the first pin 11；Meanwhile the adjacent circle of colleague or same column
Spacing between electric contact is 0.45 millimeter, if first pin 11 is also 0.4 millimeter of diameter of circular electric contact point, at this point,
The diameter of first pin 11 be less than adjacent second pin 22 between spacing, at this point it is possible to prevent same first pin 11 across
Being connected between two adjacent adjacent second pins 22 two leads to short circuit, meanwhile, between the adjacent circular electric contact point
Spacing be 0.45 millimeter, also make protection protrusion 23 with sufficiently large placement space.
Preferably, be projected as circular projection of the protection protrusion 23 in the printed circuit board 20, the circular projection
Diameter be the circular electric contact point diameter 1/5-4/5.
In the present embodiment, the protection protrusion 23 is projected as circular projection in the printed circuit board 20, that is, not
It is any shape by the tin cream on the pad, at least described pad is circular pad, and the tin cream and the tin cream are described
The projection of printed circuit board 20 is also necessarily circular projection, and the diameter of the circular projection is the 1/ of the circular electric contact point diameter
, that is, the circular projection is small than the area of the circular electric contact point (second pin 22), when the protection protrusion
23 when being set to the center for the rectangle that 22 line of second pin is formed, and the protection raised 23 is drawn with the second of surrounding
Foot 22 does not contact and avoids short circuit between protection protrusion 23 and second pin 22, and protection protrusion 23 can be in line direction
And protective action is played on column direction.
In addition, to achieve the above object, the application also proposes a kind of electronic equipment, including chip package as described above
Structure 100.
In the present embodiment, the electronic equipment includes but is not limited to bank ATM, since the electronic equipment includes
Above-mentioned chip-packaging structure 100, therefore, at least with the beneficial effect of above-mentioned chip-packaging structure 100, herein no longer
It repeats.
The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all at this
Under the inventive concept of invention, using equivalent structure transformation made by description of the invention and accompanying drawing content, or directly/use indirectly
It is included in other related technical areas in scope of patent protection of the invention.
Claims (10)
1. a kind of chip-packaging structure characterized by comprising
Electronic chip is provided with multiple first pins on the electronic chip；
Printed circuit board is provided with packaging area corresponding with the electronic chip, the encapsulation region on the printed circuit board
Multiple corresponding with first pin and electrical connection second pin is set in domain, and the second pin includes that multiple secret orders pass
Defeated pin；
Multiple protection protrusions, the protection protrusion are set in the packaging area and are set between the second pin with right
The secret order transmission pin is protected.
2. chip-packaging structure according to claim 1, which is characterized in that multiple protection protrusions are at least located on every
The surrounding of a secret order transmission pin.
3. chip-packaging structure according to claim 2, which is characterized in that be located on the surrounding of the secret order transmission pin
Protection protrusion be at least 4.
4. chip-packaging structure according to claim 1, which is characterized in that the second pin is arranged in array, multiple
The protection protruding ring is set to the inside of the second pin of outmost turns so that the line encirclement of multiple adjacent protection protrusions is all
Multiple secret orders transmit pin.
5. chip-packaging structure according to claim 1, which is characterized in that the second pin is arranged in array, in phase
The protection protrusion is arranged in the center that the line of 4 adjacent second pins is formed by rectangle.
6. chip-packaging structure according to claim 1-5, which is characterized in that the protection protrusion includes setting
In the pad on the printed circuit board and the tin cream being welded on the pad.
7. chip-packaging structure according to claim 1-5, which is characterized in that the protection protrusion is in cylinder
And/or cone.
8. chip-packaging structure according to claim 1-5, which is characterized in that the second pin is circular electric
Contact, the diameter of the circular electric contact point are 0.4 millimeter, the spacing between colleague or the adjacent circular electric contact point of same column
It is 0.45 millimeter.
9. chip-packaging structure according to claim 8, which is characterized in that the protection protrusion is in the printed circuit board
Be projected as circular projection, the diameter of the circular projection is the 1/5-4/5 of the circular electric contact point diameter.
10. a kind of electronic equipment, which is characterized in that including such as described in any item chip-packaging structures of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811479211.2A CN109671678B (en) | 2018-12-05 | 2018-12-05 | Chip packaging structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811479211.2A CN109671678B (en) | 2018-12-05 | 2018-12-05 | Chip packaging structure and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109671678A true CN109671678A (en) | 2019-04-23 |
| CN109671678B CN109671678B (en) | 2020-09-15 |
Family
ID=66144637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811479211.2A Active CN109671678B (en) | 2018-12-05 | 2018-12-05 | Chip packaging structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109671678B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113987991A (en) * | 2021-09-29 | 2022-01-28 | 展讯半导体(南京)有限公司 | Signal transmission device and electronic equipment |
| CN115052420A (en) * | 2022-06-17 | 2022-09-13 | 河南驰诚电气股份有限公司 | Circuit board with electronic circuit laminated design and design method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203503049U (en) * | 2013-09-10 | 2014-03-26 | 深圳市九思泰达技术有限公司 | Novel anti-spying code keyboard and anti-spying structure thereof |
| CN106339700A (en) * | 2016-10-19 | 2017-01-18 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and manufacturing method thereof and electronic equipment |
| JP2017151845A (en) * | 2016-02-26 | 2017-08-31 | 沖電気工業株式会社 | Input device |
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2018
- 2018-12-05 CN CN201811479211.2A patent/CN109671678B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203503049U (en) * | 2013-09-10 | 2014-03-26 | 深圳市九思泰达技术有限公司 | Novel anti-spying code keyboard and anti-spying structure thereof |
| JP2017151845A (en) * | 2016-02-26 | 2017-08-31 | 沖電気工業株式会社 | Input device |
| CN106339700A (en) * | 2016-10-19 | 2017-01-18 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module group and manufacturing method thereof and electronic equipment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113987991A (en) * | 2021-09-29 | 2022-01-28 | 展讯半导体(南京)有限公司 | Signal transmission device and electronic equipment |
| CN115052420A (en) * | 2022-06-17 | 2022-09-13 | 河南驰诚电气股份有限公司 | Circuit board with electronic circuit laminated design and design method thereof |
| CN115052420B (en) * | 2022-06-17 | 2024-01-19 | 河南驰诚电气股份有限公司 | Circuit board for electronic circuit lamination design and design method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109671678B (en) | 2020-09-15 |
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