CN109630921A - 一种背部涂覆石墨烯的柔性灯丝基板及其制备工艺 - Google Patents
一种背部涂覆石墨烯的柔性灯丝基板及其制备工艺 Download PDFInfo
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Abstract
一种背部涂覆石墨烯的柔性灯丝,包括基板和倒装在基板顶部的若干LED柔性灯丝条,所述基板的底部涂覆有石墨烯膜。一种背部涂覆石墨烯的柔性灯丝的制备工艺,包括五个步骤,将石墨烯分散到乙醇水溶液中,用真空过滤的方式将分散好的石墨烯过滤到滤膜上然后将滤膜置于去离子水中静置12小时,再将滤膜贴合到基板的底部,最后将滤膜置于丙酮溶液中溶去滤膜,即完成柔性灯丝基板的制备工艺。本发明步骤简单,操作方便,使用寿命长,能将石墨烯与柔性灯丝基板完美贴合不脱落,增强柔性灯丝的散热,可实现高功率,高光效的LED灯丝的制备。
Description
技术领域
本发明涉及LED照明,特别是一种背部涂覆石墨烯的柔性灯丝基板及其制备工艺。
背景技术
由于LED灯具具有发光均匀、节能的特点,目前正逐渐取代传统的钨丝和卤素灯具,成为灯具界的新宠。LED灯在点亮时,其发光亮度受功率瓦数的限制,瓦数小的话,发光亮度有限,若要提高发光亮度,就要增加瓦数,相应的,需要增加发光光源和泡壳的面积;同时,随着瓦数的增加,如何散热成为一个问题,因为功率越大,散热就越大。实际应用当中,很多厂家为了达到平衡,会在增加功率、增加发光光源及泡壳面积的同时,增加散热结构,但这无疑会大大增加灯具的成本,制造难度也大大增加。。
柔性灯丝可以任意造型,焊线可利用倒装工艺解决,柔性灯丝一般为条状的灯丝,柔性灯丝从基板上剪切得到,但由于柔性倒装灯丝的散热能力偏弱,难以实现大功率的驱动,故无法得到高光效。
石墨烯材料具有比表面积大,热导率高等特点,但目前还没有一种有效的方法将石墨烯贴合用于柔性倒装灯丝基板。
发明内容
有鉴于此,本发明提供了一种背部涂覆石墨烯的柔性灯丝基板及其制备工艺,以解决上述问题。
一种背部涂覆石墨烯的柔性灯丝基板,包括基板,所述基板上呈矩阵分布开设有若干条形分隔槽,所述相邻的条形分隔槽间沿基板的长度方向间隔设置有若干LED芯片,所述基板的背面涂覆有石墨烯膜。
所述基板为铝制基板。。
所述LED芯片上涂覆有胶体层。
所述基板的宽度方向的两侧位于相邻的条形分隔槽间设有金属连接件。
所述LED芯片通过串联或者并联方式连接形成柔性灯丝,多条柔性灯丝通过串联或并联或串并联方式连接,形成灯丝串的总输入电压范围为120-170V或240-270V或350-370V中的任意一种。
一种背部涂覆石墨烯的柔性灯丝的制备工艺,步骤为:
步骤S1、提供石墨烯、乙醇、水、丙酮溶液、滤膜、布氏漏斗和基板;
步骤S2、将乙醇和水等比例均匀混合形成乙醇水溶液,将石墨烯分散于配好的乙醇水溶液中;
步骤S3、使用布氏漏斗,采用真空过滤的方式将分散好的石墨烯过滤在滤膜上;
步骤S4、采用RO反渗透将水制备成去离子水,并将滤膜至于去离子水中,静置12小时;
步骤S5、将静置后的滤膜贴合到基板的背部,再将基板置于丙酮溶液中,溶去滤膜,得到背面涂覆有石墨烯膜的基板。
进一步地,所述滤膜为孔径为22μm的纤维素膜。
进一步地,所述滤膜通过粘结剂与基板贴合。
进一步地,所述滤膜与基板通过直接压合贴合。
与现有技术相比,本发明的一种背部涂覆石墨烯的柔性灯丝基板及其制备工艺,步骤简单,操作方便,使用寿命长,能将石墨烯与柔性灯丝基板完美贴合不脱落,增强柔性灯丝的散热,可实现高功率,高光效的LED灯丝的制备。
附图说明
以下结合附图描述本发明的实施例,其中:
图1为本发明提供的一种背部涂覆石墨烯的柔性灯丝基板及其制备工艺的基板的结构示意图。
图2为本发明提供的一种背部涂覆石墨烯的柔性灯丝基板及其制备工艺的柔性灯丝的结构示意图。
图3为本发明提供的一种背部涂覆石墨烯的柔性灯丝基板及其制备工艺的柔性灯丝的侧面结构示意图。
其中,10、基板;12、石墨烯膜;13、LED芯片;14、胶体层;15、金属连接件;16、条形分隔槽;17、柔性灯丝。
具体实施方式
以下基于附图对本发明的具体实施例进行进一步详细说明。应当理解的是,此处对本发明实施例的说明并不用于限定本发明的保护范围。
请参考图1至图3,其为本发明提供的一种背部涂覆石墨烯的柔性灯丝基板,包括基板10,所述基板10上呈矩阵分布开设有若干条形分隔槽16,所述相邻的条形分隔槽16间沿基板10的长度方向间隔设置有若干LED芯片13,所述基板10的背面涂覆有石墨烯膜12。
所述基板10为铝制基板。
所述LED芯片13上涂覆有胶体层14。优选地,可以根据用户需要涂覆或者不涂覆胶体,所用胶体为荧光胶体或者透明胶体,胶体层14可以通过点胶机定点点胶或者通过喷涂设备将基板10的正面或者背面全部涂覆。
所述基板10的宽度方向的两侧位于相邻的条形分隔槽间设有金属连接件15。金属连接件15用于连接电源使LED芯片13发光。
所述LED芯片通过串联或者并联方式连接形成柔性灯丝17,多条柔性灯丝17通过串联或并联或串并联方式连接,形成灯丝串的总输入电压范围为120-170V或240-270V或350-370V中的任意一种。其中,柔性灯丝17从基板10上剪取得到,所得的柔性灯丝通过焊接的方式进行连接。
一种背部涂覆石墨烯的柔性灯丝基板的制备工艺,所述基板10的顶部倒装有若干LED柔性灯丝条11,所述基板10的底部附着有石墨烯膜12,其制备工艺的步骤为:
步骤S1、提供石墨烯、乙醇、水、丙酮溶液、滤膜、布氏漏斗和基板10;
步骤S2、将乙醇和水等比例均匀混合形成乙醇水溶液,将石墨烯分散于配好的乙醇水溶液中;
步骤S3、使用布氏漏斗,采用真空过滤的方式将分散好的石墨烯过滤在滤膜上;
步骤S4、采用RO反渗透将水制备成去离子水,并将滤膜至于去离子水中,静置12小时;
步骤S5、将静置后的滤膜贴合到基板10的背部,再将基板10置于丙酮溶液中,溶去滤膜,得到背面涂覆有石墨烯膜12的基板10。
所述滤膜为孔径为22μm的纤维素膜。
所述滤膜通过粘结剂与基板10贴合。
所述滤膜与基板10通过直接压合贴合。
本实施方式中,在基板10上冲压出LED芯片槽,将LED芯片13固定于LED芯片槽内,此工序可在涂覆石墨烯膜12之前或之后均可实施。
与现有技术相比,本发明的一种背部涂覆石墨烯的柔性灯丝基板及其制备工艺,步骤简单,操作方便,使用寿命长,能将石墨烯与柔性灯丝基板完美贴合不脱落,增强柔性灯丝的散热,可实现高功率,高光效的LED灯丝的制备。
以上仅为本发明的较佳实施例,并不用于局限本发明的保护范围,任何在本发明精神内的修改、等同替换或改进等,都涵盖在本发明的权利要求范围内。
Claims (9)
1.一种背部涂覆石墨烯的柔性灯丝基板,其特征在于:包括基板(10),所述基板(10)上呈矩阵分布开设有若干条形分隔槽(16),所述相邻的条形分隔槽(16)间沿基板(10)的长度方向间隔设置有若干LED芯片(13),所述基板(10)的背面涂覆有石墨烯膜(12)。
2.一种背部涂覆石墨烯的柔性灯丝基板,其特征在于:所述基板(10)为铝制基板。
3.一种背部涂覆石墨烯的柔性灯丝基板,其特征在于:所述LED芯片(13)上涂覆有胶体层(14)。
4.一种背部涂覆石墨烯的柔性灯丝基板,其特征在于:所述基板(10)的宽度方向的两侧位于相邻的条形分隔槽间设有金属连接件(15)。
5.一种背部涂覆石墨烯的柔性灯丝基板,其特征在于:所述LED芯片通过串联或者并联方式连接形成柔性灯丝(17),多条柔性灯丝(17)通过串联或并联或串并联方式连接,形成灯丝串的总输入电压范围为120-170V或240-270V或350-370V中的任意一种。
6.一种背部涂覆石墨烯的柔性灯丝基板的制备工艺,其特征在于:包括以下步骤:
步骤S1、提供石墨烯、乙醇、水、丙酮溶液、滤膜、布氏漏斗和基板(10);
步骤S2、将乙醇和水等比例均匀混合形成乙醇水溶液,将石墨烯分散于配好的乙醇水溶液中;
步骤S3、使用布氏漏斗,采用真空过滤的方式将分散好的石墨烯过滤在滤膜上;
步骤S4、采用RO反渗透将水制备成去离子水,并将滤膜至于去离子水中,静置12小时。
7.步骤S5、将静置后的滤膜贴合到基板(10)的背部,再将基板(10)置于丙酮溶液中,溶去滤膜,得到背面涂覆有石墨烯膜(12)的基板(10)。如权利要求1所述的一种背部涂覆石墨烯的柔性灯丝基板的制备工艺,其特征在于:所述滤膜为孔径为22μm的纤维素膜。
8.如权利要求1所述的一种背部涂覆石墨烯的柔性灯丝基板的制备工艺,其特征在于:所述滤膜通过粘结剂与基板(10)贴合。
9.如权利要求1所述的一种背部涂覆石墨烯的柔性灯丝基板的制备工艺,其特征在于:所述滤膜与基板(10)通过直接压合贴合。
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114729728A (zh) * | 2019-11-21 | 2022-07-08 | 昕诺飞控股有限公司 | 发光设备 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102290477A (zh) * | 2011-09-13 | 2011-12-21 | 青岛科技大学 | 一种基于石墨烯pn结的光伏电池及其制备方法 |
CN202210535U (zh) * | 2011-07-15 | 2012-05-02 | 广东德豪润达电气股份有限公司 | Led用柔性线路板 |
CN104297301A (zh) * | 2014-10-20 | 2015-01-21 | 薛洁 | 基于聚苯胺/石墨烯纳米带/二氧化硅/硅的氨气传感器 |
GB2539190A (en) * | 2015-06-05 | 2016-12-14 | Graphene Lighting Plc | LED light bulb simultaneously using as nightlight |
CN206488097U (zh) * | 2017-03-06 | 2017-09-12 | 厦门乾照照明有限公司 | 一种led线条灯及其灯板 |
CN108682738A (zh) * | 2018-04-16 | 2018-10-19 | 中国科学院宁波材料技术与工程研究所 | 一种全碳忆阻器及其制备方法 |
CN208154130U (zh) * | 2017-12-29 | 2018-11-27 | Bgt材料有限公司 | Led灯丝灯泡 |
CN108910863A (zh) * | 2018-06-26 | 2018-11-30 | 中科钢研节能科技有限公司 | 一种智能石墨烯导热膜及其制备方法 |
-
2018
- 2018-12-19 CN CN201811554120.0A patent/CN109630921A/zh active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202210535U (zh) * | 2011-07-15 | 2012-05-02 | 广东德豪润达电气股份有限公司 | Led用柔性线路板 |
CN102290477A (zh) * | 2011-09-13 | 2011-12-21 | 青岛科技大学 | 一种基于石墨烯pn结的光伏电池及其制备方法 |
CN104297301A (zh) * | 2014-10-20 | 2015-01-21 | 薛洁 | 基于聚苯胺/石墨烯纳米带/二氧化硅/硅的氨气传感器 |
GB2539190A (en) * | 2015-06-05 | 2016-12-14 | Graphene Lighting Plc | LED light bulb simultaneously using as nightlight |
CN206488097U (zh) * | 2017-03-06 | 2017-09-12 | 厦门乾照照明有限公司 | 一种led线条灯及其灯板 |
CN208154130U (zh) * | 2017-12-29 | 2018-11-27 | Bgt材料有限公司 | Led灯丝灯泡 |
CN108682738A (zh) * | 2018-04-16 | 2018-10-19 | 中国科学院宁波材料技术与工程研究所 | 一种全碳忆阻器及其制备方法 |
CN108910863A (zh) * | 2018-06-26 | 2018-11-30 | 中科钢研节能科技有限公司 | 一种智能石墨烯导热膜及其制备方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114729728A (zh) * | 2019-11-21 | 2022-07-08 | 昕诺飞控股有限公司 | 发光设备 |
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