CN109630921A - A kind of graphene coated flexible filament substrate in back and its preparation process - Google Patents
A kind of graphene coated flexible filament substrate in back and its preparation process Download PDFInfo
- Publication number
- CN109630921A CN109630921A CN201811554120.0A CN201811554120A CN109630921A CN 109630921 A CN109630921 A CN 109630921A CN 201811554120 A CN201811554120 A CN 201811554120A CN 109630921 A CN109630921 A CN 109630921A
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- Prior art keywords
- substrate
- graphene
- flexible filament
- filter membrane
- preparation process
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
A kind of graphene coated flexible filament in back, including substrate and several LED flexible light strands for being inverted in substrate top, the bottom of the substrate is coated with graphene film.A kind of preparation process of the graphene coated flexible filament in back, including five steps, by graphene dispersion into ethanol water, scattered graphene is filled on filter membrane and then filter membrane is placed in deionized water with the mode of vacuum filter and stands 12 hours, filter membrane is fitted to the bottom of substrate again, finally filter membrane is placed in acetone soln and dissolves filter membrane, that is, completes the preparation process of flexible filament substrate.Step of the present invention is simple, easy to operate, long service life, graphene can be bonded with flexible filament substrate perfection and not fallen off, and enhances the heat dissipation of flexible filament, it can be achieved that high power, the preparation of the LED filament of high photosynthetic efficiency.
Description
Technical field
The present invention relates to LED illumination, the graphene coated flexible filament substrate in especially a kind of back and its preparation process.
Background technique
Since LED lamp has the characteristics that the uniform, energy conservation that shines, traditional tungsten wire and halogen lamp are just being gradually replaced at present
Tool, becomes the new lover of lamps and lanterns circle.When lighting, light emission luminance is limited LED light by power wattage, if wattage is small, is shone
Limited brightness, to improve light emission luminance it is necessary to increase wattage, correspondingly, needing to increase the area of illuminating source and blister；Together
When, with the increase of wattage, how to radiate as a problem, because power is bigger, radiates bigger.In practical application,
Many producers can increase radiator structure while increasing power, increasing illuminating source and blister area to reach balance,
But this can undoubtedly greatly increase the cost of lamps and lanterns, and manufacture difficulty also greatly increases.
Flexible filament can any moulding, bonding wire can be solved using reverse installation process, and flexible filament be generally the filament of strip,
Flexible filament is sheared from substrate and is obtained, but since the heat-sinking capability of flexible upside-down mounting filament is on the weak side, it is difficult to realize powerful drive
It is dynamic, therefore it is unable to get high photosynthetic efficiency.
The features such as grapheme material has large specific surface area, and thermal conductivity is high, but there is presently no a kind of effective methods to incite somebody to action
Graphene fitting is for flexible upside-down mounting filament substrate.
Summary of the invention
In view of this, the present invention provides a kind of graphene coated flexible filament substrate in back and its preparation process, with
It solves the above problems.
A kind of graphene coated flexible filament substrate in back, including substrate are distributed on the substrate in matrix and are equipped with
Several bar shaped separation troughs, the length direction between the adjacent bar shaped separation trough along substrate are arranged at intervals with several LED chips, institute
The backside coating for stating substrate has graphene film.
The substrate is aluminum base plate.
Colloid layer is coated in the LED chip.
The two sides of the width direction of the substrate are equipped with metal connecting piece between adjacent bar shaped separation trough.
The LED chip connects to form flexible filament by mode in series or in parallel, and a plurality of flexibility filament passes through series connection
Or the connection of in parallel or series-parallel system, the total input voltage range for forming filament string is 120-170V or 240-270V or 350-
Any one in 370V.
A kind of preparation process of the graphene coated flexible filament in back, step are as follows:
Step S1, graphene, ethyl alcohol, water, acetone soln, filter membrane, Buchner funnel and substrate are provided；
Step S2, second alcohol and water equal proportion is uniformly mixed to form ethanol water, disperses graphene in the second prepared
In alcohol solution；
Step S3, using Buchner funnel, by the way of vacuum filter by the filtering of scattered graphene on filter membrane；
Step S4, water is prepared into deionized water using RO is reverse osmosis, and it is small is stood 12 as in deionized water for filter membrane
When；
Step S5, the filter membrane after standing is fitted to the back of substrate, then substrate is placed in acetone soln, dissolves filter
Film obtains the substrate that backside coating has graphene film.
Further, the filter membrane is the cellulose membrane that aperture is 22 μm.
Further, the filter membrane is bonded by binder with substrate.
Further, the filter membrane is bonded with substrate by directly pressing.
Compared with prior art, a kind of graphene coated flexible filament substrate in back of the invention and its preparation process,
Step is simple, easy to operate, long service life, graphene can be bonded with flexible filament substrate perfection and not fallen off, enhancing is flexible
The heat dissipation of filament is, it can be achieved that high power, the preparation of the LED filament of high photosynthetic efficiency.
Detailed description of the invention
The embodiment of the present invention is described below in conjunction with attached drawing, in which:
Fig. 1 is a kind of substrate of the graphene coated flexible filament substrate and its preparation process in back provided by the invention
Structural schematic diagram.
Fig. 2 is a kind of flexible light of the graphene coated flexible filament substrate and its preparation process in back provided by the invention
The structural schematic diagram of silk.
Fig. 3 is a kind of flexible light of the graphene coated flexible filament substrate and its preparation process in back provided by the invention
The side structure schematic diagram of silk.
Wherein, 10, substrate；12, graphene film；13, LED chip；14, colloid layer；15, metal connecting piece；16, bar shaped point
Separate slot；17, flexible filament.
Specific embodiment
Specific embodiments of the present invention are further elaborated below based on attached drawing.It should be understood that herein
The explanation of the embodiment of the present invention is not intended to limit the scope of protection of the present invention.
Fig. 1 to Fig. 3 is please referred to, is a kind of graphene coated flexible filament substrate in back provided by the invention, including
Substrate 10 is distributed equipped with several bar shaped separation troughs 16 on the substrate 10 in matrix, between the adjacent bar shaped separation trough 16
Several LED chips 13 are arranged at intervals with along the length direction of substrate 10, the backside coating of the substrate 10 has graphene film 12.
The substrate 10 is aluminum base plate.
Colloid layer 14 is coated in the LED chip 13.Preferably, it can be needed to coat or be not coated by glue according to user
Body, colloid used are that perhaps transparent colloid colloid layer 14 can pinpoint dispensing by dispenser or pass through spraying fluorescent colloid
Equipment all coats in the front of substrate 10 or the back side.
The two sides of the width direction of the substrate 10 are equipped with metal connecting piece 15 between adjacent bar shaped separation trough.Metal
Connector 15 makes LED chip 13 shine for connecting power supply.
The LED chip connects to form flexible filament 17 by mode in series or in parallel, and a plurality of flexibility filament 17 passes through
Serial or parallel connection or series-parallel system connection, is formed total input voltage range of filament string for 120-170V or 240-270V or
Any one in 350-370V.Wherein, flexible filament 17 is obtained from clip on substrate 10, and resulting flexibility filament passes through welding
Mode be attached.
A kind of preparation process of the graphene coated flexible filament substrate in back, the top upside-down mounting of the substrate 10 has several
The step of LED flexible light strand 11, the bottom of the substrate 10 are attached with graphene film 12, preparation process are as follows:
Step S1, graphene, ethyl alcohol, water, acetone soln, filter membrane, Buchner funnel and substrate 10 are provided；
Step S2, second alcohol and water equal proportion is uniformly mixed to form ethanol water, disperses graphene in the second prepared
In alcohol solution；
Step S3, using Buchner funnel, by the way of vacuum filter by the filtering of scattered graphene on filter membrane；
Step S4, water is prepared into deionized water using RO is reverse osmosis, and it is small is stood 12 as in deionized water for filter membrane
When；
Step S5, the filter membrane after standing is fitted to the back of substrate 10, then substrate 10 is placed in acetone soln, is dissolved
Filter membrane obtains the substrate 10 that backside coating has graphene film 12.
The filter membrane is the cellulose membrane that aperture is 22 μm.
The filter membrane is bonded by binder with substrate 10.
The filter membrane is bonded with substrate 10 by directly pressing.
In present embodiment, LED core film trap is stamped out on the substrate 10, and LED chip 13 is fixed in LED core film trap,
This process can be implemented before or after graphene coated film 12.
Compared with prior art, a kind of graphene coated flexible filament substrate in back of the invention and its preparation process,
Step is simple, easy to operate, long service life, graphene can be bonded with flexible filament substrate perfection and not fallen off, enhancing is flexible
The heat dissipation of filament is, it can be achieved that high power, the preparation of the LED filament of high photosynthetic efficiency.
The foregoing is merely a prefered embodiment of the invention, is not used to limitation protection scope of the present invention, any in the present invention
Modification, equivalent replacement or improvement in spirit etc., all cover in scope of the presently claimed invention.
Claims (9)
1. a kind of graphene coated flexible filament substrate in back, it is characterised in that: including substrate (10), on the substrate (10)
It is distributed in matrix equipped with several bar shaped separation troughs (16), along the length of substrate (10) between the adjacent bar shaped separation trough (16)
Direction is arranged at intervals with several LED chips (13), and the backside coating of the substrate (10) has graphene film (12).
2. a kind of graphene coated flexible filament substrate in back, it is characterised in that: the substrate (10) is aluminum base plate.
3. a kind of graphene coated flexible filament substrate in back, it is characterised in that: be coated with colloid on the LED chip (13)
Layer (14).
4. a kind of graphene coated flexible filament substrate in back, it is characterised in that: the two of the width direction of the substrate (10)
Side is equipped with metal connecting piece (15) between adjacent bar shaped separation trough.
5. a kind of graphene coated flexible filament substrate in back, it is characterised in that: the LED chip passes through in series or in parallel
Mode connects to be formed flexible filament (17), and a plurality of flexibility filament (17) is connected by serial or parallel connection or series-parallel system, is formed
Total input voltage range of filament string is any one in 120-170V or 240-270V or 350-370V.
6. a kind of preparation process of the graphene coated flexible filament substrate in back, it is characterised in that: the following steps are included:
Step S1, graphene, ethyl alcohol, water, acetone soln, filter membrane, Buchner funnel and substrate (10) are provided；
Step S2, second alcohol and water equal proportion is uniformly mixed to form ethanol water, disperses graphene in the ethanol water prepared
In solution；
Step S3, using Buchner funnel, by the way of vacuum filter by the filtering of scattered graphene on filter membrane；
Step S4, water is prepared into deionized water using RO is reverse osmosis, and filter membrane is stood 12 hours as in deionized water.
7. step S5, the back that the filter membrane after standing is fitted to substrate (10), then substrate (10) is placed in acetone soln, it is molten
Filter membrane is removed, the substrate (10) that backside coating there are graphene film (12) is obtained.A kind of back as described in claim 1 coats graphite
The preparation process of the flexible filament substrate of alkene, it is characterised in that: the filter membrane is the cellulose membrane that aperture is 22 μm.
8. a kind of preparation process of the graphene coated flexible filament substrate in back as described in claim 1, it is characterised in that:
The filter membrane is bonded by binder with substrate (10).
9. a kind of preparation process of the graphene coated flexible filament substrate in back as described in claim 1, it is characterised in that:
The filter membrane is bonded with substrate (10) by directly pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811554120.0A CN109630921A (en) | 2018-12-19 | 2018-12-19 | A kind of graphene coated flexible filament substrate in back and its preparation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811554120.0A CN109630921A (en) | 2018-12-19 | 2018-12-19 | A kind of graphene coated flexible filament substrate in back and its preparation process |
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| Publication Number | Publication Date |
|---|---|
| CN109630921A true CN109630921A (en) | 2019-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811554120.0A Pending CN109630921A (en) | 2018-12-19 | 2018-12-19 | A kind of graphene coated flexible filament substrate in back and its preparation process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114729728A (en) * | 2019-11-21 | 2022-07-08 | 昕诺飞控股有限公司 | Light emitting device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102290477A (en) * | 2011-09-13 | 2011-12-21 | 青岛科技大学 | Photovoltaic cell based on graphene PN junction and preparation method thereof |
| CN202210535U (en) * | 2011-07-15 | 2012-05-02 | 广东德豪润达电气股份有限公司 | Flexible circuit board for LED |
| CN104297301A (en) * | 2014-10-20 | 2015-01-21 | 薛洁 | Ammonia gas sensor based on polyaniline/graphene nanoribbons/silicon dioxide/silicon |
| GB2539190A (en) * | 2015-06-05 | 2016-12-14 | Graphene Lighting Plc | LED light bulb simultaneously using as nightlight |
| CN206488097U (en) * | 2017-03-06 | 2017-09-12 | 厦门乾照照明有限公司 | A kind of LED line and its lamp plate |
| CN108682738A (en) * | 2018-04-16 | 2018-10-19 | 中国科学院宁波材料技术与工程研究所 | A kind of full carbon memristor and preparation method thereof |
| CN208154130U (en) * | 2017-12-29 | 2018-11-27 | Bgt材料有限公司 | LED filament light bulb |
| CN108910863A (en) * | 2018-06-26 | 2018-11-30 | 中科钢研节能科技有限公司 | A kind of intelligence graphene heat conducting film and preparation method thereof |
-
2018
- 2018-12-19 CN CN201811554120.0A patent/CN109630921A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202210535U (en) * | 2011-07-15 | 2012-05-02 | 广东德豪润达电气股份有限公司 | Flexible circuit board for LED |
| CN102290477A (en) * | 2011-09-13 | 2011-12-21 | 青岛科技大学 | Photovoltaic cell based on graphene PN junction and preparation method thereof |
| CN104297301A (en) * | 2014-10-20 | 2015-01-21 | 薛洁 | Ammonia gas sensor based on polyaniline/graphene nanoribbons/silicon dioxide/silicon |
| GB2539190A (en) * | 2015-06-05 | 2016-12-14 | Graphene Lighting Plc | LED light bulb simultaneously using as nightlight |
| CN206488097U (en) * | 2017-03-06 | 2017-09-12 | 厦门乾照照明有限公司 | A kind of LED line and its lamp plate |
| CN208154130U (en) * | 2017-12-29 | 2018-11-27 | Bgt材料有限公司 | LED filament light bulb |
| CN108682738A (en) * | 2018-04-16 | 2018-10-19 | 中国科学院宁波材料技术与工程研究所 | A kind of full carbon memristor and preparation method thereof |
| CN108910863A (en) * | 2018-06-26 | 2018-11-30 | 中科钢研节能科技有限公司 | A kind of intelligence graphene heat conducting film and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114729728A (en) * | 2019-11-21 | 2022-07-08 | 昕诺飞控股有限公司 | Light emitting device |
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Application publication date: 20190416 |