CN109623172A - A kind of laser cutting method and device of optical filter - Google Patents
A kind of laser cutting method and device of optical filter Download PDFInfo
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- CN109623172A CN109623172A CN201910099113.4A CN201910099113A CN109623172A CN 109623172 A CN109623172 A CN 109623172A CN 201910099113 A CN201910099113 A CN 201910099113A CN 109623172 A CN109623172 A CN 109623172A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of laser cutting method of optical filter and device, described device includes: ultrafast laser, beam shaping mould group, focusing objective len, vision inspection apparatus and motion platform；Vision inspection apparatus is located at focusing objective len top, motion platform be located at focusing objective len lower part for carry to optical filter, focusing objective len for vision inspection apparatus image-forming objective lens；Ultrafast laser issues ultra-short pulse laser beam incident beam sizing die group, the incident focusing objective len after beam shaping mould group is shaped to the equally distributed linear Beams of energy, the high-energy density Beams to form cutting optical filter are focused by focusing objective len.Each element cross-section for obtaining and upper and lower surface form that regular, straightness is good, superficial film is destroyed without obvious after present invention cutting, and the modification thickness degree formed in cutting process can be selected to meet the process requirements of different size with position according to substrate thickness or actual requirement.
Description
Technical field
The present invention relates to technical field of laser processing more particularly to the laser cutting methods and device of a kind of optical filter.
Background technique
Optical filter pass through as a kind of achievable specific wavelength or by optical element, be the remote sensing of aerospace precision,
The key feature in the fields such as optic communication, high-performance camera, by it may be implemented the detection of higher precision and sensitivity with
High quality information transmission.The multiband detection for for example realizing aerospace field, inhibits Infrared background radiation, used more
It will be installed the infrared fileter group of multiple specific band ranges in the infrared vision inspection apparatus of wave band；In the transmitting-receiving of optic communication device
In module, communication quality can be obviously improved by the signal of selected required wavelength, and inhibit the noise jamming in transmission process；It is high
Specific optical filter is added before the camera lens of performance camera then can be improved image quality.Substantially in all spectra in application, be both needed to by
Size requires to be cut into lesser discrete component and carry out assembling use bulk optical filter on demand.
With the integrated and miniaturization of vision inspection apparatus, the optical filtering chip size for needing to process is also increasingly
It is small, and the requirement to processing quality is then continuously improved.The conventional method for currently carrying out cutting processing to optical filter mainly has line wheel
Wire drawing cutting and mechanical wheeled two kinds of cutting.Wherein line wheel wire drawing cutting is by multiple groups line wheel arranged opposite two-by-two, then by cutting wire
It passes around in line wheel, the cutting of different size optical filters can be realized by the spacing between control line wheel.This method can be cut
Multiple optical filters and small to the injury of optical filter are obtained, but are limited by line wheel threaded configuration, the optical filter ruler of this method processing
The very little diameter dimension that can not be less than line wheel.And mechanical wheeled cutting is directly processed to filter sheet base plate with blade,
Blade used by this method can cause very major injury to optical filter superficial film, and the coolant liquid used in cutting process is known from experience
Pollution is generated to skin covering of the surface.
In conclusion molding cutting requirement when traditional optical filtering slice processing method has been unable to satisfy its application.And laser
The development of technology provides very good solution method for the processing of optical filter.It especially experienced continuous laser and Long Pulse LASER
After the continuous accumulation and development of processing technology, (pulsewidth is less than 10 for ultrafast laser-12Second) it is considered as the preferred of associated materials processing
Means.Ultrafast laser by high peak power and with can to the Nonlinear optical absorption during its transparent material effects
Internal modification is carried out to material, which does not remove material directly, for realize efficiently, high quality cutting processing provides can
Energy.But the Gaussian beam directly exported with laser carries out the width that the modified region that internal modification cutting obtains only has very little,
This occurs after just leading to the thicker material of cutting compared with multiple cracks (as shown in Figure 5 a).
Correlative study the result shows that, the improvement of cutting section be the key that improve cut quality, and to a certain degree increase change
Cut quality can be improved in the thickness of matter layer.Salt free ligands threadiness focal beam spot, which relies on, can get broader modification layer just in related material
The manufacture field of material is concerned, but the diffraction light-free beam energy directly generated prolongs its direction of propagation and is unevenly distributed (such as attached drawing
6a), it means that though section can be with flawless, non-uniform beam energy after using the Beams directly generated to cut
Distribution will lead to the modification layer morphological inhomogeneity (as shown in Figure 5 b) after cutting.
Therefore, the existing technology needs to be improved and developed.
Summary of the invention
In view of above-mentioned deficiencies of the prior art, the purpose of the present invention is to provide a kind of laser cutting method of optical filter and
Device, to overcome the problems, such as to use the cutting method cut quality of existing optical filter poor.
Technical scheme is as follows:
The present invention provides a kind of laser cutting device of optical filter, wherein include: ultrafast laser, beam shaping mould group,
Focusing objective len, vision inspection apparatus and motion platform；
Vision inspection apparatus is located at focusing objective len top, and motion platform is located at focusing objective len lower part for carrying wait filter
Piece, focusing objective len are the image-forming objective lens of vision inspection apparatus；
Ultrafast laser issues ultra-short pulse laser beam incident beam sizing die group, is shaped to energy by beam shaping mould group
Incident focusing objective len after equally distributed linear Beams is measured, the high energy to form cutting optical filter is focused by focusing objective len
Metric density Beams.
The laser cutting device of the optical filter, wherein the beam shaping mould group includes:
Beams generation module exports the incident initial Beams of ultra-short pulse laser Shu Shengcheng；
Uniformity of energy Shaping Module, the initial Beams that Beams generation module is exported are shaped to energy
Equally distributed threadiness Beams.
The laser cutting device of the optical filter, wherein the uniformity of energy Shaping Module includes: intermediate region pair
The energy attenuation of light beam is greater than the attenuator of peripheral region.
The laser cutting device of the optical filter, wherein the attenuator is rotated in the outbound course of Beams
Setting.
The laser cutting device of the optical filter, wherein the Beams generation module includes axicon.
The laser cutting device of the optical filter, wherein the ultra-short pulse laser beam that the ultrafast laser generates
Pulsewidth is less than 100 picoseconds.
The laser cutting device of the optical filter, wherein the laser cutting device further includes for ultrafast laser
The control system that device, beam shaping mould group, focusing objective len, vision inspection apparatus and motion platform are controlled.
The present invention also provides a kind of laser cutting methods of optical filter, wherein comprising steps of
Laser cutting device described in any of the above item is provided；
After optical filter is placed in motion platform, adjust vision inspection apparatus and motion platform, search out finished surface with
Cutting position；
It opens ultrafast laser and issues ultra-short pulse laser beam, it is equally distributed to be shaped to energy by beam shaping mould group
Incident focusing objective len after linear Beams；
It adjusts motion platform and focusing objective len is precisely focused, the high-energy density to be formed will be focused by focusing objective len
The selected areas that Beams act on optical filter completes the laser cutting of optical filter.
The laser cutting method of the optical filter, wherein when optical filter is cut by laser, adjusted by beam shaping mould group
Control modification thickness degree, the adjusting of modification layer position is realized by the adjusting of focusing objective len and motion platform focus point position.
The laser cutting method of the optical filter, wherein point spacing when optical filter is cut by laser is 4~20 microns,
The energy density of the high-energy density Beams is greater than 1J/cm2。
The beneficial effects of the present invention are:
The present invention is shaped to the equally distributed linear Beams progress optical filter of energy by beam shaping mould group and cuts
It cuts, each element cross-section and upper and lower surface obtained after cutting forms that regular, straightness is good, superficial film is destroyed without obvious,
And the modification thickness degree formed in cutting process and position can be selected according to substrate thickness or actual requirement to meet difference
The process requirements of specification.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of optical filter.
Fig. 2 is the structural schematic diagram of the laser cutting device of the optical filter of the embodiment of the present invention.
Fig. 3 is the structural schematic diagram of the beam shaping mould group of the embodiment of the present invention.
Fig. 4 is the flow chart of the laser cutting method of the optical filter of the embodiment of the present invention.
Fig. 5 is cutting effect before traditional Gauss light beam, Beams shaping.
Fig. 6 is Energy distribution on its direction of propagation after the distribution of Beams primary power and uniformity of energy processing
Comparison；Wherein, (a) is that Beams prolong its direction of propagation energy uneven distribution before shaping, (b) to can be achieved to prolong after shaping
The equally distributed Beams of direction of propagation energy.
Fig. 7 is the optical filter section and cutting effect after different modification layer forms are adjusted；Wherein, (a), (b) are respectively light
The different modification slice width degree of beam Shaping Module adjustment realization and point spacing cutting are (c) the crackle straight line before separation after laser cutting
Degree is (d) the optical filter front cutting effect again after the separation of mechanical sliver.
Specific embodiment
The present invention provides the laser cutting method and device of a kind of optical filter, for make the purpose of the present invention, technical solution and
Effect is clearer, clear, and the present invention is described in more detail as follows in conjunction with drawings and embodiments.It should be appreciated that herein
Described specific embodiment is only used to explain the present invention, is not intended to limit the present invention.
It is shown in Figure 2, a kind of laser cutting device 100 of optical filter provided in an embodiment of the present invention, wherein include:
Ultrafast laser 110, beam shaping mould group 120, focusing objective len 130, vision inspection apparatus 200 and motion platform 210；Its
In, vision inspection apparatus 200 is located at 130 top of focusing objective len, and motion platform 210 is located at 130 lower part of focusing objective len for carrying
To optical filter 300, focusing objective len 130 is the image-forming objective lens of vision inspection apparatus 200；Focusing objective len 130, vision inspection apparatus
200 and motion platform 210 constitute process focusing positioning system, it can be achieved that different type filter manufacturing process is cut
Cut positioning and precisely focusing；Ultrafast laser 110 issues ultra-short pulse laser beam incident beam sizing die group 120, by light beam
Sizing die group 120 is shaped to incident focusing objective len 130 after the equally distributed linear Beams of energy, by focusing objective len
130 focus the high-energy density Beams for forming cutting optical filter 300.
The present invention is shaped to the equally distributed linear Beams progress optical filter of energy by beam shaping mould group and cuts
It cuts, each element cross-section and upper and lower surface obtained after cutting forms that regular, straightness is good, superficial film is destroyed without obvious,
And the modification thickness degree formed in cutting process and position can be selected according to substrate thickness or actual requirement to meet difference
The process requirements of specification.
Further, shown in Figure 3, in the present embodiment, the beam shaping mould group 120 is included at least: diffraction light-free
Beam generation module 121 and uniformity of energy Shaping Module 122；Wherein, Beams generation module 121 is used to surpass incident
Short pulse laser beam generates initial Beams output；Uniformity of energy Shaping Module 122 is for generating Beams
The initial Beams of module output prolong the Energy distribution on its direction of propagation, and to be shaped to energy equally distributed linear without spreading out
Irradiating light beam, 122 intermediate region of uniformity of energy Shaping Module are greater than peripheral region to the energy attenuation of light beam to realize uniformly
The Beams of Energy distribution.
Preferably, shown in Figure 3, in the present embodiment, the beam shaping mould group 120 further includes being located at uniformity of energy
The energy of 122 front of Shaping Module redistributes element 123, and the energy that uniformity of energy Shaping Module 122 exports is equally distributed
Light beam convergence is carried out after linear Beams projectile energy redistribution element 123, then incident focusing objective len 130.It is specific real
Shi Shi, energy redistribution element 123 can be the lens of convergence effect.The uniformity of energy Shaping Module includes: centre
Region is greater than the attenuator of peripheral region to the energy attenuation of light beam, which that is to say that the decaying of intermediate and outer region is stronger
The attenuating device with cyclic character.Preferably, the attenuator can lead in the outbound course rotary setting of Beams
The mode for crossing rotation further enhances the uniformity of Energy distribution, obtains Energy distribution more evenly shaping hot spot.
Beams uniformity of energy processing unit key element used in the embodiment of the present invention is intermediate region to light
The energy attenuation of beam is greater than the attenuator of peripheral region.The non-uniform basic place of the Beams Energy distribution directly formed
It is that the intermediate region energy of its light beam is more concentrated, being equipped with specific energy attenuation device can carry out Energy distribution at homogenization
Reason.And the essence of Beams generation is the interference of wavefront, therefore the element attenuation characteristic (different zones attenuation ratio) is adjusted
The different zones (such as dotted line position) before Beams generating element can be located at after whole, in the present embodiment, using intermediate and
Outer region decaying is stronger, and there is cyclic character attenuating device to be substantially put in solid line position in Fig. 3, can get such as attached drawing 6b
Shown in optimal energy distribution Beams, this optimum position be incipient beam of light length half.
Further, in the present embodiment, the Beams generation module includes axicon or other can reach identical
The component or system of effect.The pulsewidth for the ultra-short pulse laser beam that the ultrafast laser generates is less than 100ps.The laser
Cutter device further includes for ultrafast laser 110, beam shaping mould group 120, focusing objective len 130, vision inspection apparatus
200 and the control system 400 (controller) that is controlled of motion platform 210, control system 400 can realize cutting positioning with
Beams after shaping are focused and carry out optical filter cutting by the automatic control of focus process.
Further, vision inspection apparatus described in the present embodiment is CCD camera, and CCD camera camera is located at focusing objective len
Surface, the object lens be both used as laser focusing objective len, also as the image-forming objective lens of CCD camera, specifically, selected by the present embodiment
Numerical aperture of objective value is 0.5, multiplying power is 50 times, and CCD camera pixel is 400,000.
When it is implemented, shown in Figure 2, the laser-processing system 100 includes ultrafast laser 110, beam shaping
Mould group 120, processing object lens 130, first laser transfer element 140 and second laser transfer element 150, first laser transfer element
140 be reflecting mirror, and second laser transfer element 150 is that half-reflecting half mirror can realize coaxial imaging.Ultrafast laser is used for
The ultra-short pulse laser beam for meeting individual features is generated, generated laser preliminarily forms energy after passing through beam shaping mould group 120
The linear Beams of high concentration are measured, the Beams generating element that the present embodiment selects is axicon, and laser generates
The Gaussian beam that device exports 532 nano wave lengths, pulsewidth is 15 picoseconds.Generated Gaussian beam is incident to the axis of almost plane
Interfered by generated diffraction light through wavefront after pyramid and generate Beams, the producing method of this Beams determines
Its 90% or more energy is distributed in Line of light spot, and Laser beam energy distribution outside the region for being slightly away from linear hot spot sharply
Reduce.It further, can be non-uniform initial along the direction of propagation by the light beam by selected uniformity of energy Shaping Module
Energy is shaped to essentially uniformly distributed Beams respectively.Energy distribution form is immovable after processed object lens focus
In the case of, the high-energy density Beams for material processing can be formed.
Shown in Figure 4, the embodiment of the present invention also provides a kind of laser cutting method of optical filter, wherein includes:
Step S100, the laser cutting device is provided；
Step S200, after optical filter being placed in motion platform, vision inspection apparatus and motion platform are adjusted, searches out and adds
Work surface and cutting position；
Step S300, it opens ultrafast laser and issues ultra-short pulse laser beam, be shaped to energy by beam shaping mould group
Incident focusing objective len after equally distributed threadiness Beams；
Step S400, motion platform and focusing objective len are adjusted precisely to be focused, process focusing objective len is focused to be formed
The selected areas that high-energy density Beams act on optical filter completes the laser cutting of optical filter.
The present invention proposes to carry out optical filter cutting based on the equally distributed linear Beams that focus of energy, after cutting
Modification layer quality have very big improvement compared with Beams before Gaussian beam, shaping, can further improving laser technology
In the advantage of associated materials processed and applied.
The method is based on the equally distributed Beams of energy on the shaped laser spot direction of propagation along the line, carries out optical filter and cuts
It cuts, each element cross-section and upper and lower surface obtained after cutting forms that regular, straightness is good, superficial film is destroyed without obvious,
And the modification thickness degree formed in cutting process and position can be selected according to substrate thickness or actual requirement to meet difference
The process requirements of specification.
Further, in the present embodiment, when optical filter is cut by laser, control modification thickness is adjusted by beam shaping mould group
Degree realizes the adjusting of modification layer position by the adjusting of focusing objective len and motion platform focus point position.Generated energy is equal
Even distribution Beams, which focus on inside optical filter, to be cut, and the modification thickness degree formed and position are adjustable.Wherein change
Matter thickness degree can be adjusted by sizing die group and be controlled, and modification layer position can pass through motion control and vision system focus point position
It adjusts and realizes, can be selected according to actual needs when guaranteeing processing effect.
Further, in the present embodiment, the step S400 is when it is implemented, by set by optical filter and object lens relative movement
Fixed distance makes machining beams focus on the selected areas of optical filter and realizes the cutting of material in the case where setting technological parameter.It filters
Point spacing when piece is cut by laser is 4~20 microns, and the energy density of the high-energy density Beams is greater than 1J/cm2。
The initial laser pulsewidth that the ultrafast laser generates is not limited to 532 nanometers less than 100 picoseconds, wavelength and can focus on optical filter
Inside carries out modification processing to it.
Further, shown in Figure 1 in the present embodiment, the structure of the optical filter can be surface (upper and lower surface or
Only one surface) there is optical thin film, the material that substrate is transparent optical glass or coloured glass and other corresponding functions,
Affiliated film can be one or more layers.The optical filter is to used 532 nm wavelength laser through (transmitance is greater than
80%) bandpass filter for meeting the characteristic, edge filter, light splitting optical filter etc., be can be by spectral characteristic point, can also be pressed
Spectral band point is the ultraviolet filter, vision filter and infrared fileter for meeting characteristic requirements.It is equally distributed with energy
Single vertical crack can be observed on optical filter surface after Beams processing and can carry out later separation, practical square crossing
Two Crack straightness of the formation after cutting are maintained and orthogonal.Optimize the optical filter after cutting under machined parameters
Modification layer form well and can occur without any crackle in addition to modified region, with optical thin film in the case where can guarantee cutting
The optical property and intensity of device outside region, and nearby film destroys cutting region without obvious.This method is in optimization machined parameters
The optical filter with higher cutting requirement and more complicated structure can be processed down, therefore this method equally also can be directly used for
The cutting of the transparent materials such as sapphire, simple glass.
The upper surface of cutting sample is searched out through CCD and correlation detection device, and is moved with the position searched out for cutting
Focus reference point, adjust cutting parameter and set relative movement distance, can be obtained respectively such as Fig. 7 after optimization processing technology
Shown in cutting section, all sections have uniform cutting modification layer, and other region flawlesses in addition to modifying layer.This reality
Applying the selected rapidoprint of example is that (infrared band is cut the substrate of glass optical filter of 0.2 millimeters thick, only one surface with film layer
Only).Especially it is noted that the present invention can realize modification layer shape using apparatus and method by the regulation of sizing die group parameter
The adjusting of state can be achieved different modification slice width degree and put spacing cutting (only by replacement attenuator after adjusting as shown in the picture
It is related).Crackle straightness (Fig. 7 c) before observation separation and the optical filter after separating are positive (Fig. 7 d), the single member finally obtained
Part edge is substantially without chipping and superficial film is protected well.Above-mentioned experimental result shows that this method can be mentioned significantly
The cut quality of optical filter is risen, also provides total solution for the optical filter cutting of different size.
To sum up, the present invention is based on optical filters to process constantly improve demand, the advantage of laser cutting technique and current ultrafast
Possessed room for promotion is laser machined, the present invention proposes the ultrafast laser cutter device and method of a kind of optical filter.It is invented
Device the non-uniform initial Beams of the Energy distribution directly generated are carried out by energy based on particular optical element or device
Measure Homogenization Treatments；The method is processed based on the Beams after Shape correction, and processing quality is higher, and is formed
Modification slice width degree can be adjusted according to substrate thickness or actual processing request to meet different practical application requests.
It should be understood that the application of the present invention is not limited to the above for those of ordinary skills can
With improvement or transformation based on the above description, all these modifications and variations all should belong to the guarantor of appended claims of the present invention
Protect range.
Claims (10)
1. a kind of laser cutting device of optical filter characterized by comprising ultrafast laser, beam shaping mould group, conglomeration
Mirror, vision inspection apparatus and motion platform；
Vision inspection apparatus is located at focusing objective len top, motion platform be located at focusing objective len lower part for carry to optical filter, it is poly-
Focus objective lens are the image-forming objective lens of vision inspection apparatus；
Ultrafast laser issues ultra-short pulse laser beam incident beam sizing die group, and it is equal to be shaped to energy by beam shaping mould group
Incident focusing objective len after the linear Beams of even distribution, focused by focusing objective len to be formed cutting optical filter high-energy it is close
Spend Beams.
2. the laser cutting device of optical filter according to claim 1, which is characterized in that the beam shaping mould group packet
It includes:
Beams generation module exports the incident initial Beams of ultra-short pulse laser Shu Shengcheng；
Uniformity of energy Shaping Module, it is uniform that the initial Beams that Beams generation module is exported are shaped to energy
The linear Beams of distribution.
3. the laser cutting device of optical filter according to claim 1, which is characterized in that the uniformity of energy sizing die
Block includes: the attenuator that intermediate region is greater than peripheral region to the energy attenuation of light beam.
4. the laser cutting device of optical filter according to claim 3, which is characterized in that the attenuator is in diffraction light-free
The outbound course rotary setting of beam.
5. the laser cutting device of optical filter according to claim 2, which is characterized in that the Beams generate mould
Block includes axicon.
6. the laser cutting device of optical filter according to claim 1, which is characterized in that the ultrafast laser generated
The pulsewidth of ultra-short pulse laser beam is less than 100 picoseconds.
7. the laser cutting device of optical filter according to claim 1, which is characterized in that the laser cutting device also wraps
It includes for being controlled ultrafast laser, beam shaping mould group, focusing objective len, vision inspection apparatus and motion platform
Control system.
8. a kind of laser cutting method of optical filter, which is characterized in that comprising steps of
The described in any item laser cutting devices of claim 1~7 are provided；
After optical filter is placed in motion platform, vision inspection apparatus and motion platform are adjusted, searches out finished surface and cutting
Position；
It opens ultrafast laser and issues ultra-short pulse laser beam, be shaped to the equally distributed threadiness of energy by beam shaping mould group
Incident focusing objective len after Beams；
It adjusts motion platform and focusing objective len precisely to be focused, process focusing objective len will be focused into the high-energy density to be formed without spreading out
The selected areas that irradiating light beam acts on optical filter completes the laser cutting of optical filter.
9. the laser cutting method of optical filter according to claim 8, which is characterized in that when optical filter is cut by laser, lead to
It crosses beam shaping mould group and adjusts control modification thickness degree, changed by the adjusting realization of focusing objective len and motion platform focus point position
The adjusting of matter layer position.
10. the laser cutting method of optical filter according to claim 8, which is characterized in that when optical filter is cut by laser
Point spacing is 4~20 microns, and the energy density of the high-energy density Beams is greater than 1J/cm2。
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| CN201910099113.4A CN109623172B (en) | 2019-01-31 | 2019-01-31 | Laser cutting method and device for optical filter |
| TW109100097A TWI727592B (en) | 2019-01-31 | 2020-01-02 | Laser cutting method and device for filter |
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| CN201910099113.4A CN109623172B (en) | 2019-01-31 | 2019-01-31 | Laser cutting method and device for optical filter |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112276344A (en) * | 2019-07-09 | 2021-01-29 | 大族激光科技产业集团股份有限公司 | Focus positioning method for ultrafast laser cutting of transparent material |
| CN112427814A (en) * | 2019-08-23 | 2021-03-02 | 大族激光科技产业集团股份有限公司 | Laser pre-segmentation device and laser pre-segmentation method |
| CN112775567A (en) * | 2020-12-28 | 2021-05-11 | 友芯(厦门)半导体设备有限公司 | Pretreatment method, device and method for laser cutting of narrow-band-pass filter |
| CN113634877A (en) * | 2020-04-27 | 2021-11-12 | 大族激光科技产业集团股份有限公司 | Laser processing device and method |
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| CN112775567A (en) * | 2020-12-28 | 2021-05-11 | 友芯(厦门)半导体设备有限公司 | Pretreatment method, device and method for laser cutting of narrow-band-pass filter |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI727592B (en) | 2021-05-11 |
| TW202030046A (en) | 2020-08-16 |
| CN109623172B (en) | 2020-10-23 |
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