CN113634877A - Laser processing device and method - Google Patents
Laser processing device and method Download PDFInfo
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- CN113634877A CN113634877A CN202010342490.9A CN202010342490A CN113634877A CN 113634877 A CN113634877 A CN 113634877A CN 202010342490 A CN202010342490 A CN 202010342490A CN 113634877 A CN113634877 A CN 113634877A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
The embodiment of the application belongs to the technical field of laser processing, and relates to a laser processing device and a method, wherein the laser processing device comprises: the laser beam deflection device comprises a laser output assembly, a beam deflection element, a focusing element and an image detection assembly; the laser processing device comprises a laser output assembly, a beam deflection element and a focusing element, wherein the laser output assembly, the beam deflection element and the focusing element form a laser processing light path for processing a product; the light beam deflection element, the focusing element and the image acquisition assembly form a laser detection light path for detecting laser energy distribution, and laser reflected from the processing position is acquired and detected by the image acquisition assembly through the laser detection light path. According to the technical scheme, on the basis that components are not added, transverse and axial energy distribution of laser can be detected, and automatic acquisition of focus and light path collimation debugging can be met.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a laser processing device and method
Background
The laser processing equipment utilizes the high-energy-density light spot focused by the optical focusing system to act on a production object for processing, the axial relative position of the laser focus and the processing object determines the transverse energy distribution and the power density of the laser spot acting on the processing object, the transverse processing effect of the laser can be obviously influenced (taking laser cutting as an example), and the axial energy distribution of the laser determines the thickness of a cuttable material and the quality of a cut section, so that the axial and transverse energy distribution at the laser focus plays a crucial role in the processing quality.
In the prior art, only laser energy is detected, and a positioning point of a material to be cut is illuminated by using a coaxial light source lens, so that the cutting efficiency and the positioning precision are improved, and laser energy distribution detection cannot be realized.
Disclosure of Invention
The embodiment of the application aims to solve the problem of detecting the transverse and axial energy distribution of laser without additionally adding other equipment.
In order to solve the above technical problem, the present application provides a laser processing apparatus, the laser processing apparatus includes: a laser output assembly, a beam deflection element, a focusing element, and an image detection assembly;
the laser output assembly, the beam deflection element and the focusing element form a laser processing light path for processing a product, and laser output by the laser output assembly is projected to a processing position on the objective table through the laser processing light path;
the light beam deflection element, the focusing element and the image acquisition assembly form a laser detection light path for detecting laser energy distribution, and laser reflected from the processing position is acquired and detected by the image acquisition assembly through the laser detection light path.
Further, the laser processing device further comprises a lens element, the lens element is located between the beam deflection element and the image acquisition assembly, and the lens element is coaxial with the focusing element.
Further, the laser output assembly includes: a laser and an optical path transmission element; the laser is used for generating laser beams, and the optical path transmission element is used for converting the laser beams incident to the laser into processing beams.
Further, the optical path transmission element includes one or more of a reflection unit, a collimation unit, or a shaping unit.
Further, the beam deflection element has a splitting ratio of less than 2: 98 beam splitter or mirror with reflectivity greater than 98%.
Further, the image acquisition assembly comprises a CCD camera coaxial with the focusing element and the lens assembly, and a computer connected to the CCD camera.
Furthermore, the laser processing device also comprises a reflecting element, wherein the reflecting element is arranged at a processing position on the objective table to reflect the laser output by the laser output assembly, and the reflected laser passes through the laser detection light path and is collected and detected by the image collecting assembly.
Furthermore, the laser processing device further comprises a moving device connected to the focusing element or the object stage, so as to enable the focusing element and the object stage to move relatively.
The present application also provides a laser processing method, including:
the method adopts the laser processing device, and comprises the following steps:
the laser emits a light beam to the objective table;
reflected light beams are reflected by a reflecting element arranged on the objective table or a processed product, and the reflected light beams are incident to the image acquisition assembly through a laser detection light path;
the image acquisition assembly analyzes the reflected light beam to obtain a transverse energy distribution image of the laser spot;
adjusting the position of the focusing element for multiple times, receiving and analyzing a primary reflected light beam through the image acquisition assembly after each adjustment to obtain laser spot transverse energy distribution images at different axial positions, and drawing the laser spot transverse energy distribution images into curves along the axial direction to obtain laser spot axial energy distribution curves;
and determining the position of the focusing element according to the laser spot axial energy distribution curve so as to adjust the laser processing light path.
Further, the method further comprises:
and changing the optical path structure formed by the focusing element and the lens element by adjusting the focal length and the position of the lens element so as to enlarge the light spot distribution on the surface of the processed product or the reflecting element by a certain proportion and acquire the light spot distribution by the image acquisition assembly, wherein the enlargement proportion is controlled by adjusting the focal length and the position of the lens element.
According to the laser processing device and the laser processing method provided by the embodiment of the application, compared with the prior art, the laser processing device and the laser processing method at least have the following beneficial effects:
by adopting the laser processing device and the method, namely, the laser processing device is composed of the laser output assembly, the beam deflection element, the focusing element and the image acquisition assembly, the laser processing device can be used under the condition that other additional equipment is not added, specifically, the focusing element can play a role in focusing the processing beam in the processing light path, so that a focus can fall on an objective table, and can play a role in imaging the laser in the detection light path, so that the subsequent image acquisition assembly can acquire the laser conveniently, and other auxiliary beams or additional equipment is not needed, the complexity of the structure of the device can be obviously reduced by using the elements, the transverse and axial energy distribution of the laser can be detected simultaneously, the requirement of light path collimation and debugging can be met, and the device has the characteristics of simple structure, convenience in operation and high precision.
Drawings
In order to more clearly illustrate the solution of the present application, the drawings needed for describing the embodiments of the present application will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and that other drawings can be obtained by those skilled in the art without inventive effort.
Fig. 1 is a schematic view of a laser processing apparatus according to an embodiment of the present invention;
fig. 2 is a simulation diagram of the transverse energy distribution of a laser spot according to an embodiment of the present invention;
fig. 3 is a simulation diagram of the axial energy distribution of a laser spot according to an embodiment of the present invention;
FIG. 4 is a transverse energy distribution map of a laser spot provided by an embodiment of the present invention;
FIG. 5 is an isometric view of the axial energy distribution of a laser spot provided by an embodiment of the invention;
fig. 6 is a simulation diagram of the transverse energy distribution of a laser spot according to another embodiment of the present invention;
FIG. 7 is a simulation diagram of the axial energy distribution of a laser spot according to another embodiment of the present invention;
FIG. 8 is a transverse energy distribution map of a laser spot provided in accordance with another embodiment of the present invention;
FIG. 9 is an axial energy distribution map of a laser spot provided in accordance with another embodiment of the present invention;
fig. 10 is a flowchart of a laser processing method according to an embodiment of the present invention.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions. The terms "first," "second," and the like in the description and claims of this application or in the above-described drawings are used for distinguishing between different objects and not for describing a particular order.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.
As shown in fig. 1, the laser processing apparatus includes: a laser output assembly 11, a beam deflecting element 103, a focusing element 104, a lens element 106, an image detection assembly 12;
the laser output assembly 11, the beam deflection element 103 and the focusing element 104 form a laser processing light path for processing a product, and laser output by the laser output assembly 11 is projected to a processing position on the objective table 10 through the laser processing light path;
the beam deflection element 103, the focusing element 104, the lens assembly 106, and the image pickup assembly 12 form a laser detection optical path for laser energy distribution detection, and the laser light reflected from the machining position is picked up and detected by the image pickup assembly 12 via the laser detection optical path.
Specifically, the laser output assembly 11 is configured to generate and process laser, an initial laser beam processed by the laser output assembly 11 becomes a processing beam, a propagation direction of the processing beam is a laser processing optical path formed by the laser output assembly 11, the beam deflecting element 103, and the focusing element 104, the processing beam is deflected by the beam deflecting element 103 so that the propagation direction of the processing beam faces the stage 10, and then passes through the focusing element 104, and a focal point of the processing beam 104 after being focused by the focusing element 104 falls on a processing position on the stage 10.
The laser reflected from the processing position passes through the laser detection optical path and is finally collected and detected by the image collection assembly 12, the focusing element 104, the light beam deflection element 103, the lens element 106 and the image collection assembly 12 form the laser detection optical path, and the laser reflected from the processing position passes through the light beam deflection element 103, the focusing element 104 and the lens element 106 in sequence and is finally collected and detected by the image collection assembly 12. Wherein the beam deflecting element 103 is in the laser detection path, primarily by virtue of its transmissive properties, irrespective of its deflection of the beam.
The focusing element 104 plays a focusing role in the laser processing light path, and plays an imaging role in the laser detection light path, so that the laser energy distribution can be determined without other auxiliary light beams, the structural complexity of the system is obviously reduced, and the laser processing light path system can be used for automatic laser focus finding and laser light path debugging. In a specific embodiment, the focusing element 104 may be a single lens, a combined lens, or a high power objective lens, and the like, and different lens types are used for different laser beams.
By adopting the laser processing device, the focusing element respectively plays a focusing role and an imaging role in the laser processing light path and the laser detection light path, and other auxiliary light beams or additional equipment are not needed, so that the complexity of the device structure can be obviously reduced by using the elements. The laser energy distribution detection device not only can detect the transverse and axial energy distribution of laser simultaneously, but also meets the requirement of light path collimation and debugging, and has the characteristics of simple structure, convenience in operation and high precision.
Further, as shown in fig. 1, the laser processing apparatus further includes a lens element 106, and the lens element 106 is a single lens or a combined lens. The lens element 106 is mounted on the laser detection optical path between the beam deflection element and the image capturing assembly 12. The principle is that the optical lens made of glass or other transparent materials with the curved surface of the lens can magnify and image an object. The laser light may be imaged to facilitate acquisition of the image acquisition assembly 12 through the use of a lens element 106.
In this embodiment, the positions of the focusing element 104 and the lens element 106 are adjusted to make the focal points of the focusing element 104 and the lens element 106 coincide, the focusing element 104 and the lens element 106 thereby constitute a 4f system, the 4f system enlarges the spot distribution on the surface of the machining position in a certain proportion and the enlarged proportion is adjusted by the image acquisition assembly 12 according to actual needs.
Further, as shown in fig. 1, the laser output assembly 11 includes: the laser processing device comprises a laser 101 and an optical path transmission element 102, wherein the laser 101 is used for generating a laser beam, and the optical path transmission element 102 is used for processing the laser beam incident from the laser 101 and converting the laser beam into a processing beam.
Specifically, the laser 101 generates an initial laser beam, and then the initial laser beam is incident into the optical path transmission element 102, the initial laser beam is converted into a processing beam by the processing of the optical path transmission element 102, the initial laser beam is generated by the laser 101, and the initial laser beam is processed by the optical path transmission element 102 to be converted into a processing beam, so as to meet the requirement of laser processing.
In some embodiments, the processing of the laser light by the optical path transport software 102 includes one or more of reflection, collimation, or shaping; the reflection is to realize the deflection of the laser beam according to the light path structure, the collimation is to perform beam expanding collimation on the generated initial laser beam, and the shaping is to modulate the initial laser beam into a beam for processing. Thus, in an implementable embodiment, the optical path transport element 102 may comprise one or more of a reflecting unit, a collimating unit, or a shaping unit; the reflection unit is used for deflecting the optical path of the light beam so as to enable the light beam to irradiate a specified place; the collimating unit is used for converting incident initial laser into a collimated beam with a specific size; the shaping unit is used for modulating the collimated light beam into a light beam for processing. In this embodiment, the laser 101 is an ultrashort pulse laser, which generates an initial laser beam with a wavelength of 1030nm, a pulse repetition frequency of 1-300KHz, and a pulse width of less than 10 ps.
Since the optical path transmission element 102 may include one or more of a reflection unit, a collimation unit, or a shaping unit, when the structure of the optical path transmission element 102 is different, there will be different situations in the processing process of the laser beam generated by the laser 101 through the optical path transmission element 102, and the laser beam obtained by the different processing processes will have an influence on the subsequently formed processing beam and the detected laser beam. In some embodiments, the structure of the optical path transmission element 102 may also cause the structure of other parts of the laser processing apparatus to change.
Some specific structures of the optical path transmission element 102 are exemplified below.
In one embodiment, the optical path transmission element 102 includes a collimating unit and a reflecting unit. The focusing element 104 may then be a combination lens for rendering the incident beam a filament in the axial direction; before detecting the laser energy, the computer 108 may first perform simulation to obtain simulated laser beam spot energy distribution for verifying several beam spot energy distributions obtained by subsequent actual detection, in this embodiment, a simulation result of the laser beam spot transverse energy distribution is shown in fig. 2, and a simulation result of the laser beam energy distribution along the light propagation direction, that is, a simulation graph of the laser beam spot axial energy distribution is shown in fig. 3.
In the actual detection process, the laser output assembly 11 composed of a laser and an optical path transmission element makes the output processing beam pass through the beam deflection element 103, the laser deflects and enters the focusing element 104, after the processing beam is focused by the focusing element 104, the focus of the processing beam falls on the processing position on the object stage 10, the processing beam incident from the processing position is reflected, passes through the focusing element 104, the beam deflection element 103 and the lens element 106 in sequence, and is finally collected and detected by the image collection assembly 12, in the embodiment, the laser output assembly 11 which performs the imaging function includes the focusing element 104 and the lens element 106, the focus of the focusing element 104 and the focus of the lens element 106 are overlapped by adjusting the positions, so as to form a 4F system, and the 4F system can proportionally transmit the transverse energy distribution of the light spot to the image collection assembly 12; the transverse energy distribution of the light spot transmitted by the 4F system composed of the focusing element 104 and the lens element 106 received by the image acquisition assembly 12 is shown in fig. 4; the image acquisition component 12 obtains the focal depth energy distribution along the light propagation direction by performing normalization processing on the gray level images at the positions and quantizing the energy of the centers of the spots at the fitting positions, that is, the actual measurement diagram of the axial energy distribution of the laser spots is shown in fig. 5, the actual measurement diagram of the transverse energy distribution of the laser beams is shown in fig. 2 by comparing the simulation result of the transverse energy distribution of the laser beams along the light propagation direction with the actual measurement diagram of the transverse energy distribution of the laser spots in fig. 4 by comparing the simulation result of the transverse energy distribution of the laser beams along the light propagation direction with the actual measurement diagram 5 of the axial energy distribution of the laser beams, and it can be seen that the actual measurement diagram is close to the simulation diagram.
In another embodiment, taking the case that the optical path transmission element 102 includes a collimating unit, a shaping unit and a reflecting unit, the focusing unit 104 may be a single lens, and the lens element 106 may not be needed, the collimating unit is configured to convert the incident initial laser beam into a collimated beam with a specific size, and the shaping module is configured to modulate the collimated beam into a bessel beam for processing; at this time, the simulation result of the transverse distribution of the bessel beam spots is shown in fig. 6; the simulation result of the light energy distribution along the light propagation direction, i.e. the simulation graph of the axial energy distribution of the laser spot, is shown in fig. 7.
In the actual detection process, after the incident processing light beam is reflected by the reflection of the processing position on the object stage 10, the reflected light beam passes through the focusing element 104 and the light beam deflection element 103 in sequence, and is finally collected and detected by the image collection assembly 12; the image acquisition assembly 12 receives the light spot energy distribution transmitted by the focusing element, and the transverse light energy distribution is as shown in fig. 8; after the image acquisition assembly 12 acquires and detects the focal depth energy distribution along the light propagation direction, namely, the laser spot axial energy distribution real-time graph is shown in fig. 9, by performing normalization processing on the gray level images at each position and quantizing the energy of the spot center at the fitting position. By comparing the simulation result of the transverse energy distribution of the laser beam spot with that shown in fig. 6 and the actually measured image of the transverse energy distribution of the laser beam spot with that shown in fig. 8, and comparing the simulation result of the energy distribution of the laser beam in the light propagation direction with that shown in fig. 7 and the actually measured graph 9 of the laser axial energy distribution curve, it can be seen that the actually measured graph is close to the simulation graph. Actually, there is jitter in the energy distribution in the test depth of focus because the machining error affects the apex angle of the actual axicon not to be a perfectly sharp angle but to have a rounded corner with a certain smoothness.
Further, the beam deflection element 103 has a splitting ratio of less than 2: 98 beam splitter or mirror with a reflection greater than 98%.
Specifically, the splitting ratio is less than 2: 98 spectroscopes, i.e. mirrors with a reflected light proportion of more than 98% of the total have a better reflection capacity, while mirrors with a reflection of more than 98% also have a better reflection capacity. In some embodiments, a light block is disposed at the back of the beam deflection element, i.e. at the back of the beam deflection element where the incident light beam impinges on the beam deflection element, and functions to prevent the light beam refracted by the incident light beam after passing through the beam deflection element from affecting the detection of the laser light, i.e. to prevent the refracted light beam from propagating. In the laser detection optical path, the beam deflecting element 103 mainly utilizes its transmission characteristic, and does not consider its deflection of the light beam.
By using the light beam deflection element 103, the propagation direction of the laser beam can be changed, the overall size of the device is saved, and the light stop block is arranged to avoid the propagation of the refracted beam and influence on the laser detection of the device.
Further, as shown in fig. 1, the image capturing assembly 12 includes a CCD camera 107 and a computer 108, the CCD camera 107 is coaxial with the focusing element 104 and the lens element 106, and the computer 108 is connected to the CCD camera 107.
Specifically the collection subassembly includes: a CCD camera 107 and a computer 108, said CCD camera 107 being mounted coaxially with said focusing element 104 and said lens element 106, said CCD camera 107 being connected to said computer 108 for displaying and processing the resulting transverse distribution of the beam spots and the resulting energy distribution profile 5 of the beam in the direction of propagation.
Through the arrangement of the CCD camera 107 and the computer 108, the CCD camera 107 will capture the light spot distribution and display and detect the light spot distribution by the computer 108.
Further, as shown in fig. 1, the laser processing apparatus further includes a reflection element 105, where the reflection element 105 is disposed at a processing position on the object stage 10 to reflect the laser output by the laser output assembly 11, and the reflected laser is collected and detected by the image collecting assembly 12 through the laser detection optical path. The stage 10 can obtain the energy distribution of the laser spot in the lateral and axial directions more accurately by performing the reflection process using the reflection element 105.
Further, the laser processing apparatus further includes a moving device (not shown in the drawings), and the moving device may be connected to the focusing element 104 or the object stage 10, so as to drive the focusing element 104 or the object stage 10 to move, and adjust a relative distance between the focusing element 104 and the object stage 10, so as to facilitate focusing of the incident laser, and enable a focal point of the laser to fall on a processing position of the object stage 10 or a processed product.
The operation of the laser processing apparatus will be described below.
Firstly, a laser processing beam is output through a laser output component 11, then the laser processing beam is deflected through a beam deflection component 103, so that the processing beam enters a focusing component 104, the processing beam is focused through the focusing component 104 and then falls on a processing product or a reflection component 105 on an object stage 10, the processing beam reflected through the processing product or the reflection component 105 enters the focusing component 104 again, the processing beam is imaged through the focusing component 104 and then passes through the beam deflection component 103, and then is collected and detected by an image collection component 12, and the position of the focusing component 104 is adjusted through a movement device according to the detection result, so that the laser processing light path is adjusted.
By adopting the laser processing device, the laser processing device is composed of the laser output component 11, the beam deflection component 103, the focusing component 104 and the image acquisition component 12, the laser processing device can be used without adding other additional equipment and without other auxiliary beams or additional equipment, the complexity of the structure of the device can be obviously reduced by using the components, the transverse and axial energy distribution of laser can be detected simultaneously, the requirement of light path collimation and debugging is met, and the device has the characteristics of simple structure, convenience in operation and high precision. Specifically, in this arrangement the focusing element 104 functions both to focus the machining beam in the machining path so that the machining beam is focused on the stage 10 and to image the machining beam in the detection path. For acquisition by a subsequent image acquisition assembly 12.
The present application further provides another embodiment, and provides a laser processing method, where the method is applied to the laser processing apparatus provided in the above embodiment. As shown in fig. 10, in conjunction with fig. 1, the method includes the steps of:
s1, emitting a light beam to the objective table 10 by the laser 101;
s2, reflecting the reflected light beam by the reflecting element 105 or the processed product placed on the object stage 10, and making the reflected light beam incident to the image acquisition component 12 through the laser detection optical path;
s3, the image acquisition component 12 analyzes the reflected light beam to obtain a transverse energy distribution image of the laser spot;
s4, adjusting the position of the focusing element 104 for multiple times, receiving and analyzing the primary reflected light beam by the image acquisition assembly 12 after each adjustment to obtain laser spot transverse energy distribution images at different axial positions, and drawing the laser spot transverse energy distribution images into a curve along the axial direction to obtain a laser spot axial energy distribution curve;
and S5, determining the position of the focusing element 104 according to the laser spot axial energy distribution curve so as to adjust the laser processing light path.
Specifically, a laser beam is emitted from the laser 101, and is converted into a processing beam by the optical path transmission element, the processing beam is deflected by the beam deflection element 103, the processing beam is deflected to be incident through the focusing element 104, and the position of the focusing element 104 is adjusted by the movement device so that the focal point of the processing beam falls on the processing surface of the stage 10. The processing light beam is reflected by the reflecting element 105 or the surface of the processing product placed on the surface of the object stage 10 to pass through the focusing element 104, the light beam deflection element 103 and the lens element 106 and finally is collected and detected by the image collection assembly 12, namely, the reflected light beam reflected by the reflecting element 105 or the surface of the processing product enters the image collection assembly 12 through the laser detection optical path; and the transverse energy distribution images of the light spots with different axial positions are obtained by adjusting the positions of the reflecting element 105 or the processed product and the focusing element 104 for a plurality of times, namely adjusting the positions of the focusing element 104 and the reflecting element 105 or the processed product by the moving device. The CCD camera 107 in the image acquisition assembly 12 will acquire and analyze the transverse energy distribution of the light spot transmitted by the laser detection light path, and the computer 108 will display the transverse energy distribution image of the light spot. And the computer 108 in the image acquisition assembly 12 will curve the transverse energy distribution image of the spot in the axial direction to obtain an axial energy distribution curve of the spot. The position of the focusing element 104 is determined by the obtained spot axial energy distribution curve, specifically, the position of the focusing element 104 corresponding to the highest point of the spot axial energy distribution curve is obtained as the final position of the focusing element 104, so that the focal point of the processing beam can fall on the reflecting element 105 on the surface of the object stage 10 or the surface of the processed product, and the adjustment of the laser processing light path is realized.
By adopting the method, the function of detecting the transverse and axial energy distribution of the laser can be realized on the basis of not increasing components, and the position of the focusing element 104 is adjusted according to the axial energy distribution curve of the light spot, so that the focal point of the laser processing light beam can fall on the reflecting element 105 on the surface of the objective table 10 or the surface of a processed product to realize the adjustment of the laser processing light path.
Further, the method further comprises: the optical path structure formed by the focusing element 104 and the lens element 106 is changed by adjusting the focal length and the position of the lens element 106, so that the spot distribution on the surface of the processed product or the reflecting element 105 is collected by the image collecting assembly 12 with a certain magnification, wherein the magnification ratio is controlled by adjusting the focal length position of the lens element 106.
Specifically, by changing the focal length and position of the lens element 106, the spot distribution on the surface of the processed product or the reflective element 105 is collected by the image collection assembly 12 at a certain magnification, which is achieved by adjusting the focal length and position of the lens element 106.
By adopting the method, the laser spots can be collected and detected by the image collecting assembly 12 more clearly.
It is to be understood that the above-described embodiments are merely illustrative of some, but not restrictive, of the broad invention, and that the appended drawings illustrate preferred embodiments of the invention and do not limit the scope of the invention. This application is capable of embodiments in many different forms and is provided for the purpose of enabling a thorough understanding of the disclosure of the application. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that the present application may be practiced without modification or with equivalents of some of the features described in the foregoing embodiments. All equivalent structures made by using the contents of the specification and the drawings of the present application are directly or indirectly applied to other related technical fields and are within the protection scope of the present application.
Claims (10)
1. A laser processing apparatus, characterized by comprising: the laser beam deflection device comprises a laser output assembly, a beam deflection element, a focusing element and an image detection assembly;
the laser output assembly, the beam deflection element and the focusing element form a laser processing light path for processing a product, and laser output by the laser output assembly is projected to a processing position on the objective table through the laser processing light path;
the light beam deflection element, the focusing element and the image acquisition assembly form a laser detection light path for detecting laser energy distribution, and laser reflected from the processing position is acquired and detected by the image acquisition assembly through the laser detection light path.
2. The laser processing apparatus of claim 1, further comprising a lens element positioned between the beam deflecting element and the image capturing assembly, the lens element being coaxial with the focusing element.
3. The laser processing apparatus of claim 1, wherein the laser output assembly comprises: a laser and an optical path transmission element; the laser is used for generating laser beams, and the optical path transmission element is used for converting the laser beams incident to the laser into processing beams.
4. The laser processing apparatus of claim 3, wherein the optical path transmission element comprises one or more of a reflection unit, a collimation unit, or a shaping unit.
5. The laser processing apparatus according to claim 1, wherein the beam deflecting element has a splitting ratio of less than 2: 98 beam splitter or mirror with reflectivity greater than 98%.
6. The laser machining apparatus of claim 1, wherein the image acquisition assembly includes a CCD camera coaxial with the focusing element and the lens assembly and a computer coupled to the CCD camera.
7. The laser processing apparatus according to claim 1, further comprising a reflection element provided at a processing position on the stage to reflect the laser light output from the laser output assembly, the reflected laser light being collected and detected by the image collecting assembly through the laser detection optical path.
8. A laser machining apparatus according to any one of claims 1 to 6 further comprising movement means connected to the focusing element or stage for moving the focusing element and stage relative to each other.
9. A laser processing method using the laser processing apparatus according to any one of claims 1 to 8, the method comprising the steps of:
the laser emits a light beam to the objective table;
reflected light beams are reflected by a reflecting element arranged on the objective table or a processed product, and the reflected light beams are incident to the image acquisition assembly through a laser detection light path;
the image acquisition assembly analyzes the reflected light beam to obtain a transverse energy distribution image of the laser spot;
adjusting the position of the focusing element for multiple times, receiving and analyzing a primary reflected light beam through the image acquisition assembly after each adjustment to obtain laser spot transverse energy distribution images at different axial positions, and drawing the laser spot transverse energy distribution images into curves along the axial direction to obtain laser spot axial energy distribution curves;
and determining the position of the focusing element according to the laser spot axial energy distribution curve so as to adjust the laser processing light path.
10. The laser machining method according to claim 9, further comprising:
and changing the optical path structure formed by the focusing element and the lens element by adjusting the focal length and the position of the lens element so as to enlarge the light spot distribution on the surface of the processed product or the reflecting element by a certain proportion and acquire the light spot distribution by the image acquisition assembly, wherein the enlargement proportion is controlled by adjusting the focal length and the position of the lens element.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114160966A (en) * | 2021-12-28 | 2022-03-11 | 镭射谷科技（深圳）股份有限公司 | Laser processing apparatus |
| CN114178723A (en) * | 2021-12-09 | 2022-03-15 | 中国科学院西安光学精密机械研究所 | Folded light path laser cutting head debugging method |
| CN115657412A (en) * | 2022-12-28 | 2023-01-31 | 歌尔股份有限公司 | Optical path calibration device and optical path adjustment method |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07132391A (en) * | 1993-11-10 | 1995-05-23 | Niigata Eng Co Ltd | Method for automatically grasping focus position in laser beam machine |
| JPH09304684A (en) * | 1996-05-15 | 1997-11-28 | Citizen Watch Co Ltd | Converging type autofocusing method |
| US20050121596A1 (en) * | 2002-03-13 | 2005-06-09 | Yeda Research And Development Company Ltd. | Auto-focusing method and device |
| CN101354481A (en) * | 2007-07-25 | 2009-01-28 | 奥林巴斯株式会社 | Laser irradiation apparatus and laser processing system using the same |
| CN101422848A (en) * | 2008-11-21 | 2009-05-06 | 陈伟良 | Distance-measurement focusing method applied for laser cutting processing |
| CN101673666A (en) * | 2008-09-12 | 2010-03-17 | 奥林巴斯株式会社 | Laser repair device and a laser repair method |
| CN102430858A (en) * | 2011-10-10 | 2012-05-02 | 华中科技大学 | Automatic focusing adjustor for laser processing |
| CN102896420A (en) * | 2011-07-27 | 2013-01-30 | 三星钻石工业股份有限公司 | Focusing position adjusting method, focusing position adjusting device, and laser processing device |
| US20140042133A1 (en) * | 2011-04-12 | 2014-02-13 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Apparatus for focusing a laser beam and method for monitoring a laser processing operation |
| US20160045980A1 (en) * | 2014-08-18 | 2016-02-18 | Disco Corporation | Laser beam spot shape detection method |
| CN206010147U (en) * | 2016-09-05 | 2017-03-15 | 苏州大学 | A kind of automatic focusing adjustor for laser processing |
| CN106624389A (en) * | 2017-02-22 | 2017-05-10 | 西安交通大学 | Optical fiber cutting device and method based on ultra-short pulse lasers |
| CN109623172A (en) * | 2019-01-31 | 2019-04-16 | 大族激光科技产业集团股份有限公司 | A kind of laser cutting method and device of optical filter |
| JP2019068077A (en) * | 2018-11-20 | 2019-04-25 | 株式会社東京精密 | Laser processing device and laser processing method |
| CN110121398A (en) * | 2016-08-30 | 2019-08-13 | 康宁股份有限公司 | The laser processing of transparent material |
-
2020
- 2020-04-27 CN CN202010342490.9A patent/CN113634877A/en active Pending
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07132391A (en) * | 1993-11-10 | 1995-05-23 | Niigata Eng Co Ltd | Method for automatically grasping focus position in laser beam machine |
| JPH09304684A (en) * | 1996-05-15 | 1997-11-28 | Citizen Watch Co Ltd | Converging type autofocusing method |
| US20050121596A1 (en) * | 2002-03-13 | 2005-06-09 | Yeda Research And Development Company Ltd. | Auto-focusing method and device |
| CN101354481A (en) * | 2007-07-25 | 2009-01-28 | 奥林巴斯株式会社 | Laser irradiation apparatus and laser processing system using the same |
| CN101673666A (en) * | 2008-09-12 | 2010-03-17 | 奥林巴斯株式会社 | Laser repair device and a laser repair method |
| CN101422848A (en) * | 2008-11-21 | 2009-05-06 | 陈伟良 | Distance-measurement focusing method applied for laser cutting processing |
| US20140042133A1 (en) * | 2011-04-12 | 2014-02-13 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Apparatus for focusing a laser beam and method for monitoring a laser processing operation |
| CN102896420A (en) * | 2011-07-27 | 2013-01-30 | 三星钻石工业股份有限公司 | Focusing position adjusting method, focusing position adjusting device, and laser processing device |
| CN102430858A (en) * | 2011-10-10 | 2012-05-02 | 华中科技大学 | Automatic focusing adjustor for laser processing |
| US20160045980A1 (en) * | 2014-08-18 | 2016-02-18 | Disco Corporation | Laser beam spot shape detection method |
| CN110121398A (en) * | 2016-08-30 | 2019-08-13 | 康宁股份有限公司 | The laser processing of transparent material |
| CN206010147U (en) * | 2016-09-05 | 2017-03-15 | 苏州大学 | A kind of automatic focusing adjustor for laser processing |
| CN106624389A (en) * | 2017-02-22 | 2017-05-10 | 西安交通大学 | Optical fiber cutting device and method based on ultra-short pulse lasers |
| JP2019068077A (en) * | 2018-11-20 | 2019-04-25 | 株式会社東京精密 | Laser processing device and laser processing method |
| CN109623172A (en) * | 2019-01-31 | 2019-04-16 | 大族激光科技产业集团股份有限公司 | A kind of laser cutting method and device of optical filter |
Non-Patent Citations (1)
| Title |
|---|
| 张冬云: "激光先进制造基础实验", 北京工业大学出版社, pages: 197 - 198 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114178723A (en) * | 2021-12-09 | 2022-03-15 | 中国科学院西安光学精密机械研究所 | Folded light path laser cutting head debugging method |
| CN114178723B (en) * | 2021-12-09 | 2022-08-19 | 中国科学院西安光学精密机械研究所 | Folded light path laser cutting head debugging method |
| CN114160966A (en) * | 2021-12-28 | 2022-03-11 | 镭射谷科技（深圳）股份有限公司 | Laser processing apparatus |
| CN115657412A (en) * | 2022-12-28 | 2023-01-31 | 歌尔股份有限公司 | Optical path calibration device and optical path adjustment method |
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