CN101793990A - Processing method for cutting and forming rectangular infrared filter - Google Patents
Processing method for cutting and forming rectangular infrared filter Download PDFInfo
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- CN101793990A CN101793990A CN201010101835A CN201010101835A CN101793990A CN 101793990 A CN101793990 A CN 101793990A CN 201010101835 A CN201010101835 A CN 201010101835A CN 201010101835 A CN201010101835 A CN 201010101835A CN 101793990 A CN101793990 A CN 101793990A
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Abstract
The invention discloses a processing method for cutting and forming a rectangular infrared filter, which is applied to the technology of multi-band infrared detector integrated package. A main mounting piece structure for the processing method for cutting and forming the rectangular infrared filter comprises a base metal of the infrared filter, an auxiliary forming silicon chip, a photoresist, white wax, an aligned etched line. By introducing specific treatment methods in aspects of gluing protection of the infrared filter, etching the aligned etched line, cutting processing, washing out protective glue, and the like, and through a specific structure and operating steps, the processing method for cutting and forming the rectangular infrared filter is realized. Therefore, a small-dimension rectangular infrared filter which cannot be realized by the traditional processing methods can be obtained through processing, and mechanical damage and water pollution on a filter film system are effectively reduced.
Description
Technical field
The present invention relates to the optical element technology, specifically refer to a kind of job operation of rectangular infrared filter excision forming.
Background technology
High-performance multiband infrared eye is the critical component of space flight, airborne remote sensing instrument, by means of the face of land and the atmospheric information that it can obtain to enrich, carries out resource exploration, weather forecast, crops the yield by estimation, environmental monitoring etc.In order to realize the multiband detection, improve detector dynamic range and detection sensitivity, suppress Infrared background radiation, in the multiband infrared eye, the infrared fileter group of a plurality of specific band scopes can be installed all before the detection light activated element.Along with integrated, the miniaturization development development of multiband infrared eye, its infrared filtering chip size that needs is more and more littler, requires also more and more higher to the piece between optical filter.Require infrared fileter to be of a size of long 3.5mm * wide 1.5mm * thickness 0.2mm as certain engineering project, infrared fileter in long and wide both direction effective light transmission scope from the dimensional requirement at parent edge less than 0.02mm.And infrared fileter is the optical filter parent to be carried out certain masking process, is coated with by vacuum to obtain after certain multilayer film structure is.Shelving in masking process and the technique for vacuum coating can cause infrared fileter effective light transmission scope from the size of matrix border at least greater than 0.5mm, obvious this infrared fileter is can't be directly with doing the small size infrared fileter of effective light transmission scope from the multiband infrared eye of the dimensional requirement strictness of matrix border.
To main wired wire drawing cutting and the two kinds of methods of mechanical wheeled cutting of taking turns of the classic method of infrared fileter mother metal cutting processing.Line wheel wire drawing cutting is to be arranged relatively in twos by many groups line wheel, has a undercut to cut silk again and wears on the line wheel, just can process the infrared fileter that obtains different size by the spacing between the control line wheel.Its advantage is to cut simultaneously and obtains multiple optical filters and less to the injury of optical filter, but along with the compact in size demand of optical filter improves day by day, the limitation of traditional job operation is also obvious day by day: (1) is owing to be subjected to the congenital restriction of line wheel wire drawing structure, the size of its processing optical filter can not be less than the diameter dimension of line wheel, so this job operation can not realize the moulding requirement of small pieces optical filter smaller szie.(2) line wheel wire drawing cutting machine range of application is little, complex structure, and complex operation, the equipment manufacturing cost height, these have all restricted the development of this kind cutting mode.It is to utilize mechanical wheeled cutting machine processing optical filter that traditional diamond-making technique also has a kind of, with blade directly on the optical filter mother metal cutting obtain optical filter, though this kind optical filter forming method can be realized the small pieces moulding of optical filter, but also there is following problem in it: the blade wheel of (1) high speed rotating mechanically cuts optical filter, can cause very big injury to the assembly of thin films medium on optical filter surface; (2) cutting process need be used water and cools off blade, and water can pollute optical filter film system.Existing in sum optical filter job operation all can't reach the small size moulding requirement of infrared fileter well.
Summary of the invention
The job operation that the purpose of this invention is to provide a kind of rectangular infrared filter excision forming, overcome and solved some problems and a difficult problem in the preparation of existing infrared fileter, satisfied the multiband infrared eye small size and effective light transmission scope demand from the infrared fileter of the dimensional requirement strictness of matrix border.
The present invention is a kind of job operation of rectangular infrared filter excision forming: 1) infrared fileter such as accompanying drawing 1 are mounted part by certain processing step installation formation, it mainly comprises assistant formation silicon chip 1, Chinese wax 2, infrared fileter mother metal 3, photoresist 4, contraposition groove 5.Assistant formation silicon chip 1 also is the carrier of contraposition groove 5 for infrared fileter mother metal 3 provides one carrier is installed simultaneously.Chinese wax 2 is media that infrared fileter mother metal 3 and assistant formation silicon chip 1 install and fix.Photoresist 4 plays the protective effect to film system on the infrared fileter mother metal 3, in order to avoid the pollution that water to film is in the mechanical damage of infrared fileter and the process; 2) use monofilament wire drawing cutting machine cutting processing on request; 3), thereby obtain needed miniature rectangular infrared filter by the part that mounts after certain processing step processing cutting.
Key step of the present invention is as follows:
1) germanium wafer of infrared fileter mother metal 3 for having specific band infrared filtering ability makes with photoresist and 4 evenly smears parcel infrared fileter mother metal 3, and photoresist 4 can be cut to add and play a very good protection man-hour at infrared fileter.Find by microscopic examination, make the suffered injury meeting of its work in-processes of infrared fileter of 4 protections with photoresist than do not make with photoresist 4 littler.
When 2) selecting assistant formation silicon chip 1 for use, require its diameter dimension need be than the diameter dimension of infrared fileter mother metal 3 big 10mm～20mm, its thickness range is at 0.5mm～1mm.
3) on the warm table Chinese wax 2 is being melted on assistant formation silicon chip 1; to have the infrared fileter mother metal 3 of photoresist 4 parcel protection to be placed on the central authorities that have the assistant formation silicon chip 1 that melts Chinese wax 2 again, wait Chinese wax 2 cooling curings after infrared fileter mother metal 3 promptly be adhesively fixed together by Chinese wax 2 with assistant formation silicon chip 1.
4) portrayal contraposition groove 5, use groove equipment such as mechanical dividing machine or laser beam marking machine, be fixed with on the assistant formation silicon chip 1 of infrared fileter mother metal 3 dimensional requirement according to the moulding optical filter in the horizontal and vertical directions respectively by equidistant requirement portrayal contraposition lines.Can obtain the grid that surrounds with vertical contraposition groove 5 place straight lines by laterally at last, its size is exactly the size of rectangular infrared filter to be processed.Note only portrayal contraposition groove 5 on assistant formation silicon chip 1.So just obtained infrared fileter mother metal 3, Chinese wax 2 and have contraposition groove 5 assistant formation silicon chip 1 mount part.
5) infrared fileter mother metal 3, Chinese wax 2 and the part that mounts that has an assistant formation silicon chip 1 of contraposition groove 5 are fixed on the workbench of wire drawing cutting machine, make the x direction that mounts part as shown in drawings parallel with wire drawing.
6) with first contraposition groove 5 on the x direction on the silk thread aligning assistant formation silicon chip 1 of wire drawing cutting machine.
7) start the wire drawing cutting machine, infrared fileter is carried out cutting processing, depth of cut is to 1/2nd places of silicon wafer thickness.
8) repeating step 6) and 7) cutting of optical filter of other contraposition groove 5 positions of this direction finished.
9) will mount part and on worktable, revolve to turn 90 degrees and make the y direction that mounts part parallel,, 7 again according to step 6) with wire drawing), 8) finish the cutting processing of the infrared fileter mother metal 3 of this direction.
10) will mount part heats from being placed on heating furnace after worktable takes off.After treating Chinese wax 2 fusing, the infrared fileter of the rectangle of moulding is taken off from assistant formation silicon chip 1 with homalocephalus bamboo tweezers.For avoiding damaging infrared fileter, requirement is taken off at infrared fileter and is avoided colliding with other infrared fileter that does not take off in the process, and in taking off the optical filter process, require the optical filter of tweezers clamping to take off vertically upward, notice that optical filter does not allow parallel dragging on Chinese wax 2 in order to avoid optical filter film system damaged.
11) the small pieces infrared fileter that obtains is at first cleaned with acetone, push away with writing brush again and sweep its surface, remove the photoresist 4 on surface, at last the small pieces infrared fileter is cleaned one time with anhydrous alcohol.
12) finished product is put into baking oven, under 40 ℃ of temperature, dry optical filter surface residual alcohol, finally obtain the rectangular infrared filter finished product of machine-shaping.
Advantage of the present invention is:
1) can realize processing the infrared fileter of wide range of size, and can process and obtain the small size infrared fileter that traditional diamond-making technique can't be realized.
2) make with photoresist 4 protection infrared fileter mother metals 3 effectively reduce the pollution of mechanical damage in the wire drawing cutting process and water to optical filter film system.
3) equipment is simple, makes the processing of infrared fileter have more operability and low processing cost.
4) use assistant formation silicon chip 1 infrared fileter mother metal 3 to be played the certain protection effect as the carrier work in-process, but and its repeated multiple times use.
Description of drawings
Mount the part synoptic diagram in the processing of Fig. 1 rectangular infrared filter excision forming;
Among the figure: 1-assistant formation silicon chip;
2-Chinese wax;
3-infrared fileter mother metal;
The 4-photoresist;
5-contraposition groove.
Embodiment
Below in conjunction with accompanying drawing and embodiment the specific embodiment of the present invention is described in further detail: present embodiment is the job operation of certain space flight project with rectangular infrared filter excision forming in the multiband infrared detector module.Require its infrared fileter to be of a size of 3.5mm * 1.5mm * 0.2mm and optical filter edge and do not have the width of film system less than 20 microns.The processing of rectangular infrared filter excision forming mounts part as shown in Figure 1, and it mainly is made up of assistant formation silicon chip 1, Chinese wax 2 (model OCON-199,65 ℃ of fusing points), infrared fileter mother metal 3, photoresist 4 (model AZ4620, positive glue), contraposition groove 5.The main implementation step of the job operation of rectangular infrared filter excision forming is as follows:
1) germanium wafer that the infrared fileter mother metal of selecting for use 3 has specific band infrared filtering ability for the thick 0.2mm of φ 12mm.Make 4 (model AZ4620) with photoresist, with writing brush photoresist 4 is evenly spread upon on face of infrared fileter mother metal, toasted 60 minutes under 60 ℃ of environment with baking oven, take out infrared fileter and on its lap, smear photoresist 4 equally again, and under 60 ℃ of environment, toasted 60 minutes with baking oven.
2) assistant formation silicon chip 1 is the silicon chip of the thick 0.5mm of φ 40mm, and assistant formation silicon chip 1 cleans with acetone earlier, then uses alcohol wash one time, cleans one time with ionized water again, uses baking oven (45 ℃) oven dry at last.
3) the use fusing point is 65 ℃ a Chinese wax 2; on the warm table 0.1 Chinese wax 2 that restrains is being placed on fusing on the assistant formation silicon chip 1; to have the infrared fileter mother metal 3 of photoresist 4 parcel protections to be placed on the bamboo tweezers more has on the assistant formation silicon chip 1 that melts Chinese wax 2; adjust infrared fileter mother metal 3 positions gently with the bamboo tweezers and make it occupy in the middle of the assistant formation silicon chip 1 as far as possible and flatten infrared fileter mother metal 3 gently, take off assistant formation silicon chip 1 from warm table and make Chinese wax 2 cooling curings.
4) use optical alignment blaze machine PSV-6001 in the dimensional requirement that is fixed with on the assistant formation silicon chip 1 of infrared fileter mother metal 3 according to the small pieces infrared fileter, at first portray a contraposition groove 5 again to 3.5 millimeters parallel portrayal contraposition grooves 5 of both sides spacing on assistant formation silicon chip 1 through infrared fileter mother metal 3 centers in the x direction, a contraposition groove 5 is respectively portrayed in the center line both sides.Same also portrays a contraposition groove 5 again to 1.5 millimeters parallel portrayal contraposition grooves 5 of both sides spacing through infrared fileter mother metal 3 centers in the y direction on assistant formation silicon chip 1, three contraposition grooves 5 are respectively portrayed in the center line both sides.So just obtained infrared fileter mother metal 3, Chinese wax 2 and have contraposition groove 5 assistant formation silicon chip 1 mount part.
5) infrared fileter mother metal 3, Chinese wax 2 and the part that mounts that has an assistant formation silicon chip 1 of contraposition groove 5 are fixed on the workbench of wire drawing cutting machine PSW-1000, allow the x direction that mounts part shown in the accompanying drawing parallel when installing and fixing with wire drawing.
6) by microscopic examination cutting silk thread (the used silk thread diameter of Ben Lasi cutting machine is 0.04mm) and contraposition groove 5, the adjusting knob on the alignment jig is aimed at first contraposition groove 5 on the x direction (any side) on the assistant formation silicon chip 1 with wire drawing.On cutting surface and silk thread, smear lapping compound again---the white alundum powder aqueous solution.
7) start the wire drawing cutting machine, infrared fileter mother metal 3 is carried out cutting processing, stop cutting when depth of cut is to silicon wafer thickness 1/2 place by the time.
8) repeating step 6) and 7) cutting of infrared fileter mother metal 3 of other contraposition groove 5 positions of this direction finished according to the order of sequence.
9) will mount part and on worktable, revolve to turn 90 degrees and make the y direction that mounts part parallel,, 7 again according to step 6) with wire drawing), 8) finish the cutting of the infrared fileter mother metal 3 of this direction.
10) will mount part heats from being placed on heating furnace after worktable takes off.After treating Chinese wax 2 fusings, 12 rectangular infrared filters that wherein cut aftershaping are taken off from assistant formation silicon chip 1 with the bamboo tweezers.
12 miniature infrared fileters that 11) will obtain at first clean with acetone, push away with writing brush and sweep its surface, remove the photoresist 4 that shields, and at last the small pieces infrared fileter are cleaned one time with anhydrous alcohol.
12) finished product is put into baking oven, under 40 ℃ of temperature, dry optical filter surface residual alcohol, finally obtain the rectangular infrared filter finished product of machine-shaping.
Below just finished the processing of rectangular infrared filter excision forming.
Claims (2)
1. the job operation of a rectangular infrared filter excision forming is characterized in that may further comprise the steps:
The photoresist (4) that plays a protective role during 1) with cutting processing is smeared equably and is wrapped on the infrared fileter mother metal (3);
2) on warm table, Chinese wax (2) is gone up fusing at assistant formation silicon chip (1), to there be the infrared fileter mother metal (3) of photoresist (4) parcel protection to be placed on the central authorities that have the assistant formation silicon chip (1) that melts Chinese wax (2) again, behind Chinese wax (2) cooling curing, infrared fileter mother metal (3) is adhesively fixed together with assistant formation silicon chip (1);
3) portrayal contraposition groove (5), use mechanical dividing machine or laser beam marking machine groove equipment, upward portray the contraposition lines by equidistant requirement respectively in the horizontal and vertical directions at the assistant formation silicon chip (1) that is fixed with infrared fileter mother metal (3) according to the dimensional requirement of moulding optical filter, can obtain the grid that surrounds with vertical contraposition groove (5) place straight line by laterally at last, its size is exactly the size of rectangular infrared filter to be processed; Infrared fileter mother metal (3), Chinese wax (2) and the assistant formation silicon chip (1) that has a contraposition groove (5) constitute and to mount part;
4) part that mounts described in the step 3 is fixed on the workbench of wire drawing cutting machine, upward the contraposition lines of cut direction should be parallel with the wire drawing of wire drawing cutting machine for contraposition groove (5);
5) with the first contraposition groove (5) on the last cut direction of the silk thread aligning assistant formation silicon chip (1) of wire drawing cutting machine;
6) start the wire drawing cutting machine, infrared fileter is carried out cutting processing, depth of cut is to 1/2nd places of silicon wafer thickness;
7) repeating step 5 and 6 is finished the cutting of optical filter of other contraposition groove (5) position of this direction;
8) will mount part and revolve to turn 90 degrees on worktable and make the contraposition lines of the other direction that mounts part parallel with wire drawing, again according to step 5,6,7 finish the cutting processing of the infrared fileter mother metal (3) of this direction;
9) will mount part and heat from being placed on heating furnace after worktable takes off, treat Chinese wax (2) fusing after, the infrared fileter of the rectangle of moulding is taken off from assistant formation silicon chip (1) with homalocephalus bamboo tweezers;
10) the small pieces infrared fileter that takes off is at first cleaned with acetone, push away with writing brush again and sweep its surface, remove the photoresist (4) on surface, at last the small pieces infrared fileter is cleaned one time with anhydrous alcohol;
11) finished product is put into baking oven, under 40 ℃ of temperature, dry optical filter surface residual alcohol, finally obtain the rectangular infrared filter finished product of machine-shaping.
2. the job operation of a kind of rectangular infrared filter excision forming according to claim 1, it is characterized in that: the diameter dimension of described assistant formation silicon chip (1) is than the big 10mm～20mm of diameter dimension of infrared fileter mother metal (3), and its thickness is 0.5mm～1mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010101018358A CN101793990B (en) | 2010-01-27 | 2010-01-27 | Processing method for cutting and forming rectangular infrared filter |
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| CN2010101018358A CN101793990B (en) | 2010-01-27 | 2010-01-27 | Processing method for cutting and forming rectangular infrared filter |
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| CN101793990A true CN101793990A (en) | 2010-08-04 |
| CN101793990B CN101793990B (en) | 2011-08-10 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103639090A (en) * | 2013-11-29 | 2014-03-19 | 苏州晓炎自动化设备有限公司 | Full-automatic high-efficiency net sticking and discharging machine |
| CN107843949A (en) * | 2017-11-20 | 2018-03-27 | 北京空间机电研究所 | A kind of high accuracy positioning carries the ultraprecise optical filter of error compensation |
| CN109623172A (en) * | 2019-01-31 | 2019-04-16 | 大族激光科技产业集团股份有限公司 | A kind of laser cutting method and device of optical filter |
| CN112873293A (en) * | 2020-12-24 | 2021-06-01 | 别清杰 | Dedicated device of tailorring of image branch of academic or vocational study |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1330009C (en) * | 2003-03-05 | 2007-08-01 | 中国科学院半导体研究所 | Manufacture of small-size GaN-base blue and green LED die |
| CN101158790A (en) * | 2006-10-08 | 2008-04-09 | 中华映管股份有限公司 | Active element array substrates and cutting method thereof |
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2010
- 2010-01-27 CN CN2010101018358A patent/CN101793990B/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103639090A (en) * | 2013-11-29 | 2014-03-19 | 苏州晓炎自动化设备有限公司 | Full-automatic high-efficiency net sticking and discharging machine |
| CN103639090B (en) * | 2013-11-29 | 2016-04-20 | 苏州道众机械制造有限公司 | Full automatic high efficiency sticky net unloads net machine |
| CN107843949A (en) * | 2017-11-20 | 2018-03-27 | 北京空间机电研究所 | A kind of high accuracy positioning carries the ultraprecise optical filter of error compensation |
| CN107843949B (en) * | 2017-11-20 | 2020-08-14 | 北京空间机电研究所 | High-precision positioning ultra-precise optical filter with error compensation function |
| CN109623172A (en) * | 2019-01-31 | 2019-04-16 | 大族激光科技产业集团股份有限公司 | A kind of laser cutting method and device of optical filter |
| CN109623172B (en) * | 2019-01-31 | 2020-10-23 | 大族激光科技产业集团股份有限公司 | Laser cutting method and device for optical filter |
| CN112873293A (en) * | 2020-12-24 | 2021-06-01 | 别清杰 | Dedicated device of tailorring of image branch of academic or vocational study |
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| CN101793990B (en) | 2011-08-10 |
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