CN109616588B

CN109616588B - Packaging structure and packaging method of light-emitting device and display device

Info

Publication number: CN109616588B
Application number: CN201811486626.2A
Authority: CN
Inventors: 臧丹丹; 李杰威; 高昕伟; 李朋
Original assignee: BOE Technology Group Co Ltd; Hefei Xinsheng Optoelectronics Technology Co Ltd
Current assignee: BOE Technology Group Co Ltd; Hefei Xinsheng Optoelectronics Technology Co Ltd
Priority date: 2018-12-06
Filing date: 2018-12-06
Publication date: 2020-10-30
Anticipated expiration: 2038-12-06
Also published as: CN109616588A

Abstract

The invention discloses a packaging method and a packaging structure of a light-emitting device and a display device. The packaging method comprises the steps of preparing a device substrate and a packaging substrate, wherein the device substrate comprises a base and a light-emitting device arranged on the base; the packaging substrate comprises a packaging cover plate and a packaging structure layer which is arranged on the packaging cover plate and comprises a spacer layer, wherein the spacer layer is used for enabling one side surface of the packaging structure layer, which is far away from the packaging cover plate, to be a flat surface; and oppositely pressing the packaging substrate and the device substrate, and attaching the surface of one side of the packaging structure layer, which is far away from the packaging cover plate, to the surface of the substrate. By adopting the packaging method, the surface of one side of the packaging structure layer, which is pressed with the device substrate, can be attached to the surface of the substrate by only one pressing process, so that the packaging edge area is ensured to have good packaging effect, and the packaging process time and cost of the packaging structure are reduced.

Description

Packaging structure and packaging method of light-emitting device and display device

Technical Field

The invention relates to the technical field of display device packaging, in particular to a packaging structure and a packaging method of a light-emitting device and a display device.

Background

A Light Emitting device in an Organic Light-Emitting Diode (OLED) is very easy to react with moisture, oxygen, and other components in the air, and therefore, the Light Emitting device needs to be strictly separated from water and oxygen in the environment to prolong the service life of the Light Emitting device.

The package structure in the prior art includes a device substrate and a package substrate that are aligned. The packaging substrate comprises a packaging cover plate and a packaging structure layer arranged on one side of the packaging cover plate facing the device substrate. The packaging structure layer comprises a barrier layer and an adhesive buffer layer arranged on one side of the barrier layer, which faces the device substrate. Since the covering area of the barrier layer is the same as that of the adhesive buffer layer, the barrier layer cannot cover the packaging boundary area (the area around the adhesive buffer layer), so that water and oxygen easily invade into the device substrate from the packaging boundary area, and the light-emitting device of the device substrate fails. In order to enable the blocking layer to cover the packaging boundary area, the covering area of the blocking layer can be larger than that of the bonding buffer layer, but the thickness of the film layer at the edge of the packaging structure layer is smaller than that of the film layer in the middle, a pressing process is needed for multiple times, the process time and the cost of the packaging structure are increased, the pressing at the edge has high requirements on the precision of pressing equipment, and the process difficulty is high.

Disclosure of Invention

An object of the embodiments of the present invention is to provide a package structure, a package method and a display device of a light emitting device, so as to reduce the number of times of a pressing process in a process of forming the package structure.

In order to solve the technical problem, an embodiment of the present invention provides a method for packaging a light emitting device, where the method includes:

preparing a device substrate and a packaging substrate, wherein the device substrate comprises a substrate and a light-emitting device arranged on the substrate; the packaging substrate comprises a packaging cover plate and a packaging structure layer which is arranged on the packaging cover plate and comprises a spacer layer, wherein the spacer layer is used for enabling one side surface of the packaging structure layer, which is far away from the packaging cover plate, to be a flat surface;

and oppositely pressing the packaging substrate and the device substrate, and attaching the surface of one side of the packaging structure layer, which is far away from the packaging cover plate, to the surface of the substrate.

Optionally, the preparing the package substrate includes,

preparing a packaging structure layer, wherein the packaging structure layer comprises a blocking layer arranged on the packaging cover plate and an adhesive buffer layer arranged on the blocking layer, the orthographic projection of the adhesive buffer layer on the packaging cover plate is positioned in the orthographic projection of the blocking layer on the packaging cover plate, the spacer layer is arranged on the blocking layer around the periphery of the blocking layer, and the height of the spacer layer is equal to that of the blocking layer;

attaching the packaging structure layer on the packaging cover plate, so that one side of the blocking layer, which is deviated from the bonding buffer layer, faces the packaging cover plate.

Optionally, the preparing the package structure layer includes:

preparing a packaging adhesive film and preparing a bonding buffer layer coiled material, wherein the preparing of the packaging adhesive film comprises the following steps: forming the barrier layer on the first protective film; forming the spacer layer on the barrier layer, the spacer layer having an inner circumferential boundary and an outer circumferential boundary; the bonding buffer layer coiled material comprises a bonding buffer layer which is arranged on the second protective film and corresponds to an area surrounded by the inner peripheral boundary of the barrier layer, and the thickness of the bonding buffer layer is equal to that of the barrier layer;

and oppositely pressing the packaging adhesive film and the bonding buffer layer coiled material to form a packaging structure layer positioned between the first protective film and the second protective film, wherein the bonding buffer layer is positioned in an area surrounded by the inner peripheral boundary of the spacer layer.

Optionally, the manufacturing of the package substrate includes manufacturing a cover structure layer and manufacturing a sheet-like adhesive film,

preparing a cover structure layer includes forming a spacer layer on the package cover, the spacer layer having an inner perimeter boundary and an outer perimeter boundary; the sheet adhesive film comprises a blocking layer and an adhesive buffer layer arranged on the blocking layer, the thickness of the adhesive buffer layer is equal to that of the spacer layer, and the adhesive buffer layer corresponds to an area surrounded by the inner peripheral boundary of the spacer layer;

will the slice glued membrane is attached on the apron structural layer, make the one side orientation that deviates from of barrier layer the bonding buffer layer the apron structural layer, the barrier layer covers the spacer layer and the region that the inner periphery border was enclosed, the bonding buffer layer is located the region that the inner periphery border was enclosed.

Optionally, the preparing the sheet-like adhesive film includes:

forming a barrier layer on the first protective film;

forming an adhesive buffer layer on the second protective film, wherein the thickness of the adhesive buffer layer is equal to that of the spacer layer;

and oppositely pressing the first protective film and the second protective film to form a sheet-shaped adhesive film between the first protective film and the second protective film.

Optionally, the outer perimeter boundary of the spacer layer is flush with the outer perimeter boundary of the barrier layer.

Optionally, the spacer layer and the barrier layer are made of the same material, and hygroscopic particles are doped in the spacer layer and the barrier layer.

Optionally, the thickness of the spacer layer is 10 μm to 30 μm, and the thickness of the barrier layer is 10 μm to 30 μm.

In order to solve the above technical problem, an embodiment of the present invention further provides a package structure of a light emitting device, including a device substrate and a package substrate laminated in opposite directions,

a device substrate including a substrate and a light emitting device disposed on the substrate;

packaging substrate, be in including encapsulation apron and setting encapsulation structure layer on the encapsulation apron and containing the spacer layer, the spacer layer is used for making the deviating from of encapsulation structure layer a side surface of encapsulation apron is flat surface, deviating from of encapsulation structure layer a side surface of encapsulation apron with the surface laminating of basement.

Optionally, the packaging structure layer still includes the setting and is in barrier layer on the encapsulation apron and setting are in bonding buffer layer on the barrier layer, bonding buffer layer is in orthographic projection on the encapsulation apron is located the barrier layer is in orthographic projection on the encapsulation apron, the spacer layer centers on the periphery of bonding buffer layer sets up on the barrier layer, the height of spacer layer with the height of bonding buffer layer equals.

Optionally, the spacer layer sets up on the encapsulation apron, the spacer layer has inner peripheral border and outer peripheral border, packaging structure layer still includes barrier layer and bonding buffer layer, the barrier layer sets up on the spacer layer just the barrier layer covers the spacer layer with the region that the inner peripheral border encloses, the bonding buffer layer sets up on the barrier layer just the bonding buffer layer is located in the region that the inner peripheral border encloses, the thickness of bonding buffer layer with the thickness of spacer layer equals.

In order to solve the above technical problem, an embodiment of the present invention further provides a display device, including the package structure described above.

According to the packaging method of the light-emitting device, the packaging structure layer comprises the spacer layer, and the spacer layer enables the surface of one side, away from the packaging cover plate, of the packaging structure layer to be a flat surface, so that when the packaging substrate and the device substrate are oppositely pressed, the surface of one side, pressed with the device substrate, of the packaging structure layer can be attached to the surface of the substrate through one-time pressing process, and the packaging edge area is guaranteed to have a good packaging effect. The packaging method of the embodiment of the invention does not need to carry out secondary pressing aiming at the edge area, thereby shortening the packaging process time and cost of the packaging structure. Because the second pressing fit is not needed to be carried out on the edge area, the phenomenon that the packaging cover plate deforms in the edge area to cause larger stress can be avoided, the packaging structure is firmer, and meanwhile, the precision requirement on the pressing fit equipment is reduced.

Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

Drawings

The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention.

Fig. 1 is a schematic structural view of a package structure of a light emitting device in the related art;

FIG. 2a is a schematic diagram of a device substrate;

FIG. 2b is a schematic diagram of a package substrate;

fig. 2c is a schematic view of a package structure obtained by first laminating the device substrate shown in fig. 2a and the package substrate shown in fig. 2 b;

fig. 2d is a schematic view of the package structure obtained after the package structure shown in fig. 2c is pressed again;

fig. 3 is a schematic view of a packaging method of a light emitting device according to an embodiment of the present invention;

FIG. 4a is a cross-sectional view of a package substrate according to a first embodiment of the present invention;

FIG. 4b is a schematic top view of a package substrate according to the first embodiment of the present invention;

FIG. 5 is a diagram illustrating a package structure according to a first embodiment of the present invention;

FIG. 6 is a schematic view illustrating a process for manufacturing a package structure layer according to a first embodiment of the present invention;

FIG. 7a is a schematic view of a structure after forming a barrier layer according to a first embodiment of the present invention;

FIG. 7b is a schematic view of the spacer layer after being formed according to the first embodiment of the present invention;

FIG. 7c is a schematic view of a first embodiment of an adhesive buffer web according to the present invention;

FIG. 8a is a schematic structural diagram of a package structure layer according to a first embodiment of the present invention;

FIG. 8b is a schematic view of the cross-sectional structure A-A of FIG. 8 a;

FIG. 9a is a cross-sectional view of a package substrate formed in a third embodiment of the present invention;

FIG. 9b is a schematic top view of a package substrate according to a third embodiment of the present invention;

FIG. 10 is a diagram of a package structure formed according to a third embodiment of the present invention;

FIG. 11 is a schematic view of a process for preparing a sheet-like adhesive film according to a third embodiment of the present invention;

FIG. 12a is a schematic view of a structure after forming a barrier layer according to a third embodiment of the present invention;

FIG. 12b is a schematic view of a sheet-like adhesive film according to a third embodiment of the present invention;

FIG. 12c is a schematic view of the cross-sectional structure B-B of FIG. 12B;

FIG. 13 is a schematic view illustrating a process for manufacturing a cover structure layer according to a third embodiment of the present invention;

fig. 14 is a schematic structural diagram of a cover structure layer according to a third embodiment of the present invention.

Description of reference numerals:

10-a device substrate; 11-a substrate; 12-a light emitting device;

13-a passivation layer; 20, packaging the structural layer; 21-an adhesive buffer layer;

22-a barrier layer; 23-a spacer layer; 30-packaging a cover plate;

40-a package substrate; 51 — a first roller; 52-a second roller;

53-third roller; 54-a fourth roller; 61-a first protective film;

62-a second protective film; 71-a coating device; 100-package edge area;

231 — inner perimeter boundary; 232 — peripheral boundary.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be noted that the embodiments and features of the embodiments in the present application may be arbitrarily combined with each other without conflict.

Fig. 1 is a schematic structural diagram of a package structure of a light emitting device in the related art. The package structure includes a device substrate 10 and a package substrate 40 attached to each other. The device substrate 10 includes a base 11, a light emitting device 12 disposed on the base 11, and a Passivation layer (Passivation)13 covering an outer surface of the light emitting device 12. The light emitting device may be an OLED device. The package substrate 40 includes a package cover 30 and a package adhesive film 20 disposed on a side of the package cover 30 facing the device substrate. The adhesive packaging film 20 generally includes an adhesive buffer layer 21 and a barrier layer 22. The device substrate 10 and the package substrate 40 are attached to each other in an opposed manner by a laminator, and are thermally pressed into a case in a vacuum atmosphere, thereby forming a package structure as shown in fig. 1. The bonding buffer layer 21 is a glue layer with uniform film thickness, and plays a role in buffer protection. The barrier layer 22 further functions as a barrier to water and oxygen. In the package structure shown in fig. 1, the covering areas of the barrier layer 22 and the adhesive buffer layer 21 are the same, and therefore, the barrier layer 22 does not cover the package border area 100, so that the barrier layer 22 cannot function as a barrier to water and oxygen in the package border area 100, and thus, water and oxygen may intrude into the light emitting device along the border of the adhesive buffer layer 21, causing the light emitting device to fail.

In order to make the barrier layer 22 cover the package border area 100, the coverage area of the barrier layer 22 may be increased so that the barrier layer may cover the package border area 100 when the package structure is formed.

Fig. 2a is a schematic structural diagram of a device substrate, fig. 2b is a schematic structural diagram of a package substrate, fig. 2c is a schematic structural diagram of a package structure obtained by first laminating the device substrate shown in fig. 2a and the package substrate shown in fig. 2b, and fig. 2d is a schematic structural diagram of a package structure obtained by laminating the package structure shown in fig. 2c again. The packaging method for forming the package structure shown in fig. 2d is briefly as follows:

a device substrate is formed as shown in fig. 2 a. The device substrate 10 includes a base 11, a light emitting device 12 disposed on the base 11, and a passivation layer 13 covering an outer surface of the light emitting device 12.

A package substrate is formed as shown in fig. 2 b. The package substrate includes a substrate 30 and a package structure layer 20 disposed on the substrate 30. In forming the package substrate, generally, the adhesive buffer layer 21 and the barrier layer 22 are laminated to form a sheet-like film, and the sheet-like film is a sheet-like adhesive material. The sheet film layer is attached to the package cover 30 by a film coating process to form the structure shown in fig. 2 b. The encapsulation structure layer includes a barrier layer 22 and an adhesive buffer layer 21. In order that the barrier layer 22 may cover the encapsulation boundary area, the coverage area of the barrier layer 22 is larger than that of the adhesive buffer layer 21.

And pressing the device substrate and the package substrate in opposite directions by using a pressing process, as shown in fig. 2 c. In fig. 2c, the coverage area of the barrier layer 22 is larger than the coverage area of the adhesive buffer layer 21, so that in the process of laminating the device substrate 10 and the package substrate 40, the thickness of the edge film layer of the package structure layer is smaller than that of the middle film layer, and after one lamination, the edge film layer cannot be attached to the surface of the substrate 11, resulting in poor packaging effect at the package edge area 100. In order to obtain a good packaging effect of the package edge region 100, a second pressing process is required to be performed on the edge region, so that the edge film layer is attached to the surface of the substrate 11.

Fig. 2b is a schematic view of the package structure after the second press-fitting. After the second pressing process is performed on the package edge region 100, the blocking layer 22 covers the package edge region 100, and the blocking layer 22 is doped with an alkali metal oxide, such as calcium oxide, so that the blocking layer 22 can block water and oxygen from entering the light emitting device along the boundary of the adhesive buffer layer 21, and the service life of the light emitting device is prolonged.

However, in the process of forming the package structure, the two pressing processes are performed, which not only increases the processing equipment and processing time, but also causes a larger stress when the package cover 30 deforms in the edge region. The stress tends to cause the package to be weak for a long time, resulting in the package cover plate 30 being separated from the device substrate and opened. In addition, in the second pressing process, edge pressing is required, which has high precision requirement on pressing equipment, and if the pressing area deviates to the outside of the display area, a gap may be left between the barrier layer 22 and the adhesive buffer layer 21, so that the barrier layer 22 and the adhesive buffer layer 21 do not make good contact, which results in poor packaging effect; if the pressing area is shifted towards the display area, the display area may be damaged by pressure, which affects the product quality.

In order to reduce the packaging process time and cost of the light emitting device, the embodiment of the invention provides a packaging method of the light emitting device. As shown in fig. 3, fig. 3 is a schematic diagram of a packaging method of a light emitting device according to an embodiment of the present invention, the method including:

The technical contents of the present invention will be described in detail by specific embodiments. The light emitting device in the embodiment of the present invention may be an OLED device.

The first embodiment:

in a first embodiment of the present invention, a method for packaging a light emitting device specifically includes:

s1: the device substrate 10 is prepared. The device substrate 10 includes a base 11, a light emitting device 12 disposed on the base 11, and a passivation layer 13 covering an outer surface of the light emitting device 12, as shown in fig. 2 a. In the present embodiment, the device substrate 10 can be prepared by a conventional method in the art, and will not be described herein.

S2: preparing a package substrate 40, the package substrate including a package cover plate 30 and a package structure layer disposed on the package cover plate 30, the package structure layer including a barrier layer 22 disposed on the package cover plate 30 and an adhesive buffer layer 21 disposed on the barrier layer 22, an orthographic projection of the adhesive buffer layer 21 on the package cover plate 30 is within an orthographic projection range of the barrier layer 22 on the package cover plate 30, the package structure layer further including a spacer layer 23 disposed on the barrier layer 22 around a periphery of the adhesive buffer layer 21, a thickness H1 of the spacer layer 23 being equal to a thickness H2 of the adhesive buffer layer 21, such that a side surface of the package structure layer to which the device substrate is bonded (in fig. 4a, an upper side surface of the package structure layer) is a flat surface, in this embodiment, the side surface of the package structure layer to which the device substrate is bonded includes a side surface of the adhesive buffer layer 21 facing the device substrate 10 and a side surface of the spacer layer 23 facing the device substrate, as shown in fig. 4a and fig. 4 b. Fig. 4a is a schematic cross-sectional structure diagram of a package substrate formed in the first embodiment of the present invention, and fig. 4b is a schematic top-view structure diagram of the package substrate formed in the first embodiment of the present invention. In the present embodiment, the surface of the package substrate on the side to which the device substrate is bonded includes the upper surface of the adhesive buffer layer 21 and the upper surface of the spacer layer 23. In the present embodiment, the material of the package cover 30 is metal.

S3: the package substrate 40 and the device substrate 10 are pressed in opposite directions by using a pressing device, a surface of the package structure layer facing away from the package cover plate 30 is attached to a surface of the substrate 11, that is, a surface of the bonding buffer layer 21 facing the device substrate 10 is attached to a surface of the substrate 11, and a surface of the spacer layer 23 facing the device substrate 10 is attached to a surface of the substrate 11, as shown in fig. 5. Fig. 5 is a schematic diagram of a package structure according to a first embodiment of the invention.

It is to be understood that steps S1 and S2 are not in a substantial sequence, and the device substrate and the package substrate may be fabricated simultaneously or sequentially.

According to the packaging method of the light-emitting device provided by the embodiment of the invention, when the packaging substrate 40 is prepared, the spacer layer 23 surrounding the bonding buffer layer 21 is formed on the barrier layer 22, the thickness of the spacer layer 23 is equal to that of the bonding buffer layer 21, so that the thickness of the edge film layer of the packaging structure layer 20 is equal to that of the middle film layer, the height difference between the edge region and the middle region is avoided, and the surface where the packaging structure layer is laminated with the device substrate 10 is a flat surface, therefore, when the device substrate 10 and the packaging substrate 40 are laminated, the surface of one side, facing the device substrate 10, of the spacer layer 23 and the bonding buffer layer 21 can be simultaneously attached to the surface of the substrate 11 only by one-time laminating process, and the packaging edge region is ensured to have a good packaging effect. The packaging method of the embodiment of the invention does not need to carry out secondary pressing aiming at the edge area, thereby shortening the packaging process time and cost of the packaging structure. Because the second pressing fit is not needed to be carried out on the edge area, the phenomenon that the packaging cover plate 30 deforms in the edge area to cause larger stress can be avoided, the packaging structure is firmer, and meanwhile, the precision requirement on the pressing fit equipment is reduced.

In this embodiment, the spacer layer 23 is formed to have a thickness H1 of 10 μm to 30 μm, and the barrier layer 22 is formed to have a thickness H3 of 10 μm to 30 μm.

In order to make the spacer layer 23 have the same water and oxygen blocking effect as the barrier layer 22, the material of the spacer layer 23 may be the same as that of the barrier layer 22, so that the spacer layer 23 may be integrated with the barrier layer 22 to achieve the water and oxygen blocking effect of the barrier layer as shown in fig. 2 d. In this embodiment, the material of the barrier layer 22 includes organic matter, wherein the organic matter can be used as the matrix material of the barrier layer 22, and the inorganic matter is doped in the matrix material, so that not only can the barrier layer 22 have good elasticity, but also the barrier layer has good water oxygen barrier property. The organic substance may be PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PI (polyimide), PVC (polyvinyl chloride), PTFE (polytetrafluoroethylene), or the like. In the present embodiment, the spacer layer 23 and the barrier layer 22 are each doped with hygroscopic particles, for example, alkali metal oxide particles. The hygroscopic particles are preferably CaO particles. All doped with the hygroscopicity particulate matter in spacer layer 23 and the barrier layer 22, just so can increase the moisture absorption sectional area of spacer layer 23 and barrier layer 22 to reinforcing hydroscopicity has further blockked steam and has passed through spacer layer and barrier layer, has improved packaging structure's encapsulation effect.

In this embodiment, as shown in fig. 4a and 4b, the inner side boundary of the spacer layer 23 is flush with the outer side boundary of the adhesive buffer layer 21, which not only facilitates the preparation of the package substrate, but also improves the water and oxygen blocking performance of the package structure and improves the bonding firmness of the package structure because the exposed side surface and the exposed upper surface of the adhesive buffer layer 21 can be covered by the spacer layer 23 and the barrier layer 22 after the package structure is formed. In the present embodiment, the thickness of the spacer layer 23 in the circumferential direction of the spacer layer 23 is equal, and as shown in fig. 4b, W1 is W2. It is easy to understand that the wall thickness of the spacer layer 23 can be set according to actual needs, and if actual needs exist, W1 may not be equal to W2. It can also be seen from figure 4b that the outside surface of the spacer layer 23 is flush with the outside surface of the barrier layer 22.

In the present embodiment, the preparing of the package substrate 40 includes preparing a package structure layer including the barrier layer 22, the adhesive buffer layer 21, and the spacer layer 23. Fig. 6 is a schematic flow chart illustrating a process for manufacturing a package structure layer according to a first embodiment of the invention. Referring to fig. 6, the step of preparing the packaging structure layer includes preparing a packaging adhesive film and preparing a bonding buffer layer coil, and the process of preparing the packaging adhesive film is specifically described as follows:

the barrier layer 22 is formed on the first protective film 61 as follows: the first roller 51 is wound with a first protective film 61, and the material of the first protective film 61 may be PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PI (polyimide), or PC (polycarbonate). The coating device 71 is provided on the side of the second roller 52, and a gap (0.01 mm to 1mm) is maintained between the nozzle of the coating device 71 and the second roller 52. Under the rolling action of the roller, the first protective film 61 is transferred from the first roller 51 to the second roller 52, and the coating device 71 uniformly coats the first protective film 61 to form the barrier layer 22, as shown in fig. 7a, fig. 7a is a schematic structural view after the barrier layer is formed in the first embodiment of the present invention. The base material of the barrier layer 22 is an inorganic substance, and the barrier layer 22 is doped with hygroscopic particles, for example, alkali metal oxide particles. The hygroscopic particulate material is preferably CaO.

The spacer layer 23 is formed on the barrier layer 22 as follows: the first protective film 61 carrying the barrier layer 22 is transferred to the lower side of the third roller 53, the third roller 53 forms the spacer layer 23 on the barrier layer 22 by means of transfer printing, as shown in fig. 7b, and fig. 7b is a schematic structural view after the spacer layer is formed in the first embodiment of the present invention. The spacer layer 23 is located within the barrier layer 22, and the spacer layer 23 has an inner circumference 231 and an outer circumference 232, and in this embodiment, the spacer layer 23 is in a shape of a "square". The outer peripheral boundary of the spacer layer 23 is flush with the outer boundary of the barrier layer 22 and the lower outer boundary of the spacer layer 23 is flush with the lower boundary of the barrier layer 22 as shown in fig. 7 b. In the present embodiment, the wall thickness of the spacer layer 23 is equal in the circumferential direction of the spacer layer 23. The barrier layer 22 and the spacer layer 23 may be made of the same material as the barrier layer 22.

And pre-curing the barrier layer 22 and the spacer layer 23, specifically, allowing the first protective film 61 carrying the barrier layer 22 and the spacer layer 23 to enter a baking oven for drying and pre-curing, thereby completing the manufacture of the packaging adhesive film.

As shown in fig. 7c, fig. 7c is a schematic structural diagram of the adhesive buffer layer roll in the first embodiment of the present invention, the adhesive buffer layer roll includes a second protective film 62 and an adhesive buffer layer 21 disposed on the second protective film 62, and the adhesive buffer layer 21 is made of a plastic material, such as epoxy resin. The boundary size of the adhesive buffer layer 21 is smaller than or equal to the inner boundary size of the spacer layer 23, namely, a2 ≦ a1 and b2 ≦ b1, and in the present embodiment, the boundary size of the adhesive buffer layer 21 is equal to the inner boundary size of the spacer layer 23, namely, a2 ═ a1 and b2 ═ b 1. The thickness H2 of the adhesive buffer layer 21 is equal to the thickness H1 of the spacer layer 23, as shown in fig. 5. In forming the adhesive buffer layer roll, the adhesive buffer layer 21 corresponding to the spacer layer 23 on the first protective film 61 may be formed on the second protective film 62 by a transfer process, and the adhesive buffer layer 21 may be pre-cured, so that the adhesive buffer layer roll as shown in fig. 7c may be obtained.

The packaging adhesive film and the adhesive material of the adhesive buffer layer are simultaneously fed into a laminating device, and hot-pressed and attached on the laminating device, so that the adhesive buffer layer 21 enters an area surrounded by the inner side boundary of the spacer layer 23, and a packaging structure layer as shown in fig. 8a and 8b is formed, wherein fig. 8a is a schematic diagram of the packaging structure layer in the first embodiment of the invention, and fig. 8b is a schematic diagram of a cross-sectional structure a-a in fig. 8 a. The packaging structure layer comprises a barrier layer 22, a spacer layer 23 and an adhesive buffer layer 21, wherein the barrier layer 22, the spacer layer 23 and the adhesive buffer layer 21 are positioned between a first protective film 61 and a second protective film 62, and the spacer layer 23 is arranged around the periphery of the adhesive buffer layer 21. Fig. 7a to 8b are schematic views for explaining the present invention in detail, and do not represent actual sizes. It is easily understood that through the manufacturing process shown in fig. 6, a plurality of package structure layers can be formed, and in a specific application, the package structure layers are cut into a single package structure layer for use.

In the present embodiment, as shown in fig. 8b, the first protective film 61 is a light release film and the second protective film 62 is a heavy release film, that is, the adhesion between the first protective film 61 and the packaging structure layer is smaller than the adhesion between the second protective film 62 and the packaging structure layer, so that the first protective film 61 is easily peeled off from the packaging structure layer.

The first protective film 61 is peeled off from the package structure layer, and the package structure layer with the second protective film 62 is attached to the package cover 30, and then the second protective film 62 is peeled off to form the package substrate shown in fig. 4 a.

Second embodiment:

a second embodiment of the present invention provides a package structure, as shown in fig. 5. The package structure is prepared by the packaging method of the first embodiment, and includes the device substrate 10 and the package substrate 40 which are pressed in opposite directions. The device substrate 10 includes a base 11, a light emitting device 12 disposed on the base 11, and a passivation layer 13 covering an outer surface of the light emitting device 12. The package substrate comprises a package cover plate and a package structure layer which is arranged on the package cover plate 30 and comprises a spacer layer, and the spacer layer 23 is used for enabling one side surface of the package structure layer, which is far away from the package cover plate 30, to be a flat surface. And the surface of one side of the packaging structure layer, which is far away from the packaging cover plate, is attached to the surface of the substrate.

In the present embodiment, as shown in fig. 5, the package structure layer includes an adhesive buffer layer 21, a barrier layer 22, and a spacer layer 23. Wherein, the barrier layer 22 is disposed on a side of the package cover plate 30 facing the device substrate 10, the adhesion buffer layer 21 is disposed on a side of the barrier layer 22 facing the device substrate 10, and an orthographic projection of the adhesion buffer layer 21 on the package cover plate 30 is located within an orthographic projection of the barrier layer 22 on the package cover plate 30. The spacer layer 23 is provided on the side of the barrier layer 22 facing the device substrate 10 around the periphery of the adhesive buffer layer 21, and the thickness H1 of the spacer layer 23 is equal to the thickness H2 of the adhesive buffer layer 21, so that the surface of the adhesive buffer layer 21 facing the device substrate 10 is attached to the surface of the base 11, and the surface of the spacer layer 23 facing the device substrate 10 is also attached to the surface of the base 11.

In this embodiment, the spacer layer 23 has a thickness H1 of 10 μm to 30 μm, and the barrier layer 22 has a thickness H3 of 10 μm to 30 μm.

Fig. 4b is a schematic top view of the package substrate. In this embodiment, as shown in fig. 4b, the inner side boundary of the spacer layer 23 is flush with the outer side boundary of the bonding buffer layer 21, which not only facilitates the preparation of the package substrate, but also, after the package structure is formed, the spacer layer 23 and the barrier layer 22 can cover the exposed side surface and the upper surface of the bonding buffer layer 21 together, thereby improving the water and oxygen resistance of the package structure and improving the bonding firmness of the package structure. In the present embodiment, the thickness of the spacer layer 23 in the circumferential direction of the spacer layer 23 is equal, and as shown in fig. 4b, W1 is equal to W2. It is easy to understand that the wall thickness of the spacer layer 23 can be set according to actual needs, and if actual needs, W may not be equal to W2. It can also be seen from figure 4b that the outside surface of the spacer layer 23 is flush with the outside surface of the barrier layer 22.

The third embodiment:

in a second embodiment of the present invention, a method for packaging a light emitting device specifically includes:

s1: the device substrate 10 is prepared. In this embodiment, the structure and the manufacturing method of the device substrate 10 are the same as those of the first embodiment, and are not described herein again.

S2: a package substrate 40 is prepared, which includes a package cover 30 and a package structure layer disposed on the package cover 30. The package structure layer includes a spacer layer 23 disposed on the package cover 30, the spacer layer 23 having an inner circumferential boundary 231 and an outer circumferential boundary 232. In the present embodiment, the boundary of the spacer layer 23 has a quadrangular shape. It is easily understood that the boundary shape of the spacer layer 23 may be set according to actual needs. The package structure layer further includes a barrier layer 22 disposed on the metal cover plate 30 and the spacer layer 23, and the barrier layer 22 covers the spacer layer 23 and the area surrounded by the inner periphery 231. The package structure layer further includes an adhesive buffer layer 21 disposed on the barrier layer 22, the adhesive buffer layer 21 is located in the region surrounded by the inner peripheral boundary 231, and the spacer layer 23 has a thickness H1 equal to the thickness H2 of the adhesive buffer layer 21, so that a surface of the package structure layer (the upper surface of the package structure layer in fig. 9 a) to which the device substrate is bonded is a flat surface, as shown in fig. 9a and 9 b. Fig. 9a is a schematic cross-sectional view of a package substrate formed in a third embodiment of the invention. Fig. 9b is a schematic top view of a package substrate formed in the third embodiment of the invention. In the present embodiment, the surface of the package structure layer on the side to which the device substrate is bonded includes the upper surface of the adhesive buffer layer 21 and the upper surface of the barrier layer 22 on the outer portion of the adhesive buffer layer 21. In the present embodiment, the material of the package cover 30 is metal, such as ITO.

S3: the package substrate 40 and the device substrate 10 are pressed oppositely by using a pressing device, a surface of the bonding buffer layer 21 facing the device substrate 10 is attached to a surface of the substrate 11, and a surface of the barrier layer 22 facing the device substrate 10 is attached to a surface of the substrate 11, as shown in fig. 10. Fig. 10 is a schematic diagram of a package structure according to a third embodiment of the invention.

According to the packaging method of the light-emitting device provided by the embodiment of the invention, when the packaging substrate 40 is prepared, the spacer layer 23 is formed on the packaging cover plate 30, the thickness of the spacer layer 23 is equal to that of the bonding buffer layer 21, so that the thickness of the edge film layer of the packaging structure layer 20 is equal to that of the middle film layer, the height difference between the edge region and the middle region is avoided, and the surface of the packaging structure layer 20, which is pressed with the device substrate 10, is a flat surface, so that when the device substrate 10 and the packaging substrate 40 are pressed, the surface of one side, facing the device substrate 10, of the barrier layer 22 and the bonding buffer layer 21 can be simultaneously attached to the surface of the substrate 11 only through one-time pressing process, and the good packaging effect of the packaging edge region is ensured. The packaging method of the embodiment of the invention does not need to carry out secondary pressing aiming at the edge area, thereby shortening the packaging process time and cost of the packaging structure. Because the second pressing fit is not needed to be carried out on the edge area, the phenomenon that the packaging cover plate 30 deforms in the edge area to cause larger stress can be avoided, the packaging structure is firmer, and meanwhile, the precision requirement on the pressing fit equipment is reduced.

The material of the spacer layer 23 and the material of the barrier layer 22 in this embodiment are completely the same as those in the first embodiment, and are not described herein again. In the present embodiment, as shown in fig. 9b, the thickness of the spacer layer 23 is equal in the circumferential direction of the spacer layer 23, and in fig. 9b, W1 is W2. It is easy to understand that the wall thickness of the spacer layer 23 can be set according to actual needs, and if actual needs exist, W1 may not be equal to W2. It can also be seen from figure 9b that the outside surface of the spacer layer 23 is flush with the outside surface of the barrier layer 22.

In the present embodiment, the preparing of the package substrate 40 includes preparing a sheet-shaped adhesive film including the barrier layer 22 and the adhesive buffer layer 21, and preparing a cover structure layer including the package cover 30 and the spacer layer 23.

FIG. 11 is a schematic view of a process for preparing a sheet-like adhesive film according to a third embodiment of the present invention. Referring to fig. 11, the process of preparing the sheet-like adhesive film is specifically described as follows:

the barrier layer 22 is formed on the first protective film 61 as follows: the first roller 51 is wound with a first protective film 61, and the material of the first protective film 61 may be PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PI (polyimide), or PC (polycarbonate). The coating device 71 is provided on the side of the second roller 52, and a gap (0.01 mm to 1mm) is maintained between the nozzle of the coating device 71 and the second roller 52. Under the rolling action of the roller, the first protective film 61 is transferred from the first roller 51 to the second roller 52, and the coating device 71 uniformly coats the first protective film 61 to form the barrier layer 22, as shown in fig. 12a, where fig. 12a is a schematic structural view after the barrier layer is formed in the third embodiment of the present invention. The base material of the barrier layer 22 is an inorganic substance, and the barrier layer 22 is doped with hygroscopic particles, for example, alkali metal oxide particles. The hygroscopic particulate material is preferably CaO.

The barrier layer 22 is pre-cured, and specifically, the first protective film 61 carries the barrier layer 22 into a baking oven for drying and pre-curing.

The fourth roller 54 is wound with an adhesive buffer layer coil, which is the same as the first embodiment and will not be described herein.

The first protective film 61 carrying the pre-cured barrier layer 22 and the adhesive buffer layer rubber material are simultaneously fed into a laminating device, and are thermally pressed and attached on the laminating device to form a sheet-like adhesive film as shown in fig. 12B and 12c, where fig. 12B is a schematic structural diagram of the sheet-like adhesive film in the third embodiment of the present invention, and fig. 12c is a schematic structural diagram of a cross section B-B in fig. 12B. The sheet-like adhesive film includes a barrier layer 22 and an adhesion buffer layer 21 between a first protective film 61 and a second protective film 62, the adhesion buffer layer 21 being located in a region where the barrier layer 22 is located.

In the present embodiment, as shown in fig. 12c, the first protection film 61 is a light release film and the second protection film 62 is a heavy release film, that is, the adhesion between the first protection film 61 and the sheet-shaped adhesive film is smaller than the adhesion between the second protection film 62 and the sheet-shaped adhesive film, so that the first protection film 61 is easily peeled off from the sheet-shaped adhesive film.

Fig. 13 is a schematic view of a process for preparing a cover structure layer according to a third embodiment of the present invention, and referring to fig. 13, the process for preparing the cover structure layer is specifically described as follows:

the spacer layer 23 is formed on the package cover plate 30, and specifically, the spacer layer 23 is formed on the package cover plate 30 through a transfer process, as shown in fig. 14. Fig. 14 is a schematic structural diagram of a structural layer of a cover plate according to a third embodiment of the present invention, in which the spacer layer 23 has an inner circumferential boundary 231 and an outer circumferential boundary 232. In the present embodiment, the boundary of the spacer layer 23 has a quadrangular shape. The spacer layer 23 has a thickness H1 equal to the thickness H2 of the adhesive buffer layer 21.

Preparing the package substrate 40, specifically, peeling the first protective film 61 from the sheet-shaped adhesive film, and attaching the sheet-shaped adhesive film with the second protective film 62 on the cover structure layer such that the barrier layer 22 covers the spacer layer 23 and the region surrounded by the inner peripheral boundary 231 and the adhesive buffer layer 21 is located in the region surrounded by the inner peripheral boundary 231, and then peeling the second protective film 62 to form the package substrate shown in fig. 9 a.

Fig. 12a to 14 are schematic views for explaining the present invention in detail, and do not represent actual sizes.

The fourth embodiment:

a fourth embodiment of the present invention provides a package structure, as shown in fig. 10. The package structure is prepared by the packaging method of the third embodiment, and includes the device substrate 10 and the package substrate 40 which are pressed in opposite directions. The device substrate 10 includes a base 11, a light emitting device 12 disposed on the base 11, and a passivation layer 13 covering an outer surface of the light emitting device 12. The package substrate comprises a package cover plate and a package structure layer which is arranged on the package cover plate 30 and comprises a spacer layer, and the spacer layer 23 is used for enabling one side surface of the package structure layer, which is far away from the package cover plate 30, to be a flat surface. And the surface of one side of the packaging structure layer, which is far away from the packaging cover plate, is attached to the surface of the substrate.

In the present embodiment, as shown in fig. 10, the package structure layer includes a spacer layer 23, a barrier layer 22, and an adhesive buffer layer 21. Wherein a spacer layer 23 is provided on a side of the package cover plate 30 facing the device substrate 10, the spacer layer 23 having an inner circumferential boundary 231 and an outer circumferential boundary 232. The barrier layer 22 is disposed on a side of the spacer layer 23 facing the device substrate 10, and an orthographic projection of the barrier layer 22 on the package cover 20 includes a region where the spacer layer 23 is located and a region surrounded by the inner peripheral boundary 231. The adhesion buffer layer 21 is provided on the side of the barrier layer 22 facing the device substrate 10, the adhesion buffer layer 21 is located in the region surrounded by the inner peripheral boundary 231, and the thickness H1 of the spacer layer 23 is equal to the thickness H2 of the adhesion buffer layer 21. The surface of the adhesive buffer layer 21 facing the device substrate 10 is bonded to the surface of the base 11, and the surface of the barrier layer 22 facing the device substrate 10 is bonded to the surface of the base 11.

Fifth embodiment:

based on the inventive concept of the foregoing embodiments, an embodiment of the present invention further provides a display device, which includes the package structure employing the foregoing embodiments. The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.

In the description of the embodiments of the present invention, it should be understood that the terms "middle", "upper", "lower", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

Although the embodiments of the present invention have been described above, the above description is only for the convenience of understanding the present invention, and is not intended to limit the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A method of packaging a light emitting device, the method comprising:

preparing a device substrate and a packaging substrate, wherein the device substrate comprises a substrate and a light-emitting device arranged on the substrate; the packaging substrate comprises a packaging cover plate and a packaging structure layer arranged on the packaging cover plate, the packaging structure layer comprises a blocking layer arranged on the packaging cover plate, a bonding buffer layer and a spacer layer, the bonding buffer layer and the spacer layer are arranged on the blocking layer or the packaging cover plate, the spacer layer is provided with an inner peripheral boundary and an outer peripheral boundary, the bonding buffer layer is arranged in an area surrounded by the inner peripheral boundary, and the spacer layer is used for enabling one side surface of the packaging structure layer, which is far away from the packaging cover plate, to be a flat surface;

2. The packaging method according to claim 1, wherein the preparing a package substrate comprises,

preparing an encapsulation structure layer, wherein the encapsulation structure layer comprises a blocking layer arranged on the encapsulation cover plate and an adhesive buffer layer arranged on the blocking layer, the orthographic projection of the adhesive buffer layer on the encapsulation cover plate is positioned in the orthographic projection of the blocking layer on the encapsulation cover plate, the spacer layer surrounds the periphery of the adhesive buffer layer and is arranged on the blocking layer, and the height of the spacer layer is equal to that of the adhesive buffer layer;

3. The method of claim 2, wherein the preparing the package structure layer comprises:

4. The packaging method according to claim 1, wherein the preparing of the package substrate comprises preparing a cover structure layer and preparing a sheet-like adhesive film,

5. The packaging method according to claim 4, wherein the preparing the sheet-like adhesive film comprises:

forming a barrier layer on the first protective film;

6. The method of packaging of claim 2 or 4, wherein the outer perimeter boundary of the spacer layer is flush with the outer perimeter boundary of the barrier layer.

7. The method of claim 2 or 4, wherein the spacer layer and the barrier layer are made of the same material, and the spacer layer and the barrier layer are both doped with hygroscopic particles.

8. The method of claim 2 or 4, wherein the spacer layer has a thickness of 10 μm to 30 μm, and the barrier layer has a thickness of 10 μm to 30 μm.

9. A packaging structure of a light emitting device is characterized by comprising a device substrate and a packaging substrate which are oppositely pressed,

packaging substrate, be in including encapsulation apron and setting encapsulation structure layer on the encapsulation apron, encapsulation structure layer including set up in barrier layer on the encapsulation apron, set up in bonding buffer layer and dottle pin layer on the barrier layer, the dottle pin layer set up in the barrier layer perhaps on the encapsulation apron, the dottle pin layer has interior border and outer periphery border, the bonding buffer layer sets up in the region that interior border was enclosed and is established, the dottle pin layer is used for making the deviation of encapsulation structure layer a side surface of encapsulation apron is flat surface, deviating from of encapsulation structure layer a side surface of encapsulation apron with the surface laminating of basement.

10. The package structure of claim 9, wherein the package structure layer further comprises a barrier layer disposed on the package cover plate and an adhesive buffer layer disposed on the barrier layer, an orthographic projection of the adhesive buffer layer on the package cover plate is located within an orthographic projection of the barrier layer on the package cover plate, the spacer layer surrounds a periphery of the adhesive buffer layer and is disposed on the barrier layer, and a height of the spacer layer is equal to a height of the adhesive buffer layer.

11. The package structure of claim 9, wherein the spacer layer is disposed on the package cover plate, the spacer layer has an inner periphery and an outer periphery, the package structure layer further comprises a barrier layer and an adhesive buffer layer, the barrier layer is disposed on the spacer layer and covers the spacer layer and the inner periphery, the adhesive buffer layer is disposed on the barrier layer and the adhesive buffer layer is located in the inner periphery, and the adhesive buffer layer has a thickness equal to that of the spacer layer.

12. The package structure of claim 10 or 11, wherein the outer perimeter boundary of the spacer layer is flush with the outer perimeter boundary of the barrier layer.

13. The package structure according to claim 10 or 11, wherein the spacer layer and the barrier layer are made of the same material, and the spacer layer and the barrier layer are both doped with moisture-absorbing particles.

14. The package structure according to claim 10 or 11, wherein the spacer layer has a thickness of 10 μm to 30 μm, and the barrier layer has a thickness of 10 μm to 30 μm.

15. A display device, comprising the package structure according to any one of claims 9 to 14.