CN106784360B - A kind of organic light emitting diode device and its packaging method, sealed in unit - Google Patents
A kind of organic light emitting diode device and its packaging method, sealed in unit Download PDFInfo
- Publication number
- CN106784360B CN106784360B CN201710042006.9A CN201710042006A CN106784360B CN 106784360 B CN106784360 B CN 106784360B CN 201710042006 A CN201710042006 A CN 201710042006A CN 106784360 B CN106784360 B CN 106784360B
- Authority
- CN
- China
- Prior art keywords
- substrate
- magnetic field
- filling
- movement module
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention provides a kind of organic light emitting diode device and its packaging method, sealed in unit, the packaging method includes: offer first substrate, the cofferdam glue and the filling glue in the filling region that the cofferdam glue is enclosed that closure is formed on the first substrate, doped with magnetic particle in the filling glue；The second substrate is provided, is formed with organic light emitting diode device in the second substrate；One magnetic field movement module is provided；The first substrate and the second substrate are pressed, and during the pressing process, it is mobile towards assigned direction on the outside of the first substrate and/or on the outside of the second substrate to control the magnetic field movement module, to drive the magnetic particle in the filling glue mobile towards the assigned direction, promote to fill the every nook and cranny that glue uniformly diffuses to filling region, and bubble can be squeezed out inside filling glue, improve the packaging effect of organic light emitting diode device.
Description
Technical field
The present invention relates to technical field of electronic components more particularly to a kind of organic light emitting diode device and its encapsulation sides
Method, sealed in unit.
Background technique
Active matrix organic light-emitting diode (AMOLED) is ultra-thin since higher colour gamut can be achieved, the display of flexibility,
Gradually have received widespread attention.But steam and oxygen can cause to corrode to OLED, influence service life, need stringent
Encapsulation is protected.Cofferdam type (Dam&Fill) encapsulation is a kind of more commonly used packaged type of large scale OLED, i.e., using viscous
It spends biggish glue and forms cofferdam, then the lesser filling glue of application viscosity in cofferdam, when pressing using upper and lower base plate, cause to fill
The diffusion of glue makes to fill glue full of cofferdam inner space, completes encapsulation after solidifying glue material.
Although however upper and lower base plate mostly uses vacuum environment during pressing, can still remain in glue material a small amount of
Gas forms bubble, and concentrates in cofferdam enclosing and corner, is difficult to remove.Remaining bubble not only influences beautiful (especially right
In top emitting device, intermediate remaining bubble directly affects display effect), and the bubble at edge does not have barriering effect, it can not
Water oxygen is prevented, packaging effect is influenced.
Based on the above reasons, it needs to improve OLED encapsulation method, optimizes packaging effect.
Summary of the invention
In view of this, the present invention provides a kind of organic light emitting diode device and its packaging method, sealed in unit, for mentioning
The packaging effect of high organic light emitting diode device.
In order to solve the above technical problems, the present invention provides a kind of packaging method of organic light emitting diode device, comprising:
First substrate is provided, be formed with the cofferdam glue of closure on the first substrate and is enclosed positioned at the cofferdam glue
Filling glue in filling region, doped with magnetic particle in the filling glue；
The second substrate is provided, is formed with organic light emitting diode device in the second substrate；
Magnetic field movement module is provided；
The first substrate and the second substrate are pressed, and during the pressing process, controls the magnetic field movement module
It is mobile towards assigned direction on the outside of the first substrate and/or on the outside of the second substrate, to drive the magnetic in the filling glue
Property particle it is mobile towards the assigned direction.
Preferably, described the step of pressing to the first substrate and the second substrate, includes:
One pressing pallet is provided, the first substrate is placed on the pressing pallet；
Force fit plate on one is provided, the second substrate is fixed on the upper force fit plate；
The upper force fit plate direction that control is fixed with the second substrate is placed with the side of the pressing pallet of the first substrate
It is pressed downward；During the pressing process, the magnetic field movement module is controlled in the not set the second substrate of the upper force fit plate
On on one side, and/or, it is mobile towards assigned direction in the one side of the not set first substrate of the pressing pallet, to drive
Magnetic particle in the filling glue is mobile towards the assigned direction.
Preferably, it using a magnetic field movement module, during the pressing process, controls the magnetic field movement module and is filled out from described
The central region corresponding position in region is filled, helical form is mobile to the fringe region direction of the filling region；Or
Using the magnetic field movement module of two strips, during the pressing process, control one of magnetic field movement module from
First edge direction of the central region corresponding position of the filling region, Xiang Suoshu filling region moves in parallel, and controls another
Magnetic field movement module is moved in parallel from the central region corresponding position of the filling region, the second edge direction of Xiang Suoshu filling region
It is dynamic, described first while and second while be the filling region opposite two side, the extending direction of the magnetic field movement module
With described first while and extending direction when second it is identical；Or
Using the magnetic field movement module of four strips, during the pressing process, control two of them magnetic field movement module point
Not from the central region corresponding position of the filling region, the first side of Xiang Suoshu filling region is parallel with the second edge direction to be moved
It is dynamic, other two magnetic field movement module is controlled respectively from the central region corresponding position of the filling region, Xiang Suoshu fill area
The third side in domain and the 4th edge direction move in parallel, described first while and second while be the filling region opposite two
Side, the third while and the 4th while be the filling region other two opposite side, the extension of the magnetic field movement module
The extending direction on direction side corresponding with its moving direction is identical.
Preferably, the magnetic particle uses the magnetic material with superparamagnetism to be made.
Preferably, the magnetic particle is the magnetic particle of nano-scale.
Preferably, the surface of the magnetic particle is coated using organic material.
Preferably, the organic material includes: oleic acid, PMMA or PVP.
The present invention also provides a kind of organic light emitting diode devices, are encapsulated using above-mentioned packaging method；
The organic light emitting diode device includes: the first substrate and the second substrate of pairing, is set in the second substrate
It is equipped with organic light emitting diode device, the cofferdam glue of closure is provided between the first substrate and the second substrate and is filled in
The filling glue in filling region that the cofferdam glue is enclosed, doped with magnetic particle in the filling glue.
The present invention also provides a kind of sealed in unit of organic light emitting diode device, comprising:
Gluing module, for being formed with the cofferdam glue of closure, and the filling enclosed in the cofferdam glue on the first substrate
It is formed in region and fills glue, doped with magnetic particle in the filling glue；
Magnetic field movement module；
Module is pressed, for being pressed to the first substrate with the second substrate for being formed with Organic Light Emitting Diode,
And during the pressing process, magnetic field movement module court on the outside of the first substrate and/or on the outside of the second substrate is controlled
Assigned direction is mobile, to drive the magnetic particle in the filling glue mobile towards the assigned direction.
Preferably, the pressing module includes:
Pallet is pressed, for placing the first substrate；
Upper force fit plate, for fixing the second substrate；
Magnetic field movement module；
Control module is fixed with the upper force fit plate of the second substrate towards being placed with the first substrate for controlling
It presses pallet direction to push, and during the pressing process, controls the magnetic field movement module in the not set institute of the upper force fit plate
It states in the one side of the second substrate, and/or, in the one side of the pressing not set first substrate of pallet, towards assigned direction
It is mobile, to drive the magnetic particle in the filling glue mobile towards the assigned direction.
The advantageous effects of the above technical solutions of the present invention are as follows:
For in the filling glue of encapsulating organic light emitting diode component doped with magnetic particle, in first substrate and the second base
When plate presses, control magnetic field movement module is moved towards assigned direction movement, is filled out in first substrate and/or the outside of the second substrate
The magnetic field that the magnetic particle filled in glue is generated by magnetic field movement module magnetizes, and moves along magnetic field movement module direction, to promote
Make to fill the every nook and cranny that glue uniformly diffuses to filling region, and bubble can be squeezed out inside filling glue, improves organic hair
The packaging effect of optical diode device, also, packaging method is simple, and cost is relatively low.
Detailed description of the invention
Fig. 1 is the flow diagram of the packaging method of the organic light emitting diode device of one embodiment of the invention；
Fig. 2 and Fig. 3 is the packaging method schematic diagram of the organic light emitting diode device of another embodiment of the present invention；
Fig. 4 is the coating method schematic diagram of the filling glue of the embodiment of the present invention；
Fig. 5-Fig. 7 is the move mode schematic diagram of the magnetic field movement module of the embodiment of the present invention；
Fig. 8 is the structural schematic diagram of the organic light emitting diodde desplay device of the embodiment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
Attached drawing, the technical solution of the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is this hair
Bright a part of the embodiment, instead of all the embodiments.Based on described the embodiment of the present invention, ordinary skill
Personnel's every other embodiment obtained, shall fall within the protection scope of the present invention.
Unless otherwise defined, the technical term or scientific term used herein should be in fields of the present invention and has
The ordinary meaning that the personage of general technical ability is understood.Used in present patent application specification and claims " the
One ", " second " and similar word are not offered as any sequence, quantity or importance, and are used only to distinguish different
Component part.Equally, the similar word such as "one" or " one " does not indicate that quantity limits yet, but indicates that there are at least one.
" connection " either the similar word such as " connected " is not limited to physics or mechanical connection, but may include electrical
Connection, it is either direct or indirect."upper", "lower", "left", "right" etc. are only used for indicating relative positional relationship, work as quilt
After the absolute position of description object changes, then the relative positional relationship also correspondingly changes.
In order to improve the packaging effect of organic light emitting diode device, referring to FIG. 1, one embodiment of the invention provides one kind
The packaging method of organic light emitting diode device, comprising the following steps:
Step S11: providing first substrate, and the cofferdam glue of closure is formed on the first substrate and is located at the cofferdam
Filling glue in the filling region that glue is enclosed, doped with magnetic particle in the filling glue；
Step S12: the second substrate is provided, is formed with organic light emitting diode device in the second substrate；
Step S13: magnetic field movement module is provided；
Step S13: pressing the first substrate and the second substrate, and during the pressing process, controls the magnetic field
Mobile module is mobile towards assigned direction on the outside of the first substrate and/or on the outside of the second substrate, to drive the filling
Magnetic particle in glue is mobile towards the assigned direction.
In the embodiment of the present invention, in the filling glue of encapsulating organic light emitting diode component doped with magnetic particle,
When first substrate and the second substrate press, control magnetic field movement module is in first substrate and/or the outside of the second substrate, towards specified
Direction is mobile, fills the magnetic field that the magnetic particle in glue is generated by magnetic field movement module and magnetizes, along magnetic field movement module
Direction is mobile, to promote to fill the every nook and cranny that glue uniformly diffuses to filling region, and can squeeze bubble inside filling glue
Out, the packaging effect of organic light emitting diode device is improved, also, packaging method is simple, cost is relatively low.
In the embodiment of the present invention, it is preferable that the magnetic particle uses the magnetic material with superparamagnetism to be made, i.e. magnetic
Property particle be integrally able to maintain and change repeatedly between a direction of easy axis and another direction of easy axis in parallel, to improve
The magnetic property of magnetic particle.
The material that the magnetic particle uses can be the combination of any one or more of materials described below: Fe3O4(four oxygen
Change three-iron), SmCo5(SmCo), Fe (iron), Ni (nickel) and Co (cobalt) etc., certainly, however it is not limited to the above material.
In the embodiment of the present invention, it is preferable that the size of the magnetic particle is nano-scale, the magnetic particle of nano-scale
Small volume, can preferably be dispersed in filling glue in.Preferably, the partial size of the magnetic particle is 10nm-50nm.
In the embodiment of the present invention, it is preferable that the magnetic particle shared volume ratio in the filling glue is 0.5%-
10%, under this kind of ratio, it can both guarantee that magnetic particle can have enough energy for driving filling glue mobile, nor affect on
Fill the packaging effect and viscosity of glue itself.
In the embodiment of the present invention, it is preferable that the surface of the magnetic particle is coated using organic material, using organic material
It after cladding, can not only optimize the magnetic property of magnetic particle, magnetic particle can be more preferably dispersed in filling glue, and prevent
Sliding damage is generated to organic light emitting diode device when moving under magnetic fields.Preferably, the organic material includes: oil
Acid, PMMA (polymethyl methacrylate) and PVP (polyvinylpyrrolidone).Certainly, however it is not limited to the above material, or
Other kinds of organic polymer material.
In the embodiment of the present invention, the number of magnetic field movement module can be one or more, and multiple magnetic field movement modules can
To improve packaging efficiency.
Fig. 2 and Fig. 3 are please referred to, Fig. 2 and Fig. 3 are the encapsulation side of the organic light emitting diode device of another embodiment of the present invention
Method, method includes the following steps:
Step S21: first substrate 100 is provided, cofferdam glue 101 and the position of closure are formed on the first substrate 100
Filling glue 102 in the filling region that the cofferdam glue 101 is enclosed, doped with magnetic particle in the filling glue 102；
Step S22: the second substrate 200 is provided, is formed with organic light emitting diode device 201 in the second substrate 200；
Step S23: a pressing pallet 300 is provided, the first substrate 100 is placed on the pressing pallet 300；
Step S24: providing force fit plate 400 on one, the second substrate 200 be fixed on the upper force fit plate 400,
In, upper force fit plate 400 and pressing 300 face of pallet setting；
In the embodiment of the present invention, the second substrate can be fixed on upper force fit plate 400 by way of absorption；
Step S25: providing two magnetic field movement modules 500, and the magnetic field movement module 500 is set to pressing pallet 300
Not set first substrate 100 one side；
Step S26: control is fixed with the upper force fit plate 400 of the second substrate 200 towards being placed with the first substrate
100 300 direction of pressing pallet pushes；During the pressing process, the magnetic field movement module 500 is controlled in the pressing pallet
It is mobile towards assigned direction in the one side of 300 not set first substrate 100, to drive the magnetic particle in the filling glue 102
It is moved towards the assigned direction.
In the embodiment of the present invention, controls two magnetic field movement modules 500 and (filled from the intermediate region of pressing pallet 300
The intermediate region corresponding position in region), towards two edges of pressing pallet 300, (i.e. the fringe region of filling region is corresponding respectively
Position) it is mobile, so that filling glue is extended to the fringe region of filling region.
In embodiments of the present invention, magnetic field movement module 500 is set to not set described the first of the pressing pallet 300
In the one side of substrate 100, certainly, certainly, in some other embodiment of the invention, magnetic field movement module 500 can also be set
It is placed in the one side of the not set the second substrate 200 of the upper force fit plate 400.Alternatively, being set to the pressing pallet simultaneously
The not set the second substrate 200 of the one side and upper force fit plate 400 of the 300 not set first substrate 100
On on one side, to improve packaging efficiency.
It can also include: in institute before the step of first substrate 100 are provided in the packaging method of the embodiment of the present invention
State the cofferdam glue 101 that closure is formed on first substrate 100 and the filling in the filling region that the cofferdam glue 101 is enclosed
Glue 102, doped with magnetic particle in the filling glue 102.The method that filling glue 102 is formed on first substrate 100 can be found in
Fig. 4 can be spread evenly across in filling region by coating module 600 by glue 102 is filled.
In the embodiment of the present invention, magnetic field movement module can be mobile using various ways, and several preferred shiftings are described below
Flowing mode:
Move mode one: referring to Fig. 5, in the present embodiment, using a magnetic field movement module 500, during the pressing process,
Controlling the magnetic field movement module, (central region of the i.e. described filling region corresponds to position from the central region of pressing pallet 300
Set), fringe region (fringe region of the corresponding filling region) direction of helical form to pressing pallet 300 is mobile.In figure, to
The lines of arrow are the movement routine of magnetic field movement module 500；
Move mode two: referring to Fig. 6, in the present embodiment, using the magnetic field movement module 500 of two strips, is pressing
During conjunction, control one of magnetic field movement module 500 from pressing pallet 300 central region (the i.e. described filling region
Central region corresponding position), the first edge direction of the filling region is mobile, controls another magnetic field movement module 500 from pressure
The second side side of central region (the central region corresponding position of the i.e. described filling region) Xiang Suoshu filling region of plywood platform 300
To movement, described first while and second while be the filling region opposite two side, the magnetic field movement module 500 prolongs
Stretch direction with described first while and extending direction when second it is identical.In figure, the lines to arrow are magnetic field movement module 500
Movement routine；
Move mode three: referring to Fig. 7, in the present embodiment, using the magnetic field movement module 500 of four strips, is pressing
During conjunction, control two of them magnetic field movement module 500 is respectively from central region (the i.e. described fill area of pressing pallet 300
The central region corresponding position in domain), the first side of Xiang Suoshu filling region and the second edge direction are mobile, and control another two magnetic field is moved
Dynamic model block 500 is respectively from the central region (the central region corresponding position of the i.e. described filling region) of pressing pallet 300, Xiang Suoshu
The third side of filling region and the 4th edge direction are mobile, described first while and second while be the filling region opposite two
Side, the third while and the 4th while be the filling region other two opposite side, the magnetic field movement module 500 prolongs
The extending direction for stretching direction side corresponding with its moving direction is identical.In figure, the lines to arrow are magnetic field movement module 500
Movement routine.
Certainly, in the embodiment of the present invention, also it is not excluded for magnetic field movement module using other move modes, herein no longer one by one
Explanation.
In the above method of the embodiment of the present invention, after the step of being pressed to the first substrate and the second substrate
Further include: the cofferdam glue and the filling glue are solidified, to complete the encapsulation of first substrate and the second substrate.
Referring to FIG. 8, the embodiment of the present invention also provides a kind of organic light emitting diode device, using any of the above-described embodiment
Described in packaging method encapsulate；The organic light emitting diode device includes: the first substrate 100 and the second base of pairing
Plate 200, second base are provided with organic light emitting diode device 201, the first substrate 100 and the second substrate on 200
The filling glue for being provided with the cofferdam glue 101 of closure between 200 and being filled in the filling region that the cofferdam glue 101 is enclosed
102, doped with magnetic particle in the filling glue 102.
The cofferdam glue 101 and filling glue 102, can be uv-curing type resin glue or heat reactive resin glue, can adopt
With the combination of any one or more in materials described below: epoxy resin, Glycidyl Acrylate, glycidyl third
Ester, methyl methacrylate, ethyl methacrylate, n-BMA, methyl polyacrylic acid 6,7- epoxy heptyl ester, first
The homopolymer or copolymer of the monomers such as base 2-Hydroxy ethyl acrylate, unsaturated polyester resin, have melamine resin
Machine silicone resin or furane resins etc..The range of viscosities of cofferdam glue 101 is 10000-400000mPa s, fills the viscosity model of glue 102
It encloses for 10-2000mPas.
The embodiment of the present invention also provides a kind of sealed in unit of organic light emitting diode device, comprising:
Gluing module, for being formed with the cofferdam glue of closure, and the filling enclosed in the cofferdam glue on the first substrate
It is formed in region and fills glue, doped with magnetic particle in the filling glue；
Magnetic field movement module；
Module is pressed, for being pressed to the first substrate with the second substrate for being formed with Organic Light Emitting Diode,
And during the pressing process, control magnetic field movement module is on the outside of the first substrate and/or on the outside of the second substrate towards specified
Direction is mobile, to drive the magnetic particle in the filling glue mobile towards the assigned direction.
In the preferred embodiment of the present invention, the pressing module includes:
Pallet is pressed, for placing the first substrate；
Upper force fit plate, for fixing the second substrate；
Control module is fixed with the upper force fit plate of the second substrate towards being placed with the first substrate for controlling
It presses pallet direction to push, and during the pressing process, controls the magnetic field movement module not set the of the upper force fit plate
In the one side of two substrates, and/or, in the one side of the not set first substrate of the pressing pallet, moved towards assigned direction
It is dynamic, to drive the magnetic particle in the filling glue mobile towards the assigned direction.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principles of the present invention, it can also make several improvements and retouch, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (9)
1. a kind of packaging method of organic light emitting diode device characterized by comprising
First substrate, the filling for being formed with the cofferdam glue of closure on the first substrate and being enclosed positioned at the cofferdam glue are provided
Filling glue in region, doped with magnetic particle in the filling glue；
The second substrate is provided, is formed with organic light emitting diode device in the second substrate；
Magnetic field movement module is provided；
The first substrate and the second substrate are pressed, and during the pressing process, controls the magnetic field movement module in institute
It states on the outside of first substrate and/or the second substrate outside is mobile towards assigned direction, to drive the magnetic particles in the filling glue
Son is mobile towards the assigned direction；
Using a magnetic field movement module, during the pressing process, the magnetic field movement module is controlled from the filling region
Portion region corresponding position, helical form are mobile to the fringe region direction of the filling region；Or
Using the magnetic field movement module of two strips, during the pressing process, one of magnetic field movement module is controlled from described
First edge direction of the central region corresponding position of filling region, Xiang Suoshu filling region moves in parallel, and controls another magnetic field
Mobile module is moved in parallel from the central region corresponding position of the filling region, the second edge direction of Xiang Suoshu filling region,
Described first while and second while be the filling region opposite two side, the extending direction of the magnetic field movement module and institute
It is identical to state the first extending direction while with second；Or
Using the magnetic field movement module of four strips, during the pressing process, control two of them magnetic field movement module respectively from
The central region corresponding position of the filling region, the first side of Xiang Suoshu filling region and the second edge direction move in parallel, control
Make other two magnetic field movement module respectively from the central region corresponding position of the filling region, the of Xiang Suoshu filling region
Three sides and the 4th edge direction move in parallel, described first while and second while be the filling region opposite two side, it is described
Third while and the 4th while be the filling region other two opposite side, the extending direction of the magnetic field movement module and its
The extending direction on the corresponding side of moving direction is identical.
2. the packaging method of organic light emitting diode device according to claim 1, which is characterized in that described to described
The step of one substrate and the second substrate are pressed include:
One pressing pallet is provided, the first substrate is placed on the pressing pallet；
Force fit plate on one is provided, the second substrate is fixed on the upper force fit plate；
The upper force fit plate direction that control is fixed with the second substrate is placed under the direction of pressing pallet of the first substrate
Pressure；During the pressing process, the magnetic field movement module is controlled in the one side of the not set the second substrate of the upper force fit plate
On, and/or, it is mobile towards assigned direction in the one side of the not set first substrate of the pressing pallet, described in driving
The magnetic particle filled in glue is mobile towards the assigned direction.
3. the packaging method of organic light emitting diode device according to claim 1, which is characterized in that the magnetic particle
It is made of the magnetic material with superparamagnetism.
4. the packaging method of organic light emitting diode device according to claim 1, which is characterized in that the magnetic particle
For the magnetic particle of nano-scale.
5. the packaging method of organic light emitting diode device according to claim 1, which is characterized in that the magnetic particle
Surface using organic material coat.
6. the packaging method of organic light emitting diode device according to claim 5, which is characterized in that the organic material
It include: oleic acid, PMMA or PVP.
7. a kind of organic light emitting diode device, which is characterized in that use packaging method as claimed in any one of claims 1 to 6
It encapsulates；
The organic light emitting diode device includes: the first substrate and the second substrate of pairing, is provided in the second substrate
Organic light emitting diode device is provided with the cofferdam glue of closure and is filled in described between the first substrate and the second substrate
Filling glue in the filling region that cofferdam glue is enclosed, doped with magnetic particle in the filling glue.
8. a kind of sealed in unit of organic light emitting diode device characterized by comprising
Gluing module, for being formed with the cofferdam glue of closure, and the filling region enclosed in the cofferdam glue on the first substrate
Glue is filled in interior formation, doped with magnetic particle in the filling glue；
Magnetic field movement module；
Module is pressed, for being pressed to the first substrate with the second substrate for being formed with Organic Light Emitting Diode, and
In bonding processes, the magnetic field movement module is controlled on the outside of the first substrate and/or on the outside of the second substrate towards specified
Direction is mobile, to drive the magnetic particle in the filling glue mobile towards the assigned direction；
Using a magnetic field movement module, during the pressing process, the magnetic field movement module is controlled from the filling region
Portion region corresponding position, helical form are mobile to the fringe region direction of the filling region；Or
Using the magnetic field movement module of two strips, during the pressing process, one of magnetic field movement module is controlled from described
First edge direction of the central region corresponding position of filling region, Xiang Suoshu filling region moves in parallel, and controls another magnetic field
Mobile module is moved in parallel from the central region corresponding position of the filling region, the second edge direction of Xiang Suoshu filling region,
Described first while and second while be the filling region opposite two side, the extending direction of the magnetic field movement module and institute
It is identical to state the first extending direction while with second；Or
Using the magnetic field movement module of four strips, during the pressing process, control two of them magnetic field movement module respectively from
The central region corresponding position of the filling region, the first side of Xiang Suoshu filling region and the second edge direction move in parallel, control
Make other two magnetic field movement module respectively from the central region corresponding position of the filling region, the of Xiang Suoshu filling region
Three sides and the 4th edge direction move in parallel, described first while and second while be the filling region opposite two side, it is described
Third while and the 4th while be the filling region other two opposite side, the extending direction of the magnetic field movement module and its
The extending direction on the corresponding side of moving direction is identical.
9. the sealed in unit of organic light emitting diode device according to claim 8, which is characterized in that the pressing module
Include:
Pallet is pressed, for placing the first substrate；
Upper force fit plate, for fixing the second substrate；
Magnetic field movement module；
Control module is fixed with the upper force fit plate of the second substrate towards the pressing for being placed with the first substrate for controlling
Pallet direction pushes, and during the pressing process, controls the magnetic field movement module not set described the of the upper force fit plate
In the one side of two substrates, and/or, it is mobile towards assigned direction in the one side of the pressing not set first substrate of pallet,
To drive the magnetic particle in the filling glue mobile towards the assigned direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710042006.9A CN106784360B (en) | 2017-01-20 | 2017-01-20 | A kind of organic light emitting diode device and its packaging method, sealed in unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710042006.9A CN106784360B (en) | 2017-01-20 | 2017-01-20 | A kind of organic light emitting diode device and its packaging method, sealed in unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106784360A CN106784360A (en) | 2017-05-31 |
| CN106784360B true CN106784360B (en) | 2019-05-03 |
Family
ID=58944940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710042006.9A Active CN106784360B (en) | 2017-01-20 | 2017-01-20 | A kind of organic light emitting diode device and its packaging method, sealed in unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106784360B (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106935729A (en) * | 2017-04-01 | 2017-07-07 | 京东方科技集团股份有限公司 | The method for packing and sealed in unit of packaging plastic, display device |
| CN107394062B (en) | 2017-07-20 | 2019-02-05 | 京东方科技集团股份有限公司 | A kind of organic LED display panel and preparation method thereof, display device |
| CN107452901A (en) * | 2017-07-31 | 2017-12-08 | 京东方科技集团股份有限公司 | A kind of method for packing of display panel, display panel and display device |
| CN107634155B (en) * | 2017-09-22 | 2019-02-22 | 京东方科技集团股份有限公司 | Packaging method, encapsulating structure and the display device of oled display substrate |
| CN108470846B (en) | 2018-04-11 | 2019-09-10 | 京东方科技集团股份有限公司 | Packaging method, electronic device and sealed in unit |
| CN110600620B (en) * | 2018-06-12 | 2020-12-01 | Tcl科技集团股份有限公司 | Preparation method of quantum dot film |
| CN109037464B (en) * | 2018-07-26 | 2020-06-23 | 京东方科技集团股份有限公司 | Quantum dot light-emitting layer, quantum dot light-emitting device and preparation method thereof |
| CN109119542B (en) * | 2018-07-26 | 2020-10-09 | 苏州星烁纳米科技有限公司 | Quantum dot electroluminescent device |
| CN109616588B (en) * | 2018-12-06 | 2020-10-30 | 合肥鑫晟光电科技有限公司 | Packaging structure and packaging method of light-emitting device and display device |
| CN110416436B (en) * | 2019-08-29 | 2021-05-25 | 京东方科技集团股份有限公司 | Thin film packaging structure, display device and packaging method |
| CN110729205B (en) * | 2019-09-16 | 2021-11-23 | 上海先方半导体有限公司 | Filling method of underfill |
| CN112909202B (en) * | 2021-01-25 | 2022-12-09 | 绵阳京东方光电科技有限公司 | Display panel, preparation method thereof and display device |
| CN116699911B (en) * | 2023-08-03 | 2023-11-14 | 惠科股份有限公司 | Display panel, bonding method of display panel and display device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204155965U (en) * | 2014-11-17 | 2015-02-11 | 京东方科技集团股份有限公司 | LED display panel |
| CN105161630A (en) * | 2015-10-14 | 2015-12-16 | 京东方科技集团股份有限公司 | OLED and preparation method thereof |
| CN105907329A (en) * | 2016-06-27 | 2016-08-31 | 京东方科技集团股份有限公司 | Bonding glue mixture, bonding glue detecting device, display panel and preparation method of display panel |
| CN105957977A (en) * | 2016-05-13 | 2016-09-21 | 京东方科技集团股份有限公司 | Packaging material, packaging cover plate, sintering device, sintering method and display device |
-
2017
- 2017-01-20 CN CN201710042006.9A patent/CN106784360B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204155965U (en) * | 2014-11-17 | 2015-02-11 | 京东方科技集团股份有限公司 | LED display panel |
| CN105161630A (en) * | 2015-10-14 | 2015-12-16 | 京东方科技集团股份有限公司 | OLED and preparation method thereof |
| CN105957977A (en) * | 2016-05-13 | 2016-09-21 | 京东方科技集团股份有限公司 | Packaging material, packaging cover plate, sintering device, sintering method and display device |
| CN105907329A (en) * | 2016-06-27 | 2016-08-31 | 京东方科技集团股份有限公司 | Bonding glue mixture, bonding glue detecting device, display panel and preparation method of display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106784360A (en) | 2017-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106784360B (en) | A kind of organic light emitting diode device and its packaging method, sealed in unit | |
| CN103258971B (en) | The method for packing of display element and device thereof | |
| CN104505466B (en) | OLED encapsulating structure and method for packing thereof | |
| CN202585523U (en) | Optical assembly and packaging structure for semiconductor light-emitting device | |
| CN104183785A (en) | OLED device packaging method, OLED display panel and OLED display device | |
| CN104505465A (en) | OLED packaging structure and packaging method thereof | |
| KR102659865B1 (en) | Display module, method of manufacturing display module | |
| CN110112323A (en) | OLED packaging structure, packaging method and display device | |
| CN108470846B (en) | Packaging method, electronic device and sealed in unit | |
| Lei et al. | Optical performance enhancement of quantum dot-based light-emitting diodes through an optimized remote structure | |
| CN107086263A (en) | Display device and its four sides are emitting led | |
| CN109065755A (en) | Display panel and packing component | |
| CN202474018U (en) | Led packaging structure | |
| CN204278722U (en) | A kind of half tone and display device | |
| CN108538763B (en) | Heating assembly, packaging device and packaging method | |
| CN101436638A (en) | High-power LED packaging structure | |
| CN207124208U (en) | A kind of plant illumination novel high-power support and packaging | |
| CN105870356A (en) | Display equipment and production method thereof | |
| CN206422094U (en) | A kind of LED support, LED component and the LED display of pad depression | |
| CN108963107B (en) | Packaging jig | |
| CN107452901A (en) | A kind of method for packing of display panel, display panel and display device | |
| CN208637454U (en) | A kind of uniform vapour-pressure type molding press | |
| CN103022327A (en) | LED packaging structure and method for manufacturing same | |
| TW200636965A (en) | IC packaging process with non-tape die attachment | |
| CN203179942U (en) | Light emitting diode device protected by isolating layer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |