CN112786802A - Display device packaging structure and manufacturing method of packaging plate - Google Patents
Display device packaging structure and manufacturing method of packaging plate Download PDFInfo
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- CN112786802A CN112786802A CN202011545666.7A CN202011545666A CN112786802A CN 112786802 A CN112786802 A CN 112786802A CN 202011545666 A CN202011545666 A CN 202011545666A CN 112786802 A CN112786802 A CN 112786802A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 49
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000005260 corrosion Methods 0.000 claims abstract description 36
- 239000000853 adhesive Substances 0.000 claims description 34
- 230000001070 adhesive effect Effects 0.000 claims description 34
- 239000000758 substrate Substances 0.000 claims description 21
- 238000002161 passivation Methods 0.000 claims description 20
- 239000011265 semifinished product Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 4
- 238000009966 trimming Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 abstract description 13
- 239000010408 film Substances 0.000 description 32
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- 238000000151 deposition Methods 0.000 description 4
- 229910001148 Al-Li alloy Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 238000005536 corrosion prevention Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000012855 volatile organic compound Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a display equipment packaging structure and a manufacturing method of the packaging plate. The packaging plate of the packaging structure of the display equipment has the anti-corrosion film, so that the phenomenon that the packaging plate is corroded due to the contact of the external environment or personnel can be effectively avoided, the probability that the OLED device is damaged due to the corrosion of the packaging plate is reduced, and the bad incidence rate of the display equipment is low. The packaging plate manufactured by the manufacturing method of the packaging plate has the advantages of good performance, stable anti-corrosion film, simple manufacturing process and low cost.
Description
Technical Field
The invention relates to the technical field of display, in particular to a display device packaging structure and a manufacturing method of a packaging plate.
Background
In the field of Display technology, flat panel Display technologies such as Liquid Crystal Displays (LCDs) and Organic Light Emitting Diodes (OLEDs) have gradually replaced CRT displays. Among them, the OLED has many advantages of self-luminescence, low driving voltage, high luminous efficiency, short response time, high definition and contrast, a viewing angle of nearly 180 °, a wide temperature range, and capability of realizing flexible display and large-area full-color display, and is widely used in mobile phone screens, computer monitors, full-color televisions, etc., and is considered as a display device with the most potential for development in the industry.
The OLED device is generally disposed on a thin film transistor array substrate (TFT substrate for short), and includes an anode, a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, an electron injection layer, and a cathode sequentially formed on the TFT substrate. The organic light emitting layer is very sensitive to moisture and oxygen in the atmosphere, and electrochemical corrosion easily occurs in an environment containing moisture or oxygen to damage the OLED device, so that the service life of the OLED device can be greatly shortened due to moisture or oxygen permeation. At present, the OLED device is usually packaged between the TFT substrate and the packaging plate to prevent water vapor and oxygen from entering the OLED device, but the surface of the packaging plate is also easy to corrode, so that the blocking capability of the packaging plate on the water vapor or the oxygen is weakened, and the OLED device is damaged.
Disclosure of Invention
The invention aims to provide a display equipment packaging structure and a manufacturing method of a packaging plate, wherein the packaging plate has good anti-corrosion performance, can reduce the probability of damage of an OLED device, and reduces the bad occurrence rate of display equipment.
In order to achieve the purpose, the invention adopts the following technical scheme:
on the one hand, the display equipment packaging structure comprises a packaging plate, a TFT substrate and an OLED device, wherein the OLED device is arranged between the packaging plate and the TFT substrate, the packaging plate comprises a plate body and an anti-corrosion film, and the anti-corrosion film at least covers one surface of the plate body, which is far away from the OLED device.
As a preferable aspect of the display device package structure of the present invention, the display device package structure further includes an adhesive, the adhesive is filled between the board body and the TFT substrate, and both the board body and the TFT substrate are connected to the adhesive.
As a preferable aspect of the display device encapsulation structure of the present invention, the display device encapsulation structure further includes a passivation layer, the passivation layer is disposed on the TFT substrate, the OLED device is encapsulated in the passivation layer, and the adhesive covers a surface of the passivation layer.
As a preferable scheme of the display device package structure of the present invention, the passivation layer is made of silicon nitride, silicon dioxide, or aluminum oxide.
As a preferable aspect of the display device package structure of the present invention, the plate body is made of an alloy.
As a preferable scheme of the display device packaging structure of the present invention, a plurality of grooves are formed on a surface of the board body, which is connected to the adhesive, and the adhesive is filled in the grooves.
As a preferable aspect of the display device packaging structure of the present invention, the adhesive is a shadowless adhesive.
In another aspect, a method for manufacturing a package board in a package structure of a display device according to any one of the above technical solutions is provided, including the following steps:
s1, providing a plate body and a coating, cleaning the plate body, and spraying the coating on the plate body to form an anti-corrosion film to obtain a semi-finished product;
s2, drying the semi-finished product;
s3, cooling the semi-finished product;
and S4, trimming the edge of the anti-corrosion film to obtain the packaging plate.
As a preferable scheme of the manufacturing method of the package board of the present invention, the semi-finished product is dried by using a vacuum oven.
As a preferable mode of the manufacturing method of the package board of the present invention, the semi-finished product is cooled with an inert gas.
The invention has the beneficial effects that:
the packaging plate of the packaging structure of the display equipment has the anti-corrosion film, so that the phenomenon that the packaging plate is corroded due to the contact of the external environment or personnel can be effectively avoided, the probability that the OLED device is damaged due to the corrosion of the packaging plate is reduced, and the bad incidence rate of the display equipment is low. The packaging plate manufactured by the manufacturing method of the packaging plate has the advantages of good performance, stable anti-corrosion film, simple manufacturing process and low cost.
Drawings
Fig. 1 is a schematic structural diagram of a display device package structure according to an embodiment of the invention;
FIG. 2 is a side view of a plate body according to an embodiment of the invention;
FIG. 3 is a side schematic view of a plate body according to another embodiment of the invention;
fig. 4 is a flowchart of a method for manufacturing a package board of a package structure of a display device according to an embodiment of the present invention.
In the figure:
1. a package board; 11. a plate body; 111. a groove; 12. an anticorrosive film; 2. a TFT substrate; 3. an OLED device; 4. an adhesive; 5. and a passivation layer.
Detailed Description
Advantages and features of the present invention and methods of accomplishing the same will become apparent with reference to the following detailed description of the embodiments taken in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various forms, which are provided only to complete the disclosure of the present invention and make those skilled in the art sufficiently understand the scope of the present invention, and the present invention is limited only by the scope of the claims. Like reference numerals denote like constituent elements throughout the specification.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the word "over" a first feature or feature in a second feature may include the word "over" or "over" the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature "under" a second feature may include a first feature that is directly under and obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Hereinafter, the present invention is described in detail with reference to the accompanying drawings.
In order to better protect the OLED device 3 in the display device and reduce the occurrence rate of the defects of the display device, as shown in fig. 1, the display device packaging structure of the embodiment includes a packaging plate 1, a TFT substrate 2 and the OLED device 3, the OLED device 3 is disposed between the packaging plate 1 and the TFT substrate 2, the packaging plate 1 includes a plate body 11 and an anti-corrosion film 12, and the anti-corrosion film 12 covers one surface of the plate body 11, which faces away from the OLED device 3.
The packaging plate 1 of the packaging structure of the display device in the embodiment comprises the anti-corrosion film 12, so that the phenomenon that the packaging plate 1 is corroded due to external environment or personnel contact can be effectively avoided, the probability that the OLED device 3 is damaged due to corrosion of the packaging plate 1 is reduced, and the bad occurrence rate of the display device is low.
The anti-corrosion film 12 may cover only one side of the plate body 11 away from the OLED device 3, and the anti-corrosion film 12 may cover a larger area of the plate body 11 without affecting the fixation of the package plate 1.
The display device packaging structure further comprises an adhesive 4, wherein the adhesive 4 is filled between the plate body 11 and the TFT substrate 2, and both the plate body 11 and the TFT substrate 2 are connected with the adhesive 4. The adhesive 4 connects the package plate 1 and the TFT substrate 2 together so that the package plate 1 provides protection for the OLED device 3.
Further, the display device packaging structure further comprises a passivation layer 5, the passivation layer 5 is arranged on the TFT substrate 2, the OLED device 3 is packaged in the passivation layer 5, and the adhesive 4 covers the surface of the passivation layer 5. The passivation layer 5 is generally made of a dense non-metal material, and can effectively prevent water vapor or oxygen from passing through, so that the OLED device 3 is protected, and the material for making the passivation layer 5 can be selected from silicon nitride, silicon dioxide or aluminum oxide. The passivation layer 5 made of the silicon nitride material can be prepared by adopting a plasma enhanced chemical vapor deposition method, so that the film forming reaction can be carried out at a lower temperature, and the passivation layer has the advantages of high deposition rate, good film forming quality, few pinholes and difficult cracking.
The passivation layer 5 can be made by depositing a plurality of layers of thin films layer by layer, for example, using high density polyethylene and AL-LI alloy, depositing AL-LI alloy on the metal cathode first, then vapor depositing polyethylene film, wrapping a layer of AL-LI alloy, and finally encapsulating the OLED device 3 with polyethylene film, under the protection of the three-layer passivation structure, the service life of the OLED device 3 will be greatly prolonged, and all steps of the encapsulation process are continuously completed in the vacuum chamber, and the manufacturing process is simple and stable.
The plate body 11 may be made of alloy or may be made of non-metallic materials such as glass. Specifically, the plate body 11 can be made of invar alloy, namely, iron alloy containing 35.4% of nickel, has a very low thermal expansion coefficient at normal temperature, and is suitable for manufacturing precision devices such as display equipment.
As shown in fig. 2, a plurality of grooves 111 may be formed on the surface of the plate body 11 to which the adhesive 4 is attached, and the adhesive 4 is filled in the grooves 111. The groove 111 increases the contact area of the surface of the board body 11 with the adhesive 4, thereby increasing the connection strength of the board body 11 with the adhesive 4, so that the package board 1 is not easily detached. The depth of the recess 111 should not be too large in order to avoid a large weakening of the structural strength of the package plate 1, the depth of the recess 111 preferably not exceeding one third of the thickness of the package plate 1.
In the embodiment shown in fig. 2, the cross-sectional shape of the groove 111 is rectangular.
As shown in fig. 3, in another embodiment, the cross section of the groove 111 is semicircular, and besides, the cross section of the groove 111 may be trapezoidal or other shapes, which can make the plate body 11 adhere to the adhesive 4 more firmly. However, it is to avoid sharp-angled bending on the plate body 11, for example, to avoid the grooves 111 having an equilateral triangular cross section, thereby preventing stress concentration regions.
The adhesive 4 can be shadowless adhesive, which is also called photosensitive adhesive or ultraviolet light curing adhesive, and the shadowless adhesive is an adhesive which can be cured only by ultraviolet light irradiation, and can be used as adhesive, and can also be used as adhesive material of paint, coating, ink and the like.
The curing speed of the shadowless adhesive is high, the labor productivity is improved, and volatile organic compounds and pollution are not generated.
As shown in fig. 4, an embodiment of the present invention further provides a method for manufacturing a package board in a package structure of a display device, including the following steps:
s1, providing a plate body 11 and a coating, and after the plate body 11 is cleaned, spraying the coating on the plate body 11 to form an anti-corrosion film 12 to obtain a semi-finished product;
s2, drying the semi-finished product;
s3, cooling the semi-finished product;
and S4, trimming the edge of the anti-corrosion film 12 to obtain the packaging plate 1.
The plate body 11 is cleaned first, so that impurities on the plate body 11 can be removed, the coating can be more tightly covered on the plate body 11, and the thickness of the anti-corrosion film 12 is more uniform. The semi-finished product is firstly dried to remove the residual solvent in the coating and harden the anti-corrosion film 12 so as to be firmly attached to the plate body 11, and then the semi-finished product is cooled, so that the high-temperature plate body 11 or the anti-corrosion film 12 can be prevented from being directly contacted with air to be oxidized. In order to ensure the coverage of the plate body 11 by the corrosion protection film 12, the coating range of the coating exceeds one surface of the plate body 11 during the coating process, and the edge of the corrosion protection film 12 formed after the coating process is finished exceeds the edge of the plate body 11, so the edge of the corrosion protection film 12 needs to be trimmed.
After finishing the trimming of the corrosion-resistant film 12, a layer of protective glue can be covered on the edge of the corrosion-resistant film 12, so that the boundary between the corrosion-resistant film 12 and the plate body 11 is also protected, the edge of the corrosion-resistant film 12 is prevented from being curled, and the plate body 11 is protected more effectively. The protective glue can also cover the side surface of the plate body 11, so that the surface of the plate body 11 has no exposed area, and the corrosion resistance of the plate body 11 is further enhanced.
And further, drying the semi-finished product by using a vacuum oven. The vacuum oven can volatilize volatile organic compounds in the coating more quickly, reduce the drying time and improve the production efficiency. Because the device operates under negative pressure, the oxidation reaction can be reduced or avoided. In addition, since no air flow blows the coating, the uniformity of the thickness of the corrosion prevention film 12 can be ensured.
Further, inert gas is used for cooling the semi-finished product. The inert gas does not react with the plate body 11 or the corrosion protection film 12 when it encounters a high temperature, thereby preventing the plate body 11 or the corrosion protection film 12 from being oxidized or chemically reacted. Specifically, the plate body 11 and the corrosion prevention film 12 may be cooled by using nitrogen gas. If the conditions allow, clean dry air can be used for cooling so as to reduce the production cost.
Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments, but may be manufactured in various forms, and those skilled in the art will appreciate that the present invention may be embodied in other specific forms without changing the technical spirit or essential features of the invention. It is therefore to be understood that the above described embodiments are illustrative and not restrictive in all respects.
Claims (10)
1. The display equipment packaging structure is characterized by comprising a packaging plate, a TFT substrate and an OLED device, wherein the OLED device is arranged between the packaging plate and the TFT substrate, the packaging plate comprises a plate body and an anti-corrosion film, and the anti-corrosion film at least covers one surface of the plate body, which is far away from the OLED device.
2. The display device package structure according to claim 1, further comprising an adhesive filled between the board body and the TFT substrate, both the board body and the TFT substrate being connected to the adhesive.
3. The display device encapsulation structure of claim 2, further comprising a passivation layer disposed on the TFT substrate, the OLED device being encapsulated in the passivation layer, the adhesive coating a surface of the passivation layer.
4. The display device package structure of claim 3, wherein the passivation layer is made of silicon nitride, silicon dioxide or aluminum oxide.
5. The display device package structure of any one of claims 1 to 4, wherein the plate body is made of an alloy.
6. The display device package structure according to any one of claims 2 to 4, wherein a plurality of grooves are formed on a surface of the board body connected to the adhesive, and the adhesive is filled in the grooves.
7. The display device package structure of any one of claims 2 to 4, wherein the adhesive is a shadowless glue.
8. A method for manufacturing a package board in a package structure of a display device according to any one of claims 1 to 7, comprising the steps of:
s1, providing a plate body and a coating, cleaning the plate body, and spraying the coating on the plate body to form an anti-corrosion film to obtain a semi-finished product;
s2, drying the semi-finished product;
s3, cooling the semi-finished product;
and S4, trimming the edge of the anti-corrosion film to obtain the packaging plate.
9. The method for manufacturing a package board in a package structure of a display device according to claim 8, wherein the semi-finished product is dried by a vacuum oven.
10. The method of claim 8, wherein the semi-finished product is cooled by inert gas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011545666.7A CN112786802A (en) | 2020-12-23 | 2020-12-23 | Display device packaging structure and manufacturing method of packaging plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011545666.7A CN112786802A (en) | 2020-12-23 | 2020-12-23 | Display device packaging structure and manufacturing method of packaging plate |
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| Publication Number | Publication Date |
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| CN112786802A true CN112786802A (en) | 2021-05-11 |
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| CN202011545666.7A Pending CN112786802A (en) | 2020-12-23 | 2020-12-23 | Display device packaging structure and manufacturing method of packaging plate |
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2020
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