CN109599381A - A kind of fixed proportion auri/silver-based bonding line and preparation method thereof - Google Patents
A kind of fixed proportion auri/silver-based bonding line and preparation method thereof Download PDFInfo
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Abstract
The invention discloses a kind of fixed proportion auri/silver-based bonding line and preparation method thereof, auri/silver-based bonding line includes matrix element and alloying element, and described matrix element is high-purity gold element or high-purity silver element.The present invention is different from existing bonding filamentary silver or electrum bonding wire basis material ratio arbitrarily changes, and alloy material arbitrarily adds, and leads to problems such as the stability of material and consistency poor；Fixed proportion auri/silver-based the bonding line is substrate gold or silver and matched fixed proportion addition alloying element as constant concentration ratio made of solid-state mixing, liquid consolute, with preferable mechanical performance, conductive radiator performance and bonding performance, and performance is stablized, consistency is good；Super Fine Gold or filamentary silver can be effectively solved to often result in wire sway, bonding fracture in bonding process and step on a phenomenon；And cost is relatively low for the alloying element added, and can obviously reduce the material cost of wire rod, thus play the role of substituting gold line in a certain range.
Description
Technical field
The present invention relates to the microelectronic industries encapsulation Material Field such as semiconductor, integrated circuit, LED and PCB circuit board,
More particularly to a kind of fixed proportion auri/silver-based bonding line and preparation method thereof.
Background technique
Bonding wire (bonding wire) is connection chip and outer enclosure substrate (substrate) and/or multilayer line
The main connection type of plate (PCB).Bonding wire development trend is mainly line footpath imperceptibility, high workshop service life from application direction
(floor life) and high spool length.
As integrated antenna package industry is quickly to small size, high-performance is highly dense, and multi-chip direction promotes, between feature
Carpenters square cun is smaller and smaller, and integrated level is higher and higher, this greatly improves the requirement of para-linkage wire material, also increases bonding envelope
Fill difficulty.Spun gold in the case where thin space, long range bonding techniques require, fade in by disadvantage；Because in ultra-fine spacing ball bond technique
In, number of pins increases, and greatly increases original gold, the quantity of aluminium bonding wire and length also, causes lead-in inductance, resistance very
Height, to also be difficult to adapt to the requirement of high-frequency high-speed performance；Meanwhile pin number increases, pin spacing reduces, it is necessary to use
Ultra-fine spun gold, and Super Fine Gold often results in wire sway, bonding fracture in bonding process and steps on a phenomenon, at arc ability
Stability also decline therewith, to increase operation difficulty.On the other hand, golden with high costs, therefore, develop performance and at
This novel bonding line for all having advantage is the what the trend requires that microelectronic industry is constantly miniaturized, low cost develops.
The mainly filamentary silver of existing substitution spun gold and the Silver alloy wire that microelement is added in silver, but not because of composition transfer
Fixed, performance is highly unstable and consistency is poor, influences service performance.
Summary of the invention
The invention proposes a kind of fixed proportion auri/silver-based bonding line and preparation method thereof, the fixed proportion auri keys
The base material component immobilization of zygonema can effectively solve Super Fine Gold or filamentary silver and be bonded because using auri or silver-base alloy form
Wire sway, bonding fracture are often resulted in the process and step on a phenomenon.
It realizes the technical scheme is that a kind of fixed proportion auri/silver-based bonding line, auri/silver-based bonding line packet
Matrix element and alloying element are included, described matrix element is high-purity gold element or high-purity silver element.
Described matrix element is high-purity gold element, and alloying element is the alloy member of high purity silver, High Purity Palladium, platinum, osmium, tellurium and selenium
Element, high-purity gold element mass percent is 80%, 70%, 60% or 51% in auri/silver-based bonding line, and surplus is alloying element, system
It is standby to obtain auri bonding line.
Described matrix element is high-purity silver element, and alloying element is the alloying element of High Purity Gold and High Purity Palladium, auri/silver-based
High-purity silver element mass percent is 80%, 85%, 88%, 90% or 95% in bonding line, and surplus is alloying element, and silver is prepared
Base bonding line.
The auri/silver-based bonding line diameter is 0.01mm-0.03mm.
Fixed proportion auri/silver-based bonding line preparation method, steps are as follows:
(1) solid-state mixes: taking the high-purity silver element of High Purity Gold in specific proportions or is sufficiently mixed in the solid state with alloying element, obtains
Alloy base metal；
(2) founding: being heated to whole fusings for alloy base metal, liquid be mixed melting uniformly after directional solidification, be casting continuously to form
The alloy material stick of 8-3mm；
(3) drawing: alloy material stick is successively secondary through excessive drawing, middle drawing, small drawing, thin drawing, micro- draw bead, it is drawn into 0.01mm-
Atomic thin auri/silver-based bonding line of 0.03mm；
(4) cleaning annealing: atomic thin auri/silver-based bonding line is cleaned, annealed, is air-dried；
(5) after-combustion bundling: after-combustion bundling depending on the application, packed products.
Heating method is to be placed in alloy base metal in the crucible of high vacuum casting furnace in the step (2), is vacuumized in rear
Frequency induction heating.
Apply pulse current in the step (3) when drawing around alloy material stick, while ultrasound is carried out to alloy material stick
Impact rolling.
The concrete operations annealed in the step (4) are the steady that atomic thin auri/silver-based bonding line is placed in 0.5-5T
In magnetic field, in 400-450 DEG C of heat preservation 5-5.5h, then it is slowly cooled to room temperature, then import in annealing furnace and anneal.
Directional solidification is applied around alloy base metal using vertically-oriented solidification in directional solidification in the step (2)
Add AC field, the direction of AC field is vertical with the directional solidification direction of alloy base metal always.
The beneficial effects of the present invention are: being different from existing bonding filamentary silver or electrum bonding wire basis material ratio is random
Variation, alloy material arbitrarily add, and lead to problems such as the stability of material and consistency poor；Fixed proportion auri/silver-based the key
Zygonema is to be mixed by the substrate gold or silver and matched fixed proportion addition alloying element of constant concentration ratio in solid-state mixing, liquid
Made of molten, there is preferable mechanical performance, conductive radiator performance and bonding performance, and performance is stablized, consistency is good；It can be effective
It solves Super Fine Gold or filamentary silver often results in wire sway, bonding fracture in bonding process and steps on a phenomenon；And the conjunction added
Cost is relatively low for gold element, and can obviously reduce the material cost of wire rod, thus plays the work of substitution gold line in a certain range
With.In addition, using specific production method, so that the bonding line produced is functional.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical solution of the present invention is clearly and completely described, it is clear that institute
The embodiment of description is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention,
Those of ordinary skill in the art's every other embodiment obtained under that premise of not paying creative labor, belongs to this hair
The range of bright protection.
Embodiment 1
A kind of fixed proportion auri bonding line include: by mass percentage be 80% High Purity Gold Au and mass percentage be
18.5% high purity silver Ag, the High Purity Palladium Pd that mass percentage is 1.25%, mass percentage add up to 0.25% tellurium and selenium
Together, fusing is vacuumized in the crucible for being put into vacuum casting furnace after solid-state mixing, it is uniformly cooling solidifying afterwards in liquid mixed smelting
Gu, be casting continuously to form alloy base metal stick, through the passages cold-drawn such as large, medium and small, thin, micro- at atomic thin between diameter 0.01mm-0.03mm
Silk thread.
The production method of 80% auri bonding line in the present embodiment, its step are as follows:
(1) solid-state mixes: take the matrix element High Purity Gold Au and total 20% that mass percentage is 80% addition element silver Ag,
Palladium Pd and tellurium Te, selenium Se, wherein the content of silver-colored Ag is 18.5%, the content of palladium Pd is 1.25, the content of tellurium and selenium is 0.25%,
It mixes in the solid state；
(2) melt cast alloys base material: the mixture that step (1) obtains is placed in the crucible of high vacuum casting furnace and vacuumizes intermediate frequency
Induction heating to whole elements melts, liquid mixed smelting uniformly after directional solidification, be casting continuously to form 8-3mm alloy base metal stick；
(3) drawing silk material: the 8mm alloy base metal stick that step (2) is obtained is through excessive drawing, middle drawing, small drawing, thin drawing, the road Wei Ladeng
The secondary atomic thin 80% auri bonding line for being drawn into 0.01mm-0.03mm；
(4) cleaning annealing: the atomic thin 80% auri bonding line that step (3) is obtained is cleaned, is annealed, is air-dried；
(5) after-combustion bundling: according to different purposes after-combustion bundlings, packed products.
Embodiment 2
It is 70% matrix element High Purity Gold Au and quality percentage that a kind of fixed proportion auri bonding line, which includes: by mass percentage,
High Purity Palladium Pd that high purity silver Ag that content is 27.5%, mass percentage are 2.25%, mass percentage add up to 0.25%
Tellurium and selenium together, vacuumize fusing in the crucible for being put into vacuum casting furnace after solid-state mixing, after liquid mixed smelting is uniform
Cooled and solidified is casting continuously to form alloy base metal stick, through the passages cold-drawn such as large, medium and small, thin, micro- between diameter 0.01mm-0.03mm
Atomic thin silk thread.
The production method of 70% auri bonding line in the present embodiment, its step are as follows:
(1) solid-state mixes: take the matrix element High Purity Gold Au and total 30% that mass percentage is 70% addition element silver Ag,
Palladium Pd and tellurium Te, selenium Se, wherein the content of silver-colored Ag is 37.5%, the content of palladium Pd is 2.25, tellurium Te, selenium Se add up to 0.25%,
It mixes in the solid state；
(2) melt cast alloys base material: the solid mixt that step (1) obtains is placed in the crucible of high vacuum casting furnace and is vacuumized
Mid-frequency induction heating to whole metal moltens, liquid mixed smelting uniformly after directional solidification, to be casting continuously to form 8-3mm hybrid alloys female
Material stick；
(3) drawing silk material: the 8mm hybrid alloys base material stick that step (2) is obtained is through excessive drawing, middle drawing, small drawing, thin drawing, micro- drawing
Etc. passages be drawn into the atomic thin 80% auri bonding line of 0.01mm-0.03mm；
(4) cleaning annealing: the atomic thin 70% auri bonding line that step (3) is obtained is cleaned, is annealed, is air-dried；
(5) after-combustion bundling: according to different purposes after-combustion bundlings, packed products.
Embodiment 3
A kind of fixed proportion auri bonding line include: be 60% High Purity Gold Au by mass percentage and mass percentage is
36.5% high purity silver Ag, the High Purity Palladium Pd that mass percentage is 3.25%, the tellurium Te of mass percentage total 0.25%, selenium
Se together, vacuumizes fusing in the crucible for being put into vacuum casting furnace after solid-state mixing, uniformly cools down afterwards in liquid mixed smelting
It solidifies, be casting continuously to form alloy base metal stick, through the passages cold-drawn such as large, medium and small, thin, micro- at atomic between diameter 0.01mm-0.03mm
Thin silk thread.
The production method of 60% auri bonding line in the present embodiment, its step are as follows:
(1) solid-state mixes: take the matrix element High Purity Gold Au and total 40% that mass percentage is 60% addition element silver Ag,
Palladium Pd and microelement platinum Pt, tellurium Te, selenium Se, wherein the content of silver-colored Ag is 36.5%, the content of palladium Pd is 3.25%, platinum Pt and
Tellurium Te and selenium Se add up to 0.25%, mix in the solid state；
(2) melt cast alloys base material: the solid mixt that step (1) obtains is placed in the crucible of high vacuum casting furnace and is vacuumized
Mid-frequency induction heating to whole elements melts, liquid mixed smelting uniformly after directional solidification, be casting continuously to form 8mm alloy base metal stick；
(3) drawing silk material: the 8mm alloy base metal stick that step (2) is obtained is through excessive drawing, middle drawing, small drawing, thin drawing, the road Wei Ladeng
The secondary atomic thin 60% auri bonding line for being drawn into 0.01mm-0.03mm；
(4) cleaning annealing: the atomic thin 80% auri bonding line that step (3) is obtained is cleaned, is annealed, is air-dried；
(5) after-combustion bundling: according to different purposes after-combustion bundlings, packed products.
Embodiment 4
A kind of fixed proportion auri bonding line include: be 51% High Purity Gold Au by mass percentage and mass percentage is
36.5% high purity silver Ag, the High Purity Palladium Pd that mass percentage is 3.25%, mass percentage add up to 0.25% platinum Pt,
The microelements such as osmium Os, tellurium Te, selenium Se together, vacuumize fusing in the crucible for being put into vacuum casting furnace after solid-state mixing,
Liquid mixed smelting uniformly after cooled and solidified, be casting continuously to form alloy base metal stick, through the passages cold-drawn such as large, medium and small, thin, micro- at diameter
Atomic thin silk thread between 0.01mm-0.03mm.
The production method of 51% auri bonding line in the present embodiment, its step are as follows:
(1) solid-state mixes: taking silver-colored Ag, palladium Pd and the platinum of the matrix element High Purity Gold Au and total 49% that mass percentage is 51%
The trace additives such as Pt, osmium Os, tellurium Te, selenium Se, wherein the content of silver-colored Ag is 36.5%, and the content of palladium Pd is 3.25%, platinum
The microelements such as Pt, osmium Os, tellurium Te, selenium Se add up to content to be 0.25%, mix in the solid state；
(2) melt cast alloys base material: the solid mixt that step (1) obtains is placed in the crucible of high vacuum casting furnace and is vacuumized
Mid-frequency induction heating to whole elements melts, liquid mixed smelting uniformly after directional solidification, be casting continuously to form 8mm alloy base metal stick；
(3) drawing silk material: the 8mm alloy base metal stick that step (2) is obtained is through excessive drawing, middle drawing, small drawing, thin drawing, the road Wei Ladeng
The secondary atomic thin 51% auri bonding line for being drawn into 0.01mm-0.03mm；
(4) cleaning annealing: the atomic thin 80% auri bonding line that step (3) is obtained is cleaned, is annealed, is air-dried；
(5) after-combustion bundling: according to different purposes after-combustion bundlings, packed products.
Particularly, step (2) described directional solidification is all made of vertically-oriented solidification in the various embodiments described above, and solidifying in orientation
Gu when, apply AC field around alloy base metal, the direction of AC field always with the directional solidification direction of alloy base metal
Vertically.The effect of AC field is constantly to change the activity coefficient of each element in alloy under molten condition, stick after raising solidification
The homogeneous property of material, improves the bonding line mass produced.
In addition, carrying out eddy current inspection lookup surface in embodiment 1-4 before drawing step to the surface of alloy material stick and lacking
It falls into, and reconditioning removes the surface defect found.
By the fixed proportion auri bonding line of above-mentioned manufacture, 100mm is sampled, with 10mm/min speed on strength tester
The silk thread fracture load and elongation percentage measured, and will be put into cooling thermal impact case with the LED lamp bead after this thread bonding packaging, if
Within the scope of -40 DEG C -150 DEG C fixed, it is as shown in table 1 below that temperature transition time 8S carries out impact test data acquired.
As can be seen from the above table, the mechanical performance of fixed proportion auri bonding line produced by the present invention is excellent, cold-hot punching
It hits that stability is good, fully meets the performance requirement of the encapsulation bonding wire such as domestic semiconductor devices, LED lamp bead.
Embodiment 5
A kind of 80% silver-based bonding line of fixed proportion include: by mass percentage be 80% high purity silver Ag and total 20% add
Additional element, in which: High Purity Gold Au content 15%, High Purity Palladium Pd content 5% are put into vacuum casting furnace after solid-state mixing together
Crucible in vacuumize fusing, liquid mixed smelting uniformly after cooled and solidified, be casting continuously to form alloy base metal stick, through it is large, medium and small,
Carefully, the passages cold-drawn such as micro- is at the atomic thin silk thread between diameter 0.01mm-0.03mm.
The production method of 80% silver-based bonding line in the present embodiment, its step are as follows:
(1) solid-state mixes: taking content is the palladium Pd of the golden Au and 5% of 80% matrix element high purity silver Ag and 15%, is mixed in the solid state
It gets togather；
(2) melt cast alloys base material: the mixture that step (1) obtains is placed in the crucible of high vacuum casting furnace and vacuumizes heating
To whole elements melts, liquid mixed smelting uniformly after directional solidification, be casting continuously to form 8-3mm alloy base metal stick；
(3) drawing silk material: the 8mm alloy base metal stick that step (2) is obtained is through excessive drawing, middle drawing, small drawing, thin drawing, the road Wei Ladeng
The secondary atomic thin fixed proportion silver-based bonding line for being drawn into 0.01mm-0.03mm；
(4) cleaning annealing: the atomic thin fixed proportion silver-based bonding line that step (3) is obtained is cleaned, is annealed, is air-dried；It moves back
The concrete operations of fire are that atomic thin silver-based bonding line is placed in the steady magnetic field of 0.5T, in 400 DEG C of heat preservation 5.5h, then slowly
It is cooled to room temperature, then imports in annealing furnace and anneal；
(5) after-combustion bundling: according to different purposes after-combustion bundlings, packed products.
Embodiment 6
A kind of 85% silver-based bonding line includes: the addition alloy member for the high purity silver Ag and total 15% for being 85% by mass percentage
Element, in which: High Purity Gold Au content 10%, High Purity Palladium Pd content 5%, together solid-state mixing after be put into vacuum casting furnace crucible in
Vacuumize fusing, liquid mixed smelting uniformly after cooled and solidified, be casting continuously to form alloy base metal stick, through large, medium and small, thin, Wei Dengdao
Secondary cold-drawn is at the atomic thin silk thread between diameter 0.01mm-0.03mm.
The production method of fixed proportion silver-based bonding line in the present embodiment, its step are as follows:
(1) solid-state mixes: taking the matrix element high purity silver Ag that mass percentage is 85% and the gold that mass percentage is 10%
The palladium Pd of Au and 5%, mixes in the solid state；
(2) melt cast alloys base material: the solid mixt that step (1) obtains is placed in the crucible of high vacuum casting furnace and is vacuumized
Be heated to whole metal moltens, liquid mixed smelting uniformly after directional solidification, be casting continuously to form 8-3mm hybrid alloys base material stick；
(3) drawing silk material: the 8mm hybrid alloys base material stick that step (2) is obtained is through excessive drawing, middle drawing, small drawing, thin drawing, micro- drawing
Etc. passages be drawn into the atomic thin fixed proportion silver-based bonding line of 0.01mm-0.03mm；
(4) cleaning annealing: the atomic thin fixed proportion silver-based bonding line that step (3) is obtained is cleaned, is annealed, is air-dried；It moves back
The concrete operations of fire are that atomic thin silver-based bonding line is placed in the steady magnetic field of 2T, then slowly cold in 410 DEG C of heat preservation 5.2h
But it to room temperature, then imports in annealing furnace and anneals；
(5) after-combustion bundling: according to different purposes after-combustion bundlings, packed products.
Embodiment 7
A kind of 88% silver-based bonding line includes: the addition alloy member for the high purity silver Ag and total 12% for being 88% by mass percentage
Element, in which: High Purity Gold Au content 7%, High Purity Palladium Pd content 4%, the trace additives such as platinum Pt, tellurium Te, selenium Se total 1%, together
Solid-state mixing after be put into vacuum casting furnace crucible in vacuumize fusing, liquid mixed smelting uniformly after cooled and solidified, company
Alloy base metal stick is cast, through the passages cold-drawn such as large, medium and small, thin, micro- at the atomic thin silk thread between diameter 0.01mm-0.03mm.
The production method of fixed proportion silver-based bonding line in the present embodiment, its step are as follows:
(1) solid-state mixes: take matrix element high purity silver Ag that mass percentage is 88% and mass percentage be 7% it is high-purity
Golden Au, 3% High Purity Palladium Pd and mass percentage add up to the trace additives such as 1% platinum Pt, tellurium Te, selenium Se, exist together
It is mixed under solid-state；
(2) melt cast alloys base material: the solid mixt that step (1) obtains is placed in the crucible of high vacuum casting furnace and is vacuumized
Be heated to whole elements melts, liquid mixed smelting uniformly after directional solidification, be casting continuously to form 8mm alloy base metal stick；
(3) drawing silk material: the 8mm alloy base metal stick that step (2) is obtained is through excessive drawing, middle drawing, small drawing, thin drawing, the road Wei Ladeng
The secondary atomic thin fixed proportion silver-based bonding line for being drawn into 0.01mm-0.03mm；
(4) cleaning annealing: the atomic thin fixed proportion silver-based bonding line that step (3) is obtained is cleaned, is annealed, is air-dried；It moves back
The concrete operations of fire are that atomic thin silver-based bonding line is placed in the steady magnetic field of 3T, in 420 DEG C of heat preservation 5h, then Slow cooling
To room temperature, then imports in annealing furnace and anneal；
(5) after-combustion bundling: according to different purposes after-combustion bundlings, packed products.
Embodiment 8
A kind of 90% silver-based bonding line includes: the addition alloy member for the high purity silver Ag and total 10% for being 90% by mass percentage
Element, in which: High Purity Gold Au content 4%, High Purity Palladium Pd content 5%, the trace additives such as platinum Pt, tellurium Te, selenium Se total 1%, together
Solid-state mixing after be put into vacuum casting furnace crucible in vacuumize fusing, liquid mixed smelting uniformly after cooled and solidified, company
Alloy base metal stick is cast, through the passages cold-drawn such as large, medium and small, thin, micro- at the atomic thin silk thread between diameter 0.01mm-0.03mm.
The production method of fixed proportion silver-based bonding line in the present embodiment, its step are as follows:
(1) solid-state mixes: take matrix element high purity silver Ag that mass percentage is 90% and mass percentage be 4% it is high-purity
Golden Au, 5% High Purity Palladium Pd and total 1% trace additives platinum Pt, tellurium Te, selenium Se etc., mix in the solid state；
(2) melt cast alloys base material: the solid mixt that step (1) obtains is placed in the crucible of high vacuum casting furnace and is vacuumized
Be heated to whole elements melts, liquid mixed smelting uniformly after directional solidification, be casting continuously to form 8mm alloy base metal stick；
(3) drawing silk material: the 8mm alloy base metal stick that step (2) is obtained is through excessive drawing, middle drawing, small drawing, thin drawing, the road Wei Ladeng
The secondary atomic thin fixed proportion silver-based bonding line for being drawn into 0.01mm-0.03mm；
(4) cleaning annealing: the atomic thin fixed proportion silver-based bonding line that step (3) is obtained is cleaned, is annealed, is air-dried；It moves back
The concrete operations of fire are that atomic thin silver-based bonding line is placed in the steady magnetic field of 5T, in 450 DEG C of heat preservation 5h, then Slow cooling
To room temperature, then imports in annealing furnace and anneal；
(5) after-combustion bundling: according to different purposes after-combustion bundlings, packed products.
Embodiment 9
A kind of 95% silver-based bonding line includes: the addition alloy member for the high purity silver Ag and total 5% for being 95% by mass percentage
Element, in which: 2 content 4% of High Purity Gold, High Purity Palladium Pd content 2%, the trace additives such as platinum Pt, tellurium Te, selenium Se total 1%, together
Solid-state mixing after be put into vacuum casting furnace crucible in vacuumize fusing, liquid mixed smelting uniformly after cooled and solidified, company
Alloy base metal stick is cast, through the passages cold-drawn such as large, medium and small, thin, micro- at the atomic thin silk thread between diameter 0.01mm-0.03mm.
The production method of fixed proportion silver-based bonding line in the present embodiment, its step are as follows:
(1) solid-state mixes: taking the addition element for the matrix element high purity silver Ag and total 5% that mass percentage is 95%, in which:
Golden Au content 2%, palladium Pd content 2%, the trace additives such as platinum Pt, tellurium Te, selenium Se total 1%, mix in the solid state together；
(2) melt cast alloys base material: the solid mixt that step (1) obtains is placed in the crucible of high vacuum casting furnace and is vacuumized
Be heated to whole elements melts, liquid mixed smelting uniformly after directional solidification, be casting continuously to form 8mm alloy base metal stick；
(3) drawing silk material: the 8mm alloy base metal stick that step (2) is obtained is through excessive drawing, middle drawing, small drawing, thin drawing, the road Wei Ladeng
The secondary atomic thin fixed proportion silver-based bonding line for being drawn into 0.01mm-0.03mm；
(4) cleaning annealing: the atomic thin fixed proportion silver-based bonding line that step (3) is obtained is cleaned, is annealed, is air-dried；It moves back
The concrete operations of fire are that atomic thin silver-based bonding line is placed in the steady magnetic field of 5T, then slowly cold in 450 DEG C of heat preservation 5.5h
But it to room temperature, then imports in annealing furnace and anneals；
(5) after-combustion bundling: according to different purposes after-combustion bundlings, packed products.
Particularly, embodiment 5-9 applies pulse current in drawing around alloy material stick, at the same to alloy material stick into
The rolling of row ultrasonic impact, reduces the plastic deformation resistance on alloy material stick surface layer, and so that dislocation density is increased crystal grain refinement and formed
Strengthening layer.
By the fixed proportion silver-based bonding line of above-mentioned manufacture, 100mm is sampled, with 10mm/min speed on strength tester
The silk thread fracture load and elongation percentage measured, and will be put into cooling thermal impact case with the LED lamp bead after this thread bonding packaging, if
Within the scope of -40 DEG C -150 DEG C fixed, it is as shown in table 2 below that temperature transition time 8S carries out impact test data acquired.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Within mind and principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (9)
1. a kind of fixed proportion auri/silver-based bonding line, it is characterised in that: auri/silver-based bonding line includes matrix element and conjunction
Gold element, described matrix element are high-purity gold element or high-purity silver element.
2. fixed proportion auri/silver-based bonding line according to claim 1, it is characterised in that: described matrix element is height
Proof gold element, alloying element are the alloying element of high purity silver, High Purity Palladium, platinum, osmium, tellurium and selenium,
High-purity gold element mass percent is 80%, 70%, 60% or 51% in auri/silver-based bonding line, and surplus is alloying element, system
It is standby to obtain auri bonding line.
3. fixed proportion auri/silver-based bonding line according to claim 1, it is characterised in that: described matrix element is height
Fine silver element, alloying element are the alloying element of High Purity Gold and High Purity Palladium, high-purity silver element quality hundred in auri/silver-based bonding line
Score is 80%, 85%, 88%, 90% or 95%, and surplus is alloying element, and silver-based bonding line is prepared.
4. fixed proportion auri/silver-based bonding line according to claim 1, it is characterised in that: the auri/silver-based bonding
The diameter of line is 0.01mm-0.03mm.
5. the preparation method of the described in any item fixed proportion auri/silver-based bonding lines of claim 1-4, it is characterised in that step
It is as follows:
(1) solid-state mixes: taking the high-purity silver element of High Purity Gold in specific proportions or is sufficiently mixed in the solid state with alloying element, obtains
Alloy base metal；
(2) founding: being heated to whole fusings for alloy base metal, liquid be mixed melting uniformly after directional solidification, be casting continuously to form
The alloy material stick of 8-3mm；
(3) drawing: alloy material stick is successively secondary through excessive drawing, middle drawing, small drawing, thin drawing, micro- draw bead, it is drawn into 0.01mm-
Atomic thin auri/silver-based bonding line of 0.03mm；
(4) cleaning annealing: atomic thin auri/silver-based bonding line is cleaned, annealed, is air-dried；
(5) after-combustion bundling: after-combustion bundling depending on the application, packed products.
6. the preparation method of fixed proportion auri/silver-based bonding line according to claim 5, it is characterised in that: the step
Suddenly heating method is to be placed in alloy base metal in the crucible of high vacuum casting furnace in (2), vacuumizes rear mid-frequency induction heating.
7. the preparation method of fixed proportion auri/silver-based bonding line according to claim 5, it is characterised in that: the step
Suddenly apply pulse current in (3) when drawing around alloy material stick, while ultrasonic impact rolling is carried out to alloy material stick.
8. the preparation method of fixed proportion auri/silver-based bonding line according to claim 5, it is characterised in that: the step
Suddenly the concrete operations annealed in (4) are that atomic thin auri/silver-based bonding line is placed in the steady magnetic field of 0.5-5T, in 400-
450 DEG C of heat preservation 5-5.5h, are then slowly cooled to room temperature, then import in annealing furnace and anneal.
9. the preparation method of fixed proportion auri/silver-based bonding line according to claim 5, it is characterised in that: the step
Suddenly directional solidification uses vertically-oriented solidification in (2), and in directional solidification, applies AC field around alloy base metal,
The direction of AC field is vertical with the directional solidification direction of alloy base metal always.
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| CN111715857A (en) * | 2020-07-20 | 2020-09-29 | 四川虹微技术有限公司 | Preparation device and method of metal lithium alloy cathode |
| CN111816836A (en) * | 2020-07-20 | 2020-10-23 | 四川虹微技术有限公司 | Composite lithium metal negative electrode material and preparation method thereof |
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Application publication date: 20190409 |