CN105463237B - A kind of Kufil bonding wire and preparation method thereof - Google Patents
A kind of Kufil bonding wire and preparation method thereof Download PDFInfo
- Publication number
- CN105463237B CN105463237B CN201510880814.3A CN201510880814A CN105463237B CN 105463237 B CN105463237 B CN 105463237B CN 201510880814 A CN201510880814 A CN 201510880814A CN 105463237 B CN105463237 B CN 105463237B
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- CN
- China
- Prior art keywords
- wire
- kufil
- bonding wire
- alloy
- copper
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510880814.3A CN105463237B (en) | 2015-12-05 | 2015-12-05 | A kind of Kufil bonding wire and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510880814.3A CN105463237B (en) | 2015-12-05 | 2015-12-05 | A kind of Kufil bonding wire and preparation method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105463237A CN105463237A (en) | 2016-04-06 |
CN105463237B true CN105463237B (en) | 2017-12-01 |
Family
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Family Applications (1)
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CN201510880814.3A Active CN105463237B (en) | 2015-12-05 | 2015-12-05 | A kind of Kufil bonding wire and preparation method thereof |
Country Status (1)
Country | Link |
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CN (1) | CN105463237B (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107195608A (en) * | 2017-06-15 | 2017-09-22 | 滕州晨晖电子集团股份有限公司 | A kind of copper microalloy bonding line and preparation method thereof |
CN107904434B (en) * | 2017-11-24 | 2020-03-31 | 昆明贵金属研究所 | Ultra-fine and ultra-long copper alloy wire and production method thereof |
CN108265194A (en) * | 2018-01-09 | 2018-07-10 | 北京有色金属研究总院 | A kind of railway power through track copper alloy conductor and preparation method thereof |
CN108823463A (en) * | 2018-06-30 | 2018-11-16 | 汕头市骏码凯撒有限公司 | One Albatra metal bonding wire and its manufacturing method |
CN109273055B (en) * | 2018-08-15 | 2021-12-03 | 北京康普锡威科技有限公司 | Method for judging alloy surface segregation state and method for manufacturing alloy |
CN110718526A (en) * | 2019-10-22 | 2020-01-21 | 烟台一诺电子材料有限公司 | Rare earth copper alloy bonding wire for superfine linear pitch electronic packaging and preparation method thereof |
CN113549785B (en) * | 2021-07-27 | 2022-04-26 | 四川威纳尔特种电子材料有限公司 | Bonding copper-silver alloy wire and preparation method and application thereof |
CN116656998B (en) * | 2023-07-31 | 2023-10-10 | 烟台一诺电子材料有限公司 | Silver bonding wire and processing method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007046378A1 (en) * | 2005-10-17 | 2007-04-26 | National Institute For Materials Science | Cu-Ag ALLOY WIRE HAVING HIGH STRENGTH AND HIGH CONDUCTIVITY AND METHOD FOR MANUFACTURE THEREOF |
US20100000860A1 (en) * | 2006-09-08 | 2010-01-07 | Tosoh Smd, Inc. | Copper Sputtering Target With Fine Grain Size And High Electromigration Resistance And Methods Of Making the Same |
JP5045784B2 (en) * | 2010-05-14 | 2012-10-10 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, and rolled copper alloy material for electronic equipment |
SG190481A1 (en) * | 2011-12-01 | 2013-06-28 | Heraeus Materials Tech Gmbh | Alloyed 2n copper wire for bonding in microelectronics device |
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2015
- 2015-12-05 CN CN201510880814.3A patent/CN105463237B/en active Active
Also Published As
Publication number | Publication date |
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CN105463237A (en) | 2016-04-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Copper-silver alloy bonding wire and manufacturing method thereof Effective date of registration: 20200218 Granted publication date: 20171201 Pledgee: Shanghai Pudong Development Bank Limited by Share Ltd Yantai branch Pledgor: Yantai YesNo Electronic Materials Co., Ltd. Registration number: Y2020980000263 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201214 Granted publication date: 20171201 Pledgee: Shanghai Pudong Development Bank Limited by Share Ltd. Yantai branch Pledgor: YANTAI YESNO ELECTRONIC MATERIALS Co.,Ltd. Registration number: Y2020980000263 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A copper silver alloy bonding wire and its preparation method Effective date of registration: 20201221 Granted publication date: 20171201 Pledgee: Shanghai Pudong Development Bank Limited by Share Ltd. Yantai branch Pledgor: YANTAI YESNO ELECTRONIC MATERIALS Co.,Ltd. Registration number: Y2020980009638 |