CN109586352A - 电源供应装置 - Google Patents
电源供应装置 Download PDFInfo
- Publication number
- CN109586352A CN109586352A CN201811008510.8A CN201811008510A CN109586352A CN 109586352 A CN109586352 A CN 109586352A CN 201811008510 A CN201811008510 A CN 201811008510A CN 109586352 A CN109586352 A CN 109586352A
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- CN
- China
- Prior art keywords
- battery pack
- power supply
- way conduction
- supply device
- conduction component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/12—Moulds or cores; Details thereof or accessories therefor with incorporated means for positioning inserts, e.g. labels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
- B23P21/004—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control the units passing two or more work-stations whilst being composed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H54/00—Winding, coiling, or depositing filamentary material
- B65H54/02—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers
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- B65H54/14—Winding and traversing material on to reels, bobbins, tubes, or like package cores or formers for making packages of specified shapes or on specified types of bobbins, tubes, cores, or formers on tubes, cores, or formers having generally parallel sides, e.g. cops or packages to be loaded into loom shuttles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/04—Kinds or types
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- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/50—Methods of making reels, bobbins, cop tubes, or the like by working an unspecified material, or several materials
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/10—Lighting devices or systems using a string or strip of light sources with light sources attached to loose electric cables, e.g. Christmas tree lights
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- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
- F21S4/26—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of rope form, e.g. LED lighting ropes, or of tubular form
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/04—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/26—Power supply means, e.g. regulation thereof
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/269—Mechanical means for varying the arrangement of batteries or cells for different uses, e.g. for changing the number of batteries or for switching between series and parallel wiring
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/28—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for wire processing before connecting to contact members, not provided for in groups H01R43/02 - H01R43/26
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
- H02G1/00—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines
- H02G1/12—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof
- H02G1/1202—Methods or apparatus specially adapted for installing, maintaining, repairing or dismantling electric cables or lines for removing insulation or armouring from cables, e.g. from the end thereof by cutting and withdrawing insulation
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- H02G1/1251—Machines the cutting element not rotating about the wire or cable
- H02G1/1253—Machines the cutting element not rotating about the wire or cable making a transverse cut
- H02G1/1256—Machines the cutting element not rotating about the wire or cable making a transverse cut using wire or cable-clamping means
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0063—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with circuits adapted for supplying loads from the battery
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- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/007—Regulation of charging or discharging current or voltage
- H02J7/00712—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters
- H02J7/007182—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters in response to battery voltage
- H02J7/007184—Regulation of charging or discharging current or voltage the cycle being controlled or terminated in response to electric parameters in response to battery voltage in response to battery voltage gradient
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/10—Controlling the intensity of the light
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/40—Details of LED load circuits
- H05B45/42—Antiparallel configurations
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
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Abstract
本发明提供一种电源供应装置。所述电源供应装置包含多个电池组以及多个单向导通组件;多个电池组彼此同向并联;多个单向导通组件分别串联连接多个电池组;每一单向导通组件的正引脚串联连接对应的电池组的正极端,每一单向导通组件的负引脚并联连接其他单向导通组件的负引脚。
Description
技术领域
本发明是有关于一种电源供应装置,且特别是有关于一种可避免相互并联的多个电池组相互充电的电源供应装置。
背景技术
随着电子技术的蓬勃发展,中型、大型电池组的用量越来越大。而在这些电池组的生产、测试与使用过程中,要用到许多充电和放电过程。现有的充电设备或放电设备仍存在以下缺点:电池组需要使用相同型号的电池组进行并联使用,即并联的电池组要求每个电池电压相同,不能将完全不一样类型、电压等级的电池组进行并联。因为在电池组中,单体之间的差异总是存在的,以电容量为例,在使用上,电容量大的电池组可能对电容量小的电池组充电或放电,造成电容量小的电池组损坏,进而降低电池组的使用寿命。
发明内容
为解决背景技术的缺失,本发明的目的在于提供一种电源供应装置,其简单易行、便于操作、可靠性强地解决多个电池组之间相互充放电的问题。
本发明提供的电源供应装置,包含多个电池组以及多个单向导通组件。多个电池组彼此同向并联。多个单向导通组件具有彼此相同或不同的额定电压,且相互同向并联。多个单向导通组件分别串联连接所有多个第一电池组中具有相对较低额定电压的部分多个第一电池组,其中多个第一低单向导通组件相互同向并联。
优选地,各所述第一低单向导通组件的正引脚串联连接对应的所述第一电池组的正极端。
优选地,各所述第一低单向导通组件的负引脚串联连接对应的所述第一电池组的负极端。
优选地,各所述第一电池组包含一或多个电池,同一所述第一电池组的所述多个电池彼此同向串联,任一所述第一电池组的所述多个电池与其他所述多个第一电池组的所述多个电池彼此同向并联。
优选地,所述电源供应装置连接电源接收电路,所述电源接收电路的输入端连接各所述第一低单向导通组件的负引脚以及所述第一电池组的正极端,所述电源接收电路的输出端连接各所述第一电池组的负极端。
优选地,所述电源接收电路包含一或多个发光组件,所述发光组件的正引脚连接各所述第一低单向导通组件的负引脚以及所述第一电池组的正极端,所述发光组件的负引脚连接各所述第一电池组的负极端。
优选地,所述电源接收电路连接控制电路,所述控制电路连接各所述第一低单向导通组件的负引脚以及各所述第一电池组的负极端,所述控制电路配置以控制或调整所述电源供应装置的所述多个第一电池组的电力供应至所述电源接收电路。
优选地,所述电源供应装置更包含一或多个第一高单向导通组件,分别串联连接所有所述多个第一电池组中具有最高额定电压的所述一或多个第一电池组。
优选地,各所述第一高单向导通组件的正引脚串联连接对应的所述第一电池组的正极端。
优选地,各所述第一高单向导通组件的负引脚串联连接对应的所述第一电池组的负极端。
优选地,所述第一低单向导通组件或所述第一高单向导通组件为发光二极管。
优选地,所述电源供应装置更包含一或多个第二电池组,具有彼此相同或不同的额定电压,且相互同向并联,所述第二电池组的并联电路与所述多个第一电池组的并联电路串联,各所述第二电池组的正极端连接各所述第一电池组的负极端,所述第二电池组的负极端连接一电源接收电路。
优选地,各所述第二电池组包含一或多个电池,同一所述第二电池组的所述多个电池彼此同向串联,任一所述第二电池组的所述多个电池与其他所述多个第二电池组的所述多个电池彼此同向并联。
优选地,所述电源供应装置以及所述电源接收电路连接一控制电路,所述控制电路连接各所述第一低单向导通组件的负引脚、所述第一电池组的正极端、各所述第二电池组的负极端以及所述电源接收电路,所述控制电路配置以控制或调整所述电源供应装置的所述第一电池组以及所述第二电池组的电力供应至所述电源接收电路。
优选地,所述电源供应装置更包含多个第二单向导通组件,分别串联连接所有所述多个第二电池组。
优选地,所述电源供应装置更包含多个第二单向导通组件,分别串联连接所有所述多个第二电池组中具有相对较低额定电压的部分所述多个第二电池组,具有最高额定电压的所述一或多个第二电池组则不连接任何所述第二单向导通组件。
优选地,各所述第二单向导通组件的正引脚串联连接对应的所述第二电池组的正极端。
优选地,各所述第二单向导通组件的负引脚串联连接对应的所述第二电池组的负极端。
优选地,所述多个第一电池组以及所述多个第二电池组具有相同或不同的额定电压,除了所述多个第一电池组以及所述多个第二电池组中具有最高额定电压的所述一或多个第一电池组及/或所述一或多个第二电池组以外,其余具有相对较低额定电压的各所述第一电池组串联连接各所述第一低单向导通组件以及各所述第二电池组串联连接一第二单向导通组件。
优选地,各所述第一高单向导通组件的正引脚串联连接对应的所述第一电池组的正极端,各所述第二单向导通组件的正引脚串联连接对应的所述第二电池组的正极端。
优选地,各所述第一高单向导通组件的负引脚串联连接对应的所述第一电池组的负极端,各所述第二单向导通组件的负引脚串联连接对应的所述第二电池组的负极端。
如上所述,本发明提供的电源供应装置,其将所有电池组或仅针对低电压的电池组分别串联连接至少一个单向导通组件例如发光二极管,以利用单向导通组件的单向导通特性,有效防止相互并联的多个电池组相互充电或放电,而损坏电池组的内部电池,导致电池发热、漏液,更甚者发生电池组的***的问题发生。
附图说明
图1是本发明第一实施例的电源供应装置的各具多颗电池的多个电池组的正极端各串接单向导通组件的正引脚并且多个串行电路相互并联的电路布局图。
图2是本发明第二实施例的电源供应装置的各具多颗电池的多个电池组的正极端各串接单向导通组件的正引脚并且多个串行电路以及控制电路相互并联的电路布局图。
图3是本发明第三实施例的电源供应装置的各具单颗电池的两个电池组的正极端各串接单向导通组件的正引脚并且两个串行电路以及控制电路相互并联的电路布局图。
图4是本发明第四实施例的电源供应装置的各具单颗电池的多个电池组的正极端各串接单向导通组件的正引脚并且多个串行电路以及控制电路相互并联的电路布局图。
图5是本发明第五实施例的电源供应装置的各具多颗电池的两个电池组的正极端各串接单向导通组件的正引脚并且两个串行电路以及控制电路相互并联的电路布局图。
图6是本发明第六实施例的电源供应装置的各具多颗电池的多个电池组的正极端各串接单向导通组件的正引脚并且多个串行电路以及控制电路相互并联的电路布局图。
图7是本发明第七实施例的电源供应装置的各具单颗电池的两个电池组的正极端各串接单向导通组件的正引脚的串行电路相互并联后再串接具单颗电池的电池组以及控制电路的电路布局图。
图8是本发明第八实施例的电源供应装置的各具多颗电池的多个电池组的正极端各串接单向导通组件的正引脚的串行电路相互并联后再串接具多颗电池的电池组以及控制电路的电路布局图。
图9是本发明实施例的电源供应装置的控制电路的电路布局图。
图10是本发明第九实施例的电源供应装置的多个电池组的负极端各串接单向导通组件的负引脚的串行电路相互并联后再串接具多颗电池的电池组以及控制电路的电路布局图。
图11是本发明第十实施例的电源供应装置的多个电池组的负极端各串接单向导通组件的负引脚的串行电路相互并联后再串接具多颗电池的电池组的电路布局图。
图12是本发明第十一实施例的电源供应装置的多个电池组的正极端各串接单向导通组件的正引脚的串行电路相互并联后再串接具多颗电池的电池组的电路布局图。
具体实施方式
以下是通过特定的具体实施例来说明本发明所公开有关本发明的实施方式,本领域技术人员可由本说明书所公开的内容了解本发明的优点与效果。本发明可通过其他不同的具体实施例加以施行或应用,本说明书中的各项细节也可基于不同观点与应用,在不悖离本发明的构思下进行各种修改与变更。另外事先声明,本发明的附图仅为简单示意说明,并非依实际尺寸的描绘。以下的实施方式将进一步详细说明本发明的相关技术内容,但所公开的内容并非用以限制本发明的保护范围。
应理解,虽然本文中可能使用术语第一、第二、第三等来描述各种组件或者信号,但这些组件或者信号不应受这些术语的限制。这些术语主要是用以区分一组件与另一组件,或者一信号与另一信号。另外,本文中所使用的术语“或”,应视实际情况可能包括相关联的列出项目中的任一个或者多个的组合。
为了解释清楚,在一些情况下,本技术可被呈现为包括包含功能块的独立功能块,其包含装置、装置组件、软件中实施的方法中的步骤或路由,或硬件及软件的组合。
实施根据这些公开方法的装置可以包括硬件、韧体及/或软件,且可以采取任何各种形体。这种形体的典型例子包括笔记本电脑、智能电话、小型个人计算机、个人数字助理等等。本文描述之功能也可以实施于***设备或内置卡。通过进一步举例,这种功能也可以实施在不同芯片或在单个装置上执行的不同程序的电路板。
该指令、用于传送这样的指令的介质、用于执行其的计算资源或用于支持这样的计算资源的其他结构,都是为用于提供在这些公开方案中所述的功能的手段。
请参阅图1,其是本发明第一实施例的电源供应装置的各具多颗电池的多个电池组的正极端各串接单向导通组件的正引脚并且多个串行电路相互并联的电路布局图。如图1所示,电源供应装置包含多个电池组BP1~BPn以及多个单向导通组件DB1~DBn,其中n可为大于1的任意正整数。
在本实施例中,每一个电池组BP1~BPn可包含多个电池,实际上,每一个电池组BP1~BPn也可仅具有一个电池。电池组BP1~BPn可彼此具有不同数量的电池。同一电池组BP1~BPn的多个电池彼此同向串联,即每一电池的正极端连接相邻的电池的负极端。不同电池组BP1~BPn的多个电池彼此同向并联,即所有电池的正极端皆面向与电池相互串联的单向导通组件DB1~DBn设置的方向。
值得注意的是,多个单向导通组件DB1~DBn分别串联连接多个电池组BP1~BPn,如单向导通组件DB1串联连接电池组BP1,而单向导通组件DBn串联连接电池组BPn。在本实施例中,单向导通组件DB1~DBn为发光二极管,例如硅或锗发光二极管,在此举例说明,不以此为限。每一单向导通组件DB1~DBn可具有正引脚以及负引脚。每一单向导通组件DB1~DBn的正引脚串联连接对应的电池组BP1~BPn的正极端,每一单向导通组件DB1~DBn的负引脚并联连接其他单向导通组件DB1~DBn的负引脚。换言之,多个单向导通组件DB1~DBn彼此同向并联。
本实施例的每一个电池组BP1~BPn仅串接一个单向导通组件DB1~DBn,即电池组BP1~BPn的数量与单向导通组件DB1~DBn的数量相同。然而,实际上,若有需求,例如为了更有效地避免多个电池组相互充电,可增加每一电池组DB1~DBn串接的单向导通组件的数量。
电池组(非充电电池组)可能包含新旧混用或不同品牌同型号混用的多个电池,使电池组BP1~BPn的电压不一致。因此,本实施例针对电池组BP1~BPn分别配置单向导通组件DB1~DBn,利用单向导通组件DB1~DBn的单向导通特性,以有效防止电池组BP1~BPn相互充放电的情况发生,例如高额定电压的电池组BPn对低电压的电池组BP1充电,而损坏低额定电压的电池组BP1,甚至使电池发热、漏液,更甚者发生电池组BP1~BPn的***的问题发生。
另外,电源供应装置(包含多个电池组BP1~BPn以及多个单向导通组件DB1~DBn)的输出端可连接电源接收电路。每一电池组BP1~BPn以及对应的单向导通组件DB1~DBn的串行电路与电源接收电路并联。借此,利用电池组BP1~BPn供应电力至电源接收电路。电源接收电路可例如为需利用电力始可作业的任何耗能的电子组件。
举例来说,如图1所示,电源接收电路可包含发光二极管D0以及电阻R1。发光二极管D0与电阻R1相互串联。另外,发光二极管D0以及电阻R1之间更可选择性串联连接开关SW。发光二极管D0与单向导通组件DB1~DBn反向并联,即发光二极管D0的正引脚通过开关SW以及电阻R1并联连接单向导通组件DB1~DBn的负引脚,发光二极管D0的负引脚并联连接各电池组BP1~BPn的负极端。
实施上,在开关SW导通的情况下,电源供应装置通过电池组BP1~BPn供应电力时,每一电池组BP1~BPn的电流将从电池的正极端流向单向导通组件DB1~DBn的正引脚,接着从单向导通组件DB1~DBn的负引脚流出至电阻R1,并接着流过发光二极管D0,使得发光二极管D0发光。在此过程中,由于单向导通组件DB1~DBn的单向导通特性限制了电流的流向,使得电流无法从任一电池组BP1~BPn的正极端流至其他电池组BP1~BPn的正极端并从其他电池组BP1~BPn的负极端流出。因此,单向导通组件DB1~DBn的配置可有效避免相互并联的多个电池组BP1~BPn相互充电而影响电池组BP1~BPn对发光二极管D0的电力供应。
应理解的是,电池组BP1~BPn供应的电力至少需大于单向导通组件DB1~DBn的正向压降,例如单向导通组件DB1~DBn为硅发光二极管时,电池组BP1~BPn供应的电力至少需大于0.7伏特的正向压降。
在本实施例中,电池组BP1~BPn彼此具有相同或不同的额定电压,即工作电压。每一个电池组BP1~BPn串接一个单向导通组件DB1~DBn。然而,单向导通组件DB1~DBn的配置,主要为了防止高额定电压的电池组BP1~BPn对低额定电压的电池组BP1~BPn充电。因此,实际上,可仅针对每一个低额定电压的电池组BP1~BPn串接一个单向导通组件DB1~DBn,避免低额定电压的电池组BP1~BPn接收高额定电压的电池组BP1~BPn的电流,而高额定电压的电池组BP1~BPn则可省略不串接单向导通组件DB1~DBn,以节省电路成本。
请参阅图2,其是本发明第二实施例的电源供应装置的各具多颗电池的多个电池组的正极端各串接单向导通组件的正引脚并且多个串行电路以及控制电路相互并联的电路布局图。如图2所示,电源供应装置包含多个电池组BP1~BPn以及多个单向导通组件DB1~DBn。电源供应装置适用于电源接收电路,电源接收电路可包含电阻R2以及发光二极管D0。控制电路100连接在电源供应装置以及电源接收电路之间,以控制电源供应装置供应至电源接收电路的电力。
电源接收电路的发光二极管D0的正引脚可串联连接开关SW,而发光二极管D0的负引脚则串联连接电阻R2。控制电路100可控制开关SW关闭,即如图2所示在打开位置,使得电池组BP1~BPn供应的电流无法流至发光二极管D0。相反地,控制电路100可控制开关SW从如图2所示的打开位置切换至闭合位置,即从截止状态转为导通状态,使得电池组BP1~BPn的电流可供应至发光二极管D0,使发光二极管D0发光。
进一步地,每一个电池组BP1~BPn与对应的单向导通组件DB1~DBn的串行电路可串联连接另一开关,例如此开关设置在彼此串联连接的电池组BP1~BPn以及单向导通组件DB1~DBn之间,或串联连接单向导通组件DB1~DBn的负引脚。控制电路100可基于发光二极管D0所需的电力或其他特性,开启特定的电池组BP1~BPn的开关,并关闭其他电池组BP1~BPn的开关,以从所有电池组BP1~BPn中选择由特定(部分或全部)的电池组BP1~BPn,例如通过选择使用不同特性例如电池寿命、电压大小、电池组数、电池数量的电池组BP1~BPn,以供应适当的电力至电源接收电路的发光二极管D0。
请参阅图3,其是本发明第三实施例的电源供应装置的各具单颗电池的两个电池组的正极端各串接单向导通组件的正引脚并且两个串行电路以及控制电路相互并联的电路布局图。如图3所示,电源供应装置包含两个电池组BPP1、BPP2以及两个单向导通组件DB1、DB2。电源供应装置适用于电源接收电路,电源接收电路可包含发光二极管D0。控制电路100连接在电源供应装置以及电源接收电路之间,以控制电源供应装置供应至电源接收电路的电力。
不同于第一和第二实施例的每一个电池组BPP1~BPPn具有多个电池,本实施例的每一电池组BPP1、BPP2仅具有一个电池,分别串联连接一个单向导通组件DB1、DB2。具体地,单向导通组件DB1的正引脚串联连接单向导通组件DB1的正极端,单向导通组件DB2的正引脚串联连接单向导通组件DB2的正极端。电池组BPP1与单向导通组件DB1的串行电路以及单向导通组件DB2与单向导通组件DB2的串行电路相互并联。
多个单向导通组件DB1、DB2的负引脚通过控制电路100的正极端连接发光二极管D0的正引脚,多个电池组BPP1、BPP2的负极端则通过控制电路100的负极端连接发光二极管D0的负引脚。实施上,当电源供应装置通过两个电池组BPP1、BPP2分别供应两个相同或不同大小的电流时,两电流将分别从两个电池组BPP1、BPP2的正极端流出,接着分别通过单向导通组件DB1以及单向导通组件DB2至控制电路100。
控制电路100可允许两电流异步地流过发光二极管D0,使得发光二极管D0依序利用电池组BPP1、BPP2所供应的相同或不同大小的电流,而在不同时间点分别发射出具有相同或不同的亮度的光线,从而使发光二极管D0以相同或不同的亮度闪烁发光。或者,控制电路100可允许电池组BPP1、BPP2的两电流同步地流过发光二极管D0,使得发光二极管D0以两电流加总的较大电流,以发射具有相对较大光强度的光线。
请参阅图4,其是本发明第四实施例的电源供应装置的各具单颗电池的多个电池组的正极端各串接单向导通组件的正引脚并且多个串行电路以及控制电路相互并联的电路布局图。如图4所示,电源供应装置包含多个电池组BPP1~BPPn以及多个单向导通组件DB1~DBn,其中n可为大于1的任意正整数。每一电池组BPP1、BPP2仅具有一个电池,各连接一个单向导通组件DB1、DB2。相比于第三实施例仅配置两组电池,本实施例可进一步扩增电池组BPP1~BPPn的数量,即n>2,并对应扩增单向导通组件DB1~DBn的数量,即单向导通组件DB1~DBn的数量取决于电池组BPP1~BPPn的数量。通过并联更多电池组可使电源供应装置的电容量增加,如此可降低在供应电力的过程中需更换没电或损坏的电池的频率,从而延长电源供应装置供电的使用时间,提升使用上的方便性。
请参阅图5,其是本发明第五实施例的电源供应装置的各具多颗电池的两个电池组的正极端各串接单向导通组件的正引脚并且两个串行电路以及控制电路相互并联的电路布局图。如图5所示,电源供应装置包含两个电池组BP1、BP2以及两个单向导通组件DB1、DB2。电池组BP1串联连接单向导通组件DB1,而电池组BP2串联连接单向导通组件DB2。电池组BP1与单向导通组件DB1的串行电路以及电池组BP2与单向导通组件DB2的串行电路相互并联连接。相比于如图3所示的第三实施例的每一电池组BPP1、BPP2仅具有一个电池,本实施例的每一电池组BP1、BP2具有多个电池彼此同向串联连接。
具体而言,电池组BP1最上方电池的正极端连接单向导通组件DB1的正引脚,通过单向导通组件DB1以及控制电路100连接至发光二极管D0的正引脚,而电池组BP1的最下方电池的负极端通过控制电路100连接发光二极管D0的负引脚。类似地,电池组BP2最上方电池的正极端连接单向导通组件DB2的正引脚,通过单向导通组件DB2以及控制电路100连接至发光二极管D0的正引脚,而电池组BP2的最下方电池的负极端通过控制电路100连接发光二极管D0的负引脚。
请参阅图6,其是本发明第六实施例的电源供应装置的各具多颗电池的多个电池组的正极端各串接单向导通组件的正引脚并且多个串行电路以及控制电路相互并联的电路布局图。如图6所示,电源供应装置包含多个电池组BP1~BPn以及多个单向导通组件DB1~DBn。每一电池组BP1~BPn具有多个电池。不同电池组BP1~BPn的电池数量可为相同或不同。相比于如图5所示的第五实施例仅设置两个电池组BP1、BP2,即n=2,本实施例的电源供应装置可包含更多个电池组BP1~BPn,即n可为大于2的任意正整数,以扩增电源供应装置的电容量。
请参阅图7,其是本发明第七实施例的电源供应装置的各具单颗电池的两个电池组的正极端各串接单向导通组件的正引脚的串行电路相互并联后再串接具单颗电池的电池组以及控制电路的电路布局图。如图7所示,电源供应装置包含电池组BPP1、BPP2、BSP1以及两个单向导通组件DB1、DB2。电源供应装置适用于电源接收电路,电源接收电路可包含发光二极管D0。控制电路100连接在电源供应装置以及电源接收电路之间。
电池组BPP1的正极端串联连接单向导通组件DB1的正引脚,而电池组BPP2的正极端串联连接单向导通组件DB2的正引脚。单向导通组件DB1、DB2的负引脚并联连接控制电路100的输入端,通过控制电路100的输出端连接发光二极管D0的正引脚。值得注意的是,电池组BPP1与单向导通组件DB1的串行电路以及电池组BPP2与单向导通组件DB2的串行电路并联,并且此并联电路与另一电池组BSP1串联。电池组BSP1的正极端连接两个电池组BPP1、BPP2的负极端,电池组BSP1的负极端通过控制电路100连接发光二极管D0的负引脚。
实施上,当控制电路100欲驱动电源接收电路例如发光二极管D0发光时,可选择性控制相互并联的电池组BPP1、BPP2以及与电池组BPP1、BPP2的并联电路串联的电池组BSP1的电力供应。电池组BSP1供应的电流可从电池组BSP1的正极端流过电池组BPP1以及单向导通组件DB1,并通过控制电路100供应至发光二极管D0。或者,电池组BSP1供应的电流可从电池组BSP1的正极端流过电池组BPP2以及单向导通组件DB2,并通过控制电路100供应至发光二极管D0。或者,电池组BSP1供应的电流将分成两分路电流,其中第一分路电流流过电池组BPP1与单向导通组件DB1的串行电路,而第二分路电流流过电池组BPP2与单向导通组件DB2的串行电路,最后通过控制电路100流过发光二极管D0。而在电池组BSP1供应电流的同时,控制电路100可允许电池组BPP1、BPP2的电流供应至发光二极管D0,使发光二极管D0可在同一时间点接收较大的电流而具有较大的发光强度。
请参阅图8,其是本发明第八实施例的电源供应装置的各具多颗电池的多个电池组的正极端各串接单向导通组件的正引脚的串行电路相互并联后再串接具多颗电池的电池组以及控制电路的电路布局图。
如图8所示,电源供应装置包含多个电池组BP1~BPn、BS1以及多个单向导通组件DB1~DBn,其中n可为任意正整数。多个单向导通组件DB1~DBn的数量取决于电池组BP1~BPn的数量。多个电池组BP1~BPn分别串联连接多个单向导通组件DB1~DBn,并且所有串行电路相互并联。相比于第七实施例的每一电池组BPP1、BPP2、BSP1仅具有一个电池,本实施例的每一电池组BP1、BP2、BS1可具有多个电池彼此同向串联连接。
应理解,本实施例仅针对相互并联的电池组BP1~BPn配置单向导通组件DB1~DBn,而与电池组BP1~BPn的并联电路串接的电池组BS1仅为一个而未配置单向导通组件。实际上,若增设更多电池组(BS2~BSn,未标示于图中)与电池组BS1相互并联,则也可将每一个电池组(BS1~BSn)或具有相对较低额定电压的部分电池组(BS1~BSn)串接单向导通组件。每一电池组(BS1~BSn)可具有多个电池相互串联。
替换地,电池组BP1~BPn以及电池组(BS1~BSn)中的每一电池组可与其他电池组具有相同或不同的额定电压。电池组BP1~BPn以及电池组(BS1~BSn)中具有相对较低额定电压的一或多个电池组BP1~BPn及/或一或多个电池组(BS1~BSn)串联连接单向导通组件。换言之,具有最高额定电压的一或多个电池组BP1~BPn及/或一或多个电池组(BS1~BSn)不需串联单向导通组件,借此节省电路成本。
请参阅图9,其是本发明实施例的电源供应装置的控制电路的电路布局图,可应用于本文其他实施例中任一实施例所述的控制电路100。如图9所示,控制电路100可包含第一集成电路10、第二集成电路20、谐振电路以及多个开关电路。第一集成电路10可作为控制器,例如为SOP8集成电路芯片。第二集成电路20可作为驱动器,例如为XJX-M005集成电路芯片。
第一集成电路10的第一引脚可连接电压源VDD。第一集成电路10的第二引脚和第三引脚可连接谐振电路。具体而言,谐振电路包含石英振荡器Y1以及电容C2、C3。第一集成电路10的第二引脚连接在谐振电路的石英振荡器Y1及电容C2的各一端之间,而第一集成电路10的第三引脚连接在谐振电路的石英振荡器Y1的另一端及电容C3的一端之间。电容C2以及电容C3的各另一端接地。
第一集成电路10的第四引脚可连接多个开关电路。开关电路包含晶体管Q2、电阻R12以及发光二极管D2。在本实施例中,晶体管Q2为PMOS晶体管,但实际上也可替换为其他开关组件,并对应调整其与其他组件的配置关系。电阻R12的两端可分别连接第一集成电路10的第四引脚以及晶体管Q2的栅极端。晶体管Q2的源极端连接电压源VDD1,而晶体管Q2的漏极端连接电压源VDD。发光二极管D2的正极端连接晶体管Q2的源极端,而发光二极管D2的负极端连接电压源VDD。
类似地,另一开关电路包含晶体管Q1、电阻R11以及发光二极管D1。在本实施例中,晶体管Q1也为PMOS晶体管,但本发明不以此为限。电阻R11的两端分别连接第一集成电路10的第四引脚以及晶体管Q1的栅极端。晶体管Q1的源极端连接电压源VDD2,而晶体管Q1的漏极端连接电压源VDD。发光二极管D1的正极端连接晶体管Q1的源极端,而发光二极管D2的负极端连接电压源VDD。
进一步地,电容可跨接在第一集成电路10的第一引脚和第八引脚之间。第一集成电路10的第八引脚可接地。开关S1的一端可连接第一集成电路10的第七引脚,而开关S1的另一端接地。第一集成电路10的第六引脚可连接第二集成电路20的第三引脚,并且第一集成电路10的第五引脚可连接第二集成电路20的第四引脚。第二集成电路20的第五引脚可连接电压源VDD,并且第二集成电路20的第二引脚接地。第二集成电路20的第一引脚可连接发光二极管LED1、LED2的正引脚,而第二集成电路20的第六引脚可连接发光二极管LED1、LED2的负引脚。
请参阅图10,其是本发明第九实施例的电源供应装置的多个电池组的负极端各串接单向导通组件的负引脚的串行电路相互并联后再串接具多颗电池的电池组以及控制电路的电路布局图。
如图10所示,电源供应装置包含多个电池组BP1~BPn、BS1以及多个单向导通组件DB1~DBn。多个电池组BP1~BPn分别串联连接多个单向导通组件DB1~DBn,而这些串行电路相互并联,且并联电路与电池组BS1串联。
值得注意的是,本实施例与第八实施例差异在于,如图8所示的每个电池组BP1~BPn的正极端连接对应的单向导通组件DB1~DBn的正引脚,而如图10所示的每个电池组BP1~BPn的负极端连接对应的单向导通组件DB1~DBn的负引脚。另外,如图10所示,多个单向导通组件DB1~DBn的正引脚连接控制电路的负极输入端。电池组BS1的正极端连接控制电路100的正极输入端,而电池组BS1的负极端连接多个电池组BP1~BPn的正极端。控制电路的输出端连接发光二极管D0。
请参阅图11,其是本发明第十实施例的电源供应装置的多个电池组的负极端各串接单向导通组件的负引脚的串行电路相互并联后再串接具多颗电池的电池组的电路布局图。如图11所示,电源供应装置包含多个电池组BP1~BPn、BS1以及多个单向导通组件DB1~DBn。
相比于如图10所示的第九实施例在电源供应装置以及电源接收电路例如发光二极管D0之间设置控制电路100,如图11所示则是以电阻R3、开关SW、发光二极管D0取代控制电路100的配置。电阻R3、开关SW以及发光二极管D0相互串联。开关SW连接在电阻R3的一端以及发光二极管D0的正引脚之间。电阻R3的另一端连接电池组BS1的正极端。发光二极管D0的负引脚连接多个单向导通组件DB1~DBn的正引脚。
请参阅图12,其是本发明第十一实施例的电源供应装置的多个电池组的正极端各串接单向导通组件的正引脚的串行电路相互并联后再串接具多颗电池的电池组的电路布局图。如图11所示,电源供应装置包含多个电池组BP1~BPn、BS1以及多个单向导通组件DB1~DBn。
相比于如图8所示的第八实施例在电源供应装置以及电源接收电路例如发光二极管D0之间设置控制电路100,如图12所示则是以电阻R4、开关SW、发光二极管D0取代控制电路100的配置。电阻R4、开关SW以及发光二极管D0相互串联。开关SW连接在电阻R4的一端以及发光二极管D0的正引脚之间。电阻R4的另一端连接多个单向导通组件DB1~DBn的负引脚。发光二极管D0的负引脚连接电池组BS1的负极端。
本发明提供的电源供应装置,其将所有电池组或仅针对低额定电压的电池组分别串联连接至少一个单向导通组件例如发光二极管,以利用单向导通组件的单向导通特性,有效防止相互并联的多个电池组相互充电或放电,而损坏电池组的内部电池,导致电池发热、漏液,更甚者发生电池组的***的问题发生。
最后须说明地是,于前述说明中,尽管已将本发明技术的概念以多个示例性实施例具体地示出与阐述,然而在本领域技术人员将理解,在不悖离由所界定的本发明技术的概念之范围的条件下,可对其作出形式及细节上的各种变化。
Claims (21)
1.一种电源供应装置,其特征在于,包含:
多个第一电池组,具有彼此相同或不同的额定电压,且相互同向并联;以及
多个第一低单向导通组件,分别串联连接所有所述多个第一电池组中具有相对较低额定电压的部分所述多个第一电池组,所述多个第一低单向导通组件相互同向并联。
2.根据权利要求1所述的电源供应装置,其特征在于,各所述第一低单向导通组件的正引脚串联连接对应的所述第一电池组的正极端。
3.根据权利要求1所述的电源供应装置,其特征在于,各所述第一低单向导通组件的负引脚串联连接对应的所述第一电池组的负极端。
4.根据权利要求1所述的电源供应装置,其特征在于,各所述第一电池组包含一或多个电池,同一所述第一电池组的所述多个电池彼此同向串联,任一所述第一电池组的所述多个电池与其他所述多个第一电池组的所述多个电池彼此同向并联。
5.根据权利要求1所述的电源供应装置,其特征在于,所述电源供应装置连接电源接收电路,所述电源接收电路的输入端连接各所述第一低单向导通组件的负引脚以及所述第一电池组的正极端,所述电源接收电路的输出端连接各所述第一电池组的负极端。
6.根据权利要求5所述的电源供应装置,其特征在于,所述电源接收电路包含一或多个发光组件,所述发光组件的正引脚连接各所述第一低单向导通组件的负引脚以及所述第一电池组的正极端,所述发光组件的负引脚连接各所述第一电池组的负极端。
7.根据权利要求5所述的电源供应装置,其特征在于,所述电源接收电路连接控制电路,所述控制电路连接各所述第一低单向导通组件的负引脚以及各所述第一电池组的负极端,所述控制电路配置以控制或调整所述电源供应装置的所述多个第一电池组的电力供应至所述电源接收电路。
8.根据权利要求1所述的电源供应装置,其特征在于,所述电源供应装置更包含一或多个第一高单向导通组件,分别串联连接所有所述多个第一电池组中具有最高额定电压的所述一或多个第一电池组。
9.根据权利要求8所述的电源供应装置,其特征在于,各所述第一高单向导通组件的正引脚串联连接对应的所述第一电池组的正极端。
10.根据权利要求8所述的电源供应装置,其特征在于,各所述第一高单向导通组件的负引脚串联连接对应的所述第一电池组的负极端。
11.根据权利要求1或8所述的电源供应装置,其特征在于,所述第一低单向导通组件或所述第一高单向导通组件为发光二极管。
12.根据权利要求1所述的电源供应装置,其特征在于,所述电源供应装置更包含一或多个第二电池组,具有彼此相同或不同的额定电压,且相互同向并联,所述第二电池组的并联电路与所述多个第一电池组的并联电路串联,各所述第二电池组的正极端连接各所述第一电池组的负极端,所述第二电池组的负极端连接一电源接收电路。
13.根据权利要求12所述的电源供应装置,其特征在于,各所述第二电池组包含一或多个电池,同一所述第二电池组的所述多个电池彼此同向串联,任一所述第二电池组的所述多个电池与其他所述多个第二电池组的所述多个电池彼此同向并联。
14.根据权利要求12所述的电源供应装置,其特征在于,所述电源供应装置以及所述电源接收电路连接一控制电路,所述控制电路连接各所述第一低单向导通组件的负引脚、所述第一电池组的正极端、各所述第二电池组的负极端以及所述电源接收电路,所述控制电路配置以控制或调整所述电源供应装置的所述第一电池组以及所述第二电池组的电力供应至所述电源接收电路。
15.根据权利要求12所述的电源供应装置,其特征在于,所述电源供应装置更包含多个第二单向导通组件,分别串联连接所有所述多个第二电池组。
16.根据权利要求12所述的电源供应装置,其特征在于,所述电源供应装置更包含多个第二单向导通组件,分别串联连接所有所述多个第二电池组中具有相对较低额定电压的部分所述多个第二电池组,具有最高额定电压的所述一或多个第二电池组则不连接任何所述第二单向导通组件。
17.根据权利要求15或16所述的电源供应装置,其特征在于,各所述第二单向导通组件的正引脚串联连接对应的所述第二电池组的正极端。
18.根据权利要求15或16所述的电源供应装置,其特征在于,各所述第二单向导通组件的负引脚串联连接对应的所述第二电池组的负极端。
19.根据权利要求12所述的电源供应装置,其特征在于,所述多个第一电池组以及所述多个第二电池组具有相同或不同的额定电压,除了所述多个第一电池组以及所述多个第二电池组中具有最高额定电压的所述一或多个第一电池组及/或所述一或多个第二电池组以外,其余具有相对较低额定电压的各所述第一电池组串联连接各所述第一低单向导通组件以及各所述第二电池组串联连接一第二单向导通组件。
20.根据权利要求19所述的电源供应装置,其特征在于,各所述第一高单向导通组件的正引脚串联连接对应的所述第一电池组的正极端,各所述第二单向导通组件的正引脚串联连接对应的所述第二电池组的正极端。
21.根据权利要求19所述的电源供应装置,其特征在于,各所述第一高单向导通组件的负引脚串联连接对应的所述第一电池组的负极端,各所述第二单向导通组件的负引脚串联连接对应的所述第二电池组的负极端。
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Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10845012B1 (en) * | 2019-06-14 | 2020-11-24 | Fourstar Group Inc. | Decorative light string |
CN110645494A (zh) * | 2019-09-06 | 2020-01-03 | 珠海博杰电子股份有限公司 | 无极侧贴led灯串、其生产方法及生产设备 |
CN110617414A (zh) | 2019-09-06 | 2019-12-27 | 珠海博杰电子股份有限公司 | Led网灯及其生产方法 |
US11603983B2 (en) | 2019-09-06 | 2023-03-14 | Zhuhai Bojay Electronics Co. Ltd. | LED light string ornament and method for manufacturing the same |
CN110726081B (zh) | 2019-09-06 | 2024-02-27 | 珠海博杰电子股份有限公司 | Led灯串、其生产方法及生产设备 |
CN110630923A (zh) | 2019-09-06 | 2019-12-31 | 珠海博杰电子股份有限公司 | 无极平贴led灯串、其生产方法及生产设备 |
CN110736034B (zh) | 2019-09-06 | 2024-05-28 | 珠海博杰电子股份有限公司 | Led软管灯、其生产方法及生产设备 |
CN110994329B (zh) * | 2019-12-06 | 2021-02-26 | 广州市亿源机电有限公司 | 线束自动识别插孔装置及方法 |
CN111168377B (zh) * | 2020-01-13 | 2021-06-11 | 浙江阳光照明电器集团股份有限公司 | 一种led球泡灯自动化装配设备 |
CN113365387A (zh) * | 2020-03-02 | 2021-09-07 | 科斯莫灯饰公司 | 具多种发光模式的灯串的发光控制器及控制方法、灯串组件 |
TWI724917B (zh) * | 2020-06-10 | 2021-04-11 | 矽誠科技股份有限公司 | 具有休眠模式之發光二極體模組及發光二極體燈串 |
US11359775B2 (en) * | 2020-06-10 | 2022-06-14 | Ledup Manufacturing Group Limited | Series connected parallel array of LEDs |
CN111933555B (zh) * | 2020-09-16 | 2021-02-19 | 深圳平晨半导体科技有限公司 | 一种高效多工位同步固晶装置及方法 |
TWI748724B (zh) * | 2020-11-03 | 2021-12-01 | 電威電機工廠股份有限公司 | 花園燈的控制系統及其控制方法 |
CN113147464B (zh) * | 2021-04-30 | 2022-09-30 | 重庆工业职业技术学院 | 一种多功能新能源汽车充电桩 |
CN115405878A (zh) | 2021-05-26 | 2022-11-29 | 珠海博杰电子股份有限公司 | 单根导线的led灯串及照明装置 |
JP7302627B2 (ja) * | 2021-06-11 | 2023-07-04 | 株式会社プロテリアル | 電線接続構造、電線接続方法、医療器具、及び医療器具の製造方法 |
EP4130552A1 (en) * | 2021-08-04 | 2023-02-08 | Chongyi Jingyi Lighting Products Co., Ltd. | Led lamp module |
US11777334B2 (en) * | 2021-11-11 | 2023-10-03 | Beta Air, Llc | System for charging multiple power sources and monitoring diode currents for faults |
TWI792840B (zh) * | 2022-01-07 | 2023-02-11 | 瑞昱半導體股份有限公司 | Usb晶片及其操作方法 |
CN114554645A (zh) * | 2022-03-11 | 2022-05-27 | 厦门普为光电科技有限公司 | 具照度补偿功能的照明装置及照明装置的照度补偿方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103915870A (zh) * | 2014-03-28 | 2014-07-09 | 小米科技有限责任公司 | 一种电源和终端 |
CN204481496U (zh) * | 2014-12-26 | 2015-07-15 | 成都建中锂电池有限公司 | 带有安全保护***的一次锂电池组 |
US20160056656A1 (en) * | 2014-08-25 | 2016-02-25 | Master Lock Company Llc | Circuits and methods for using parallel separate battery cells |
CN205489597U (zh) * | 2016-01-12 | 2016-08-17 | 吉安精程仪表科技有限公司 | 一种多电池仪表供电电路 |
CN106532150A (zh) * | 2016-12-02 | 2017-03-22 | 中国船舶重工集团公司第七〇九研究所 | 一种模块化的高压大容量锂电池组可控拓扑结构 |
Family Cites Families (69)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3794522A (en) * | 1972-01-24 | 1974-02-26 | Burroughs Corp | Stripping insulated wire |
JP2683926B2 (ja) * | 1988-01-25 | 1997-12-03 | 三菱電機株式会社 | 絶縁被覆電線の被覆剥離方法及びその装置 |
JP2928634B2 (ja) * | 1990-11-30 | 1999-08-03 | トキコーポレーション株式会社 | 帯状電線に対する導線露出穴加工具および加工方法 |
US5608290A (en) * | 1995-01-26 | 1997-03-04 | Dominion Automotive Group, Inc. | LED flashing lantern |
US5800500A (en) * | 1995-08-18 | 1998-09-01 | Pi Medical Corporation | Cochlear implant with shape memory material and method for implanting the same |
US5935465A (en) * | 1996-11-05 | 1999-08-10 | Intermedics Inc. | Method of making implantable lead including laser wire stripping |
US6027952A (en) * | 1997-01-21 | 2000-02-22 | Liu; Ming-Hsun | Method of manufacturing a string of electrically connected light emitting diodes |
DE29706201U1 (de) * | 1997-03-27 | 1997-05-28 | Osa Elektronik Gmbh | Leucht- oder Anzeigeelement mit einer Lichteinkopplung in einen Lichtleitkörper |
US6374143B1 (en) * | 1999-08-18 | 2002-04-16 | Epic Biosonics, Inc. | Modiolar hugging electrode array |
CN100343573C (zh) * | 2000-11-29 | 2007-10-17 | 吴政雄 | 可弯形灯饰装置及其制造方法 |
DE10106961A1 (de) * | 2001-02-15 | 2002-08-29 | Happich Fahrzeug & Ind Teile | Bleuchtungseinrichtung |
TW470136U (en) * | 2001-03-30 | 2001-12-21 | Tsuei-Duan Weng | Strand structure of decoration lights |
JP3796159B2 (ja) * | 2001-10-24 | 2006-07-12 | 矢崎総業株式会社 | 電線の被覆材除去方法及び被覆材除去装置 |
US7178971B2 (en) * | 2001-12-14 | 2007-02-20 | The University Of Hong Kong | High efficiency driver for color light emitting diodes (LED) |
CN1514497A (zh) * | 2002-12-12 | 2004-07-21 | 林锡煌 | 发光晶粒串联封装方法 |
CN2612082Y (zh) * | 2003-04-04 | 2004-04-14 | 京东方科技集团股份有限公司 | 组合充电电池 |
US6860007B1 (en) * | 2003-08-26 | 2005-03-01 | Li-Wen Liu | Method of producing an LED rope light |
JP4262565B2 (ja) * | 2003-10-15 | 2009-05-13 | 株式会社松村電機製作所 | 照明装置 |
US6935762B2 (en) * | 2003-11-26 | 2005-08-30 | Vickie Jean's Creations, Inc. | Light string assembly |
WO2011143510A1 (en) * | 2010-05-12 | 2011-11-17 | Lynk Labs, Inc. | Led lighting system |
US7221110B2 (en) * | 2004-12-17 | 2007-05-22 | Bruce Industries, Inc. | Lighting control system and method |
US7235815B2 (en) * | 2005-02-14 | 2007-06-26 | Hsien-Ta Shen | LED light set |
CN2830875Y (zh) * | 2005-09-29 | 2006-10-25 | 陈铭培 | 灌注成型的节日灯串 |
CN2872072Y (zh) * | 2006-01-06 | 2007-02-21 | 林书弘 | 具防呆机制的发光二极管灯串装置 |
JP2007290013A (ja) * | 2006-04-26 | 2007-11-08 | Phoeton Corp | シールド導体層の切断方法及びレーザ加工装置 |
US7670023B1 (en) * | 2006-05-15 | 2010-03-02 | Peterson Terry J | Flashlight with photovoltaic power source |
US7947921B2 (en) * | 2006-10-30 | 2011-05-24 | Delphi Technologies, Inc. | Electric wire insulation center stripping method and device |
TW200831818A (en) * | 2007-01-25 | 2008-08-01 | nai-cheng Cai | Manufacturing method of an LED lamp string |
JP2008188661A (ja) | 2007-02-07 | 2008-08-21 | Sumitomo Electric Ind Ltd | レーザ加工方法 |
CN101255961A (zh) * | 2007-03-01 | 2008-09-03 | 蔡乃成 | Led灯串制造方法 |
TWM343822U (en) * | 2008-03-21 | 2008-11-01 | Mosdesign Semiconductor Corp | Simultaneous LED cascade circuit of two-cord AC power |
CN201274636Y (zh) * | 2008-07-11 | 2009-07-15 | 上海现代科技发展有限公司 | 图像识别视觉全自动贴片机 |
EP2216866A3 (en) * | 2009-02-06 | 2011-07-13 | HID Global GmbH | Method to strip a portion of an insulated wire |
TWM368010U (en) * | 2009-06-19 | 2009-11-01 | Semisilicon Technology Corp | LED (light emitting diode) lamp string and net lamp thereof |
TWI556696B (zh) * | 2009-07-14 | 2016-11-01 | 蔡乃成 | 表面黏著型發光元件燈組之製造方法 |
US8397381B2 (en) * | 2009-08-06 | 2013-03-19 | Allied Bright Technology Limited | Method for manufacturing light set with surface mounted light emitting components |
CN201487798U (zh) * | 2009-08-18 | 2010-05-26 | 普信科技股份有限公司 | 一种安全节能型灯饰 |
CN201611025U (zh) * | 2009-08-20 | 2010-10-20 | 杭州佑国光电科技有限公司 | 可调光led灯 |
US8299724B2 (en) * | 2010-03-19 | 2012-10-30 | Active-Semi, Inc. | AC LED lamp involving an LED string having separately shortable sections |
US8568015B2 (en) * | 2010-09-23 | 2013-10-29 | Willis Electric Co., Ltd. | Decorative light string for artificial lighted tree |
EP2700284B1 (en) * | 2011-03-07 | 2017-05-03 | Osram Sylvania Inc. | High efficiency, low energy storage driver circuit for solid state light sources |
TWI431218B (zh) * | 2011-03-11 | 2014-03-21 | Lingsen Precision Ind Ltd | The manufacturing method and structure of LED light bar |
CN102833995A (zh) * | 2011-06-17 | 2012-12-19 | 王协峰 | 一种全自动高速led插件贴片机 |
CN105828473B (zh) * | 2011-07-14 | 2018-02-09 | 陈家德 | 两阶式发光二极管安全监控照明装置 |
TW201307728A (zh) * | 2011-08-09 | 2013-02-16 | Foxsemicon Integrated Tech Inc | 發光二極體燈具 |
CN202201584U (zh) * | 2011-08-31 | 2012-04-25 | 浙江恒森光电科技有限公司 | Led灯条全自动加工设备的旋转绕线台 |
CN102322589B (zh) * | 2011-08-31 | 2013-07-10 | 浙江恒森光电科技有限公司 | Led灯条全自动加工设备 |
TWI448200B (zh) * | 2011-09-06 | 2014-08-01 | Univ Nat Taipei Technology | AC-driven light-emitting diode devices |
CN202302947U (zh) * | 2011-10-14 | 2012-07-04 | 廖国荣 | 贴片led铜线灯串 |
TW201320384A (zh) * | 2011-11-08 | 2013-05-16 | Ind Tech Res Inst | 吸頂燈 |
CN102548240B (zh) * | 2012-01-12 | 2015-02-11 | 广东木几智能装备有限公司 | Led贴片机双臂多头贴片*** |
TWI528018B (zh) * | 2012-03-07 | 2016-04-01 | 鴻海精密工業股份有限公司 | 貼片機檢測裝置 |
CN103369776A (zh) * | 2012-04-10 | 2013-10-23 | 深圳中科光华科技有限公司 | 一种带实时检测的多个串联led回路并联的驱动装置和恒流驱动方法 |
FR2992784B1 (fr) | 2012-06-29 | 2015-08-07 | Laselec | Dispositif de denudage de cables electriques utilisant des diodes laser violettes ou bleues |
TWI556539B (zh) * | 2012-09-21 | 2016-11-01 | Battery pack series and parallel matrix connection application module | |
CN205724938U (zh) * | 2013-03-14 | 2016-11-23 | 米沃奇电动工具公司 | 具有多个电池组的电动工具 |
CN104185384B (zh) * | 2013-05-22 | 2017-07-25 | 松下知识产权经营株式会社 | 安装部件的安装方法及安装装置 |
TWM493218U (zh) * | 2014-05-20 | 2015-01-01 | Maintech Semiconductor Inc | 兩線式各燈可獨立明滅之發光二極體(led)燈串電路 |
CN204026263U (zh) * | 2014-08-13 | 2014-12-17 | 乐清市新明丽灯饰有限公司 | 可拆卸网灯 |
TWI536866B (zh) * | 2014-08-29 | 2016-06-01 | 矽誠科技股份有限公司 | 具有可燒錄功能之發光二極體燈及燈串及系統 |
TWI556547B (zh) * | 2014-09-16 | 2016-11-01 | 盧昭正 | 擴散電勢二極體應用電路 |
TWM503521U (zh) * | 2015-02-03 | 2015-06-21 | King Yang Internat Technology Co Ltd | Led燈裝飾載具 |
WO2016196031A1 (en) * | 2015-06-01 | 2016-12-08 | Autonomix Medical, Inc. | Elongated conductors and methods of making and using the same |
CN204836690U (zh) * | 2015-07-29 | 2015-12-02 | 东莞市纳川盈海照明有限公司 | 通过两线双回路调色温的led灯具 |
CN105407654A (zh) * | 2015-11-09 | 2016-03-16 | 东莞市浩远电子有限公司 | 贴片机及其贴片方法 |
CN105353721A (zh) * | 2015-11-10 | 2016-02-24 | 中国科学院合肥物质科学研究院 | 一种全自动led贴片机控制*** |
TWM516227U (zh) * | 2015-11-12 | 2016-01-21 | Tian-Yu Chen | 表貼式led模組的成型結構 |
CN205546029U (zh) * | 2016-01-11 | 2016-08-31 | 武汉金东方智能景观股份有限公司 | Led灯照明电路 |
US10239159B2 (en) * | 2016-06-30 | 2019-03-26 | The Boeing Company | Laser wire processing device |
-
2018
- 2018-03-30 TW TW107111312A patent/TW201914717A/zh unknown
- 2018-03-30 TW TW107111310A patent/TWI641780B/zh not_active IP Right Cessation
- 2018-03-30 TW TW107111314A patent/TWI666972B/zh not_active IP Right Cessation
- 2018-04-09 CN CN201810312731.8A patent/CN109586141B/zh active Active
- 2018-04-09 CN CN201810311959.5A patent/CN109611711A/zh active Pending
- 2018-04-09 CN CN201810312753.4A patent/CN109587898B/zh active Active
- 2018-04-23 TW TW107113722A patent/TWI661745B/zh not_active IP Right Cessation
- 2018-05-03 CN CN201810415874.1A patent/CN109587870B/zh active Active
- 2018-07-06 US US16/029,357 patent/US20190101254A1/en not_active Abandoned
- 2018-08-03 CA CA3013375A patent/CA3013375A1/en not_active Abandoned
- 2018-08-09 US US16/059,923 patent/US10993304B2/en active Active
- 2018-08-09 US US16/059,848 patent/US10264631B1/en active Active
- 2018-08-09 US US16/059,877 patent/US10299329B2/en active Active
- 2018-08-15 CA CA3014179A patent/CA3014179A1/en not_active Abandoned
- 2018-08-15 CA CA3014180A patent/CA3014180C/en active Active
- 2018-08-15 CA CA3014183A patent/CA3014183A1/en not_active Abandoned
- 2018-08-29 TW TW107130119A patent/TWI718406B/zh active
- 2018-08-31 CN CN201811008510.8A patent/CN109586352A/zh active Pending
- 2018-08-31 TW TW107130604A patent/TWI699254B/zh not_active IP Right Cessation
- 2018-09-05 TW TW107131148A patent/TWI681697B/zh not_active IP Right Cessation
- 2018-09-07 CN CN201811044271.1A patent/CN109570997A/zh active Pending
- 2018-09-17 CN CN201811081651.2A patent/CN109585627A/zh active Pending
- 2018-09-26 US US16/142,084 patent/US10609800B2/en not_active Expired - Fee Related
- 2018-09-27 US US16/143,990 patent/US10631388B2/en active Active
- 2018-09-28 CA CA3019057A patent/CA3019057A1/en not_active Abandoned
- 2018-09-28 US US16/145,268 patent/US20190103505A1/en not_active Abandoned
- 2018-09-28 CA CA3019044A patent/CA3019044A1/en not_active Abandoned
- 2018-09-28 CA CA3019082A patent/CA3019082A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103915870A (zh) * | 2014-03-28 | 2014-07-09 | 小米科技有限责任公司 | 一种电源和终端 |
US20160056656A1 (en) * | 2014-08-25 | 2016-02-25 | Master Lock Company Llc | Circuits and methods for using parallel separate battery cells |
CN204481496U (zh) * | 2014-12-26 | 2015-07-15 | 成都建中锂电池有限公司 | 带有安全保护***的一次锂电池组 |
CN205489597U (zh) * | 2016-01-12 | 2016-08-17 | 吉安精程仪表科技有限公司 | 一种多电池仪表供电电路 |
CN106532150A (zh) * | 2016-12-02 | 2017-03-22 | 中国船舶重工集团公司第七〇九研究所 | 一种模块化的高压大容量锂电池组可控拓扑结构 |
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