Summary of the invention
Based on this, it is necessary to be easy to cause asking for substrate damage in curly course for existing transparent conducting film
Topic provides a kind of transparent conducting film that can effectively prevent substrate damage, touch screen and preparation method thereof.
A kind of transparent conducting film, comprising:
Substrate, including the first surface and second surface being oppositely arranged;
It is sequentially formed in the first hard conating, the first transparency conducting layer and the first metal layer of the first surface;
It is sequentially formed in the second hard conating, the second transparency conducting layer and second metal layer of the second surface;
First hard conating and/or second hard conating contain multiple particles, in the first metal layer and/or
The surface of the second metal layer forms multiple protrusions;
Wherein, the particle include one be in planar structure bottom surface, the bottom surface towards the substrate surface be arranged.
Since the bottom surface of particle is arranged towards the surface of substrate, and bottom surface is planar structure.Therefore, between particle and substrate
Contact become face contact, contact area increases.When transparent conducting film curling, pressure that particle applies substrate surface
It is fixed, but since contact area increases, therefore particle pressure caused by substrate is smaller, so as to be effectively prevented to substrate
It causes to damage.
Further, since contact area increases, it can also increase the adhesive force of particle.
The substrate is polycyclic alkene or polycarbonate or polyethylene terephthalate in one of the embodiments,
Film.
The two kinds of film can meet the requirement to the birefringence and its deviation of substrate, and convenient for obtaining.Cause
This, can advantageously reduce the cost of transparent conducting film.
The distribution density of the protrusion is 100~3000/mm in one of the embodiments,2。
When the distribution density of protrusion is excessive, the haze value that will lead to transparent conducting film is excessive, light transmission rate reduces, into
And seriously affect the appearance and optical effect of transparent conducting film.And if the distribution density of protrusion is too small, resist blocking and that
Effect is limited.In above-mentioned roughness and density range, transparent conducting film can preferably take into account resist blocking and that and optical effect.
The material phase of the particle and first hard conating and second hard conating in one of the embodiments,
Together.
That is, the optical parameter of suspended particulate and the first hard conating and the second hard conating (being collectively referred to as hard conating below)
It is identical.Therefore, in the linkage interface of suspended particulate and hard conating, light propagates impacted smaller, suspended particulate and hard conating
Closer is an entirety.When light passes through the hard conating containing suspended particulate, the distortion that round generates is smaller.Cause
This, transparent conducting film is achieving the purpose that resist blocking and that, resistance to compression connect simultaneously, moreover it is possible to avoid its optical property by unfavorable shadow
It rings.
In one of the embodiments, along perpendicular to the first metal layer and/or the second metal layer surface
On direction, the height of the multiple protrusion is 0.1~0.5 μm.
The height of protrusion is higher, then resist blocking and that effect is better.But with the raising of height, the size phase of suspended particulate
It in requisition for increase, can also be increased with it so as to cause the haze value of transparent conducting film, and will be tight after reaching a certain level
Ghost image rings the optical effect of transparent conducting film.And in above-mentioned altitude range, transparent conducting film can preferably be taken into account
Resist blocking and that and optical effect.
The particle further includes the edge extension along the bottom surface in one of the embodiments, and is in smooth surface knot
The top surface of structure, the top surface are arranged backwards to the surface of the substrate.
The shape of top surface determines the surface shape of protrusion.Since top surface is smooth surface.Therefore, raised surface also phase
To gentle, to can avoid forming the structures such as the sharp protrusions such as corner angle on the surface of protrusion.When transparent conducting film crimp,
When protrusion forms support between two adjacent metal layers, it can effectively prevent due to convex surfaces have raised structures to metal
It causes to damage in the surface of layer.
Line of the center of gravity of the particle positioned at the center along the bottom surface to the top surface in one of the embodiments,
On, and the center of gravity is located at the line close to one end of the bottom surface.
That is, center of gravity is closer to bottom surface.When preparing transparent conducting film, first pass through coating on the surface of substrate
Mode lay the adhesive resin of a layer fluid shape;Before adhesive resin solidification, prefabricated particle is sprayed on it;?
Grain natural subsidence under gravity, until being contacted with substrate surface;Finally, solidification adhesive resin, can be included
There is the hard conating of particle 15.
Since the center of gravity of particle is closer to bottom surface.Similar to the principle of tumbler, particle can be in weight in infall process
Autonomous overturning occurs under the action of power, and makes bottom surface towards the surface of substrate 11.Therefore, without taking other operations,
The setting of particle direction can be realized, to effectively simplify the preparation flow of transparent conducting film.
The particle is hemispherical in one of the embodiments, and/or semi-cylindrical.
Due to the molding easy to process of the particle of hemispherical and semi-cylindrical, to advantageously reduce transparent conducting film
Cost.
A kind of touch screen, touch screen transparent conducting film as described in any one of above preferred embodiment are made
At the touch screen includes Touch Zone and lead district, and the first metal layer and the second metal layer are located at the lead district;
The Touch Zone include as first transparency conducting layer etching made of first electrode and by the second transparency conducting layer etching and
At second electrode;The lead district includes by the first metal layer and positioned at the first transparency conducting layer quilt of the lead district
The first lead formed is etched, and is etched shape by the second metal layer and positioned at the second transparency conducting layer of the lead district
At the second lead.
In above-mentioned touch screen, by the first metal layer, second metal layer, the first transparency conducting layer and the second transparency conducting layer
Directly etching obtains first lead and the second lead.It is therefore not necessary to be formed and first electrode and the second electricity by silk-screen mode again
The lead of pole electrical connection.Compared with traditional touch screen, due to being not necessarily to silk-screen, the contact conductor directly formed by yellow light process
Width can further reduce, therefore touch screen has narrow frame.
A kind of preparation method of touch screen, comprising steps of
A kind of transparent conducting film as described in any one of above preferred embodiment is provided;
The first metal layer and the second metal layer are etched, to expose the first transparency conducting layer and second of Touch Zone
Transparency conducting layer, and form the metal lead wire pattern for being located at lead district;
First transparency conducting layer and second transparency conducting layer are etched, to form the first electrode for being located at Touch Zone
And second electrode, and form the transparent lead pattern for being located at lead district, the metal lead wire pattern and the transparent lead pattern
Collectively form contact conductor.
Using the above method when preparing touch screen, directly to the first metal layer, second metal layer, the first transparency conducting layer
And second transparency conducting layer be etched, first electrode, second electrode can be obtained and be electrically connected with first electrode, second electrode
Contact conductor.It is therefore not necessary to lead be formed using silk-screen mode again, to effectively simplify technique, improve processing effect
Rate.Moreover, there is narrow frame by touch screen prepared by the above method.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
Fig. 1 and Fig. 2 is please referred to, the transparent conducting film 10 in present pre-ferred embodiments includes that substrate 11, first is hard
Coating 12, the first transparency conducting layer 13, the first metal layer 14, the second hard conating 22, the second transparency conducting layer 23 and the second metal
Layer 24.
Substrate 11 includes the first surface (upper surface shown in Fig. 1) and second surface (lower surface shown in Fig. 1) being oppositely arranged.
Substrate 11 is formed by amorphism thin polymer film.Since amorphism thin polymer film is smaller simultaneously than crystalline polymer film birefringence
And uniformly, the uneven color in transparent conducting film 10 of the invention can be eliminated.For amorphism polymer of the invention
Birefringence in the face of film is preferably 0~0.001, and further preferably 0~0.0005.It is poly- for amorphism of the invention
The deviation for closing the birefringence in the face of object film is preferably 0.0005 hereinafter, further preferably 0.0003 or less.
Aforementioned birefringence and its deviation can be by selecting the amorphism thin polymer film of suitable type to reach.Specifically
In the present embodiment, substrate 11 is polycyclic alkene or polycarbonate or pet film.The two types
Film can meet the requirement of birefringence and its deviation.The substrate 11 formed by amorphism thin polymer film with a thickness of 20 μm
~200 μm.
First hard conating 12, the first transparency conducting layer 13 and the first metal layer 14 are sequentially formed in the first table of substrate 11
Face.Second hard conating 22, the second transparency conducting layer 23 and second metal layer 24 are sequentially formed in the second surface of substrate 11.Its
In:
First hard conating 12 plays a protective role to the first surface of substrate 11.First hard conating 12 includes binder tree
Rouge.The binder resin is including, for example, the hardening resin composition based on ultraviolet light, electron ray.Hardening resin composition
It preferably comprises glycidyl acrylate based polymer and acrylic acid carries out polymer obtained from addition reaction.Alternatively, solidification
Property resin combination preferably comprises polyfunctional acrylic ester polymer (pentaerythrite, dipentaerythritol etc.).Curable resin group
Closing object also includes polymerization initiator.
First transparency conducting layer 13 is formed in the surface of the first hard conating 12.First transparency conducting layer 13 is by visible region
Sheet resistance value (the unit: Ω/m of transmissivity height (80% or more) and per unit area in domain (380nm~780nm)2) be
500Ω/m2Layer below is formed.Preferred 15nm~the 100nm of thickness of first transparency conducting layer 13, more preferably 15nm~
50nm.First transparency conducting layer 13 is for example by indium tin oxide (ITO), indium tin oxide or indium oxide-zinc oxide composites
Any formation.
The first metal layer 14 is formed on the surface of the first transparency conducting layer 13.The first metal layer 14 is of the invention transparent
When conductive membrane is used for such as touch panel, it is routed for being formed in the outside of touch input area.About forming the first gold medal
Belong to the material of layer 15, representational is copper, silver, it is possible to use the arbitrary metal of excellent electric conductivity in addition to this.First
The thickness of metal layer 14 is preferably 50nm~500nm, more preferably 100nm~300nm.
Further, the second hard conating 22, the second transparency conducting layer 23 and second metal layer 24 respectively with the first hard conating
12, the film layer structure of the first transparency conducting layer 13 and the first metal layer 14, function and material composition are identical, therefore no longer superfluous herein
It states.
In addition, the first hard conating 12 and/or the second hard conating 22 contain multiple particles 15, with the first metal layer 14 and/
Or the surface of second metal layer 24 forms multiple raised 16.Also referring to Fig. 3, particle 15 includes the bottom surface that one is in planar structure
151, bottom surface 151 is arranged towards the surface of substrate 11.
Specifically, particle 15 can irregularly, the first hard conating 12 can also be distributed in preset rules (as equably)
And/or second in hard conating 22.
Particle 15 can be only contained in the first hard conating 12 or the second hard conating 22, so that obtaining single side is formed with protrusion 16
Transparent conducting film 10;Particle 15 can also be contained in the first hard conating 12, be also contained in the second hard conating 22, from
And obtain the two-sided transparent conducting film 10 for being formed with protrusion 16.
It is illustrated by taking the first hard conating 12 as an example:
On the direction perpendicular to substrate 11, the size of particle 15 is greater than the thickness of the flat site 17 of the first hard conating 12
Degree, so that particle protrudes from the surface of the first hard conating 12.The region that first hard conating 12 is provided with particle 15 forms evagination
Region, and the region that the first hard conating 12 is not provided with particle 15 then forms flat site 17.Due to the first transparency conducting layer 13 and
The first metal layer 14 is cascading the surface with the first hard conating 12, therefore the surface shape of the two and the first hard conating 12
Surface shape is identical.Therefore, in the region corresponding with particle 14 of the first metal layer 14, multiple raised 16 be will form.
Similarly, when containing particle 15 in the second hard conating 22, the surface of second metal layer 24 can also form multiple raised 16.
In the transparent conductive film 10 using roll-to-roll process (roll to roll process) to manufacture strip, by
The surface of the first metal layer 14 and/or second metal layer 24 is set to form multiple raised 16 in particle 15.Therefore, transparent lead is being crimped
When electric thin film 10, multiple raised 16 can make to form point contact between two neighboring metal layer, to prevent its stick to each other, pressure
It connects.
Moreover, because the bottom surface of particle 15 is planar structure.Therefore, the contact between particle 15 and substrate 11 becomes face and connects
Touching, contact area increase.When transparent conducting film 10 crimps, the pressure that particle 15 applies 11 surface of substrate is fixed
, but since contact area increases, therefore particle 15 is smaller to pressure caused by substrate 11, so as to be effectively prevented to substrate 11
It causes to damage.
In the present embodiment, contain particle 15 in the first hard conating 12 and the second hard conating 22, so that the first metal layer
14 and the surface of second metal layer 24 be each formed with multiple raised 16.
That is, the two-sided of obtained transparent conducting film 10 is each formed with multiple raised 16.Therefore, it is crimping
When transparent conducting film 10, the point of point contact increases between two adjacent metal layers, therefore the effect that its resist blocking and that, resistance to compression connect
Fruit is more preferable.
Referring to Fig. 4, in another embodiment, any of the first hard conating 12 and the second hard conating 22 contain particle
15, so that the surface of the first metal layer 14 or second metal layer 24 is formed with multiple raised 16.
That is, only single side is formed with multiple raised 16 to obtained transparent conducting film 10.Therefore, play it is anti-
While the effect that adhesion, resistance to compression connect, moreover it is possible to avoid the shade of two layers of particle 15 from being overlapped mutually, to mitigate mist degree, to be promoted
The optical effect of transparent conducting film 10.
In the present embodiment, particle 15 is identical as the material of the first hard conating 12 and the second hard conating 22.
Since particle 15 is identical as the material of the first hard conating 12 and the second hard conating 22 (being collectively referred to as hard conating below), therefore its
Optical parameter is also identical.Therefore, in the linkage interface of particle 15 and hard conating, it is impacted smaller that light propagates institute, particle 15 with
Closer hard conating is an entirety.When light passes through the first hard conating 12 and the second hard conating 22 containing particle 15,
The distortion that round generates is smaller.Therefore, transparent conducting film 10 achieve the purpose that resist blocking and that, resistance to compression connect simultaneously, also
It is avoided that its optical property is adversely affected.
Further, in the present embodiment, the material of particle 15 is silica, organosilicon polymer, acrylic polymer
Close object or styrene polymer.
The above material has the advantage that translucency is good, is easily obtained, can be in the premise for meeting performance requirement for particle 15
Decline low cost.Certainly, other suitable materials can also be selected according to actual performance and cost needs.
In the present embodiment, particle 15 further includes the edge extension along bottom surface 151, and is in the top surface of smooth surface structure
153, top surface 153 is arranged backwards to the surface of substrate 11.
Specifically, the shape of top surface 153 determines the surface shape of protrusion 16.Since top surface 153 is smooth surface.Cause
This, the surface of protrusion 16 is also relatively gentle, to can avoid forming the structures such as the sharp protrusions such as corner angle on the surface of protrusion 16.
When transparent conducting film 10 crimps, and protrusion 16 forms support between two adjacent metal layers, can effectively prevent because of soil
The surface of body 16 has raised structures and causes to damage to the surface of metal layer.
Specifically in the present embodiment, particle 15 is hemispherical and/or semi-cylindrical.In the first hard conating 12 and the second hard painting
In layer 22, the shape of particle 15 can be one kind and be also possible to a variety of mixing of different shapes.Wherein, hemispherical and semi-cylindrical
Particle molding easy to process, to advantageously reduce cost.
It is appreciated that in other embodiments, the shape of particle 15 is not limited to as both the above type.For example, particle
15 can also be in truncated cone-shaped, taper etc..
Further, in the present embodiment, line of the center of gravity of particle 15 positioned at the center along bottom surface 151 to top surface 153
On, and center of gravity is located at line close to one end of bottom surface 151.
That is, center of gravity is closer to bottom surface 151.First hard conating 12 and the second hard conating 22 (being collectively referred to as hard conating below)
Forming process it is as described above.When preparing transparent conducting film 10, elder generation's cloth by way of coating on the surface of substrate 11
If the adhesive resin of a layer fluid shape;Before adhesive resin solidification, prefabricated particle 15 is sprayed on it;Particle 15 exists
Natural subsidence under the action of gravity, until being contacted with 11 surface of substrate;Finally, solidification adhesive resin, can be included
The hard conating of particle 15.
Since the center of gravity of particle 15 is closer to bottom surface 151.Similar to the principle of tumbler, particle 15 in infall process just
Autonomous overturning can occur under gravity, and make bottom surface 151 towards substrate 11 surface (certainly, be based on probability, and
Not all particle 15 can be overturn to bottom surface 151 towards substrate 11.But in all particles 15, bottom surface 151 is towards substrate 11
Account for the overwhelming majority).Therefore, without taking other operations, the setting of 15 direction of particle can be realized, to effectively simplify
The preparation flow of transparent conducting film 10.
In order to realize that more preferably resist blocking and that and resistance to compression connect effect, for the table of the first metal layer 14 and second metal layer 24
The concentration of surface roughness and protrusion 16 has corresponding requirement.
In the present embodiment, the first metal layer 14 and the surface arithmetic average roughness Ra of second metal layer 24 are 0.0025
~0.025 μm.In addition, the distribution density of protrusion 16 is 100~3000/mm2。
When the distribution density of protrusion 16 is excessive, the haze value that will lead to transparent conducting film 10 is excessive, light transmission rate drop
It is low, and then seriously affect the appearance and optical effect of transparent conducting film 10.And if the distribution density of protrusion 16 is too small,
The effect of resist blocking and that is limited.In above-mentioned roughness and density range, transparent conducting film 10 can preferably take into account resist blocking and that
And optical effect.
Wherein, the first metal layer 14 and the surface arithmetic average roughness Ra and distribution density of second metal layer 24 can pass through
15 shape of particle, size and content are adjusted to change.
Further, in the present embodiment, along the side perpendicular to 24 surface of the first metal layer 14 and/or second metal layer
Upwards, multiple raised 16 height are 0.1~0.5 μm.
The height of protrusion 16 refers to that protrusion 16 protrudes from the height on 24 surface of the first metal layer 14 and/or second metal layer
Degree.Since 15 size of particle is smaller, therefore it is difficult to be accurately controlled each raised 16 height.Therefore, by protrusion 16
Height control is in above-mentioned altitude range.It should be pointed out that in actual production, due to being difficult to each particle 15
Accurately controlled, thus be difficult to avoid that have few partial particulate 15 be formed by protrusion 16 height be located above range
Outside.But it is influenced caused by part protrusion 16 negligible.
Under normal circumstances, the height of protrusion 16 is higher, then resist blocking and that effect is better.But with the raising of height,
The size of grain 15 can also increase with it, and reach one mutually in requisition for increase so as to cause the haze value of transparent conducting film 10
Determine the optical effect that transparent conducting film 10 will be seriously affected after degree.And in above-mentioned altitude range, transparent conductivity
Film 10 can preferably take into account resist blocking and that and optical effect.
Wherein, the height of protrusion 16 can change by adjusting 15 size of particle and the suspension degree of particle 15.
Above-mentioned transparent conducting film 10, particle 15 form the first metal layer 14 and/or the surface of second metal layer 24
Multiple raised 16.Therefore, when crimping above-mentioned transparent conducting film 10, multiple raised 16 can make between two neighboring metal layer
Point contact is formed, to prevent its stick to each other.Moreover, the bottom surface 151 of particle 15 is arranged towards the surface of substrate 11, and bottom surface
151 be planar structure.Therefore, the contact between particle 15 and substrate 11 becomes face contact, and contact area increases.Work as electrically conducting transparent
Property film 10 when crimping, the pressure that particle 15 applies 11 surface of substrate is fixed, but due to contact area increase, therefore particle
Pressure caused by 15 pairs of substrates 11 is smaller, causes to damage to substrate 11 so as to be effectively prevented from.
In addition, the present invention also provides a kind of touch screens.Please refer to fig. 5, the touch screen in present pre-ferred embodiments
200 as made by the transparent conducting film 10 in above-described embodiment.Wherein:
Touch screen 200 includes Touch Zone 210 and lead district 220.Specifically, Touch Zone 210 is located in touch screen 200
Portion, and lead district 220 is then around the circumferential setting of Touch Zone 210.The first metal layer 14 and second metal layer 24 are located at lead district
220。
Touch Zone 210 includes first electrode 211 and second electrode 212.Wherein, first electrode 211 is by the first electrically conducting transparent
Layer 13 etches;Second electrode 212 is etched by the second transparency conducting layer 23.First electrode 211 and second electrode 212 are lost
It is carved into electrode pattern.Specifically, electrode pattern is general elongated and the first electrode 211 that intersects vertically grid-shaped, opposite
And second electrode 212 forms the two poles of the earth of capacitance structure.
Lead district 220 includes first lead 221 and the second lead 222.First lead 221 is by the first metal layer 14 and is located at
First transparency conducting layer 13 of lead district 220 is etched to form;Second lead 222 then by second metal layer 24 and is located at lead district
220 the second transparency conducting layer 23 is etched to form.First lead 221 and the second lead 222 are double-layer structure, thus realize with
First electrode 211 and second electrode 212 are electrically connected.
It is transparent by the first metal layer 14, second metal layer 24, the first transparency conducting layer 13 and second in above-mentioned touch screen
The directly etching of conductive layer 23 obtains first lead 221 and the second lead 222.Therefore, because silk-screen is not necessarily to, directly by yellow light process
The width of the contact conductor of formation can further reduce, therefore touch screen has narrow frame.
Referring to Figure 6 together, the present invention also provides a kind of preparation method of touch screen, the method comprising the steps of S310~
S330:
Step S310: a kind of transparent conducting film is provided.
Specifically, transparent conducting film is the transparent conducting film 10 in above-described embodiment comprising stacking is set
The first transparency conducting layer 13 and the first metal layer 14 set, and the second transparency conducting layer 23 and second metal layer that are stacked
24。
Step S320: etching the first metal layer 14 and second metal layer 24, to expose the first transparency conducting layer of Touch Zone
13 and second transparency conducting layer 23, and form the metal lead wire pattern for being located at lead district
Specifically, metal lead wire pattern can be formed in layer on surface of metal by one of yellow light process.Wherein, metal lead wire figure
Case is arranged along the edge of touch screen.After being etched to metal layer, the first transparency conducting layer 13 of lower layer and second transparent lead
24 part of electric layer is exposed.
Step S330 etches the first transparency conducting layer 13 and the second transparency conducting layer 23, to form be located at Touch Zone the
One electrode 211 and second electrode 212, and form the transparent lead pattern for being located at lead district, metal lead wire pattern and transparent lead
Pattern collectively forms contact conductor.
Specifically, the first transparency conducting layer 13 and the second transparency conducting layer 24 are exposed using another road yellow light process
Part be etched, to form electrode pattern, so that first electrode 211 and second electrode 212 can be obtained.Meanwhile in gold
Belong to lead pattern the first metal layer 14 and second metal layer 24 respectively with the first transparency conducting layer 13 and second in lead district
Transparency conducting layer 23 is superimposed, to form the first lead 221 and the second lead 222 of double-layer structure.First lead 221 and second
Lead 222 is electrically connected with first electrode 211 and the realization of second electrode 212 respectively.
Using the above method when preparing touch screen, directly to the first metal layer 14, second metal layer 24, first is transparent leads
Electric layer 13 and the second transparency conducting layer 23 are etched, and can obtain first electrode 211, second electrode 212 and and first electrode
211, the first lead 221 of the electrical connection of second electrode 212, the second lead 222.Draw it is therefore not necessary to be formed again using silk-screen mode
Line, to effectively simplify technique, improve processing efficiency.Moreover, there is narrow side by touch screen prepared by the above method
Frame.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.