CN109488895A - A kind of resistance to breakdown type LED lamp panel - Google Patents
A kind of resistance to breakdown type LED lamp panel Download PDFInfo
- Publication number
- CN109488895A CN109488895A CN201811487019.8A CN201811487019A CN109488895A CN 109488895 A CN109488895 A CN 109488895A CN 201811487019 A CN201811487019 A CN 201811487019A CN 109488895 A CN109488895 A CN 109488895A
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- Prior art keywords
- resistance
- glue
- breakdown
- type
- led lamp
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- 230000015556 catabolic process Effects 0.000 title claims abstract description 50
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 53
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 53
- 239000003292 glue Substances 0.000 claims abstract description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000007731 hot pressing Methods 0.000 claims abstract description 16
- 239000011889 copper foil Substances 0.000 claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims abstract description 14
- 230000001070 adhesive effect Effects 0.000 claims abstract description 14
- 239000011888 foil Substances 0.000 claims abstract description 14
- 239000004411 aluminium Substances 0.000 claims abstract description 12
- 238000003756 stirring Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 9
- 238000001914 filtration Methods 0.000 claims abstract description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 32
- 229910052742 iron Inorganic materials 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 14
- 239000007787 solid Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 238000011049 filling Methods 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 238000002360 preparation method Methods 0.000 claims description 10
- 239000012535 impurity Substances 0.000 claims description 9
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 5
- 150000003512 tertiary amines Chemical class 0.000 claims description 5
- 150000002460 imidazoles Chemical class 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- -1 heat filling Substances 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000006872 improvement Effects 0.000 description 7
- SZVJSHCCFOBDDC-UHFFFAOYSA-N ferrosoferric oxide Chemical compound O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 6
- 239000000758 substrate Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229940056319 ferrosoferric oxide Drugs 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 230000005307 ferromagnetism Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to a kind of type of resistance to breakdown LED lamp panel, including LED aluminum base plate, the LED aluminum base plate includes aluminum layer and circuit layer, and the type of resistance to breakdown insulating layer is provided between the aluminum layer and circuit layer.Epoxyn is prepared in closed stirred tank, it is passed through ozone stirring inside to stirred tank, the first glue is made, first glue obtains the second glue after filtering using magnetic filter, adhesive coated foil is made in the hair side that second glue is coated in copper foil, the back side of adhesive coated foil is folded with aluminium sheet, it is put into vacuum press progress vacuum hotpressing and obtains aluminum-based copper-clad plate, aluminum-based copper-clad plate is processed to obtain the type of the resistance to breakdown LED lamp panel according to PCB processing procedure.The thermal diffusivity of the type of the resistance to breakdown LED lamp panel is good, and breakdown voltage value promotion has 70%, and resistance to sparking can be excellent.
Description
Technical field
The present invention relates to a kind of type of resistance to breakdown LED lamp panels, belong to LED lamp technical field.
Background technique
LED light has that small in size, power consumption is low, long service life, high brightness, low in calories, sturdy and durable, changeable etc. are excellent
Point gradually replaces incandescent lamp in the status in lamps and lanterns market.
For aluminum substrate as substrate most important in LED light, aluminum substrate is that a kind of Metal Substrate with good heat radiating function is covered
Copper sheet, general single sided board are made of three-decker, are circuit layer (copper foil), insulating layer and metal-based layer respectively.It is common in LED
Illuminating product.There are tow sides, white is welding LED pin on one side, and another side is presented aluminium true qualities, can generally smear thermally conductive
It is contacted after solidifying slurry with thermal conduction portions.The breakdown voltage of LED light depends primarily on the dielectric strength of insulating layer.For example, current 75 μ
The breakdown voltage of m insulating layer is typically not greater than 5KV (AC), and it is digital in powerful automotive electronics, household electrical appliances that this just limits LED lamp panel
The service life in equal fields.
Summary of the invention
The present invention is in view of the deficienciess of the prior art, provide a kind of type of resistance to breakdown LED lamp panel, specific technical solution is such as
Under:
A kind of resistance to breakdown type LED lamp panel, including LED aluminum base plate, the LED aluminum base plate include aluminum layer and circuit layer, institute
It states and is provided with the type of resistance to breakdown insulating layer between aluminum layer and circuit layer.
As an improvement of the above technical solution, the type of the resistance to breakdown insulating layer the production method is as follows: in closed stirring
Kettle prepares epoxyn, the first glue then is made to being passed through ozone stirring inside stirred tank, the first glue uses magnetic
The second glue is obtained after filter filtering, the hair side that the second glue is coated in copper foil is toasted 1~3 minute at 200~230 DEG C and is made
At adhesive coated foil, the back side of adhesive coated foil is the coating formed after the second glue semi-solid preparation, by the back side of adhesive coated foil and aluminium
Plate is folded, and is put into vacuum press and is carried out vacuum hotpressing, is in 180~200 DEG C, the pressure of 0.9~1.1Mpa and vacuum degree
Hot pressing 30~50 minutes in the environment of 70~80kpa, natural cooling obtains aluminum-based copper-clad plate after the completion of hot pressing, to aluminum-based copper-clad plate
It is processed according to PCB processing procedure, copper foil is processed to circuit layer, and aluminium sheet is processed to aluminum layer, and the coating of semi-solid preparation is solidifying
After form the type of resistance to breakdown insulating layer.
As an improvement of the above technical solution, the epoxyn is by epoxy resin, tertiary amines curing agent, miaow
Azole promotor, silane coupling agent, heat filling, solvent are according to mass ratio (100~120): (3.5~4.3): (1.2~
1.6): (2.9~3.6): (80~95): the ratio mixing of (40~55) is made.
As an improvement of the above technical solution, the mass ratio between the ozone and epoxyn be (0.75~
1):1000。
As an improvement of the above technical solution, after being passed through ozone to the inside of stirred tank, the temperature inside stirred tank is mentioned
It rises to 50~55 DEG C and stirs 60~70 minutes at such a temperature and the first glue is made.
As an improvement of the above technical solution, the magnetic filter includes circular electromagnet, and the electromagnet includes iron
Shell and the electromagnetic coil inside iron-clad；The inner ring of the electromagnet 31 is provided with strainer；The strainer includes iron net body, institute
The edge and iron-clad for stating iron net body are welded to connect, and the iron net body is externally coated with polytetrafluorethylecoatings coatings.
As an improvement of the above technical solution, first glue is when flowing through strainer, to the electromagnetic coil in electromagnet
It is powered, electromagnetic coil energization generates magnetic force and iron-clad and iron net body are magnetized, so as to the magnetism that will contain in the first glue
Impurity removes, and finally obtains the second glue.
Beneficial effects of the present invention:
It is optimized by the manufacture craft to LED aluminum base plate in existing LED lamp panel, the type of the resistance to breakdown LED light
The thermal diffusivity of plate is good, compares existing LED lamp panel, and the breakdown voltage value promotion of LED lamp panel of the present invention has 70%, resistance to breakdown
It has excellent performance；LED lamp panel of the present invention is especially suitable for fields such as high-powered automobiles electronics, household electrical appliances numbers.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the type of resistance to breakdown LED lamp panel of the present invention；
Fig. 2 is the structural schematic diagram of LED aluminum base plate of the present invention；
Fig. 3 is the structural schematic diagram of magnetic filter of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Embodiment 1
As shown in Fig. 1~2, the type of the resistance to breakdown LED lamp panel, including LED aluminum base plate 10, the LED aluminum base plate 10 include
Aluminum layer 11 and circuit layer 13 are provided with the type of resistance to breakdown insulating layer 12 between the aluminum layer 11 and circuit layer 13.
Prepare epoxyn in closed stirred tank, by 100kg epoxy resin, 3.5kg tertiary amines curing agent,
Epoxide-resin glue is made in 1.2kg imidazoles promotor, 2.9kg silane coupling agent, 80kg heat filling, the mixing of 40kg solvent
Stick.Then the first glue is made to being passed through ozone stirring inside stirred tank, between the ozone and epoxyn
Mass ratio is 0.75:1000.After being passed through ozone to the inside of stirred tank, the temperature inside stirred tank is promoted to 50 DEG C and at this
At a temperature of stir 60 minutes the first glue be made.
As shown in figure 3, the magnetic filter includes circular electromagnet 31, the electromagnet 31 is including iron-clad and is located at iron
Electromagnetic coil inside shell；The inner ring of the electromagnet 31 is provided with strainer 32；The strainer 32 includes iron net body, the iron net
The edge and iron-clad of body are welded to connect, and the iron net body is externally coated with polytetrafluorethylecoatings coatings.First glue is flowing
It when through strainer 32, is powered to the electromagnetic coil in electromagnet 31, electromagnetic coil energization generates magnetic force and makes iron-clad and iron net body magnetic
Change, the magnetic impurity so as to contain in the first glue removes, and finally obtains the second glue.
First glue obtains the second glue after filtering using magnetic filter, the hair side that the second glue is coated in copper foil is existed
200 DEG C of bakings are made adhesive coated foil for 3 minutes, and the back side of adhesive coated foil is the coating formed after the second glue semi-solid preparation, will apply
The back side of glue copper foil is folded with aluminium sheet, is put into vacuum press and is carried out vacuum hotpressing, in 180 DEG C, the pressure of 1.1Mpa and true
Reciprocal of duty cycle is hot pressing 50 minutes in the environment of 70kpa, and natural cooling obtains aluminum-based copper-clad plate after the completion of hot pressing, presses to aluminum-based copper-clad plate
It is processed according to PCB processing procedure, copper foil is processed to circuit layer 13, and aluminium sheet is processed to aluminum layer 11, and the coating of semi-solid preparation is solid
The type of resistance to breakdown insulating layer 12 is formed after change.
The type of the resistance to breakdown insulating layer 12 with a thickness of 75 μm, the breakdown voltage of LED aluminum base plate 10 is 8.5KV (AC).
Embodiment 2
Structure phase of the structure of the LED lamp panel of the type of resistance to breakdown described in the present embodiment with the type of resistance to breakdown LED lamp panel in embodiment 1
Together.The structure of magnetic filter described in the present embodiment is identical as the structure of magnetic filter in embodiment 1.
Prepare epoxyn in closed stirred tank, by 110kg epoxy resin, 4kg tertiary amines curing agent,
Epoxy resin gluing is made in 1.5kg imidazoles promotor, 3kg silane coupling agent, 90kg heat filling, the mixing of 50kg solvent
Agent.Then the first glue is made to being passed through ozone stirring inside stirred tank, the matter between the ozone and epoxyn
Amount is than being 0.9:1000.After being passed through ozone to the inside of stirred tank, the temperature inside stirred tank is promoted to 53 DEG C and in the temperature
The first glue is made in 66 minutes in the lower stirring of degree.
First glue obtains the second glue after filtering using magnetic filter, the hair side that the second glue is coated in copper foil is existed
220 DEG C of bakings are made adhesive coated foil for 2 minutes, and the back side of adhesive coated foil is the coating formed after the second glue semi-solid preparation, will apply
The back side of glue copper foil is folded with aluminium sheet, is put into vacuum press and is carried out vacuum hotpressing, in 190 DEG C, the pressure and vacuum of 1Mpa
Degree be 75kpa in the environment of hot pressing 35 minutes, natural cooling obtains aluminum-based copper-clad plate after the completion of hot pressing, to aluminum-based copper-clad plate according to
PCB processing procedure is processed, and copper foil is processed to circuit layer 13, and aluminium sheet is processed to aluminum layer 11, and the coating of semi-solid preparation is solidifying
After form the type of resistance to breakdown insulating layer 12.
The type of the resistance to breakdown insulating layer 12 with a thickness of 75 μm, the breakdown voltage of LED aluminum base plate 10 is 9KV (AC).
Embodiment 3
Structure phase of the structure of the LED lamp panel of the type of resistance to breakdown described in the present embodiment with the type of resistance to breakdown LED lamp panel in embodiment 1
Together.The structure of magnetic filter described in the present embodiment is identical as the structure of magnetic filter in embodiment 1.
Prepare epoxyn in closed stirred tank, by 120kg epoxy resin, 4.3kg tertiary amines curing agent,
Epoxide-resin glue is made in 1.6kg imidazoles promotor, 3.6kg silane coupling agent, 95kg heat filling, the mixing of 55kg solvent
Stick.Then the first glue is made to being passed through ozone stirring inside stirred tank, between the ozone and epoxyn
Mass ratio is 1:1000.After being passed through ozone to the inside of stirred tank, the temperature inside stirred tank is promoted to 55 DEG C and in the temperature
The first glue is made in 60 minutes in the lower stirring of degree.
First glue obtains the second glue after filtering using magnetic filter, the hair side that the second glue is coated in copper foil is existed
230 DEG C of bakings are made adhesive coated foil for 1 minute, and the back side of adhesive coated foil is the coating formed after the second glue semi-solid preparation, will apply
The back side of glue copper foil is folded with aluminium sheet, is put into vacuum press and is carried out vacuum hotpressing, in 200 DEG C, the pressure of 0.9Mpa and true
Reciprocal of duty cycle is hot pressing 30 minutes in the environment of 80kpa, and natural cooling obtains aluminum-based copper-clad plate after the completion of hot pressing, presses to aluminum-based copper-clad plate
It is processed according to PCB processing procedure, copper foil is processed to circuit layer 13, and aluminium sheet is processed to aluminum layer 11, and the coating of semi-solid preparation is solid
The type of resistance to breakdown insulating layer 12 is formed after change.
The type of the resistance to breakdown insulating layer 12 with a thickness of 75 μm, the breakdown voltage of LED aluminum base plate 10 is 8.5KV (AC).
In the above-described embodiments, the heat filling is aluminium nitride, aluminium oxide, aluminium nitride, boron nitride, silicon carbide, oxidation
One of magnesium is several.The addition of heat filling can significantly improve the thermal coefficient of the type of resistance to breakdown insulating layer 12.It is described molten
Agent is one of ethyl alcohol, acetone, butanone, dimethylformamide, propylene glycol monomethyl ether or several.
It is well known that the dielectric strength of the type of resistance to breakdown insulating layer 12 depends primarily on heat filling in epoxyn
Metal impurities amount, metal impurities are since itself can be conductive, and metals content impurity is higher, the type of resistance to breakdown insulating layer 12
Dielectric strength is smaller.Heat filling is usually all to carry out comminution process using metal grinding device, in crushing process, due to
Phase mutual friction causes to contain a small amount of metal impurities inside heat filling, it can be common that iron tramp.By to epoxy resin gluing
The mode for being passed through ozone inside agent and heating, so that the metal impurities inside epoxyn are oxidized to corresponding oxidation
Object, in addition to ferroso-ferric oxide, remaining metal oxide is non-conductive or electric conductivity is very faint, this can significantly improve resistance to breakdown
The dielectric strength of type insulating layer 12.Ferroso-ferric oxide is known as magnetic iron oxide, can be adsorbed by magnet.In such a way that magnetic is overanxious
The ferroso-ferric oxide that epoxyn contains can be reduced to greatest extent.By double filtration, epoxyn
The conductive impurities content that inside is contained is preferably minimized, and the dielectric strength for finally solidifying the obtained type of resistance to breakdown insulating layer 12 is significant
Enhancing, the breakdown voltage of the LED aluminum base plate 10 can reach 8.5KV (AC) or more.
In the filter, electromagnet 31 is that annular shape keeps the Distribution of Magnetic Field of its inner ring uniform, and it is miscellaneous to be conducive to raising ferromagnetism
The adsorption effect of matter.The presence of the polytetrafluorethylecoatings coatings, which can be avoided, introduces new iron tramp.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (7)
1. a kind of type of resistance to breakdown LED lamp panel, including LED aluminum base plate, the LED aluminum base plate includes aluminum layer and circuit layer, spy
Sign is, the type of resistance to breakdown insulating layer is provided between the aluminum layer and circuit layer.
2. a kind of type of resistance to breakdown LED lamp panel according to claim 1, which is characterized in that the type of the resistance to breakdown insulating layer
The production method is as follows: epoxyn is prepared in closed stirred tank, then to being passed through ozone stirring system inside stirred tank
At the first glue, the first glue obtains the second glue after filtering using magnetic filter, and the second glue is coated in the hair side of copper foil
It is toasted at 200~230 DEG C and adhesive coated foil is made within 1~3 minute, the back side of adhesive coated foil is to be formed after the second glue semi-solid preparation
Coating folds at the back side of adhesive coated foil with aluminium sheet, be put into vacuum press carry out vacuum hotpressing, 180~200 DEG C, 0.9~
The pressure and vacuum degree of 1.1Mpa is hot pressing 30~50 minutes in the environment of 70~80kpa, and natural cooling obtains after the completion of hot pressing
To aluminum-based copper-clad plate, aluminum-based copper-clad plate is processed according to PCB processing procedure, copper foil is processed to circuit layer, and aluminium sheet is processed to
Aluminum layer, the coating of semi-solid preparation form the type of resistance to breakdown insulating layer after hardening.
3. a kind of type of resistance to breakdown LED lamp panel according to claim 2, which is characterized in that the epoxyn is
By epoxy resin, tertiary amines curing agent, imidazoles promotor, silane coupling agent, heat filling, solvent according to mass ratio (100~
120): (3.5~4.3): (1.2~1.6): (2.9~3.6): (80~95): the ratio mixing of (40~55) is made.
4. a kind of type of resistance to breakdown LED lamp panel according to claim 2, which is characterized in that the ozone and epoxide-resin glue
Mass ratio between stick is (0.75~1): 1000.
5. a kind of type of resistance to breakdown LED lamp panel according to claim 2, which is characterized in that smelly to being passed through inside stirred tank
After oxygen, the temperature inside stirred tank is promoted to 50~55 DEG C and stirred at such a temperature the first glue is made within 60~70 minutes.
6. a kind of type of resistance to breakdown LED lamp panel according to claim 2, which is characterized in that the magnetic filter includes annulus
Shape electromagnet, the electromagnet include iron-clad and the electromagnetic coil inside iron-clad；The inner ring of the electromagnet 31 is provided with
Strainer；The strainer includes iron net body, and the edge and iron-clad of the iron net body are welded to connect, and the iron net body is externally coated with
Polytetrafluorethylecoatings coatings.
7. a kind of type of resistance to breakdown LED lamp panel according to claim 6, it is characterised in that: first glue is flowing through filter
When net, it is powered to the electromagnetic coil in electromagnet, electromagnetic coil energization generates magnetic force and iron-clad and iron net body is magnetized, so as to
It is enough to remove the magnetic impurity contained in the first glue, finally obtain the second glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811487019.8A CN109488895B (en) | 2018-12-06 | 2018-12-06 | Breakdown-resistant LED lamp panel |
Applications Claiming Priority (1)
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