CN105038671A - LED aluminum substrate binder and LED aluminum substrate with same - Google Patents
LED aluminum substrate binder and LED aluminum substrate with same Download PDFInfo
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- CN105038671A CN105038671A CN201510321327.3A CN201510321327A CN105038671A CN 105038671 A CN105038671 A CN 105038671A CN 201510321327 A CN201510321327 A CN 201510321327A CN 105038671 A CN105038671 A CN 105038671A
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Abstract
The invention relates to the technical field of LED aluminum substrates and particularly relates to an LED aluminum substrate binder and an LED aluminum substrate with the same. The LED aluminum substrate binder disclosed by the invention contains epoxy resin, amines, acidic polyether esters, anhydride resin, butadiene-acrylonitrile rubber, imidazole or boron trifluoride and inorganic powder in certain proportions. The LED aluminum substrate composed of copper foil, a binding layer and an aluminum plate is formed by using the binder in a back dipping way or other ways; the binding layer of the LED aluminum substrate, formed by the binder disclosed by the invention, has the characteristics of good toughness, no powder breaking and falling and low cost, and the aluminum substrate has relatively good comprehensive properties including high voltage resistance and favorable thermal conductivity; and the aluminum substrate has the characteristics of good toughness, favorable machining property, bending resistance, no cracking and no substrate leakage after insulating layer bending and no hole edge cracking after LED aluminum substrate drilling.
Description
Technical field
The present invention relates to LED aluminum base plate technical field, be specifically related to a kind of LED aluminum base plate bonding agent and use the LED aluminum base plate of this bonding agent.
Background technology
Aluminium base (aluminum-based copper-clad plate) is a kind of metallic circuit panel material; Usually be made up of Copper Foil, key coat (insulation layer) and aluminium sheet; Along with developing rapidly of LED illumination especially household LED home lighting, also the development of the demand blowout of LED aluminium base is driven, in order to reduce costs, insulation layer now on general household LED aluminium base used, mostly all at 1080 prepregs using FR-4 copper-clad plate used (after epoxy resin in 1080 electronics glass pricker cloth dip-coatings, smoke into semi-cured state), play certain simplification and produce the effect reduced costs; But there is following defect in the LED aluminum base plate that this prepreg is produced: 1. thermal conductivity is low, generally only has about 0.4W/m.k, in the slightly large LED of power uses, with regard to there is the bad and phenomenon of the light decay that causes and service life reduction of heat radiation, have a strong impact on the quality of product; 2. proof voltage is low, the insulation layer proof voltage of this aluminium base is generally at 3000-4000 volts, the circuit card proof voltage that the LED aluminum base plate of final production is formed is general all between 500-1200 volts, easily breakdown when thunderstorm weather, this point shows particularly evident (general requirement is more than 1500 volts) in street lamp; 3. insulation layer poor toughness, not resistance to bending, affects the appearance and modeling of light fixture; 4. the resin-oatmeal on prepreg easily comes off, clean unclean, is easily solidificated in copper foil surface when pressed sheet, and causes scrapping of lower procedure.
Summary of the invention
The object of the invention is to adopt prepreg to do the deficiency of aluminium base existence for existing LED, and a kind of LED aluminum base plate bonding agent overcome the above problems and the LED aluminum base plate using this bonding agent are provided.For reaching above object, the present invention by the following technical solutions:
A kind of LED aluminum base plate bonding agent, described bonding agent is grouped into by the one-tenth of following mass parts:
Epoxy resin: 50 ~ 90 parts, as matrix resin;
Solidifying agent: 2 ~ 50 parts, combines, as the solidifying agent of epoxy resin arbitrarily containing a kind of resin in amine, acid polyether ester class, anhydrides or containing above-mentioned resin;
Paracril: 4 ~ 35 parts, strengthens the toughness of resin system;
Imidazoles or boron trifluoride: 0.05 ~ 3 part, do the use of curing catalyst, effectively can promote the crosslinking reaction of resin system;
Inorganic powder: 40 ~ 450 parts, in aluminium hydroxide, talcum powder, silicon powder, titanium dioxide, aluminum oxide, aluminium nitride, one or more mixing, improve heat conductivility, rigidity, the dimensional stability of product.
Preferably, the organic silicon compound 0.5 ~ 15 part of described bonding agent also containing mass parts, effectively can improve the electric property of bonding agent production LED aluminum base plate, thermotolerance;
A kind of LED aluminum base plate, described aluminium base is disposed with Copper Foil, key coat and aluminium sheet; It is characterized in that, described key coat is made up of above-mentioned any one bonding agent.
Beneficial effect of the present invention is: LED aluminum base plate bonding agent of the present invention, the epoxy resin containing certain proportion formula, containing the resin of amine, acid polyether ester class, anhydrides, and paracril, imidazoles or boron trifluoride, inorganic powder; Bonding agent of the present invention, is coated with impregnation mode with the back of the body or other modes form the LED aluminum base plate be made up of Copper Foil, key coat and aluminium sheet; Bonding agent of the present invention forms the key coat of LED aluminum base plate, there is good toughness and do not roll over the characteristic that dry linting cost is not low, aluminium base has good over-all properties: high withstand voltage performance, when thickness of insulating layer is 0.1mm, interchange can reach 9 kilovolts, direct current can reach on 16 kilovolts even higher, and there is good thermal conductivity, it is even higher that thermal conductivity can reach 1W/m.k; And have good toughness, good machining property, bending resistance folding endurance, after bending, insulation layer does not ftracture, does not leak base material, the feature do not broken in sheet material boring metapore limit.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of aluminium base of the present invention;
Embodiment
For the ease of the understanding of those skilled in the art, below accompanying drawing 1 the present invention is further illustrated:
Embodiment 1,
A kind of LED aluminum base plate bonding agent, described bonding agent is grouped into by the one-tenth of following mass parts:
Epoxy resin: 90 parts;
Ammonia resin: 2 parts;
Paracril: 4 parts;
Imidazoles: 3 parts;
Talcum powder: 150 parts;
Organic silicon compound 0.5 part.
Embodiment 2,
A kind of LED aluminum base plate bonding agent, described bonding agent is grouped into by the one-tenth of following mass parts:
Epoxy resin: 50 parts;
Acid polyetherester resins: 25 parts;
Paracril: 18 parts;
Boron trifluoride: 0.05 part;
Aluminium hydroxide: 450 parts.
Embodiment 3,
A kind of LED aluminum base plate bonding agent, described bonding agent is grouped into by the one-tenth of following mass parts:
Epoxy resin: 65 parts;
Anhydride resin: 50 parts;
Paracril: 35 parts;
Imidazoles: 2 parts;
Aluminum oxide: 35 parts;
Silicon powder: 120 parts;
Organic silicon compound: 7.5 parts.
Embodiment 4,
A kind of LED aluminum base plate bonding agent, described bonding agent is grouped into by the one-tenth of following mass parts:
Epoxy resin: 80 parts;
Amine resins: 10 parts;
Acid polyetherester resins: 15 parts;
Anhydride resin: 10 parts;
Paracril: 25 parts;
Boron trifluoride: 2.4 parts;
Titanium dioxide: 38 parts
Aluminium nitride: 2 parts;
Organic silicon compound: 15 parts.
The invention still further relates to a kind of aluminium base using bonding agent of the present invention obtained, aluminium base is disposed with Copper Foil 1, key coat 2 and aluminium sheet 3 (as shown in Figure 1), and key coat is made up of above-mentioned any one bonding agent; Be coated with impregnation mode with the back of the body and make the Copper Foil that one side is coated with bonding agent of the present invention, then with process after aluminium sheet High Temperature High Pressure be pressed into aluminium base of the present invention.
The bonding agent of above-mentioned four embodiments is made on the product of as follows specification: 0.018mm Copper Foil, key coat (insulation layer) 0.1mm, 0.82mm aluminium sheet, the product made, compares with the aluminium base produced with thermal conductivity glued membrane in 1080 prepregs and, obtains following detection data:
As can be seen from above performance perameter, the key coat of the aluminium base that bonding agent of the present invention is produced has superior over-all properties: bonding agent of the present invention forms the key coat of LED aluminum base plate, there is good toughness and do not roll over the characteristic that dry linting cost is not low, aluminium base has good over-all properties: high withstand voltage performance, has good thermal conductivity; And have excellent toughness, excellent, the resistance to bending of machining property, after bending, insulation layer does not ftracture, does not leak base material, the feature do not broken in LED aluminum base plate boring metapore limit.
Above content is only preferred embodiment of the present invention, and for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, this description should not be construed as limitation of the present invention.
Claims (4)
1. a LED aluminum base plate bonding agent, is characterized in that, described bonding agent is grouped into by the one-tenth of following mass parts:
Epoxy resin: 50 ~ 90 parts;
Solidifying agent: 2 ~ 50 parts, combines arbitrarily containing a kind of resin in amine, acid polyether ester class, anhydrides or containing above-mentioned resin;
Paracril: 4 ~ 35 parts;
Imidazoles or boron trifluoride: 0.05 ~ 3 part;
Inorganic powder: 40 ~ 450 parts.
2. a kind of LED aluminum base plate bonding agent according to claim 1, is characterized in that, the organic silicon compound 0.5 ~ 15 part of described bonding agent also containing mass parts.
3. a kind of LED aluminum base plate bonding agent according to claim 1, is characterized in that, described inorganic powder is one or more mixing in aluminium hydroxide, talcum powder, silicon powder, titanium dioxide, aluminum oxide, aluminium nitride.
4. a LED aluminum base plate, described aluminium base is disposed with Copper Foil, key coat and aluminium sheet; It is characterized in that, described key coat is made up of claim 1-3 any one bonding agent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510321327.3A CN105038671A (en) | 2015-06-12 | 2015-06-12 | LED aluminum substrate binder and LED aluminum substrate with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510321327.3A CN105038671A (en) | 2015-06-12 | 2015-06-12 | LED aluminum substrate binder and LED aluminum substrate with same |
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| CN105038671A true CN105038671A (en) | 2015-11-11 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109488895A (en) * | 2018-12-06 | 2019-03-19 | 安徽皇广实业有限公司 | A kind of resistance to breakdown type LED lamp panel |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012123403A1 (en) * | 2011-03-11 | 2012-09-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Epoxy resin system with visual monitoring of the hardening state |
| CN104531026A (en) * | 2014-12-25 | 2015-04-22 | 东莞翔思电子科技有限公司 | Aluminum substrate binder and aluminum substrate using same |
-
2015
- 2015-06-12 CN CN201510321327.3A patent/CN105038671A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012123403A1 (en) * | 2011-03-11 | 2012-09-20 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. | Epoxy resin system with visual monitoring of the hardening state |
| CN104531026A (en) * | 2014-12-25 | 2015-04-22 | 东莞翔思电子科技有限公司 | Aluminum substrate binder and aluminum substrate using same |
Non-Patent Citations (1)
| Title |
|---|
| 陈平等: "《环氧树脂》", 31 March 1999, 化学工业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109488895A (en) * | 2018-12-06 | 2019-03-19 | 安徽皇广实业有限公司 | A kind of resistance to breakdown type LED lamp panel |
| CN109488895B (en) * | 2018-12-06 | 2020-03-31 | 安徽皇广实业有限公司 | Breakdown-resistant LED lamp panel |
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