CN109483780A - A kind of large ratio of height to width microstructure transfer printing method - Google Patents
A kind of large ratio of height to width microstructure transfer printing method Download PDFInfo
- Publication number
- CN109483780A CN109483780A CN201811353489.5A CN201811353489A CN109483780A CN 109483780 A CN109483780 A CN 109483780A CN 201811353489 A CN201811353489 A CN 201811353489A CN 109483780 A CN109483780 A CN 109483780A
- Authority
- CN
- China
- Prior art keywords
- pdms
- conductive
- soft mold
- micro
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 67
- 238000010023 transfer printing Methods 0.000 title claims abstract description 9
- 239000004205 dimethyl polysiloxane Substances 0.000 claims abstract description 138
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims abstract description 138
- 238000012546 transfer Methods 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 239000007788 liquid Substances 0.000 claims abstract description 36
- 239000004020 conductor Substances 0.000 claims abstract description 31
- 239000002086 nanomaterial Substances 0.000 claims abstract description 16
- -1 polydimethylsiloxane Polymers 0.000 claims abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 88
- 239000011521 glass Substances 0.000 claims description 33
- 238000004519 manufacturing process Methods 0.000 claims description 32
- 238000003848 UV Light-Curing Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 27
- 238000001723 curing Methods 0.000 claims description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 17
- 239000010703 silicon Substances 0.000 claims description 17
- 239000002002 slurry Substances 0.000 claims description 16
- 238000007711 solidification Methods 0.000 claims description 16
- 230000008023 solidification Effects 0.000 claims description 16
- 238000010146 3D printing Methods 0.000 claims description 10
- 238000011049 filling Methods 0.000 claims description 9
- 238000010276 construction Methods 0.000 claims description 8
- 238000000609 electron-beam lithography Methods 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 2
- 230000001788 irregular Effects 0.000 claims description 2
- 229920001721 polyimide Polymers 0.000 claims description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims 10
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims 10
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims 10
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 1
- 239000011344 liquid material Substances 0.000 claims 1
- KUCOHFSKRZZVRO-UHFFFAOYSA-N terephthalaldehyde Chemical compound O=CC1=CC=C(C=O)C=C1 KUCOHFSKRZZVRO-UHFFFAOYSA-N 0.000 claims 1
- 230000007306 turnover Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 38
- 238000000576 coating method Methods 0.000 abstract description 38
- 229920002120 photoresistant polymer Polymers 0.000 description 37
- 229910052709 silver Inorganic materials 0.000 description 34
- 239000004332 silver Substances 0.000 description 34
- 229920002799 BoPET Polymers 0.000 description 19
- 238000012805 post-processing Methods 0.000 description 13
- 235000012431 wafers Nutrition 0.000 description 13
- 230000008569 process Effects 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 10
- 230000005684 electric field Effects 0.000 description 9
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 239000002042 Silver nanowire Substances 0.000 description 6
- 238000000465 moulding Methods 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 5
- 238000005266 casting Methods 0.000 description 5
- 125000002091 cationic group Chemical group 0.000 description 5
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 238000007641 inkjet printing Methods 0.000 description 3
- 238000001540 jet deposition Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 241000209094 Oryza Species 0.000 description 2
- 235000007164 Oryza sativa Nutrition 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000002309 gasification Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 235000009566 rice Nutrition 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- CYIGRWUIQAVBFG-UHFFFAOYSA-N 1,2-bis(2-ethenoxyethoxy)ethane Chemical compound C=COCCOCCOCCOC=C CYIGRWUIQAVBFG-UHFFFAOYSA-N 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-N Formic acid Chemical class OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229940106691 bisphenol a Drugs 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0025—Applying surface layers, e.g. coatings, decorative layers, printed layers, to articles during shaping, e.g. in-mould printing
- B29C37/0028—In-mould coating, e.g. by introducing the coating material into the mould after forming the article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
- B29C37/0025—Applying surface layers, e.g. coatings, decorative layers, printed layers, to articles during shaping, e.g. in-mould printing
- B29C37/0028—In-mould coating, e.g. by introducing the coating material into the mould after forming the article
- B29C2037/0046—In-mould printing, in-mould transfer printing
Abstract
The present invention relates to a kind of large ratio of height to width microstructure transfer printing methods to master tooling upper liquid polydimethylsiloxane (PDMS), and to heat it using the template with raised micro nano structure as master tooling, manufactures PDMS soft mold；Liquid conductive material is filled into PDMS soft mold groove by way of electrowetting auxiliary blade coating, and makes conductive material precuring at a certain temperature；Transfer technique is assisted by UV, conductive material is transferred in target substrate；Conductive structure in target substrate is further processed, the conductive structure that consistency is good, precision is high, electric conductivity is excellent is obtained.
Description
Technical field
The invention belongs to micro-nano manufacturing technology field more particularly to a kind of large ratio of height to width microstructure transfer printing methods.
Background technique
Micro-nano device is with a wide range of applications in fields such as information, the energy, medical treatment, national defence, in recent years just towards
Intelligent, flexibility direction is developed.Micro-nano manufacturing technology and it is horizontal directly decide solar panel, miniature LED,
The comprehensive performance of the minisize components such as flexible conductive film, sensor, biological devices, wearable electronic device.With multidisciplinary
Mixing together and development, more fields need to integrate micro-nano functional structure device to meet different application demands, because
And new challenge is had also been proposed to the manufacture of micro nano structure.Micro-nano manufacturing technology requires manufacturing cost low, and rapidoprint is not
It is limited, it is high-efficient, it can mass production etc..The method of currently manufactured micro nano structure has photoetching process, inkjet printing, nanometer pressure
Print, micro- transfer etc..Wherein, micro- transfer technique is realized using the difference of adhesion strength between template and substrate and transfer polymerization object
The transfer of polymer mainly has positivity transfer, negativity transfer, hectographic printing etc., these methods are simple with step, success rate is high
The advantages that, but there is also many limitations.The higher cost that positivity transfer needs, and transferable material is limited；Negativity turns
It prints harsher to the condition (air pressure and temperature) in technical process；Hectographic printing needs repeatedly transfer, efficiency lower.
Ink offset is transferred relative to positivity, compared with negativity transfer and printing transfer, with cost is relatively low, technical process
The advantages such as middle environmental requirement is low and efficiency is higher, more suitable for the mass production to the demanding micro-nano device of yield,
However, the transfer for demand large ratio of height to width micro structural component, the success rate of ink offset is lower or is difficult to realize large ratio of height to width
The transfer of micro-structure, and it is all in OLED, RFID, solar battery, touching display screen, transparent electrical-heating film, transparent electrode etc.
More optoelectronic areas, large ratio of height to width conductive micro structures are just able to satisfy the photoelectric properties demand of requirements at the higher level.Therefore, micro- transfer at present
Technology is difficult to realize effective transfer of large ratio of height to width micro-structure, becomes it and carries out widely applied significant bottleneck.To sum up, compel to be essential
A kind of new process is developed, can be realized effective transfer of large ratio of height to width micro-structure, to realize the micro- knot of large ratio of height to width
The low-coat scaleization of structure manufactures.
Summary of the invention
In order to make up the defect currently with various micro- transfer technique manufacture micro nano structures, micro- transfer technique transfer is improved
The depth-width ratio of micro nano structure, the present invention is proposed a kind of method for manufacturing micro nano structure, is assisted using UV glue, is realized efficiently
Rate low cost manufacturing large ratio of height to width micro nano structure, and simple process is flexible, has a wide range of application, to solve existing micro- transfer skill
Art is difficult to the problem of transferring large ratio of height to width micro-structure and provides a kind of scheme.
To realize the above-mentioned technical purpose, The technical solution adopted by the invention is as follows:
The present invention provides a kind of methods of large ratio of height to width microstructure transfer printing, comprising:
Step 1): template of the preparation with raised micro nano structure, it is poly- to the master tooling upper liquid as master tooling
Dimethyl siloxane PDMS is turned over and is made with reeded PDMS work mold；
Step 2): the mould of filling electrocondution slurry is made in groove filling liquid conductive material, solidification to PDMS work mold
Plate；
Step 3): one layer of UV curing materials are coated in target substrate；
Step 4): the template for filling electrocondution slurry is bonded with UV curing material layer, will be in the template that fill electrocondution slurry
Cured electrocondution slurry is transferred in target substrate, sintering to get.
Large ratio of height to width refers in the application: the depth-width ratio of material is 0.7~2.0.
In some embodiments, the production method of the template with raised micro nano structure is electron beam lithography, pole
Ultraviolet photolithographic or 3D printing technique.
In some embodiments, the raised micro nano structure is wire grid construction, network, lattice array or irregular component
Case.
In some embodiments, the liquid conductive material is metal nanometer line, graphene, conductive ink, nano silver are led
At least one of plasma-based material or Nanometer Copper electrocondution slurry.
In some embodiments, the target substrate be simple glass, silicon wafer, polyethylene terephtalate or
One of polyimides PI.
In some embodiments, in step 1), the specific steps of system are turned over are as follows: to the processing of PDMS liquid draw vacuum, then will
It is cast on master tooling, and to PDMS liquid curing；After PDMS is fully cured, the method for taking " open-type " to demould will
PDMS is separated with master tooling, is obtained with master mold lamps structure on the contrary, with reeded PDMS soft mold.
In some embodiments, in step 4), the specific steps of transfer are as follows: UV curing materials are solidified；Solidify
Bi Hou separates PDMS soft mold with target substrate, obtains the target substrate for having conductive structure.
In some embodiments, under the conditions of electrowetting, to the groove filling liquid conductive material of PDMS work mold.
The present invention also provides the large ratio of height to width micro structural components of any above-mentioned method preparation.
The present invention also provides above-mentioned large ratio of height to width micro structural components to prepare solar panel, miniature LED, flexibility
Application in conductive film, sensor, biological devices or wearable electronic device.
The beneficial effects of the present invention are:
(1) invent a kind of UV assist micro- transfer printing process, it can be achieved that large ratio of height to width micro-structure (depth-width ratio can be greater than 1) it is effective
Transfer；And it is suitable for the microfabrication of various scales (minute yardstick, sub-micron scale, scale etc. of receiving).
(2) range of choice of micro- transfer master tooling is wide, and can select different process manufacture as needed has different structure
Mold, the large ratio of height to width mold of traditional minute manufacturing technology manufacture and the big height of micro/nano-scale 3D printing manufacture such as may be selected
Width compares mold.
(3) entire manufacturing process flow is simple, and facility environment requirement is low, and adaptation conductive material range is wide, is suitable for hard
And the target substrates such as flexibility, Yi Shixian mass production.
Detailed description of the invention
The accompanying drawings constituting a part of this application is used to provide further understanding of the present application, and the application's shows
Meaning property embodiment and its explanation are not constituted an undue limitation on the present application for explaining the application.
Fig. 1 and Fig. 2 is the schematic diagram of the corresponding embodiment of the present invention.
Specific embodiment
It is noted that following detailed description is all illustrative, it is intended to provide further instruction to the application.Unless another
It indicates, all technical and scientific terms used in this application have logical with the application person of an ordinary skill in the technical field
The identical meanings understood.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, operation, device, component and/or their combination.
As background technique is introduced, effectively turning for large ratio of height to width micro-structure is difficult to realize for current micro- transfer technique
Print becomes it and carries out widely applied significant bottleneck problem.Therefore, the present invention proposes a kind of large ratio of height to width microstructure transfer printing side
Method, using the template with raised micro nano structure as master tooling, to master tooling upper liquid polydimethylsiloxane
(PDMS), it and to it heats, manufactures PDMS soft mold；It is filled out by way of electrowetting auxiliary blade coating into PDMS soft mold groove
Liquid conductive material is filled, and makes conductive material precuring at a certain temperature；Transfer technique is assisted by UV, conductive material is turned
It moves in target substrate；Conductive structure in target substrate is further processed, obtains that consistency is good, precision is high, electric conductivity
Excellent conductive structure.
The template with raised micro nano structure is including the use of the photoetching such as electron beam lithography, extreme ultraviolet photolithographic, etching
What the template and utilization micro/nano-scale 3D printing technique of the micro-nano feature structure of technology manufacture manufactured has micro-nano feature structure
Template etc..
The liquid conductive material includes metal nanometer line, graphene, conductive ink, electrocondution slurry (nano-silver conductive slurry
Material, Nanometer Copper electrocondution slurry etc.) etc..
The substrate includes the hard substrates such as simple glass, silicon wafer, and polyethylene terephthalate (PET), polyamides are sub-
The flexible substrates such as amine (PI).
A kind of large ratio of height to width microstructure transfer printing method, comprising the following steps:
Step 1, PDMS soft mold manufactures；
It to the master tooling upper liquid PDMS with raised micro nano structure, and is heating and curing to it, it is soft to obtain PDMS
Mold；
Step 2, conductive material is scratched；
Conductive material is filled into PDMS soft mold groove by way of electrowetting auxiliary blade coating, and makes conductive material
Precuring；
Step 3, UV curing materials are coated；
One layer of UV curing materials are coated in target substrate；
Step 4, UV auxiliary transfer；
The conductive material of precuring is transferred in target substrate using UV auxiliary transfer technique；
Step 5, it post-processes；
It is further processed target substrate, the conductive structure being had excellent performance.
The specific steps of the step 1 are as follows:
Master tooling required for choosing then is cast on master tooling then to the processing of PDMS liquid draw vacuum, and
To PDMS liquid curing；After PDMS is fully cured, PDMS is separated with master tooling, is obtained by the method for taking " open-type " to demould
To with master mold lamps structure on the contrary, with reeded PDMS soft mold.
The specific steps of the step 2 are as follows:
Choose suitable liquid conductive material and scraper, between scraper and PDMS soft mold apply voltage be 100~
Conductive material is filled into the groove of PDMS soft mold by the electric field of 500V using the method for blade coating, is made to be full of in groove and be led
Electric material；After filling, PDMS soft mold is placed in 60~120 DEG C of environment, to the conductive material precuring in groove.
The specific steps of the step 3 are as follows:
Target substrate is taken, after cleaning to its surface, coats one layer of UV on its surface by way of spin coating or blade coating
Curing materials.
The specific steps of the step 4 are as follows:
The PDMS soft mold that will be filled with conductive structure is covered on UV curing materials, and is carried out to UV curing materials ultraviolet
Exposure, with the curing molding of UV curing materials, the adhesion strength that surface generates " can draw the conductive structure in PDMS soft mold
Drag " arrive UV curing materials surface；After solidification, PDMS soft mold is separated with target substrate, is obtained with conductive structure
Target substrate.
The specific steps of the step 5 are as follows:
It is further sintered post-processing to target substrate, for different transfer conductive material properties and transfers target substrate
Difference, temperature and the mode for being sintered post-processing are different, and purpose is to improve comprehensive performance (electric conductivity, the adhesive force of conductive structure
Deng).
With reference to the accompanying drawing and specific embodiment the present invention is described further.
In following embodiment, the formula of used photoresist (self-control) are as follows: triethylene glycol divinyl ether, content 30%；Light
Initiator 6992, content 6%；3,4- epoxycyclohexyl-methyl -3,4- epoxycyclohexyl formic acid esters, content 60%；Bisphenol-A epoxy
Acrylate, content 4%.2h is stirred after the above components mixing up to photoresist.
Embodiment 1
Master tooling needed for the present embodiment manufactures micro- transfer using electric field driven melting jet deposition 3D printing technique, first will
Micro-structure in master tooling is transferred on PDMS soft mold, wherein micro-structure is PMMA wire grid construction；Then in PDMS soft mold
Conductive silver paste (containing glass frit component) is filled in groove and to its precuring；Common glass substrate is chosen later, is assisted using UV
Conductive structure is transferred on common glass substrate by transfer technique；Post-processing finally is sintered to conductive structure.
Concrete technology flow process are as follows: PDMS soft mold manufactures, blade coating conductive material, coating UV curing materials, UV auxiliary transfer,
Post-processing.As shown in Fig. 1 (a)~(e).
Specific step is as follows:
The manufacture of step 1:PDMS soft mold.
Step 1-1: taking 3D printing master tooling, is thereon PMMA wire grid construction, active graphical having a size of 100mm × 100mm
Region area is 80mm × 80mm, and 10 μm of line width, 100 μm of the period, 10 μm of height is applied by the way of casting on master tooling surface
Cover the PDMS liquid that a layer thickness is about 1.5mm, wherein PDMS liquid is the Sylgard 184 of Dow Corning company；
Step 1-2: the master tooling for being coated with PDMS soft mold, which is placed in heater box, to be solidified, wherein curing time is
15min, solidification temperature are 90 DEG C, form PDMS；
Step 1-3: using the release method of " open-type ", cured PDMS is separated with master tooling, it is soft to obtain PDMS
Mold.
Step 2: blade coating conductive material.
Step 2-1: choosing nano-silver conductive slurry and scraper, by way of blade coating, take suitable blade coating angle and
Speed is scratched, and applies the electric field that voltage is 300V between scraper and PDMS soft mold, by the conductive silver containing glass frit component
Slurry (Xin Luyi SS-8060) is filled into PDMS soft mold groove, due to electrowetting effect, can guarantee to fill up conduction in groove
Silver paste；
Step 2-2: after having filled conductive silver paste, PDMS soft mold being placed in heating plate, in PDMS soft mold groove
Conductive silver paste precuring, vapor away the solvent in groove, form conductive silver wire in groove, wherein curing time is
10min, solidification temperature are 120 DEG C.
Step 3: coating UV curing materials.
It takes having a size of 100mm × 100mm, is target substrate with a thickness of the simple glass of 3.5mm, to its surface clean mistake
Afterwards, a layer photoresist in spin coating, wherein photoresist is cationic.
Step 4:UV auxiliary transfer.
Step 4-1: the PDMS soft mold that will be filled with conductive silver wire covers on common glass substrate, makes PDMS soft mold
It is come into full contact with glass surface, guarantee does not generate bubble between the two；
Step 4-2: the glass substrate that will be covered with PDMS soft mold, which is placed in UV curing, carries out uv-exposure, the time
1min makes photoresist curing molding, during photoresist is cured, photoresist to the adhesion strength of conductive silver wire greatly and PDMS
Soft mold and the adhesion strength to conductive silver wire, so that conductive silver wire " pulling " is arrived photoresist surface；
Step 4-3: the method for taking " open-type " to demould separates PDMS soft mold with glass substrate, obtains having and lead
The glass of electric silver wire realizes the transfer of conductive silver wire.
Step 5: post-processing.
It being placed in 650 DEG C of environment with the glass of conductive silver wire, time 3min, photoresist can be decomposed gasification,
Conductive silver wire obtains further sintering simultaneously, finally can get saturating with large ratio of height to width (depth-width ratio 1) conductive silver wire
Bright glass, and conductive silver wire at this time and substrate of glass have stronger adhesive force (using 3M adhesive tape detection conductive silver wire and glass
The adhesive force of glass substrate, contact grade reach 4B).Fig. 1 (f) is the large ratio of height to width conductive silver wire being finally transferred in substrate of glass
Schematic diagram.
Embodiment 2
Master tooling of the present embodiment using the silicon mould of electron beam lithography manufacture as micro- transfer, first will be on silicon mould
Micro-structure is transferred on PDMS soft mold, wherein micro-structure is network；Then, it fills and receives in PDMS soft mold groove
Rice silver conductive ink and to its precuring；Later, choosing PET film is target substrate, will be conductive using UV auxiliary transfer technique
Structure is transferred in PET film；Finally conductive structure is post-processed.
Concrete technology flow process are as follows: PDMS soft mold manufactures, blade coating conductive material, coating UV curing materials, UV auxiliary transfer,
Post-processing.As shown in Fig. 2 (a)~(e).
Specific step is as follows:
The manufacture of step 1:PDMS soft mold.
Step 1-1: taking 4 inch wafer silicon moulds, is thereon network, active graphical region area be 60mm ×
60mm, 2 μm of line width, 150 μm of the period, 2 μm of height, coating a layer thickness by the way of casting on master tooling surface is about
The PDMS liquid of 1.5mm, wherein PDMS liquid is the Sylgard 184 of Dow Corning company；
Step 1-2: the master tooling for being coated with PDMS soft mold, which is placed in heater box, to be solidified, wherein curing time is
20min, solidification temperature are 80 DEG C, form PDMS；
Step 1-3: using the release method of " open-type ", cured PDMS is separated with master tooling, it is soft to obtain PDMS
Mold.
Step 2: blade coating conductive material.
Step 2-1: nano silver conductive ink (commercial product, for the ink jet printing nanometer of Daicel company production is chosen
Silver ink water) and scraper takes suitable blade coating angle and blade coating speed, and in scraper and PDMS soft mode by way of blade coating
Apply the electric field that voltage is 200V between tool, nano silver conductive ink is filled into PDMS soft mold groove, due to electrowetting
Effect can guarantee to fill up nano silver conductive ink in groove；
Step 2-2: after having filled nano silver conductive ink, PDMS soft mold is placed in heating plate, to PDMS soft mold
Nano silver conductive ink precuring in groove vapors away the solvent of the inside, and conductive silver grid is formed in groove, wherein
Curing time is 10min, and solidification temperature is 100 DEG C.
Step 3: coating UV curing materials.
Take having a size of 100mm × 100mm, be target substrate with a thickness of 100 μm of PET films, to its surface clean after,
A layer photoresist in spin coating, wherein photoresist is cationic.
Step 4:UV auxiliary transfer.
Step 4-1: the PDMS soft mold that will be filled with conductive silver grid covers in PET film, make PDMS soft mold with
PET film surface comes into full contact with, and guarantee does not generate bubble between the two；
Step 4-2: the PET film that will be covered with PDMS soft mold, which is placed in UV curing, carries out uv-exposure, the time
1min makes photoresist curing molding, during photoresist is cured, photoresist to the adhesion strength of conductive silver grid greatly and PDMS
Soft mold and the adhesion strength to conductive silver grid, so that conductive silver grid " pulling " is arrived photoresist surface；
Step 4-3: the method for taking " open-type " to demould separates PDMS soft mold with PET film, obtains with conduction
The PET film of silver-colored grid realizes the transfer of conductive silver grid.
Step 5: post-processing.
PET film with conductive silver grid is placed on 30min in 130 DEG C of environment, conductive structure is further burnt
After knot, the PET fexible film with large ratio of height to width (depth-width ratio 1) conductive grid can be obtained, detected and adhered to using 3M adhesive tape
Power, contact grade can achieve 5B.
Embodiment 3
Master tooling needed for the present embodiment manufactures micro- transfer using electric field driven melting jet deposition 3D printing technique, first will
Micro-structure is transferred on PDMS soft mold, wherein micro-structure is PCL network；Then, it is filled in PDMS soft mold groove
Silver nanowires liquid and to its precuring；Later, PET film is chosen as substrate, is tied conduction using UV auxiliary transfer technique
Structure is transferred in PET film；Finally, further being post-processed to conductive structure.
Concrete technology flow process are as follows: PDMS soft mold manufactures, blade coating conductive material, coating UV curing materials, UV auxiliary transfer,
Post-processing.As shown in Fig. 2 (a)~(e).
Specific step is as follows:
The manufacture of step 1:PDMS soft mold.
Step 1-1: taking 3D printing master tooling, is thereon PCL network, active graphical having a size of 200mm × 200mm
Region area is 160mm × 160mm, and 6 μm of line width, 150 μm of the period, 4 μm of height is applied by the way of casting on master tooling surface
Cover the PDMS liquid that a layer thickness is about 1.5mm, wherein PDMS liquid is the Sylgard 184 of Dow Corning company；
Step 1-2: the master tooling for being coated with PDMS soft mold, which is placed in heater box, to be solidified, wherein curing time is
12h, solidification temperature are 35 DEG C, form PDMS；
Step 1-3: using the release method of " open-type ", cured PDMS is separated with master tooling, it is soft to obtain PDMS
Mold.
Step 2: blade coating conductive material.
Step 2-1: choosing silver nanowires liquid and scraper, by way of blade coating, takes suitable blade coating angle and scrapes
Speed is applied, and applies the electric field that voltage is 200V between scraper and PDMS soft mold, by silver nanowires liquid (sharp Tener rice
LN-SND-30 it) is filled into PDMS soft mold groove, due to electrowetting effect, can guarantee to fill up silver nanowires liquid in groove
Body；
Step 2-2: after having filled silver nanowires liquid, PDMS soft mold being placed in heating plate, recessed to PDMS soft mold
Silver nanowires liquid precuring in slot vapors away the solvent of the inside, and conductive silver grid is formed in groove, wherein solidification
Time is 5min, and solidification temperature is 60 DEG C.
Step 3: coating UV curing materials.
Take having a size of 200mm × 200mm, be target substrate with a thickness of 150 μm of PET films, to its surface clean after,
A layer photoresist in spin coating, wherein photoresist is cationic.
Step 4:UV auxiliary transfer.
Step 4-1: the PDMS soft mold that will be filled with conductive silver grid covers in PET film, make PDMS soft mold with
PET film surface comes into full contact with, and guarantee does not generate bubble between the two；
Step 4-2: the PET film that will be covered with PDMS soft mold, which is placed in UV curing, carries out uv-exposure, the time
1min makes photoresist curing molding, during photoresist is cured, photoresist to the adhesion strength of conductive silver grid greatly and PDMS
Soft mold and the adhesion strength to conductive silver grid, so that conductive silver grid " pulling " is arrived photoresist surface；
Step 4-3: the method for taking " open-type " to demould separates PDMS soft mold with PET film, obtains with conduction
The PET film of silver-colored grid realizes the transfer of conductive silver grid.
Step 5: post-processing.
PET film with conductive silver grid is placed on 10min in 80 DEG C of environment, can be obtained with large ratio of height to width
The PET fexible film of (depth-width ratio 0.67) conductive silver grid detects adhesive force using 3M adhesive tape, and contact grade can achieve
5B。
Embodiment 4
Master tooling of the present embodiment using the silicon mould of electron beam lithography manufacture as micro- transfer, first shifts micro-structure
To PDMS soft mold, wherein micro-structure is optical grating construction；Then, nano-silver conductive ink is filled in PDMS soft mold groove
Water and to its precuring；Later, choosing simple glass is target substrate, coats a layer photoresist, assists transfer technique using UV
Conductive structure is transferred on simple glass；Finally, further being post-processed to conductive structure.
The detailed process of manufacture are as follows: the manufacture of PDMS soft mold, blade coating conductive material, coating UV curing materials, UV auxiliary turn
Print, post-processing.As shown in Fig. 1 (a)~(e).
Specific step is as follows:
The manufacture of step 1:PDMS soft mold.
Step 1-1: taking 4 inch wafer silicon moulds, is thereon optical grating construction, active graphical region area be 60mm ×
60mm, 2 μm of line width, 100 μm of the period, 2 μm of height, coating a layer thickness by the way of casting on master tooling surface is about
The PDMS liquid of 1.5mm, wherein PDMS liquid is the Sylgard 184 of Dow Corning company；
Step 1-2: the master tooling for being coated with PDMS soft mold, which is placed in heater box, to be solidified, wherein curing time is
15min, solidification temperature are 90 DEG C, form PDMS；
Step 1-3: using the release method of " open-type ", cured PDMS is separated with master tooling, it is soft to obtain PDMS
Mold.
Step 2: blade coating conductive material.
Step 2-1: choosing nano silver conductive ink and scraper, by way of blade coating, take suitable blade coating angle and
Speed is scratched, and applies the electric field that voltage is 300V between scraper and PDMS soft mold, by nano silver conductive ink (commercially available production
Product, for the ink jet printing silver ink of Daicel company production) it is filled into PDMS soft mold groove, since electrowetting is imitated
It answers, can guarantee to fill up nano silver conductive ink in groove；
Step 2-2: after having filled nano silver conductive ink, PDMS soft mold is placed in heating plate, to PDMS soft mold
Nano silver conductive ink precuring in groove vapors away the solvent of the inside, and conductive silver grid is formed in groove, wherein
Curing time is 10min, and solidification temperature is 100 DEG C.
Step 3: coating UV curing materials.
It takes having a size of 100mm × 100mm, is target substrate with a thickness of the simple glass of 3.5mm, to its surface clean mistake
Afterwards, a layer photoresist in spin coating, wherein photoresist is cationic.
Step 4:UV auxiliary transfer.
Step 4-1: the PDMS soft mold that will be filled with conductive silver grid covers on glass, makes PDMS soft mold and glass
Surface comes into full contact with, and guarantee does not generate bubble between the two；
Step 4-2: the PET film that will be covered with PDMS soft mold, which is placed in UV curing, carries out uv-exposure, the time
1min makes photoresist curing molding, during photoresist is cured, photoresist to the adhesion strength of conductive silver grid greatly and PDMS
Soft mold and the adhesion strength to conductive silver grid, so that conductive silver grid " pulling " is arrived photoresist surface；
Step 4-3: the method for taking " open-type " to demould separates PDMS soft mold with glass, obtains with conductive silver
The glass of grid realizes the transfer of conductive silver grid.
Step 5: post-processing.
It will be placed in 650 DEG C of environment with the glass of conductive silver grid, time 3min, photoresist can be decomposed gas
Change, finally can get the transparent glass with large ratio of height to width (depth-width ratio 1) conductive silver grid, conductive silver is detected using 3M adhesive tape
The adhesive force of grid and substrate of glass, contact grade reach 4B.Fig. 1 (f) is the large ratio of height to width being finally transferred in substrate of glass
Conductive silver grid schematic diagram.
Embodiment 5
Master tooling needed for the present embodiment manufactures micro- transfer using electric field driven melting jet deposition 3D printing technique, first will
Micro-structure is transferred on PDMS soft mold, wherein micro-structure is PMMA wire grid construction；Then, it is filled out in PDMS soft mold groove
The positive silver-colored conductive silver paste of solar panel is filled, and to its precuring；Later, choosing silicon wafer is substrate, coats a layer photoresist,
Conductive structure is transferred on silicon wafer using UV auxiliary transfer technique；Finally, further being post-processed to conductive structure.This
Embodiment is particularly suitable for the manufacture of front gate line electrode on solar panel.
Concrete technology flow process are as follows: PDMS soft mold manufactures, blade coating conductive material, coating UV curing materials, UV auxiliary transfer,
Post-processing.As shown in Fig. 1 (a)~(e).
Specific step is as follows:
The manufacture of step 1:PDMS soft mold.
Step 1-1: taking 3D printing master tooling, is thereon PMMA optical grating construction, active graphical having a size of 200mm × 200mm
Region area is 150mm × 150mm, and 8 μm of line width, 150 μm of the period, 8 μm of height is applied by the way of casting on master tooling surface
Cover the PDMS liquid that a layer thickness is about 1.5mm, wherein PDMS liquid is the Sylgard 184 of Dow Corning company；
Step 1-2: the master tooling for being coated with PDMS soft mold, which is placed in heater box, to be solidified, wherein curing time is
20min, solidification temperature are 90 DEG C, form PDMS；
Step 1-3: using the release method of " open-type ", cured PDMS is separated with master tooling, it is soft to obtain PDMS
Mold.
Step 2: blade coating conductive material.
Step 2-1: choosing solar panel positive silver-colored conductive silver paste (Du Pont MD2SP (PV20A)) and scraper, with scraping
The mode of painting takes suitable blade coating angle and blade coating speed, and applying voltage between scraper and PDMS soft mold is 200V
Electric field, positive silver-colored conductive silver paste is filled into PDMS soft mold groove, due to electrowetting effect, can guarantee to fill up in groove
Positive silver conductive silver paste；
Step 2-2: after having filled positive silver-colored conductive silver paste, PDMS soft mold being placed in heating plate, recessed to PDMS soft mold
Positive silver-colored conductive silver paste precuring in slot, vapors away the solvent of the inside, forms conductive silver wire in groove, wherein when solidification
Between be 10min, solidification temperature be 120 DEG C.
Step 3: coating UV curing materials.
It takes having a size of 200mm × 200mm, is target substrate with a thickness of 650 μm of silicon wafers, after its surface clean, rotation
Coat a layer photoresist, wherein photoresist is cationic.
Step 4:UV auxiliary transfer.
Step 4-1: the PDMS soft mold that will be filled with conductive silver wire covers on silicon wafer, makes PDMS soft mold and glass table
Face comes into full contact with, and guarantee does not generate bubble between the two；
Step 4-2: the glass substrate that will be covered with PDMS soft mold, which is placed in UV curing, carries out uv-exposure, the time
1min makes photoresist curing molding, during photoresist is cured, photoresist to the adhesion strength of conductive silver wire greatly and PDMS
Soft mold and the adhesion strength to conductive silver wire, so that conductive silver wire " pulling " is arrived photoresist surface；
Step 4-3: the method for taking " open-type " to demould separates PDMS soft mold with silicon wafer, obtains with conductive silver
The silicon wafer of line realizes the transfer of conductive silver wire.
Step 5: post-processing.
It being placed in 650 DEG C of environment with the silicon wafer of conductive silver wire, time 3min, photoresist can be decomposed gasification,
It finally can get the positive silver-colored conductive silver wire that depth-width ratio is 1 on silicon wafer, meanwhile, have between positive silver conductive silver wire and silicon wafer higher
Adhesive force (using 3M adhesive tape detection conductive silver wire and substrate adhesive force, contact grade reach 4B).Fig. 1 (f) is final turns
Print to the positive silver-colored conductive silver wire schematic diagram of large ratio of height to width (depth-width ratio 1) in substrate of glass.
Finally it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not limited to this hair
It is bright, although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still
It can modify to technical solution documented by previous embodiment, or part is equivalently replaced.It is all in this hair
Within bright spirit and principle, any modification, equivalent replacement, improvement and so on should be included in protection scope of the present invention
Within.Above-mentioned, although the foregoing specific embodiments of the present invention is described with reference to the accompanying drawings, not to the scope of the present invention
Limitation, those skilled in the art should understand that, based on the technical solutions of the present invention, those skilled in the art are not required to
Make the creative labor the various modifications or changes that can be made still within protection scope of the present invention.
Claims (10)
1. a kind of method of large ratio of height to width microstructure transfer printing characterized by comprising
Step 1): template of the preparation with raised micro nano structure, as master tooling, to the poly- diformazan of master tooling upper liquid
Radical siloxane PDMS is turned over and is made with reeded PDMS work mold；
Step 2): the template of filling electrocondution slurry is made in groove filling liquid conductive material, solidification to PDMS work mold；
Step 3): one layer of UV curing materials are coated in target substrate；
Step 4): the template for filling electrocondution slurry is bonded with UV curing material layer, will be solidified in the template for filling electrocondution slurry
Electrocondution slurry be transferred in target substrate, sintering to get.
2. the method as described in claim 1, which is characterized in that the production method of the template with raised micro nano structure
For electron beam lithography, extreme ultraviolet photolithographic or 3D printing technique.
3. the method as described in claim 1, which is characterized in that it is described protrusion micro nano structure be wire grid construction, network,
Lattice array or irregular pattern.
4. the method as described in claim 1, which is characterized in that the liquid conductive material is metal nanometer line, graphene, leads
At least one of electric ink, nano-silver conductive slurry or Nanometer Copper electrocondution slurry.
5. the method as described in claim 1, which is characterized in that the target substrate is simple glass, silicon wafer, poly- terephthaldehyde
One of sour glycol ester PET or polyimides PI.
6. the method as described in claim 1, which is characterized in that in step 1), turn over the specific steps of system are as follows: taken out to PDMS liquid
It is vacuum-treated, is then cast on master tooling, and to PDMS liquid curing；After PDMS is fully cured, takes and " open
The method of formula " demoulding, PDMS is separated with master tooling, is obtained with master mold lamps structure on the contrary, with reeded PDMS soft mold.
7. the method as described in claim 1, which is characterized in that in step 4), the specific steps of transfer are as follows: to UV curing materials
Solidified；After solidification, PDMS soft mold is separated with target substrate, obtains the target substrate for having conductive structure.
8. the method as described in claim 1, which is characterized in that under the conditions of electrowetting, filled out to the groove of PDMS work mold
Fill electrically conductive liquid material.
9. the large ratio of height to width micro structural component of the described in any item method preparations of claim 1-8.
10. large ratio of height to width micro structural component as claimed in claim 9 is to prepare solar panel, miniature LED, compliant conductive thin
Application in film, sensor, biological devices or wearable electronic device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811353489.5A CN109483780A (en) | 2018-11-14 | 2018-11-14 | A kind of large ratio of height to width microstructure transfer printing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811353489.5A CN109483780A (en) | 2018-11-14 | 2018-11-14 | A kind of large ratio of height to width microstructure transfer printing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109483780A true CN109483780A (en) | 2019-03-19 |
Family
ID=65695910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811353489.5A Pending CN109483780A (en) | 2018-11-14 | 2018-11-14 | A kind of large ratio of height to width microstructure transfer printing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109483780A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110021462A (en) * | 2019-05-17 | 2019-07-16 | 青岛五维智造科技有限公司 | A kind of manufacturing method and its application of embedded metal mesh flexible transparent electrode |
| CN110165366A (en) * | 2019-04-22 | 2019-08-23 | 浙江大学 | A kind of graphene antenna of thermal transfer and its preparation method and application |
| CN110631715A (en) * | 2019-09-10 | 2019-12-31 | 中国科学院上海技术物理研究所 | Focal plane detector suitable for curved surface imaging and preparation method thereof |
| CN111987175A (en) * | 2020-09-01 | 2020-11-24 | 深圳纳弘熠岦光学科技有限公司 | Transfer printing method of solar cell grid line and solar cell |
| CN112018197A (en) * | 2020-09-01 | 2020-12-01 | 深圳纳弘熠岦光学科技有限公司 | Method and apparatus for producing solar electrode mold, and computer-readable storage medium |
| CN112060750A (en) * | 2020-09-01 | 2020-12-11 | 深圳纳弘熠岦光学科技有限公司 | Method for constructing electrode grid line of solar cell |
| CN112071921A (en) * | 2020-09-01 | 2020-12-11 | 深圳纳弘熠岦光学科技有限公司 | Grid line preparation method |
| CN112216807A (en) * | 2020-09-29 | 2021-01-12 | 吉林大学 | Method for preparing highly-ordered flexible silver nanowire electrode by utilizing capillary force and application |
| CN112466800A (en) * | 2021-01-25 | 2021-03-09 | 武汉大学 | Electrowetting transfer printing head, transfer printing head array and micro LED (light emitting diode) mass transfer method |
| CN112701230A (en) * | 2020-12-23 | 2021-04-23 | 福州大学 | Method for preparing perovskite QLED electronic transmission layer by transferring ZnO nano film |
| CN112768141A (en) * | 2020-12-31 | 2021-05-07 | 西安交通大学 | Method for preparing flexible transparent conductive film based on micro-stereolithography technology |
| CN113927896A (en) * | 2021-09-08 | 2022-01-14 | 兰州大学 | PDMS microneedle secondary motherboard transfer process based on 3D printing technology |
| CN114156349A (en) * | 2021-11-08 | 2022-03-08 | 苏州诺菲纳米科技有限公司 | Solar cell and manufacturing method thereof |
| CN114302568A (en) * | 2021-12-29 | 2022-04-08 | 苏州创印电子科技有限公司 | Preparation method of conductive circuit |
| CN114953797A (en) * | 2022-06-22 | 2022-08-30 | 合肥工业大学 | Anti-distortion transfer printing method and transfer printing device for micro-nano structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101101441A (en) * | 2007-08-07 | 2008-01-09 | 山东大学 | Large area periodic array three-dimensional microstructure preparation method |
| CN105926014A (en) * | 2016-05-05 | 2016-09-07 | 中国科学院上海高等研究院 | Preparation method of large-area highly-ordered porous oxide films based on nano soft embossing |
-
2018
- 2018-11-14 CN CN201811353489.5A patent/CN109483780A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101101441A (en) * | 2007-08-07 | 2008-01-09 | 山东大学 | Large area periodic array three-dimensional microstructure preparation method |
| CN105926014A (en) * | 2016-05-05 | 2016-09-07 | 中国科学院上海高等研究院 | Preparation method of large-area highly-ordered porous oxide films based on nano soft embossing |
Non-Patent Citations (2)
| Title |
|---|
| 姜英杰: "柔性金属微纳结构转印机理及方法研究", 《中国优秀博硕士学位论文全文数据库 (硕士) 工程科技I辑》 * |
| 郑丁杰: "基于聚氨酯丙烯酸酯(PUA)的微纳米转印技术研究", 《中国优秀博硕士学位论文全文数据库 (硕士) 工程科技I辑》 * |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110165366B (en) * | 2019-04-22 | 2021-02-19 | 浙江大学 | Thermal transfer printing graphene antenna and preparation method and application thereof |
| CN110165366A (en) * | 2019-04-22 | 2019-08-23 | 浙江大学 | A kind of graphene antenna of thermal transfer and its preparation method and application |
| CN110021462B (en) * | 2019-05-17 | 2020-05-05 | 青岛五维智造科技有限公司 | Manufacturing method and application of embedded metal grid flexible transparent electrode |
| CN110021462A (en) * | 2019-05-17 | 2019-07-16 | 青岛五维智造科技有限公司 | A kind of manufacturing method and its application of embedded metal mesh flexible transparent electrode |
| CN110631715A (en) * | 2019-09-10 | 2019-12-31 | 中国科学院上海技术物理研究所 | Focal plane detector suitable for curved surface imaging and preparation method thereof |
| CN112060750B (en) * | 2020-09-01 | 2022-03-11 | 深圳纳弘熠岦光学科技有限公司 | Method for constructing electrode grid line of solar cell |
| CN111987175A (en) * | 2020-09-01 | 2020-11-24 | 深圳纳弘熠岦光学科技有限公司 | Transfer printing method of solar cell grid line and solar cell |
| CN112071921A (en) * | 2020-09-01 | 2020-12-11 | 深圳纳弘熠岦光学科技有限公司 | Grid line preparation method |
| CN112018197B (en) * | 2020-09-01 | 2022-06-03 | 深圳纳弘熠岦光学科技有限公司 | Method and apparatus for producing solar electrode mold, and computer-readable storage medium |
| CN112018197A (en) * | 2020-09-01 | 2020-12-01 | 深圳纳弘熠岦光学科技有限公司 | Method and apparatus for producing solar electrode mold, and computer-readable storage medium |
| CN112060750A (en) * | 2020-09-01 | 2020-12-11 | 深圳纳弘熠岦光学科技有限公司 | Method for constructing electrode grid line of solar cell |
| CN112216807A (en) * | 2020-09-29 | 2021-01-12 | 吉林大学 | Method for preparing highly-ordered flexible silver nanowire electrode by utilizing capillary force and application |
| CN112701230A (en) * | 2020-12-23 | 2021-04-23 | 福州大学 | Method for preparing perovskite QLED electronic transmission layer by transferring ZnO nano film |
| CN112768141A (en) * | 2020-12-31 | 2021-05-07 | 西安交通大学 | Method for preparing flexible transparent conductive film based on micro-stereolithography technology |
| CN112466800A (en) * | 2021-01-25 | 2021-03-09 | 武汉大学 | Electrowetting transfer printing head, transfer printing head array and micro LED (light emitting diode) mass transfer method |
| CN112466800B (en) * | 2021-01-25 | 2024-02-09 | 武汉大学 | Electrowetting transfer printing head, transfer printing head array and micro-LED mass transfer method |
| CN113927896A (en) * | 2021-09-08 | 2022-01-14 | 兰州大学 | PDMS microneedle secondary motherboard transfer process based on 3D printing technology |
| CN114156349A (en) * | 2021-11-08 | 2022-03-08 | 苏州诺菲纳米科技有限公司 | Solar cell and manufacturing method thereof |
| CN114302568A (en) * | 2021-12-29 | 2022-04-08 | 苏州创印电子科技有限公司 | Preparation method of conductive circuit |
| CN114953797A (en) * | 2022-06-22 | 2022-08-30 | 合肥工业大学 | Anti-distortion transfer printing method and transfer printing device for micro-nano structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109483780A (en) | A kind of large ratio of height to width microstructure transfer printing method | |
| CN108831627B (en) | Method based on 3D printing and liquid bridge transfer manufacture large-area transparent electrode | |
| CN109532067B (en) | Manufacturing method of high-performance flexible electric heating film | |
| CN104849957B (en) | A kind of SU-8 glue electrohydraulic dynamic jet stream nozzle needle manufacturing methods with nanoscale channel | |
| CN101446762B (en) | Micro-complex type method for inducing electric field under the restrict of non-contact moulding board | |
| CN112927862B (en) | High-performance large-area flexible transparent electrode and preparation method and application thereof | |
| CN102145875B (en) | Preparation method of polydimethylsiloxane micro-nanofluidic chip | |
| CN101823690B (en) | Manufacturing method of SU-8 nano fluid system | |
| CN102566262B (en) | Device and method suitable for carrying out wafer-level nano imprinting on uneven substrate | |
| CN109219174B (en) | Manufacturing method of transparent electric heating glass with high light transmittance and low sheet resistance | |
| CN102012633B (en) | Method for making self-supporting structure of nano fluid system based on SU-8 photoresist | |
| CN110021462A (en) | A kind of manufacturing method and its application of embedded metal mesh flexible transparent electrode | |
| CN103172019B (en) | A kind of preparation technology of dry adhesion micro-nano compound two-stage incline structure | |
| CN106448825A (en) | Graphical fine electroconductive film and production method thereof | |
| US11926524B1 (en) | Methods, apparatus, and systems for fabricating solution-based conductive 2D and 3D electronic circuits | |
| CN102897709B (en) | Manufacturing method of low-cost micronano integrated structure | |
| CN107623459A (en) | Friction nanometer power generator frictional layer material surface roughening agrees with structure and preparation method thereof | |
| CN106298070A (en) | A kind of preparation method of patterned conductive thin film | |
| CN101837951A (en) | Apparatus and method for graphically producing nano structures by way of electrode induction and microwave curing | |
| Zhu et al. | Fabricating transparent electrodes by combined electric-field-driven fusion direct printing and the liquid bridge transfer method | |
| CN105807557B (en) | A kind of high-resolution flexible compound mask plate and preparation method thereof for optical exposure | |
| CN105814490A (en) | Pattern formed body | |
| CN102243436B (en) | Electric-field-induced micro-compounding method under geometrical restraint | |
| JP2011005768A (en) | Master plate used for manufacturing of stamp for micro contact print, method of manufacturing the same, stamp for micro contact print, method of manufacturing of the same and pattern forming method using stamp for micro contact print | |
| CN104122747A (en) | Electroosmosis driving nanoimprint device and working method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190319 |