CN109466155A - A method of it improving rigid-flex combined board cover film and is bonded efficiency - Google Patents
A method of it improving rigid-flex combined board cover film and is bonded efficiency Download PDFInfo
- Publication number
- CN109466155A CN109466155A CN201811287454.6A CN201811287454A CN109466155A CN 109466155 A CN109466155 A CN 109466155A CN 201811287454 A CN201811287454 A CN 201811287454A CN 109466155 A CN109466155 A CN 109466155A
- Authority
- CN
- China
- Prior art keywords
- layer
- cover
- film
- viscous
- release
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
- B32B2037/268—Release layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/04—Punching, slitting or perforating
- B32B2038/045—Slitting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The present invention provides a kind of method of raising rigid-flex combined board cover film fitting efficiency comprising following steps: S1, provides protective film comprising viscous layer and release layer, viscous layer are pasted on release layer, the peelable viscous layer of release layer；S2, cover film is provided comprising cover layer and release layer, cover layer are pasted on release layer, the peelable cover layer of release layer；S3, the release layer of protective film is torn, exposes the adhesive surface of viscous layer, cover film and the adhesive surface are bonded；S4, the release paper for tearing cover film, the covering film pattern that cutting needs from the face PI of cover layer, only cut through cover film, do not cut through as the viscous layer for marrying again template；Unwanted cover layer is torn before S5, contraposition；S6, the pre-designed alignment system of the viscous layer of protective film and flex plate is realized into contraposition, realizes that cover layer is married again in flakes in the flexure region for needing to paste epiphragma；Tearing after S7, fast pressure can be realized whole plate as the viscous layer for marrying again template and pastes epiphragma.
Description
Technical field
The invention belongs to the processing and manufacturing fields of printed circuit board more particularly to a kind of raising rigid-flex combined board cover film to paste
Close the applying method of efficiency.
Background technique
Rigid-flex combined board has merged the advantages of flex plate and rigid plate and the whole body, deflection, simplifies the assembling of 3D solid.It is close several
Nian Lai, the market by photovoltaics such as smart phone and tablet computers push, and rigid-flex combined board increase of production speed is very fast.
With the design requirement of end product, rigid-flex combined board product structure is constantly changing, and difficulty of processing is increasing.
Most of producer, in rigid-flex combined board production, only exists in industry in order to guarantee rigid-flex combined board unfailing performance
Pure flexure region fits over film, remaining rigid-flexible bond area is not pasted.Such part fits over the processing technology of film, covering
When film is smaller, it can not be produced using false sticker, it can only be using artificial single fitting.When rigid-flex combined board flexure region need paste compared with
More cover films, and when cover film size is smaller, manual pad pasting inefficiency, and be easy to appear cover film and paste inclined problem.
Current manufacture craft is illustrated with rigid-flex combined board flexure region single-sided lamination cover film below:
As shown in Figure 1 to Figure 3, cover film is made of cover film 1+ release paper 2, is needed when use from covering film surface cutting
Figure does not cut through release paper 2 while cutting through cover film 1；The cover film 1 of needs is torn one by one, then manual assembly exists
The corresponding region for fitting over film on flex plate 3.
Inventor counts according to practical condition, when the rigid-flex board that flexure region is smaller, shorter fits over film
20-30 minutes patch 1PNL plates are needed, production efficiency is extremely low, and artificial fitting easily patch partially, not can guarantee quality requirements.
For status, inventor finds the new rigid-flex combined board of one kind and fits over film production technique, can by the technique
To realize 2 minutes patch 1PNL plates, cost of manufacture is greatly reduced, production yield is effectively promoted.
Summary of the invention
The purpose of the present invention is be achieved through the following technical solutions:
A kind of applying method improving rigid-flex combined board cover film fitting efficiency comprising following steps:
S1, protective film is provided comprising viscous layer and release layer, viscous layer are pasted on release layer, and release layer is peelable
Viscous layer；
S2, cover film is provided comprising cover layer and release layer, cover layer are pasted on release layer, and release layer can
Tear off cover layer；
S3, the release layer of the protective film is torn, exposes the adhesive surface of the viscous layer, by the cover film with it is described
The adhesive surface of viscous layer bonds, wherein the adhesive surface of the cover layer and the viscous layer bonds；
S4, the release paper for tearing the cover film, the covering film pattern that cutting needs from the face PI of cover layer, only cut through
Cover film is not cut through as the viscous layer for marrying again template；
Unwanted cover layer is torn before S5, contraposition；
S6, the pre-designed alignment system of the viscous layer and flex plate of the protective film is realized into contraposition, realized
Cover layer is married again in flakes in the flexure region for needing to paste epiphragma；
Tearing after S7, fast pressure can be realized whole plate as the viscous layer for marrying again template and pastes epiphragma.
Preferably, the protective film is high temperature resistant protective film.
The cover layer can only be produced in the form of machine cuts cover film, cannot be swashed using laser milling side production
Fine mill side can generate carbon black, and the same windowing of heterogeneous networks is caused to have defective insulation or short-circuit risks.
Preferably, the S6 specifically: using the corresponding substrate circle of PAD at the flexible tri- wad cutter centers core plate A, B, C as institute
State PAD pairs of cover layer and flexible core plate loci, the location hole designed size of the cover layer of corresponding position and wad cutter center
Substrate circle answered etc. is big, and corresponding cutting information paper is made on cover film by the position for needing to paste epiphragma in layout.
Compared with the existing technology, the invention has the following advantages that
1, high temperature resistant protective film guarantees to improve when as long as fitting over film contraposition and transfers pair of template and plate as template is married again
Position, goes to align, easy to operate, the efficiency for fitting over film is greatly improved without cover film one by one；
2, the low technical bottleneck of traditional-handwork fitting low efficiency, yield can be thoroughly solved, mass production is realized: passing through
2 minutes patch 1PNL plates may be implemented in new process, and cost of manufacture is greatly reduced, and production yield is effectively promoted；It is easy to operate,
Efficiency improves；
3, aligning accuracy improves: this process need to only align the contraposition that all cover films in plate once can be realized, right
Position is convenient and simple, and error probability is low, and production yield is effectively promoted.
Detailed description of the invention
Fig. 1 to Fig. 3 is that the effect of each step of the applying method of rigid-flex combined board cover film described in background technique is shown
It is intended to；
Fig. 4 to Fig. 9 is that the effect of each step of the applying method of the rigid-flex combined board cover film of the embodiment of the present invention is shown
It is intended to.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that the described embodiments are merely a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other
Embodiment shall fall within the protection scope of the present invention.
The present embodiment provides a kind of applying methods of raising rigid-flex combined board cover film fitting efficiency, please refer to Fig. 4 to Fig. 9
It is shown, it realizes that whole plate pastes epiphragma by way of marrying again and connecing, uses " high temperature resistant protective film " as marrying again mould when pasting epiphragma
Plate.
S1, protective film is provided comprising viscous layer 10 and release layer 20, viscous layer 10 is pasted on release layer 20, release
20 peelable viscous layer 10 of layer, as shown in Figure 4；
S2, cover film 30 is provided comprising cover layer 31 and release layer 32, cover layer 31 are pasted on release layer 32
On, the peelable cover layer 31 of release layer 32；
S3, the release layer 20 of the protective film is torn, exposes the adhesive surface of the viscous layer 10, by the cover film 30
It being bonded with the adhesive surface of the viscous layer 10, wherein the adhesive surface of the cover layer 31 and the viscous layer 10 bonds,
As shown in Figure 5；
S4, the release layer 32 for tearing the cover film 30, the covering film pattern that cutting needs from the face PI of cover layer 31,
It is long that sword is mixed up when cutting, only cuts through cover layer 31, is not cut through as the protective film for marrying again template, i.e. viscous layer 10, such as Fig. 6 institute
Show；
Unwanted cover layer 31 is torn before S5, contraposition, as shown in Figure 7；
S6, the pre-designed alignment system of the viscous layer 10 of the protective film and flex plate 40 is realized into contraposition,
Realize that cover layer 31 is married again in the flexure region for needing to paste epiphragma in flakes, as shown in Figure 8；Specifically: with flexible core plate
A, the corresponding substrate circle of the PAD at the tri- wad cutter centers B, C is the cover layer and flexible core plate loci, and corresponding position covers
The location hole designed size of epiphragma layer substrate circle corresponding with wad cutter center PAD etc. is big, by the position for needing to paste epiphragma in layout
It sets and makes corresponding cutting information paper on cover film；
Tearing after S7, fast pressure can be realized whole plate as the viscous layer 10 for marrying again template and pastes epiphragma, such as Fig. 9 institute
Show.
The protective film is high temperature resistant protective film, material property are as follows:
1, there is certain viscosity, will not fall off easily after clinging cover film in subsequent marry again in operation.
2, ease for operation, the viscous layer after tearing release layer have certain intensity (can be regarded as having enough thickness),
Wrinkle will not be generated easily by facilitating in subsequent contraposition, also for avoiding in subsequent operation finally leading because pullling generation deformation
Cause contraposition abnormal.
3, can high temperature resistant, after too fast pressure physical property will not change, can tear easily and not have glue residua
On cover film.
4, it easily differentiates, cover film is yellow, and protective film is white clear or brown, is easy to align identification.
Select high temperature resistant Protective coatings, the parameter of specific material Details as Follows table:
The present embodiment has the advantage that
Easy to operate, efficiency improves: high temperature resistant protective film guarantees when as long as fitting over film contraposition as template is married again
The contraposition for marrying again template and plate goes to align without cover film one by one, easy to operate, and the efficiency for fitting over film mentions significantly
It is high；Aligning accuracy improves: this process need to only align the contraposition that all cover films in plate once can be realized, and contraposition facilitates letter
Single, error probability is low, and production yield is effectively promoted.
The above content is combine specific optimal technical scheme further detailed description of the invention, and it cannot be said that
Specific implementation of the invention is only limited to these instructions.For those of ordinary skill in the art to which the present invention belongs, exist
Under the premise of not departing from present inventive concept, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to of the invention
Protection scope.
Claims (4)
1. it is a kind of improve rigid-flex combined board cover film fitting efficiency method, which is characterized in that itself the following steps are included:
S1, protective film is provided comprising viscous layer and release layer, viscous layer are pasted on release layer, the peelable viscosity of release layer
Layer；
S2, cover film is provided comprising cover layer and release layer, cover layer are pasted on release layer, and release layer is peelable
Cover layer；
S3, the release layer of the protective film is torn, exposes the adhesive surface of the viscous layer, by the cover film and the viscosity
The adhesive surface bonding of layer, wherein the adhesive surface of the cover layer and the viscous layer bonds；
S4, the release paper for tearing the cover film, the covering film pattern that cutting needs from the face PI of cover layer, only cut through covering
Film is not cut through as the viscous layer for marrying again template；
Unwanted cover layer is torn before S5, contraposition；
S6, the pre-designed alignment system of the viscous layer and flex plate of the protective film is realized into contraposition, realizes covering
Film layer is married again in flakes in the flexure region for needing to paste epiphragma；
Tearing after S7, fast pressure can be realized whole plate as the viscous layer for marrying again template and pastes epiphragma.
2. the method according to claim 1, wherein the protective film is high temperature resistant protective film.
3. the method according to claim 1, wherein the cover layer can only be using machine cuts cover film
Form production, cannot be using laser milling side production.
4. the method according to claim 1, wherein the S6 specifically: with tri- wad cutters of flexible core plate A, B, C
The corresponding substrate circle of the PAD at center is the cover layer and flexible core plate loci, the positioning of the cover layer of corresponding position
Hole designed size substrate circle corresponding with wad cutter center PAD etc. is big, by needing to paste the position of epiphragma in layout on cover film
The corresponding cutting information paper of production.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811287454.6A CN109466155A (en) | 2018-10-31 | 2018-10-31 | A method of it improving rigid-flex combined board cover film and is bonded efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811287454.6A CN109466155A (en) | 2018-10-31 | 2018-10-31 | A method of it improving rigid-flex combined board cover film and is bonded efficiency |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109466155A true CN109466155A (en) | 2019-03-15 |
Family
ID=65666751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811287454.6A Pending CN109466155A (en) | 2018-10-31 | 2018-10-31 | A method of it improving rigid-flex combined board cover film and is bonded efficiency |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109466155A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110557893A (en) * | 2019-10-12 | 2019-12-10 | 珠海景旺柔性电路有限公司 | processing method for pressing thick copper thin covering film |
| CN114258207A (en) * | 2021-11-19 | 2022-03-29 | 深圳市景旺电子股份有限公司 | Cover film manufacturing method, cover film and laminating method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208801A (en) * | 2015-08-11 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Fitting method for cover film of rigid and flexible combined board |
| CN205651718U (en) * | 2016-04-07 | 2016-10-19 | 深圳市信维通信股份有限公司 | Soft board antenna protection film |
| CN106163248A (en) * | 2016-08-30 | 2016-11-23 | 深圳市玖联科技有限公司 | A kind of screened film and method of attaching thereof |
| CN108449880A (en) * | 2018-04-08 | 2018-08-24 | 珠海市凯诺微电子有限公司 | Flexible circuit board cover film applying method |
-
2018
- 2018-10-31 CN CN201811287454.6A patent/CN109466155A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105208801A (en) * | 2015-08-11 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Fitting method for cover film of rigid and flexible combined board |
| CN205651718U (en) * | 2016-04-07 | 2016-10-19 | 深圳市信维通信股份有限公司 | Soft board antenna protection film |
| CN106163248A (en) * | 2016-08-30 | 2016-11-23 | 深圳市玖联科技有限公司 | A kind of screened film and method of attaching thereof |
| CN108449880A (en) * | 2018-04-08 | 2018-08-24 | 珠海市凯诺微电子有限公司 | Flexible circuit board cover film applying method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110557893A (en) * | 2019-10-12 | 2019-12-10 | 珠海景旺柔性电路有限公司 | processing method for pressing thick copper thin covering film |
| CN114258207A (en) * | 2021-11-19 | 2022-03-29 | 深圳市景旺电子股份有限公司 | Cover film manufacturing method, cover film and laminating method thereof |
| CN114258207B (en) * | 2021-11-19 | 2023-10-13 | 深圳市景旺电子股份有限公司 | Method for manufacturing cover film, cover film and bonding method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104519682A (en) | Semi-flexible circuit board and preparation method thereof | |
| CN105813392B (en) | A kind of preparation method of flexible LED substrate | |
| CN101193505A (en) | Method for manufacturing stacking printing wiring plate | |
| CN105430884B (en) | The preparation method of flexible PCB, terminal and flexible PCB | |
| CN102238809B (en) | Flexible printed circuit (FPC) hollowed board and manufacturing method thereof | |
| CN102711392A (en) | Manufacturing method of flexible-rigid circuit board | |
| CN103402310B (en) | Soft or hard is in conjunction with printed substrate and manufacture method thereof | |
| CN104244597B (en) | A kind of preparation method of the coreless substrate of symmetrical structure | |
| CN109466155A (en) | A method of it improving rigid-flex combined board cover film and is bonded efficiency | |
| CN106793567A (en) | A kind of preparation method of rigid and flexibility plate | |
| CN102209438B (en) | High-density flexible circuit board and manufacturing method thereof | |
| CN110012605A (en) | A kind of thickness copper hollow out window FPC production method | |
| CN108323039A (en) | A kind of multi-layer flexible circuit board manufacture craft that internal layer pad is exposed | |
| CN106714456B (en) | A kind of method that high-precision numerical control V-CUT takes off lid on metal copper base | |
| CN204272493U (en) | A kind of flexible LED substrate | |
| CN107683031A (en) | A kind of processing method for solving rigid-flex combined board outer-layer circuit and making film | |
| CN108811375A (en) | A kind of processing of multi-layer PCB blind slot gasket and fill method | |
| WO2020220680A1 (en) | High-precision forming method for rigid-flex printed circuit board | |
| CN106341944B (en) | A kind of rigid-flex combined board and preparation method thereof for protecting internal layer pad | |
| WO2015025834A1 (en) | Flexible wiring base, wiring substrate, solar cell module and ic card | |
| CN101222823A (en) | Method for manufacturing multilayer printed wiring board | |
| CN107263956A (en) | A kind of electromagnetic interference EMI composites and preparation method thereof | |
| JP2008225398A (en) | Manufacturing method of liquid crystal display element | |
| CN105246265B (en) | The production method that Rigid Flex light-sensitive surface protects soft board | |
| CN209861269U (en) | Flexible circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190315 |
|
| RJ01 | Rejection of invention patent application after publication |