CN102209438B - High-density flexible circuit board and manufacturing method thereof - Google Patents
High-density flexible circuit board and manufacturing method thereof Download PDFInfo
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- CN102209438B CN102209438B CN 201010525182 CN201010525182A CN102209438B CN 102209438 B CN102209438 B CN 102209438B CN 201010525182 CN201010525182 CN 201010525182 CN 201010525182 A CN201010525182 A CN 201010525182A CN 102209438 B CN102209438 B CN 102209438B
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Abstract
The invention discloses a manufacturing method of a high-density flexible circuit board. The method comprises the following steps of: attaching a dry film to the surface of a conductive layer after a flexible substrate is cut; exposing and etching; pressing and laminating a covering film; and drilling a blind hole by using laser, depositing copper and plating copper. By using structural design and the manufacturing process, the problems of buckling of the high-density flexible circuit board, and wire break and short circuiting of the high-density flexible circuit board during circuit etching are effectively solved, and the yield of a product can be greatly increased.
Description
Technical field
The present invention relates to circuit board, particularly the structural design of high density flexible circuit board and manufacture craft.
Background technology
The technological process of producing at present high density flexible circuit double sided board in the industry is: blanking → boring → sink copper → copper facing → pad pasting, exposure → circuit etching → paste epiphragma → lamination; A production procedure does not like this have any problem at the common flexible circuitry double sided board of production; But produce high density flexible circuit double sided board very big difficulty is just arranged: one of which; What the high-density plate major part was used is very thin base material, and plate easily wrinkles in operation process; Its two because plate approach when doing heavy, copper facing upper and lower plates or produce in buckling of plate, it is not tight when pad pasting, just dry film and plate face to be fitted like this, causes the etching broken string, this also is the low main cause of high-density plate FPC production yield in the present industry.
Summary of the invention
The present invention provides a kind of high density flexible wiring board and preparation method thereof, adopts to carry out earlier that circuit is holed again and heavy copper facing operation, solves in the prior art to cause the technical problem that yields is low because of the wrinkle plate.
The present invention solves the problems of the technologies described above the base material that provides the high density flexible wiring board to comprise polyimide; The one side of this base material is provided with first conductive layer; This is provided with copper electroplating layer above first conductive layer; On said heavy copper plate, be provided with first cover layer, also be drilled with blind hole on this wiring board, the inwall of said heavy copper plate edge and said blind hole arrives second layer conductive layer.And the manufacture method of this high density flexible wiring board may further comprise the steps: A. cuts flexible parent metal; B. on the conductor planes of the flexible parent metal that the A step cuts, paste dry film; C. make public and etching on the dry film that in the B step, has posted; D. in the C step, etch pressing behind the flexible parent metal laminated coverlay of circuit, carried out the laser drilling blind hole, and sunk copper and copper facing.
Further improvement of the present invention is: the other one side of said base material is provided with second conductive layer, and this second conductive layer is provided with second cover layer, and the hole depth of said blind hole is passed base material to the second conductive layer by heavy copper plate.When flexible parent metal is flexible two-sided base material; Pasting dry film among the above-mentioned steps B is on the A of the two-sided base material of flexibility face, to carry out, and said step D then will be divided into pressing behind following two step: D1. have etched circuit in the C step the flexible parent metal laminated coverlay; D2. carry out the laser drilling blind hole, and sink copper and copper facing; The manufacture method of this double sided board further may further comprise the steps: E. pastes dry film on the B of flexible parent metal face; F. make public and etching on the dry film that in the E step, has posted; G. in the F step, etched the flexible parent metal B face laminated coverlay of circuit, and pressing is closely knit.
Of the present invention further the improvement again is: said base material is a polyimides glue; Said first conductive layer directly pastes to be paid on the base material of polyimides glue; Perhaps said base material is a polyimides, and said first conductive layer and second conductive layer are paid the two sides at polyimide base material through the bonding sticker.Said flexible parent metal comprises flexible base, board and covers this flexible base, board conductive layer that said flexible base, board is a polyimides.
The present invention adopts above-mentioned structural design and manufacture craft, and broken string, the short circuit problem of high density flexible wiring board can improve yield of products greatly when effectively solving wrinkle plate problem and the circuit etching of high-density plate FPC.
Description of drawings
Fig. 1 is that to adopt polyimides be the cross-sectional schematic of substrate in the present invention.Fig. 2 is that to adopt polyimides glue be the cross-sectional schematic of substrate in the present invention.
Embodiment
In conjunction with above-mentioned description of drawings specific embodiment of the present invention.
By knowing among Fig. 1 and Fig. 2; This high density flexible wiring board comprises the base material 10 of polyimide, and the one side of this base material 10 is provided with first conductive layer 20, and this is provided with heavy copper plate 30 above first conductive layer 20; On said heavy copper plate 30, be provided with first cover layer 40; Also be drilled with blind hole 50 on this wiring board, the inwall of said heavy copper plate 30 edges and said blind hole 50, the hole depth of this blind hole 50 arrives second conductive layer by heavy, copper plate 30.Said flexible parent metal comprises flexible base, board and covers this flexible base, board conductive layer that said flexible base, board is a polyimides.The manufacture craft of this high density flexible wiring board comprises: cut flexible parent metal earlier; On the conductor planes of the flexible parent metal that cuts, paste dry film; On the dry film that has posted, make public and etching; In the C step, etch pressing behind the flexible parent metal laminated coverlay of circuit, carried out the laser drilling blind hole, and sunk copper and copper facing.Just carry out pad pasting, exposure after the blanking; Because plate face at this moment is very smooth, dry film and plate face are fitted closely, and etching just is not easy broken string like this; And not having does not have copper particle and factor affecting in uneven thickness through heavy, copper facing plate face, leaves scrapping of residual copper after minimizing short circuit and the etching during etching.Carry out circuit earlier, and the good coverlay of pressing, increased the thickness of plank, when carrying out laser drill, just can well avoid the fold of plate face like this and cause product rejection, improve the yields of producing with heavy, copper facing.
By knowing among Fig. 1 and Fig. 2; To two-sided base material, the other one side of base material 10 is provided with second conductive layer 60, and this second conductive layer 60 is provided with second cover layer 70; The hole depth of said blind hole 50 is passed base material 10 to second conductive layers 60 by heavy copper plate 30; First conductive layer 20 and second conductive layer 60 are Copper Foil, aluminium foil or silver foil, and said first cover layer 40 and second cover layer 70 are liquid photosensitive PI type coverlay, liquid photosensitive printing ink or PI type coverlay.And the manufacture craft of this double sided board will change to some extent, and pasting dry film in the previous process is on the A of the two-sided base material of flexibility face, to carry out, and in etching and boring step, pressing after etching the flexible parent metal laminated coverlay of circuit earlier; And then carry out the laser drilling blind hole, and sink copper and copper facing; After the processing of first of completion, also to carry out the processing of one side in addition, on the B of flexible parent metal face, paste dry film exactly; On the dry film that has posted, make public and etching; Etching the flexible parent metal B face laminated coverlay of circuit, and pressing is closely knit.
By knowing among Fig. 1, said base material 10 is a polyimides glue, and said first conductive layer 20 and second conductive layer 60 directly paste to be paid on the base material 10 of polyimides glue.
By knowing among Fig. 2, said base material 10 is a polyimides, and said first conductive layer 20 and second conductive layer 60 paste the two sides of paying at polyimide base material 10 through adhesive glue 11.
Above content is to combine concrete preferred implementation to the further explain that the present invention did, and can not assert that practical implementation of the present invention is confined to these explanations.For the those of ordinary skill of technical field under the present invention, under the prerequisite that does not break away from the present invention's design, can also make some simple deduction or replace, all should be regarded as belonging to protection scope of the present invention.
Claims (3)
1. high density flexible wiring board; It is characterized in that: this wiring board comprises the base material (10) of polyimide; The one side of this base material (10) is provided with first conductive layer (20); This is provided with above first conductive layer (20) heavy, copper plate (30); On said heavy, copper plate (30), be provided with first cover layer (40), also be drilled with blind hole (50) on this wiring board, said heavy copper plate (30) along and the inwall of said blind hole (50) connect with second conductive layer (60); Such first conductive layer just links together through heavy, copper plate (30) with second conductive layer; The other one side of said base material (10) is provided with second conductive layer (60), and this second conductive layer (60) is provided with second cover layer (70), and said blind hole (50) is passed base material (10) to second conductive layer (60) by first conductive layer (20); Said first cover layer (40) and second cover layer (70) are liquid photosensitive PI type coverlay or liquid photosensitive printing ink, and said first conductive layer (20) and second conductive layer (60) are aluminium foil or silver foil.
2. high density flexible wiring board according to claim 1 is characterized in that: said base material (10) is a polyimides glue, and said first conductive layer (20) and second conductive layer (60) directly paste to be paid on the base material (10) of polyimides glue.
3. high density flexible wiring board according to claim 1; It is characterized in that: said base material (10) is a polyimides, and said first conductive layer (20) and second conductive layer (60) paste the two sides of paying in polyimide base material (10) through adhesive glue (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010525182 CN102209438B (en) | 2010-10-29 | 2010-10-29 | High-density flexible circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010525182 CN102209438B (en) | 2010-10-29 | 2010-10-29 | High-density flexible circuit board and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN102209438A CN102209438A (en) | 2011-10-05 |
| CN102209438B true CN102209438B (en) | 2012-12-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010525182 Active CN102209438B (en) | 2010-10-29 | 2010-10-29 | High-density flexible circuit board and manufacturing method thereof |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013165164A (en) * | 2012-02-10 | 2013-08-22 | Taiyo Ink Mfg Ltd | Wiring circuit, wiring board, and manufacturing method of wiring board |
| CN102595797B (en) * | 2012-02-29 | 2014-05-28 | 博罗县精汇电子科技有限公司 | Method for making multilayer rigid-flexible board by utilizing yin-yang board copper plating method |
| CN102686031B (en) * | 2012-05-25 | 2015-06-24 | 湖南鸿瑞新材料股份有限公司 | Pre-windowing process of high-density interconnected PCB (printed circuit board) with buried blind hole |
| CN104582320A (en) * | 2013-12-16 | 2015-04-29 | 厦门弘信电子科技股份有限公司 | Front-end manufacturing technology of flexible circuit board |
| CN107993832A (en) * | 2017-11-27 | 2018-05-04 | 深圳光韵达激光应用技术有限公司 | A kind of low resistance high charge rate FPC flexibility Wireless charging coil manufacture crafts |
| CN109413845B (en) * | 2018-12-18 | 2024-02-27 | 厦门爱谱生电子科技有限公司 | Flexible circuit board containing shielding grounding copper layer and manufacturing method thereof |
| TWI730395B (en) * | 2019-09-04 | 2021-06-11 | 同泰電子科技股份有限公司 | Electromagnetic interference shielding structure, flexible circuit board having electromagnetic interference shielding structure and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1758832A (en) * | 2004-10-04 | 2006-04-12 | 株式会社丸和制作所 | Printed wiring board manufacturing method |
| CN101453838A (en) * | 2007-11-29 | 2009-06-10 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100455890B1 (en) * | 2002-12-24 | 2004-11-06 | 삼성전기주식회사 | A printed circuit board with embedded capacitors, and a manufacturing process thereof |
| KR20040085374A (en) * | 2003-03-31 | 2004-10-08 | 영풍전자 주식회사 | Method for making through-hole of multi-layer flexible printed circuit board |
| JP4520392B2 (en) * | 2005-05-12 | 2010-08-04 | 株式会社丸和製作所 | Printed circuit board manufacturing method |
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- 2010-10-29 CN CN 201010525182 patent/CN102209438B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1758832A (en) * | 2004-10-04 | 2006-04-12 | 株式会社丸和制作所 | Printed wiring board manufacturing method |
| CN101453838A (en) * | 2007-11-29 | 2009-06-10 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
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| CN102209438A (en) | 2011-10-05 |
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