CN109413964B - Satellite-borne phased array radar load integrated with satellite platform structure thermal control - Google Patents
Satellite-borne phased array radar load integrated with satellite platform structure thermal control Download PDFInfo
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- CN109413964B CN109413964B CN201811532714.1A CN201811532714A CN109413964B CN 109413964 B CN109413964 B CN 109413964B CN 201811532714 A CN201811532714 A CN 201811532714A CN 109413964 B CN109413964 B CN 109413964B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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Abstract
The invention relates to a satellite-borne phased array radar load integrated with thermal control of a satellite platform structure, which is integrated on a satellite cabin plate and comprises a phased array antenna, an active module and a thermal control device, wherein the phased array antenna is covered on the outer side surface of the satellite cabin plate, the active module is installed on the inner side surface of the satellite cabin plate and is arranged corresponding to the phased array antenna, the thermal control device is embedded in the satellite cabin plate and is positioned between the active module and the phased array antenna, and the active module is connected with the phased array antenna to realize microwave signal transmission. According to the satellite-borne phased array radar load, the phased array antenna and the satellite platform share one cabin plate, and the thermal control device is integrated in the satellite cabin plate, so that the satellite-borne phased array radar load and the satellite platform structure are integrated in a thermal control mode, the integration level is high, the occupied space is small, and the overall weight is reduced.
Description
Technical Field
The invention relates to a satellite-borne radar structure, in particular to a satellite-borne phased array radar load integrated with satellite platform structure thermal control.
Background
The satellite-borne phased array radar mainly comprises a phased array antenna and a central electronic device, and is generally designed in a configuration independent of a satellite platform. Phased array antennas typically employ a separate planar configuration. The antenna aperture is divided into a plurality of panels according to the satellite configuration and the envelope size of the rocket overall cover. Each panel comprises: phased array antenna, antenna frame, active mounting panel, thermal control device, cable and active module. The antenna panel and the satellite are generally installed in a heat insulation mode. When the antenna works in an orbit, the antenna panel automatically solves the problem of thermal control of a heating device; the central electronic device is generally designed as a multi-drawer stacked structure, and is installed in a heat-conducting manner with a satellite platform in a single satellite manner, and each drawer assembly comprises a cold plate, a PCB (printed circuit board), a thermal interface material and a cover plate.
The existing satellite-borne phased array radar load has the advantages of being simple in interface with a satellite platform and clear in division of labor. However, the antenna panel frame structure and the thermal control device are heavy in weight, and the electronic equipment is low in generalization degree, so that the configuration design is not suitable for the requirements of a small remote sensing satellite platform with higher requirements on light weight, generalization and low section.
Disclosure of Invention
The invention aims to solve the technical problems that the conventional phased-array antenna, a satellite cabin plate and a thermal control device are independent parts, and are mutually independent when in connection, and the installation paths are multiple, so that the occupied space is large, the heat dissipation effect is poor, the weight is large, and the integration level is low.
The technical scheme for solving the technical problems is as follows: the satellite-borne phased array radar load integrated with the thermal control of the satellite platform structure is integrated on a satellite cabin plate and comprises a phased array antenna, an active module and a thermal control device, wherein the phased array antenna is covered on the outer side surface of the satellite cabin plate, the active module is installed on the inner side surface of the satellite cabin plate and corresponds to the phased array antenna, the thermal control device is embedded inside the satellite cabin plate and is positioned between the active module and the phased array antenna, and the active module is connected with the phased array antenna to realize microwave signal transmission.
The invention has the beneficial effects that: according to the satellite-borne phased array radar load, the phased array antenna and the satellite platform share one cabin plate, and the thermal control device is integrated in the satellite cabin plate, so that the satellite-borne phased array radar load and the satellite platform structure are integrated in a thermal control mode, the integration level is high, the occupied space is small, and the overall weight is reduced.
On the basis of the technical scheme, the invention can be further improved as follows.
Further, the satellite cabin plate is of a sandwich structure, and the thermal control device is embedded in the position, corresponding to the active module, of the sandwich structure.
The beneficial effect of adopting the further scheme is that: the satellite deck plate adopts a sandwich structure, has a compact structure, is convenient for installing a thermal control device, and does not influence the realization of the original functions of the satellite deck plate.
Further, the satellite deck is of a 3D printed dot matrix sandwich structure.
The beneficial effect of adopting the further scheme is that: the satellite deck adopts a 3D printed dot matrix sandwich structure, is simple in structure and easy to realize, and has good vibration-proof and impact-proof effects.
Furthermore, a plurality of through holes are formed in the satellite cabin plate on the periphery of the thermal control device, and the active module and the phased array antenna are connected in a positioning mode through pins penetrating through the through holes so as to achieve microwave signal transmission.
The beneficial effect of adopting the further scheme is that: the microwave signal transmission mode does not increase extra wire harnesses, has a compact structure, and enhances the connection strength of the thermal control device, the active module, the phased array antenna and the satellite cabin plate.
Further, the thermal control device comprises a phase change material filled in the satellite capsule plate.
The beneficial effect of adopting the further scheme is that: phase change materials are filled in the satellite cabin plate, heat emitted by the active module is transmitted to the satellite cabin plate through the shell and is absorbed by the phase change materials arranged in the satellite cabin plate, and the active module shell keeps the temperature within a working temperature range and meets the requirements of different shell temperature gradients through phase change energy storage.
Furthermore, the thermal control device further comprises a heat spreading plate, wherein the heat spreading plate is positioned on one side of the phase change material and is close to the active module.
The beneficial effect of adopting the further scheme is that: the arrangement of the heat spreading plate enables the temperature transmission in the phase change process to be more uniform and stable.
Further, the phase-change material is a graphite-based paraffin phase-change material.
The beneficial effect of adopting the further scheme is that: the phase change process is more stable by adopting the graphite-based paraffin phase change material.
Further, the phased array antenna includes a plurality of antenna panels, each of the antenna panels corresponding to at least one active module and at least one thermal control device.
The beneficial effect of adopting the further scheme is that: the temperature change of the satellite-borne phased array radar load is more stable.
Furthermore, a plug board assembly is installed on the phased array antenna, a plurality of pairs of slots are formed between the plug board assemblies, and each pair of slots are internally plugged with an electronic equipment plug-in.
The beneficial effect of adopting the further scheme is that: the electronic equipment plug-ins are inserted into each pair of slots, so that the generalization level of connection between the electronic equipment plug-ins and the antenna is effectively improved.
Furthermore, the electronic equipment plug-in comprises a plug-in shell and a PCB board provided with a heating device, wherein at least one end of the plug-in shell is in locking fit with the slot through a wedge-shaped locking strip; the plug shell is internally provided with an installation cavity, one side wall of the plug shell is a cold guide plate, the PCB is installed in the installation cavity, the heating device is located between the PCB and the cold guide plate, and a thermal interface material is arranged between the heating device and the cold guide plate.
The beneficial effect of adopting the further scheme is that: the electronic equipment plug-in components adopt a cold guiding type structure, heat of heating devices on a PCB of the electronic equipment plug-in components is conducted to a cold guiding plate through a hot interface material, and then conducted to corresponding slots through the cold guiding plate, so that the temperature of the heating devices on the PCB is kept within a working temperature range.
Drawings
FIG. 1 is a schematic perspective view of a space-borne phased array radar load according to the present invention;
FIG. 2 is a schematic cross-sectional view of an integrated structure of a satellite-borne phased array radar load and phased array antenna according to the present invention;
FIG. 3 is an enlarged view of portion A of FIG. 2;
FIG. 4 is a schematic diagram of the internal structure of the electronic device package of the present invention;
fig. 5 is a schematic view of the use state of the wedge-shaped locking strip of the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. a phased array antenna; 11. an antenna panel;
2. an active module;
3. a thermal control device; 31. a phase change material; 32. a heat spreading plate;
4. a satellite deck; 41. a through hole; 42. a pin;
5. a plugboard; 51. a slot;
6. an electronic device plug-in; 61. a cold conducting plate; 611. reinforcing ribs; 612. a locking strip; 62. a cover plate; 63. a PCB board; 64. a heat generating device; 65. a mounting cavity; 66. a thermal interface material;
7. a wedge-shaped locking strip.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth to illustrate, but are not to be construed to limit the scope of the invention.
As shown in fig. 1 to 4, a satellite-borne phased array radar load integrated with thermal control of a satellite platform structure according to this embodiment is integrated on a satellite deck 4, and includes a phased array antenna 1, an active module 2, and a thermal control device 3, where the phased array antenna 1 is disposed on an outer side surface of the satellite deck 4, the active module 2 is mounted on an inner side surface of the satellite deck 4 and is disposed corresponding to the phased array antenna 1, the thermal control device 3 is embedded inside the satellite deck 4 and is located between the active module 2 and the phased array antenna 1, and the active module 2 is connected to the phased array antenna 1 to implement microwave signal transmission.
In the existing satellite-borne phased array radar load, the phased array antenna is provided with the mounting plate, and the phased array antenna and the thermal control device are mounted on a satellite cabin plate of a satellite platform after being mounted with the active module, so that the whole integration level is low.
In a preferred embodiment of the present invention, as shown in fig. 2, the satellite deck 4 is a sandwich structure, and the thermal control device 3 is embedded in a position corresponding to the active module 2 in the sandwich structure. The satellite deck plate adopts a sandwich structure, has a compact structure, is convenient for installing a thermal control device, and does not influence the realization of the original functions of the satellite deck plate.
A further solution of the satellite deck board in this embodiment is that, as shown in fig. 2, the satellite deck board 4 is a 3D printed dot matrix sandwich structure. The satellite deck adopts a 3D printed dot matrix sandwich structure, is simple in structure and easy to realize, and has good vibration-proof and impact-proof effects. The satellite deck 4 of the present embodiment is supported within the sandwich by a plurality of diagonal steels and a plurality of vertical steels.
In this embodiment, as shown in fig. 2, a plurality of through holes 41 are formed on the satellite deck 4 around the thermal control device 3, and the active module 2 and the phased array antenna 1 are connected in a positioning manner by pins 42 penetrating through the through holes 41 to realize microwave signal transmission. The microwave signal transmission mode does not increase extra wire harnesses, has a compact structure, and enhances the connection strength of the thermal control device, the active module, the phased array antenna and the satellite cabin plate.
As shown in fig. 2, the number of the through holes on the satellite deck 4 may be multiple, or two through holes may be formed on each of the two sides of the thermal control device 3. And microwave signal transmission between the active module 2 and the phased array antenna 1 can be realized through the pin 42, or a pin can be arranged on one side surface of the active module 2 close to the satellite deck board 4, and a pin can be arranged on one side surface of the phased array antenna 1 close to the satellite deck board 4, and then the pin of the active module 2 and the pin of the phased array antenna 1 are inserted into the same through hole 41 and are butted to realize microwave signal transmission between the active module 2 and the phased array antenna 1.
One specific solution of the thermal control device of the present embodiment is that, as shown in fig. 2 and 3, the thermal control device 3 includes a phase change material 31, and the phase change material 31 is filled in the satellite deck 4. Phase change materials are filled in the satellite cabin plate, heat emitted by the active module is transmitted to the satellite cabin plate through the shell and is absorbed by the phase change materials arranged in the satellite cabin plate, and the active module shell keeps the temperature within a working temperature range and meets the requirements of different shell temperature gradients through phase change energy storage.
In a preferred embodiment of the present invention, as shown in fig. 2 and 3, the thermal control device 3 further includes a heat spreading plate 32, and the heat spreading plate 32 is located on one side of the phase change material 31 and is disposed close to the active module 2. The arrangement of the heat spreading plate enables the temperature transmission in the phase change process to be more uniform and stable.
Specifically, the phase-change material 31 is a graphite-based paraffin phase-change material; the heat spreading plate 32 is pre-embedded in the position of the interlayer structure of the satellite deck 4 corresponding to the heat source of the active module 2, and then the graphite-based paraffin phase-change material with a low expansion coefficient is encapsulated in the interlayer structure of the satellite deck 4 so as to deal with the short-time high-power heat consumption of the active module 2. The phase change process is more stable by adopting the graphite-based paraffin phase change material.
A specific solution of this embodiment is that, as shown in fig. 1, the phased array antenna 1 includes a plurality of antenna panels 11, and each of the antenna panels 11 corresponds to at least one active module 2 and at least one thermal control device 3. The temperature change of the satellite-borne phased array radar load is more stable.
As shown in fig. 1 to 3, the antenna panel 11 is a thin-walled aluminum alloy structural plate with an eight-channel slot waveguide and a multilayer power divider integrated together; the active module 2 is a high heat consumption component such as a TR module component or a power supply component. The antenna panel 11 is fixed on the outer side surface of the satellite deck 4, and the active module 2 is located on the inner side surface of the satellite deck 4.
As shown in fig. 1 and 4, a patch panel assembly is installed on the phased array antenna 1, a plurality of pairs of slots 51 are formed between the patch panel assemblies, and an electronic device plug-in 6 is plugged into each pair of slots 51. The electronic equipment plug-ins are inserted into each pair of slots, so that the generalization level of connection between the electronic equipment plug-ins and the antenna is effectively improved.
As shown in fig. 1 and 4, the patch panel assembly of the present embodiment includes two opposite patch panels 5, each patch panel 5 is provided with a row of slots 51, and in the two patch panels 5, the two opposite slots 51 form a pair of slots 51 for the electronic device plug-in unit 6 to plug in. The plugboards 5 are vertically arranged on the antenna panel 11, the two plugboards 5 are arranged in parallel, the electronic device plug-in units 6 are inserted between the two plugboards 5 from the pair of slots 51 which are arranged oppositely, and are locked and positioned by the wedge-shaped locking strips 7 and fixed by screws.
One specific scheme of the electronic device plug-in the present embodiment is that, as shown in fig. 4, the electronic device plug-in 6 includes a plug-in housing and a PCB 63 mounted with a heating device 64, and at least one end of the plug-in housing is in locking fit with the slot 51 through a wedge-shaped locking strip 7; an installation cavity 65 is formed in the plug-in housing, one side wall of the plug-in housing is a cold guide plate 61, and the cold guide plate 61 is made of metal; the PCB 63 is mounted in the mounting cavity 65, the heat generating device 64 is located between the PCB 63 and the cold conducting plate 61, and a thermal interface material 66 is disposed between the heat generating device 64 and the cold conducting plate 61. The electronic equipment plug-in components adopt a cold guiding type structure, heat of heating devices on a PCB of the electronic equipment plug-in components is conducted to a cold guiding plate through a hot interface material, and then conducted to corresponding slots through the cold guiding plate, so that the temperature of the heating devices on the PCB is kept within a working temperature range.
As shown in fig. 4, the plug-in housing is formed by connecting a cold guide plate 61 and a cover plate 62, the cold guide plate 61 and the cover plate 62 are connected by screws, and the cold guide plate 61 and the cover plate 62 are oppositely arranged and enclose the mounting cavity 65. The cold conducting plate 61 is made of aluminum alloy, the outer side surface of the cold conducting plate 61 is provided with a reinforcing rib 611, the PCB 63 is mounted on the inner side of the cold conducting plate 61 through a screw, and a thermal interface material 66 is arranged between a heating device 64 on the PCB 63 and the cold conducting plate 61. One end of the electronic device plug-in unit 6 is fixedly installed with the slot 51 through a screw, and the other end is tightly pressed by the wedge-shaped locking strip 7 and the slot 61. As shown in fig. 4, a fixing plate is formed by extending one end of the cold conducting plate 61, a pressure-connecting plate is formed by extending the other end of the cold conducting plate 61, two ends of the cover plate 62 are respectively abutted and fixed with the fixing plate and the pressure-connecting plate, and the mounting cavity 65 is reserved between the cover plate and the cold conducting plate 61, the fixing plate is inserted into the slot 51 and is fixedly connected with the slot bottom of the slot 51 through a screw, a locking strip 612 is formed by extending the outer side wall of the pressure-connecting plate, the locking strip 612 is inserted into the other slot 51 and is abutted with one side wall of the slot 51, and is locked and fixed with the other side wall of the slot; the crimping plate abuts on both the wedge locking bar 7 and the end face of the slot 51.
As shown in fig. 4, a grid-shaped rib 611 is formed on the outer side surface of the cold conducting plate 61, and the height of the rib 611 is slightly lower than the thickness of the mounting cavity 65. The heat generating device 64 refers to all components that generate heat during operation. The wedge-shaped locking strip 7 can be a strip-shaped locking structure which is commercially available, the specific structural principle can refer to fig. 5, and the arrow in fig. 5 indicates a state schematic diagram of the wedge-shaped locking strip 7 from before locking to after locking. When the cylindrical structure of the one end of the wedge-shaped locking strip 7 is screwed down, the wedge blocks which are arranged in a staggered mode on the wedge-shaped locking strip 7 are mutually far away after being mutually pushed, and then the locking effect of extruding the two side walls of the slot is achieved.
In the embodiment, when the satellite-borne phased array radar load is powered on to work, heat emitted by an active module on a phased array antenna panel is conducted to a satellite cabin plate through a shell, and is absorbed and subjected to phase change energy storage by a thermal control device arranged in the satellite cabin plate, so that the temperature of the active module shell is kept within a working temperature range, and the requirements of different shell temperature gradients are met; the heat of the heating device on the PCB of the electronic equipment plug-in is conducted to the cold guide plate through the thermal interface material and then conducted to the satellite slot through the cold guide plate, so that the temperature of the heating device on the PCB is kept within the working temperature range. When the satellite-borne phase control rib radar load is in power-off standby, the heat control device in the satellite cabin plate conducts heat to the whole satellite heat radiator through the heat pipe, and the heat radiator radiates the heat absorbed and stored by the power-on working device, so that the performance of the heat control device is recovered.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (9)
1. A satellite-borne phased array radar load integrated with thermal control of a satellite platform structure is integrated on a satellite deck and is characterized by comprising a phased array antenna, an active module and a thermal control device, wherein the phased array antenna is covered on the outer side face of the satellite deck, the active module is installed on the inner side face of the satellite deck and corresponds to the phased array antenna, the thermal control device is embedded in the satellite deck and is positioned between the active module and the phased array antenna, and the active module is connected with the phased array antenna to realize microwave signal transmission;
a plurality of through holes are formed in the satellite cabin plate on the periphery of the thermal control device, and the active module and the phased array antenna are connected in a positioning mode through pins penetrating through the through holes so as to achieve microwave signal transmission; the active module can be arranged on one side face close to the satellite cabin plate, the phased array antenna can be arranged on one side face close to the satellite cabin plate, then the active module and the phased array antenna are inserted into the same through hole and are in butt joint to achieve microwave signal transmission between the active module and the phased array antenna.
2. The spaceborne phased array radar load integrated with thermal control of a satellite platform structure as recited in claim 1, wherein the satellite deck is a sandwich structure, and the thermal control device is embedded in the sandwich structure at a position corresponding to the active module.
3. The spaceborne phased array radar load integrated with satellite platform structure thermal control as claimed in claim 2 wherein the satellite deck is a 3D printed lattice sandwich structure.
4. The on-board phased array radar load integrated with satellite platform structure thermal control of claim 1, wherein the thermal control device comprises a phase change material filled within the satellite deck.
5. The spaceborne phased array radar load integrated with satellite platform structure thermal control as recited in claim 4, further comprising a heat spreading plate positioned on a side of the phase change material and adjacent to the active module.
6. The satellite-borne phased array radar load integrated with satellite platform structure thermal control of claim 4, wherein the phase change material is a graphite-based paraffin phase change material.
7. A satellite-borne phased array radar load integrated with thermal control of a satellite platform structure, as claimed in claim 1, wherein said phased array antenna comprises a plurality of antenna panels, each of said antenna panels corresponding to at least one active module and at least one thermal control device.
8. The spaceborne phased array radar load integrated with the satellite platform structure thermal control as claimed in claim 1 wherein, a patch panel assembly is mounted on the phased array antenna, a plurality of pairs of slots are formed between the patch panel assemblies, and an electronic device plug-in is inserted in each pair of slots.
9. The satellite-borne phased array radar load integrated with the satellite platform structure thermal control as claimed in claim 8, wherein the electronic device plug-in comprises a plug-in housing and a PCB board mounted with a heating device, at least one end of the plug-in housing is in locking fit with the slot through a wedge-shaped locking strip; the plug shell is internally provided with an installation cavity, one side wall of the plug shell is a cold guide plate, the PCB is installed in the installation cavity, the heating device is located between the PCB and the cold guide plate, and a thermal interface material is arranged between the heating device and the cold guide plate.
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| CN111403889B (en) * | 2020-03-25 | 2021-06-29 | 成都星时代宇航科技有限公司 | Space load bearing device and bearing assembly |
| CN112960144A (en) * | 2021-02-03 | 2021-06-15 | 北京无线电测量研究所 | Cabin plate based on 3D printing integrated into one piece |
| CN113581493B (en) * | 2021-07-30 | 2023-05-30 | 北京微焓科技有限公司 | Plate-shaped satellite main frame and plate-shaped satellite |
| CN114051359B (en) * | 2021-10-26 | 2022-10-21 | 华睿交通科技股份有限公司 | Temperature field simulation method |
| CN114537717B (en) * | 2022-03-17 | 2024-07-02 | 齐鲁空天信息研究院 | Thermal control system for load of small satellite |
| CN116406156B (en) * | 2023-06-09 | 2023-08-18 | 中国科学院微小卫星创新研究院 | Electromagnetic shielding and heat dissipation integrated satellite-borne electronic system and assembly method thereof |
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| US5293171A (en) * | 1993-04-09 | 1994-03-08 | Cherrette Alan R | Phased array antenna for efficient radiation of heat and arbitrarily polarized microwave signal power |
| US6211824B1 (en) * | 1999-05-06 | 2001-04-03 | Raytheon Company | Microstrip patch antenna |
| US6394395B1 (en) * | 2000-03-15 | 2002-05-28 | Lockheed Martin Corporation | Combination solar array assembly and antenna for a satellite |
| CN104918459A (en) * | 2015-05-04 | 2015-09-16 | 哈尔滨工业大学 | Method for preparing thermal-conductive satellite siding |
| CN204720545U (en) * | 2015-06-15 | 2015-10-21 | 中国电子科技集团公司第三十八研究所 | The stacked phased array antenna of a kind of general high band |
| CN105698581A (en) * | 2015-12-14 | 2016-06-22 | 上海利正卫星应用技术有限公司 | Light, thin and pressing-resistant flat heat pipe with high installation adaptability |
| CN108461933A (en) * | 2018-01-31 | 2018-08-28 | 中国电子科技集团公司第三十八研究所 | A kind of spaceborne radar antenna of integration |
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