CN112960144A - Cabin plate based on 3D printing integrated into one piece - Google Patents
Cabin plate based on 3D printing integrated into one piece Download PDFInfo
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- CN112960144A CN112960144A CN202110151490.5A CN202110151490A CN112960144A CN 112960144 A CN112960144 A CN 112960144A CN 202110151490 A CN202110151490 A CN 202110151490A CN 112960144 A CN112960144 A CN 112960144A
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- Prior art keywords
- deck
- heat
- printing
- integrally formed
- printed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
- B64G1/506—Heat pipes
Abstract
The invention discloses a 3D printing-based integrally-formed cabin plate, and relates to the technical field of aerospace. The deck plate is integrally printed and molded by a 3D printer, a truss channel heat pipe is printed inside the deck plate, and an internal channel is printed inside the truss channel heat pipe; a dot matrix structure is printed outside the cabin plate, and an installation interface for installing electronic equipment is printed on the dot matrix structure; the internal channel is used for supplying heat to exchange working medium to flow, so that the heat exchange working medium exchanges heat with the electronic equipment. The cabin plate disclosed by the invention is suitable for load heat dissipation of a space satellite, and the condition that the honeycomb core in the cabin plate is damaged by pre-buried heat pipes in the prior art is avoided, so that the cabin plate has better bearing capacity and mechanical resistance, and the aim of light weight is fulfilled. In addition, the purposes of heat dissipation and temperature equalization of a plurality of heat sources in all directions can be achieved, the problems of local thermal resistance or heat pipe burnout and failure caused by non-communication of channels are reduced, and the heat dissipation efficiency and the temperature control precision are improved.
Description
Technical Field
The invention relates to the technical field of aerospace, in particular to a cabin plate integrally formed based on 3D printing.
Background
At present, with the continuous development of aerospace technology, the satellite integration degree is higher and higher, and with the increase of high-power and high-heat-flow-density effective loads and the research and development of high-heating and high-precision equipment, higher requirements are provided for the heat dissipation capacity and the structural stability of a satellite platform.
In the conventional satellite platform, heat pipes are generally embedded in a sandwich layer of a honeycomb sandwich composite material structure, the honeycomb sandwich is used for bearing mechanical load, and distributed heat pipes are used for passive heat transfer to realize heat transfer in multiple directions or realize temperature equalization among electronic devices in multiple directions. However, the integrity of the honeycomb sandwich structure is damaged by pre-embedding the heat pipes, so that the bearing capacity of the honeycomb sandwich structure is reduced, and the orthogonal lap joints of the heat pipes have multi-layer lap joint thermal resistance, so that the contact thermal resistance is very high, and the heat dissipation efficiency and the temperature control accuracy are poor.
Disclosure of Invention
The invention aims to solve the technical problem of the prior art and provides a cabin plate integrally formed based on 3D printing, a heat dissipation system comprising the cabin plate and a satellite carrying the cabin plate.
The technical scheme for solving the technical problems is as follows:
a cabin plate integrally formed based on 3D printing is integrally formed by a 3D printer, a truss channel heat pipe is printed inside the cabin plate, and an internal channel is printed inside the truss channel heat pipe; a dot matrix structure is printed on the outer portion of the cabin plate, and an installation interface for installing electronic equipment is printed on the dot matrix structure;
the internal channel is used for flowing heat exchange working medium, so that the heat exchange working medium and the electronic equipment exchange heat.
Another technical solution of the present invention for solving the above technical problems is as follows:
a heat dissipation system for a satellite comprises the cabin plate integrally formed based on 3D printing according to the technical scheme.
Another technical solution of the present invention for solving the above technical problems is as follows:
a satellite comprises the integrally formed cabin plate based on 3D printing according to the technical scheme.
The invention has the beneficial effects that: the cabin plate disclosed by the invention is integrally formed based on 3D printing, is suitable for load heat dissipation of a space satellite, and is suitable for light weight due to the fact that the truss channel heat pipe is directly printed inside the cabin plate which adopts a lattice structure, and the situation that a honeycomb core inside the cabin plate is damaged by pre-buried heat pipes in the prior art is avoided. In addition, because the truss channel heat pipe is 3D prints integrated into one piece, can satisfy the intercommunication of inside channel in all directions, inside working medium can realize evaporation and backward flow in a plurality of directions to reach the heat dissipation and the samming purpose of a plurality of heat sources in all directions, reduce because the local thermal resistance that the channel does not communicate production or heat pipe burns out and the inefficacy problem, improved radiating efficiency and accuse temperature precision.
Advantages of additional aspects of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
FIG. 1 is a schematic structural view of a deck panel according to an embodiment of the present invention;
FIG. 2 is a schematic view of an exterior surface configuration provided by an embodiment of the deck of the present invention;
FIG. 3 is a schematic view of an exterior surface configuration provided by an embodiment of the deck of the present invention;
FIG. 4 is a schematic view of a vertical cross-sectional structure provided by an embodiment of the deck of the present invention;
FIG. 5 is a cross-sectional structural schematic view of an embodiment of the deck of the present invention;
FIG. 6 is a schematic view of a truss channel heat pipe configuration provided by an embodiment of the deck of the present invention;
FIG. 7 is a cross-sectional view of a truss channel heat pipe provided in an embodiment of the deck of the present invention.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth to illustrate, but are not to be construed to limit the scope of the invention.
As shown in fig. 1, a schematic structural diagram is provided for an embodiment of a deck plate 1 according to the present invention, the deck plate 1 is integrally formed based on 3D printing, a truss channel heat pipe 7 is printed inside the deck plate 1, and an internal channel 8 is printed inside the truss channel heat pipe 7; a dot matrix structure is printed on the outer part of the cabin plate 1, and an installation interface for installing electronic equipment is printed on the dot matrix structure;
the internal channel 8 is used for heat supply exchange working medium flowing, so that the heat exchange working medium and the electronic equipment perform heat exchange.
Taking the structures given in fig. 1 to 3 as examples, 5 electronic devices may be installed on the deck 1, wherein 3 electronic devices arranged in a straight line are arranged on the front side, which are the first electronic device 2, the second electronic device 3 and the third electronic device 4, respectively, 2 electronic devices are arranged on the back side, which is the fourth electronic device 5 and the fifth electronic device 6, respectively, a certain interval exists between each electronic device, and the installation interface of the electronic device directly performs machining on the satellite deck 1 with the 3D printing lattice structure, so that a metal part is not required to be embedded as in the conventional honeycomb deck 1, and weight reduction of the whole satellite can be achieved.
The electronic device may comprise a payload on a spacecraft, such as a traveling wave tube amplifier, a SAR antenna, an optical camera, and the like.
It should be understood that the above example is only an exemplary illustration, and as the layout of the electronic device on the deck plate 1 often needs to consider various requirements such as electrical, structural and thermal control, and the truss channel heat pipe 7 of the present invention is integrally formed by 3D printing, the design and the formation of the heat pipe in any outline form can be realized, the limitation of the thermal control design on the layout of the overall structure is reduced, the mechanical performance topology optimization can be performed on the whole bearing structure according to the requirement, the lightweight design is performed on the satellite deck plate 1, and the requirement of the integrated design of the spacecraft structure and the bearing is met.
The area of the deck 1 outside the electronic device can be used as a heat dissipation area, the corresponding position inside the area is also printed with a truss channel heat pipe 7 in advance, and the working process of the invention is described below by taking liquid ammonia as an example of the heat exchange medium filled in the channel 8 inside the heat pipe.
When the electronic equipment starts to work, heat is generated, the heat of the electronic equipment is transferred to the internal truss channel heat pipe 7 through the skin of the satellite deck 1, liquid ammonia working medium in the truss channel heat pipe 7 is vaporized, the heat is transferred to a region, where the electronic equipment is not installed, on the truss channel heat pipe 7 for condensation, and the liquid working medium returns to the hot end through the capillary force of the channel. Because the heat is transferred by depending on the phase change of the working medium, the temperature difference of the truss channel heat pipe 7 is very small and is generally less than 2 ℃, so that the temperature equalization of mounting surfaces of all electronic equipment can be realized. After the heat is uniformly distributed on the whole satellite cabin plate 1 by the truss channel heat pipes 7, the heat is dissipated to the cold and black universe environment through the heat dissipation surface on the surface of the cabin plate 1, so that the heat dissipation of the whole satellite is realized.
As shown in fig. 4 and 5, which respectively show sectional views in two directions, assuming that the truss channel heat pipe 7 is cross-shaped as shown in fig. 6, the electronic device can be installed at the center of the cross to facilitate heat dissipation, and the internal channels 8 thereof are two, the sectional view of the truss channel heat pipe 7 is shown in fig. 7.
The disclosed deck plate 1 of this embodiment prints integrated into one piece based on 3D, is applicable to space satellite's load heat dissipation, through directly printing truss channel heat pipe 7 inside deck plate 1, and deck plate 1 adopts lattice structure, avoids destroying the condition of the inside honeycomb core of deck plate 1 through pre-buried heat pipe among the prior art to make deck plate 1 have more excellent bearing capacity and resistance mechanical properties, reach the lightweight purpose. In addition, because the truss channel heat pipe 7 is 3D prints integrated into one piece, can satisfy the intercommunication of inside channel 8 in all directions, inside working medium can realize evaporation and backward flow in a plurality of directions to reach the heat dissipation and the purpose of samming of a plurality of heat sources in all directions, reduce because the local thermal resistance that the channel does not communicate production or heat pipe burn out and the inefficacy problem, improved radiating efficiency and accuse temperature precision.
Alternatively, in some possible embodiments, the lattice structure is arranged along the run of the truss channel heat pipe 7.
For example, as shown in fig. 7, assuming that the truss channel heat pipe 7 is cross-shaped, the lattice structure may be arranged on the outer side of the deck 1 corresponding to the branches of the cross-shaped, which can facilitate heat transfer.
Alternatively, in some possible embodiments, the lattice structure is printed on the front and back sides of the deck 1, respectively.
Dot matrix structures are respectively printed on two sides of the cabin plate 1 and used for installing electronic equipment, so that the space of the cabin plate 1 can be fully utilized, and the whole volume is reduced.
Alternatively, in some possible embodiments, the mounting interfaces on the same face of the lattice structure are spaced apart from each other by a predetermined distance.
It should be understood that the preset distance can be set according to actual requirements, and heat dissipation of the electronic equipment can be facilitated.
Optionally, in some possible embodiments, the roughness of the inner surface of the inner channel 8 is less than a preset value.
It should be understood that the preset value can be set according to actual requirements, roughness is reduced, the reflux resistance of the liquid working medium can be reduced, and the heat-conducting property is improved.
Optionally, in some possible embodiments, the inner surface of the inner channel 8 is treated by a flow of abrasive particles.
The inner surface of the inner channel 8 is treated by abrasive particle flow, so that the roughness of the inner channel 8 can be reduced, the reflux resistance of the liquid working medium is reduced, and the heat transfer performance of the truss channel heat pipe 7 is optimized.
Optionally, in some possible embodiments, a heat dissipation area is reserved outside the deck panel 1, and the internal channel 8 extends to the inside of the deck panel 1 corresponding to the heat dissipation area.
For example, as shown in fig. 2 and 3, the blank area where no electronic device is installed can be used as a heat dissipation area, and the truss channel heat pipe 7 is also printed inside.
Optionally, in some possible embodiments, the heat exchange medium is liquid ammonia.
Liquid ammonia is heated and vaporized, heat can be transferred to a heat dissipation area on the truss channel heat pipe 7 for condensation, and heat dissipation efficiency is improved.
It is to be understood that some or all of the various embodiments described above may be included in some embodiments.
The invention further provides a heat dissipation system for a satellite, which comprises the integrally formed cabin plate based on 3D printing, disclosed by any implementation method.
The invention also provides a satellite which comprises the integrally formed cabin plate based on 3D printing, which is disclosed by any implementation method.
The reader should understand that in the description of this specification, reference to the description of the terms "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
While the invention has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The integrally formed deck plate based on 3D printing is characterized in that the deck plate is integrally formed by 3D printing, a truss channel heat pipe is printed inside the deck plate, and an internal channel is printed inside the truss channel heat pipe; a dot matrix structure is printed on the outer portion of the cabin plate, and an installation interface for installing electronic equipment is printed on the dot matrix structure;
the internal channel is used for flowing heat exchange working medium, so that the heat exchange working medium and the electronic equipment exchange heat.
2. The integrally formed deck based on 3D printing of claim 1, wherein the lattice structure is arranged along a run of the truss channel heat pipe.
3. The integrally formed deck based on 3D printing of claim 1, wherein the lattice structure is printed on the front and back sides of the deck, respectively.
4. The integrally formed deck based on 3D printing according to claim 3, wherein the mounting interfaces on the same side of the lattice structure are spaced apart from each other by a preset distance.
5. The integrally formed deck board based on 3D printing of claim 1, wherein a roughness of an inner surface of the inner channel is less than a preset value.
6. The integrally formed deck board based on 3D printing of claim 5, wherein an inner surface of the internal channel is treated with a flow of abrasive particles.
7. The integrally formed deck based on 3D printing according to any one of claims 1 to 5, wherein a heat dissipation area is reserved on the outer portion of the deck, and the internal channel extends to the inner portion of the deck corresponding to the heat dissipation area.
8. The integrally formed deck based on 3D printing of claim 1, wherein the heat exchange working medium is liquid ammonia.
9. A heat dissipation system for satellites, comprising the 3D printing based integrally formed deck according to any of claims 1 to 8.
10. Satellite comprising an integrated deck based on 3D printing according to any of claims 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110151490.5A CN112960144A (en) | 2021-02-03 | 2021-02-03 | Cabin plate based on 3D printing integrated into one piece |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110151490.5A CN112960144A (en) | 2021-02-03 | 2021-02-03 | Cabin plate based on 3D printing integrated into one piece |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112960144A true CN112960144A (en) | 2021-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110151490.5A Pending CN112960144A (en) | 2021-02-03 | 2021-02-03 | Cabin plate based on 3D printing integrated into one piece |
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| Country | Link |
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| CN (1) | CN112960144A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114850490A (en) * | 2022-03-31 | 2022-08-05 | 芯体素(杭州)科技发展有限公司 | Electronic radiator manufacturing method based on 3D printing |
Citations (7)
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| CN105659945B (en) * | 2012-05-18 | 2014-06-04 | 北京空间飞行器总体设计部 | The large hear rate radiating device for electronic equipment of a kind of high heat flux |
| CN105923171A (en) * | 2016-05-19 | 2016-09-07 | 中国空间技术研究院 | Modular integrated satellite multifunctional structure and polymers |
| CN109099740A (en) * | 2018-09-03 | 2018-12-28 | 北京空间机电研究所 | A kind of truss-like liquid-gas phase transition heat transfer unit (HTU) and its assembling and welding method |
| CN109413964A (en) * | 2018-12-14 | 2019-03-01 | 北京无线电测量研究所 | A kind of and integrated spaceborne phase array radar load of satellite platform structure thermal control |
| CN110856415A (en) * | 2019-11-14 | 2020-02-28 | 上海卫星装备研究所 | Integrated satellite structure plate and manufacturing method thereof |
| CN111301717A (en) * | 2019-12-27 | 2020-06-19 | 北京空间技术研制试验中心 | Bulkhead structure of manned spacecraft sealed cabin |
| CN112229253A (en) * | 2020-10-30 | 2021-01-15 | 上海卫星装备研究所 | Heat pipe branch connecting device and heat pipe system |
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2021
- 2021-02-03 CN CN202110151490.5A patent/CN112960144A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105659945B (en) * | 2012-05-18 | 2014-06-04 | 北京空间飞行器总体设计部 | The large hear rate radiating device for electronic equipment of a kind of high heat flux |
| CN105923171A (en) * | 2016-05-19 | 2016-09-07 | 中国空间技术研究院 | Modular integrated satellite multifunctional structure and polymers |
| CN109099740A (en) * | 2018-09-03 | 2018-12-28 | 北京空间机电研究所 | A kind of truss-like liquid-gas phase transition heat transfer unit (HTU) and its assembling and welding method |
| CN109413964A (en) * | 2018-12-14 | 2019-03-01 | 北京无线电测量研究所 | A kind of and integrated spaceborne phase array radar load of satellite platform structure thermal control |
| CN110856415A (en) * | 2019-11-14 | 2020-02-28 | 上海卫星装备研究所 | Integrated satellite structure plate and manufacturing method thereof |
| CN111301717A (en) * | 2019-12-27 | 2020-06-19 | 北京空间技术研制试验中心 | Bulkhead structure of manned spacecraft sealed cabin |
| CN112229253A (en) * | 2020-10-30 | 2021-01-15 | 上海卫星装备研究所 | Heat pipe branch connecting device and heat pipe system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114850490A (en) * | 2022-03-31 | 2022-08-05 | 芯体素(杭州)科技发展有限公司 | Electronic radiator manufacturing method based on 3D printing |
| CN114850490B (en) * | 2022-03-31 | 2024-03-26 | 芯体素(杭州)科技发展有限公司 | Manufacturing method of electronic radiator based on 3D printing |
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