CN104918459A - Method for preparing thermal-conductive satellite siding - Google Patents
Method for preparing thermal-conductive satellite siding Download PDFInfo
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- CN104918459A CN104918459A CN201510220895.4A CN201510220895A CN104918459A CN 104918459 A CN104918459 A CN 104918459A CN 201510220895 A CN201510220895 A CN 201510220895A CN 104918459 A CN104918459 A CN 104918459A
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Abstract
A method for preparing a thermal-conductive satellite siding relates to a method for preparing a satellite siding. The invention aims to solve the problem that the integrity of a core is destroyed, the thermal control effect is poor and the whole function of a satellite is affected when thermal control of the existing satellite is handled with use of a pre-embedded heat pipe. The method comprises the following steps: step 1, making a lower panel and a thermal-conductive upper panel; step 2, making a thermal-conductive core: pasting each of the two sides of each prepared core board with a second high-thermal-conductivity film, and then, assembling the multiple core boards pasted with the second high-thermal-conductivity films into the thermal-conductive core; step 3, inserting high-thermal-conductivity blocks: inserting multiple high-thermal-conductivity blocks into the thermal-conductive core prepared in step 2; and step 4, fixedly connecting the thermal-conductive upper panel to the upper end face of the thermal-conductive core and fixedly connecting the lower panel to the lower end face of the thermal-conductive core, thus forming a thermal-conductive satellite siding. The method of the invention is used to prepare a thermal-conductive satellite siding.
Description
Technical field
The present invention is specifically related to a kind of preparation method of heat conduction satellite wallboard.
Background technology
Whether advanced satellite directly contained with it electronic devices and components are closely bound up, and electronic devices and components certainly lead to heat in process under arms, heat must cause thermal control problem, can heat control system well solve this part heat problem, be directly connected to use and the life-span of electronic devices and components, and then determine the allomeric function of satellite.If heat problem can not solve very well, greatly limit the application of electronic devices and components, and then the function that constraint satellite can represent.Existing scheme solves thermal control by the mode of pre-buried heat pipe, adds the weight of satellite wallboard on the one hand, and the simple heat pipe that increases can not well solve thermal control problem on the one hand in addition.
Along with developing rapidly of large scale integrated circuit technology, on surface-mounted integrated circuit in the satel-lite, the power of electronic chip unit are constantly increases.Because chip heating makes local temperature raise, how heat is derived the key issue becoming electronic technology and further develop.In order to solve the thermal control problem of satellite wallboard, the version major part of current satellite wallboard adopts honeycomb core to combine with the mode of pre-buried heat pipe, honeycomb core is used for carrying, heat pipe adopts mode vertical in length and breadth to carry out pre-buried, be used for the heat of wainscot being evened up in face and leading other region, the integrality of honeycomb core often in pre-buried process, can be destroyed.Existing version not can solve the thermal control problem of Future Satellite wallboard, needs the satellite wall panel structure form of Development of Novel badly.
Summary of the invention
The object of this invention is to provide a kind of preparation method of heat conduction satellite wallboard, utilize pre-buried heat pipe to solve its thermal control problem to solve existing satellite, not only destroy the integrality of fuse, its thermal control less effective, affect the overall using function of satellite.The present invention solves the problems of the technologies described above the technical scheme taked to be:
A preparation method for heat conduction satellite wallboard, it realizes according to following steps:
Step one: make lower panel and heat conduction top panel: original plate is cut out top panel and lower panel respectively by the size of regulation, is pasted with one deck first heat conduction diaphragm and forms heat conduction top panel in the upper surface of top panel;
The multiple fuse composing plate assemblings being pasted with the second heat conduction diaphragm are finally formed heat conduction fuse by step 2: make heat conduction fuse: first the both sides of each fuse composing plate complete for preparation are respectively pasted with one deck second heat conduction diaphragm;
Step 3: plug heat conduction block: insert multiple heat conduction block in heat conduction fuse prepared by step 2;
Step 4: upper surface heat conduction top panel being fixedly connected on heat conduction fuse, the lower surface that lower panel is fixedly connected on heat conduction fuse forms heat conduction satellite wallboard.
A preparation method for heat conduction satellite wallboard, it realizes according to following steps:
Step one: make lower panel and heat conduction top panel: original plate is cut out top panel and lower panel respectively by the size of regulation, is pasted with one deck first heat conduction diaphragm and forms heat conduction top panel in the upper surface of top panel;
Step 2: make heat conduction fuse: be first respectively pasted with one deck second heat conduction diaphragm in the both sides of each fuse composing plate, secondly, the multiple fuse composing plates being pasted with the second heat conduction diaphragm are being prepared, finally the multiple fuse composing plate assemblings after preparation are being formed heat conduction fuse;
Step 3: plug heat conduction block: insert multiple heat conduction block in heat conduction fuse prepared by step 2;
Step 4: upper surface heat conduction top panel being fixedly connected on heat conduction fuse, the lower surface that lower panel is fixedly connected on heat conduction fuse forms heat conduction satellite wallboard.
The present invention's beneficial effect compared with prior art:
1, the present invention can ensure fuse integrality, and the combination of the second heat conduction diaphragm and fuse composing plate forms heat conduction fuse, effectively plays the effect of heat conduction.
2, the present invention effectively reduces the quality of satellite wallboard, and can significantly improve structure thermal control performance, and the first heat conduction diaphragm that top panel is pasted can realize the effect that temperature is evened up in face.
3, preparation process of the present invention is simple and easy, and operation easier is low, is applicable to pipelining.The present invention easily realizes mass and cost degradation, compared with prior art, effective reduction preparation cost, heat conduction diaphragm can mass production, arrangement in the pre-buried fuse of heat-conducting block easily realizes, and ensure that the integrality of fuse to greatest extent, is conducive to the useful life extending its internal electronic component, and then the allomeric function of satellite is played, there is larger application potential in satellite fields.
4, the present invention is applicable to various types of core structures, applied widely.
Accompanying drawing explanation
Fig. 1 is the perspective view of the heat conduction satellite wallboard when heat conduction fuse is heat conduction honeycomb core,
Fig. 2 is the perspective view of the heat conduction satellite wallboard when heat conduction fuse is heat conduction grid fuse,
Fig. 3 is the perspective view of the heat conduction satellite wallboard when heat conduction fuse is heat conduction pyramid fuse,
Fig. 4 is the plan structure schematic diagram of heat conduction pyramid fuse,
Fig. 5 is the main TV structure schematic diagram of upper panel 5,
Fig. 6 is the main TV structure schematic diagram of lower panel 6.
Embodiment
Embodiment one: composition graphs 1 illustrates present embodiment, present embodiment realizes according to following steps:
Step one: make lower panel 2 and heat conduction top panel 1: original plate is cut out top panel and lower panel 2 respectively by the size of regulation, is pasted with one deck first heat conduction diaphragm 7 in the upper surface of top panel and forms heat conduction top panel 1;
The multiple fuse composing plate assemblings being pasted with the second heat conduction diaphragm 8 are finally formed heat conduction fuse 3 by step 2: make heat conduction fuse 3: first the both sides of each fuse composing plate complete for preparation are respectively pasted with one deck second heat conduction diaphragm 8;
Step 3: plug heat conduction block 4: insert multiple heat conduction block 4 in heat conduction fuse 3 prepared by step 2;
Step 4: upper surface heat conduction top panel 1 being fixedly connected on heat conduction fuse 3, the lower surface that lower panel 2 is fixedly connected on heat conduction fuse 3 forms heat conduction satellite wallboard.
In present embodiment, top panel is the plate body that composite material or aluminium alloy are made, the upper surface of top panel is the face contacted with electronic devices and components, the upper surface of top panel is integrally formed heat conduction top panel 1 by be made as bonding with the first heat conduction diaphragm 7 of heat-conducting glue, and the amount of localized heat that satellite is produced is Fast-Balance in the upper surface of top panel.Heat conduction fuse 3 Heat Conduction Material is prepared into thermal conductive belt to be preset in fuse and to be formed, and is especially preset at the region that local chip caloric value is higher, thus improves the thermal control characteristic of fuse.The present invention is that local replaces the scheme of existing pre-buried heat pipe in satellite wallboard, makes satellite wallboard not only lightweight but also have good thermal control ability.
In present embodiment, multiple second heat conduction diaphragm 8 is connected with each fuse composing plate by bonding mode, multiple heat conduction block is that the mode by inlaying connection is inserted in heat conduction fuse, multiple second heat conduction diaphragm 8 forms thermal conductive belt with the multiple heat conduction blocks 4 be plugged in heat conduction fuse 3, and thermal conductive belt is a kind of passage of heat.First heat conduction diaphragm 7 and the second heat conduction diaphragm 8 are the lamellar body that graphite film or other heat conducting films are made.The block that heat conduction block 4 is carbon foam, the foam of graphite porous material, phase-change material or other heat conduction is made, its object arranged is filled in the space producing heat in heat conduction fuse.
Embodiment two: composition graphs 1 illustrates present embodiment, the top panel of heat conduction described in present embodiment 1 is bonding or be welded on the upper surface of heat conduction fuse 3, and lower panel 2 is bonding or be welded on the lower surface of heat conduction fuse 3.
When heat conduction top panel 1 and lower panel 2 be composite material plate body, heat conduction fuse 3 make for composite material fuse time, on the upper surface that heat conduction top panel 1 and lower panel 2 are bonded in heat conduction fuse 3 respectively and lower surface; When heat conduction top panel 1 and lower panel 2 be composite material plate body, heat conduction fuse 3 make for aluminium alloy plate body or other light-weight metals time, on the upper surface that heat conduction top panel 1 and lower panel 2 are bonded in heat conduction fuse 3 respectively and lower surface;
When heat conduction top panel 1 and lower panel 2 be plate body, heat conduction fuse 3 that aluminium alloy plate body or other light-weight metals are made make for composite material fuse time, on the upper surface that heat conduction top panel 1 and lower panel 2 are bonded in heat conduction fuse 3 respectively and lower surface; When the fuse that heat conduction top panel 1 and lower panel 2 to be plate body, heat conduction fuse 3 that aluminium alloy plate body or other light-weight metals are made be aluminium alloy plate body or other light-weight metals is made, on the upper surface that heat conduction top panel 1 and lower panel 2 are welded on heat conduction fuse 3 respectively and lower surface.Other composition and annexation identical with embodiment one.
Embodiment three: composition graphs 1 illustrates present embodiment, the sub-composing plate of present embodiment SMIS is corrugated plating, and heat conduction fuse 3 is heat conduction honeycomb core.In present embodiment, multiple fuse composing plate is corrugated plating, each corrugated plating both sides are respectively bonded with a second heat conduction diaphragm 8, then the multiple corrugated plating assemblings being bonded with the second heat conduction diaphragm 8 are formed heat conduction honeycomb core, again multiple heat conduction block 4 is embedded in heat conduction honeycomb core and produces heat compared with in the multiple polygonal through hole in large regions, setting like this, multiple second heat conduction diaphragm 8 and multiple heat conduction block 4 form a thermal conductive belt, thus put forward the thermal control characteristic of heat conduction honeycomb core, the heat that effective conduction satellite produces, the setting of thermal conductive belt simultaneously can ensure the integrality of hot honeycomb core, alleviate the weight of satellite wallboard.Other composition and annexation identical with embodiment one or two.Other composition and annexation identical with embodiment one or two.
Embodiment four: composition graphs 2 and Fig. 3 illustrate present embodiment, present embodiment realizes according to following steps:
Step one: make lower panel 2 and heat conduction top panel 1: original plate is cut out top panel and lower panel 2 respectively by the size of regulation, is pasted with one deck first heat conduction diaphragm 7 in the upper surface of top panel and forms heat conduction top panel 1;
Step 2: make heat conduction fuse 3: be first respectively pasted with one deck second heat conduction diaphragm 8 in the both sides of each fuse composing plate, secondly, the multiple fuse composing plates being pasted with the second heat conduction diaphragm 8 are being prepared, finally the multiple fuse composing plate assemblings after preparation are being formed heat conduction fuse 3;
Step 3: plug heat conduction block 4: insert multiple heat conduction block 4 in heat conduction fuse 3 prepared by step 2;
Step 4: upper surface heat conduction top panel 1 being fixedly connected on heat conduction fuse 3, the lower surface that lower panel 2 is fixedly connected on heat conduction fuse 3 forms heat conduction satellite wallboard.
In present embodiment, top panel is the plate body that composite material or aluminium alloy are made, the upper surface of top panel is the face contacted with electronic devices and components, the upper surface of top panel is integrally formed heat conduction top panel 1 by be made as bonding with the first heat conduction diaphragm 7 of heat-conducting glue, and the amount of localized heat that satellite is produced is Fast-Balance in the upper surface of top panel.Heat conduction fuse 3 Heat Conduction Material is prepared into thermal conductive belt to be preset in fuse and to be formed, and is especially preset at the region that local chip caloric value is higher, thus improves the thermal control characteristic of fuse.The present invention is that local replaces the scheme of existing pre-buried heat pipe in satellite wallboard, makes satellite wallboard i.e. lightweight but also has good thermal control ability.
In present embodiment, multiple second heat conduction diaphragm 8 is connected with each fuse composing plate by bonding mode, multiple heat conduction block is that the mode by inlaying link is inserted in heat conduction fuse, multiple second heat conduction diaphragm 8 forms thermal conductive belt with the multiple heat conduction blocks 4 be plugged in heat conduction fuse 3, and thermal conductive belt is a kind of passage of heat.First heat conduction diaphragm 7 and the second heat conduction diaphragm 8 be the lamellar body made of graphite film or other heat conducting films all.The block that heat conduction block 4 is carbon foam, the foam of graphite porous material, phase-change material or other heat conduction is made, its object arranged is filled in the space producing heat in heat conduction fuse, and its concrete shape is determined according to the shape in space in fuse.
Embodiment five: composition graphs 2 and Fig. 3 illustrate present embodiment, the top panel of heat conduction described in present embodiment 1 is bonding or be welded on the upper surface of heat conduction fuse 3, and lower panel 2 is bonding or be welded on the lower surface of heat conduction fuse 3.
When heat conduction top panel 1 and lower panel 2 be composite material plate body, heat conduction fuse 3 make for composite material fuse time, on the upper surface that heat conduction top panel 1 and lower panel 2 are bonded in heat conduction fuse 3 respectively and lower surface; When heat conduction top panel 1 and lower panel 2 be composite material plate body, heat conduction fuse 3 make for aluminium alloy plate body or other light-weight metals time, on the upper surface that heat conduction top panel 1 and lower panel 2 are bonded in heat conduction fuse 3 respectively and lower surface;
When heat conduction top panel 1 and lower panel 2 be plate body, heat conduction fuse 3 that aluminium alloy plate body or other light-weight metals are made make for composite material fuse time, on the upper surface that heat conduction top panel 1 and lower panel 2 are bonded in heat conduction fuse 3 respectively and lower surface; When the fuse that heat conduction top panel 1 and lower panel 2 to be plate body, heat conduction fuse 3 that aluminium alloy plate body or other light-weight metals are made be aluminium alloy plate body or other light-weight metals is made, on the upper surface that heat conduction top panel 1 and lower panel 2 are welded on heat conduction fuse 3 respectively and lower surface.Other composition and annexation identical with embodiment four.
Embodiment six: composition graphs 2, Fig. 3, Fig. 4, Fig. 5 and Fig. 6 illustrate present embodiment, the sub-composing plate of present embodiment SMIS is straight plate, and heat conduction fuse 3 is heat conduction grid fuse or heat conduction pyramid fuse.
When fuse composing plate is straight plate, first one deck second heat conduction diaphragm 8 is respectively pasted with in the both sides of each fuse composing plate, then each straight plate with the second heat conduction diaphragm 8 is being carried out to fluting processing, multiple straight plate with the second heat conduction diaphragm 8 is assembled by interlocking mode and is formed heat conduction grid fuse, heat conduction grid fuse comprises multiple triangle through hole, multiple heat conduction block 4 is also correspondingly set to tri-prismoid, is plugged in one by one in heat conduction grid fuse and produces in the larger triangle through hole of heat.
The assembled process of heat conduction pyramid fuse is as follows: the both sides of each fuse composing plate are respectively pasted with one deck second heat conduction diaphragm 8, the multiple fuse composing plates being pasted with the second heat conduction diaphragm 8 comprise multiple upper panel 5 and multiple lower panel 6, each upper panel 5 is bar shaped plate body, the lower limb of upper panel 5 is evenly processed with multiple first and inlays gap 5-1, the plate face of upper panel 5 is evenly processed with along its length multiple first inverted trapezoidal hole 5-2, the bottom surface in each first inverted trapezoidal hole is processed with the first strip gap 5-3, the opening direction of described first strip gap 5-3 is positioned at the first inverted trapezoidal hole 5-2, each first both sides of inlaying gap 5-1 are respectively processed with a first tri-angle-holed 5-4, each lower panel 6 is bar shaped plate body, the top edge of lower panel 6 is evenly processed with multiple second and inlays gap 6-1, the plate face of lower panel 6 is evenly processed with along its length multiple second inverted trapezoidal hole 6-2, the bottom surface of each second inverted trapezoidal hole 6-2 is processed with the second strip gap 6-3, the opening direction of described second strip gap 6-3 is positioned at outside the second inverted trapezoidal hole 6-2, each second both sides of inlaying gap 6-1 are respectively processed with a second tri-angle-holed 6-4, multiple upper panel 5 is inlayed gap 5-1 by first and is inlayed the clamping of gap 6-1 phase with second of multiple lower panel 6 and form heat conduction pyramid fuse.Above form multiple rectangular opening between panel 5 and lower panel 6 in heat conduction pyramid fuse, multiple heat conduction block 4 is also correspondingly set to rectangular shape, is plugged in one by one in heat conduction pyramid fuse and produces in the larger rectangular opening of heat.Other composition and annexation identical with five with embodiment four.
The scope of application of the present invention is not confined to above-mentioned honeycomb core, grid fuse and pyramid fuse, the fuse of other types uses too, and the process of preparation heat conduction fuse is in like manner in the process of preparation heat conduction honeycomb core, heat conduction grid fuse and heat conduction pyramid fuse.
Embodiment one: combine concrete enforcement one and four, Figure of description 1 to 6 explanation the present embodiment: in the present embodiment, the first heat conduction diaphragm 7 is all identical with structure with the second heat conduction diaphragm 8 material, in order to the combination property of heat conduction satellite wallboard prepared by thoroughly evaluating the present invention, ABAQUS finite element software will be adopted to simulate mechanics and the thermal control characteristic of preset " heat transmission belt " New Satellite cabin plate, numerical optimization work will be carried out to the geometric parameter of the thermal conductive belt that heat conduction diaphragm and heat-conducting block form simultaneously.
(1) thermal conductive belt is primarily of novel highly heat-conductive material, as: the formations such as graphite film, carbon foam, need to have carried out calculating deriving to the Thermal Parameter of material or structure, Thermal Parameter is specially thermal resistance, conductive coefficient, convection transfer rate etc., to use when the finite element modelling.
(2) with conventional satellite cabin plate for analytic target, the New Satellite cabin plate structure model of conventional satellite cabin plate and preset thermal conductive belt is set up with ABAQUS finite element software, disclose its heat transfer mechanism respectively, and compare the thermal control performance of two kinds of thermal control structures, specific implementation process is as follows:
Structure fuse: adopt aluminum alloy honeycomb, volume density is 110 kilograms per cubic meter, and the Equivalent Thermal Conductivities of cellular sandwich material is 1.5W/m-K.
Top panel and lower panel: adopt 6063 aluminium alloys, conductive coefficient is 120W/m-K.
Heat control system:
A type adopting heat pipes for heat transfer ability is 112 watts. rice, sectional dimension is 9.2mm × 30mm, and Type B adopting heat pipes for heat transfer ability is 448W.m, and sectional dimension is 15.6 × 30mm.Structure interior surface spray white paint infrared emittance is 0.9, and outer surface arranges OSR layer solar absorptance 0.2, infrared emittance 0.8
In order to prove that pre-buried thermal conductive belt scheme is better than conventional satellite cabin plate structure, We conducted the comparison of heat-transfer capability: under equal in quality condition (namely structural plane density is 10.4Kg/m2), the thermal source that the chip thermal source of total amount 36 watts and the symmetrical position 30 × 30 of structure interior surface four apply 10000 watts/square meter is applied at the symmetrical position of structure interior surface four, environment temperature 20 degree, external environment temperature-269.15 degree 4K.
The heat compensator conducting property of conventional satellite cabin plate is as follows: after being evened up by entirely pre-buried heat pipe in face, maximum temperature is 52.68 degree, and whole cabin plate structure maximum temperature difference is 30.57 degree.The wainscot mean temperature of contact electronic chip is 38.68 degree, temperature variance S=14.01 degree.
The heat compensator conducting property of satellite wallboard prepared by the present invention is as follows: after being evened up by carbon foam in face, maximum temperature is 29.29 degree, and whole cabin plate structure maximum temperature difference is 8.86 degree.The wainscot mean temperature of contact electronic chip is 25.97 degree, temperature variance S=3.32 degree.
Under equal in quality condition, we can find that preset carbon foam can make the Temperature Distribution in face more even, and the amplitude of relative conventional satellite cabin plate temperature change is more mild, and namely the value of temperature variance is less.In research process, also will according to actual condition, optimize heat-transfer path, the position of reasonable Arrangement heat transmission belt and area, relatively under identical heat-transfer capability condition, provide satellite wallboard prepared by the present invention and compare the value that conventional satellite cabin plate can alleviate quality, thus provide the foundation of reference to engineer applied department.The NM structure of the present embodiment and method step are with specifically to implement one or four identical.
Claims (6)
1. a preparation method for heat conduction satellite wallboard, is characterized in that: it realizes according to following steps:
Step one: make lower panel (2) and heat conduction top panel (1): original plate is cut out top panel and lower panel (2) respectively by the size of regulation, is pasted with one deck first heat conduction diaphragm (7) and forms heat conduction top panel (1) in the upper surface of top panel;
Step 2: make heat conduction fuse (3): first the both sides of each fuse composing plate complete for preparation are respectively pasted with one deck second heat conduction diaphragm (8), multiple fuse composing plate assemblings that finally will be pasted with the second heat conduction diaphragm (8) form heat conduction fuse (3);
Step 3: plug heat conduction block (4): insert multiple heat conduction block (4) in heat conduction fuse (3) prepared by step 2;
Step 4: upper surface heat conduction top panel (1) being fixedly connected on heat conduction fuse (3), the lower surface that lower panel (2) is fixedly connected on heat conduction fuse (3) forms heat conduction satellite wallboard.
2. the preparation method of a kind of heat conduction satellite wallboard according to claim 1, it is characterized in that: described heat conduction top panel (1) is bonding or be welded on the upper surface of heat conduction fuse (3), lower panel (2) is bonding or be welded on the lower surface of heat conduction fuse (3).
3. the preparation method of a kind of heat conduction satellite wallboard according to claim 1 and 2, is characterized in that: fuse composing plate is corrugated plating, and heat conduction fuse (3) is heat conduction honeycomb core.
4. a preparation method for heat conduction satellite wallboard, is characterized in that: it realizes according to following steps:
Step one: make lower panel (2) and heat conduction top panel (1): original plate is cut out top panel and lower panel (2) respectively by the size of regulation, is pasted with one deck first heat conduction diaphragm (7) and forms heat conduction top panel (1) in the upper surface of top panel;
Step 2: make heat conduction fuse (3): be first respectively pasted with one deck second heat conduction diaphragm (8) in the both sides of each fuse composing plate, secondly, the multiple fuse composing plates being pasted with the second heat conduction diaphragm (8) are being prepared, finally the multiple fuse composing plate assemblings after preparation are being formed heat conduction fuse (3);
Step 3: plug heat conduction block (4): insert multiple heat conduction block (4) in heat conduction fuse (3) prepared by step 2;
Step 4: upper surface heat conduction top panel (1) being fixedly connected on heat conduction fuse (3), the lower surface that lower panel (2) is fixedly connected on heat conduction fuse (3) forms heat conduction satellite wallboard.
5. the preparation method of a kind of heat conduction satellite wallboard according to claim 4, it is characterized in that: described heat conduction top panel (1) is bonding or be welded on the upper surface of heat conduction fuse (3), lower panel (2) is bonding or be welded on the lower surface of heat conduction fuse (3).
6. the preparation method of a kind of heat conduction satellite wallboard according to claim 4 or 5, is characterized in that: fuse composing plate is straight plate, and heat conduction fuse (3) is heat conduction grid fuse or heat conduction pyramid fuse.
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| CN201510220895.4A CN104918459A (en) | 2015-05-04 | 2015-05-04 | Method for preparing thermal-conductive satellite siding |
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| CN105787188A (en) * | 2016-03-10 | 2016-07-20 | 浙江大学 | Regular triangular prismoid sandwich structure and design method and application thereof |
| CN109413964A (en) * | 2018-12-14 | 2019-03-01 | 北京无线电测量研究所 | A kind of and integrated spaceborne phase array radar load of satellite platform structure thermal control |
| CN110662406A (en) * | 2019-11-04 | 2020-01-07 | 深圳航天东方红海特卫星有限公司 | Phase-change heat exchanger |
| CN114051359A (en) * | 2021-10-26 | 2022-02-15 | 华睿交通科技有限公司 | Antenna plate cold guide plate, millimeter wave radar cold guide structure and temperature field simulation method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105787188A (en) * | 2016-03-10 | 2016-07-20 | 浙江大学 | Regular triangular prismoid sandwich structure and design method and application thereof |
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| CN114051359A (en) * | 2021-10-26 | 2022-02-15 | 华睿交通科技有限公司 | Antenna plate cold guide plate, millimeter wave radar cold guide structure and temperature field simulation method thereof |
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Application publication date: 20150916 |