CN109365012A - A kind of packaging method of sandwich type structural - Google Patents
A kind of packaging method of sandwich type structural Download PDFInfo
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- CN109365012A CN109365012A CN201811265060.0A CN201811265060A CN109365012A CN 109365012 A CN109365012 A CN 109365012A CN 201811265060 A CN201811265060 A CN 201811265060A CN 109365012 A CN109365012 A CN 109365012A
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- chip
- type structural
- micro
- sandwich type
- packaging bag
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Dispersion Chemistry (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Hematology (AREA)
- Clinical Laboratory Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Automatic Analysis And Handling Materials Therefor (AREA)
Abstract
The invention discloses a kind of packaging method of sandwich type structural, include the following steps: S1, by chip with micro-structure with cover plate while be bonded with double-sided adhesive；S2, the chip handled through step S1 is packed into packaging bag, pressurizeed after then vacuumizing the packaging bag；S3, the chip handled through step S2 is taken out from packaging bag, is then bonded another chip with double-sided adhesive with the another side of cover plate with the one side of micro-structure；S4, the chip handled through step S3 is packed into packaging bag, pressurizeed after then vacuumizing the packaging bag, complete encapsulation.For the present invention when cover plate two sides has the sandwich type structural of chip, by being vacuumized encapsulation twice step by step, avoiding when disposably vacuumizing encapsulation has the phenomenon that leakage.
Description
Technical field
The invention belongs to micro-total analysis system (μ-TAS:Micro Total Analysis System) technical fields, special
It is not related to a kind of packaging method of sandwich type structural.
Background technique
Micro-fluidic chip is by technologies such as micro Process, precise injection molding, tradition machinery processing, in several square centimeters of substrate
On, production microchannel, Micropump, micro-valve, structures and other functional units such as micro- liquid storage device, realize collection micro-example preparation, sample introduction,
React, separate and be detected on integrated quick, efficient, low consumption micro-full analytical system.
Micro-fluidic chip rapidoprint includes various glass, metal, silicon wafer, polymer material etc..Because of cheap, forming
It is easy and produces in batches advantage at low cost, polymer material such as dimethyl silicone polymer (PDMS), poly-methyl methacrylate
Ester (PMMA), polycarbonate (PC) and other various plastics etc. are widely adopted.No matter which kind of material is used, micro-fluidic chip
Encapsulation process be all it is essential, especially for the mass production field of micro-fluidic chip, the yield rate and production of chip
Efficiency is most important.
Patent document 1 discloses the encapsulation side that a kind of (CN102092669A) micro-fluidic chip surface treatment combines hot pressing
Method.By using the organic reagents such as chloroform, dichloroethanes, hexamethylene, n-hexane or ethyl acetate handle organic material cover plate and
Substrate surface, after drying surface layer slightly soluble, using the packaging method of conventional pneumatic hot press heating pressurization.In addition, patent document 2
A kind of (CN103264502A) bonding bonding method of rigid polymer micro-fluidic chip is disclosed, is viscous by metal block hot pressing
The packaged type of layers of chips is connect, wherein having bonding muscle, another layer of chip surface spin coating around the micro-fluidic structure of one layer of chip
Acetone solvent.The above method can improve yield rate while preventing microchannel from deforming and blocking.But above two method
Shortcoming is that organic reagent is possible to have adverse effect or its residue in chip the biochemical reagents prestored in microchannel
The biochemical reaction that will be carried out has inhibiting effect, and the one single chip production cycle is long, is not easy to mass production.
It is a kind of based on ultra-violet curing agent bond plastic microfluidic analysis chip that patent document 3 discloses (CN1557967)
Packaging method.Two panels is bonded with the natural compatibility of plastics itself using dimethyl silicone polymer, recycles ultra-violet curing viscous
Two panels plastic sheet is bonded by mixture, completes the permanent encapsulation of the plastic microfluidic chip of three-decker.Aim to overcome that heat
The microchannel blockage problem of packaging method microchannel problem on deformation and adhering method.By centrifugal force in chip in the packaging method
The mode of surface coating ultra-violet curing agent defines chip form, and is still difficult to avoid during gluing shallower micro- logical
The problem of road blocks, and the uniformity of gluing is very high to chip surface flatness requirement.
Patent document 4(CN1480724A) disclose a kind of encapsulation side of polymeric micro-fluidic chip based on laser bonding
Method and device.Using laser beam of the clarity plastic layer to bonding position is penetrated, the chip material layer to be bonded is made to reach congruent melting,
Melt bond area to form infiltration, completes the packaged type of close sealing-in.The method be although easy to automatically control, bonding speed and
High reliablity, but laser bonding device construction is complicated, equipment is expensive, at least one component needs in two components of bonding
If, two components transparent to the optical maser wavelength position coating or filling also needed in two component bondings all transparent to optical maser wavelength
The bioactivity that one layer of absorbing membrane, this absorbing membrane layer largely will affect in biochemical and medical treatment detection reaction causes
The failure of an experiment.In addition, the high heat generated during laser bonding can destroy the biological sample that chip interior embeds in advance,
Lead to sample inactive, be a bottleneck in current biochemistry detection field.
Said chip packaging method, whether chip surface processing combine hot pressing or ultra-violet curing agent bonding or laser
Bonding all has that supplementary instrument device structure is complicated, expensive, and chip fabrication processes are cumbersome, fabrication cycle length is not easy industrialization
The drawbacks of production, and organic solvent used in it can also inhibit the biochemical reaction on chip.
Patent document 5(CN105460888A) disclose a kind of micro-fluidic chip substrate and cover plate double-sided adhesive or one side glue
It is bonded the method that latter step vacuumizes pressurization encapsulation.But this method has substrate in tow sides, when disposably vacuumizing encapsulation
There is the phenomenon that chip leakage.
Summary of the invention
It is an object of the invention to: the packaging method of sandwich type structural is provided, is taken out step by step after being bonded by double-sided adhesive true
The method of sky pressurization, by being vacuumized encapsulation twice step by step, is kept away when cover plate two sides has the sandwich type structural of chip
Exempt from have the phenomenon that leakage when disposably vacuumizing encapsulation.
The technical solution adopted by the invention is as follows:
A kind of packaging method of sandwich type structural, includes the following steps:
Step 1, by chip with micro-structure with cover plate while be bonded with double-sided adhesive；
The chip handled through step 1 is packed into packaging bag by step 2, is pressurizeed after then vacuumizing the packaging bag；
Step 3 takes out the chip handled through step 2 from packaging bag, then another chip is had to the one side of micro-structure
It is bonded with the another side of cover plate with double-sided adhesive；
The chip handled through step 3 is packed into packaging bag by step 4, is pressurizeed after then vacuumizing the packaging bag, is completed envelope
Dress.
Wherein, the chip is the micro-fluidic chip with micro-structure；The micro-structure include reaction tank, microchannel, into
Sample hole and gas vent.
Wherein, the material of the chip, at least one in resin, plastics, silicon rubber, glass, ceramics, silicon and metal
Kind.
Wherein, the plastics are selected from least one of PMMA, PC, COC, PET and COP.
Wherein, the cover plate is thermal conductance cover plate, and material is selected from least one of silicon and metal.
Wherein, the metal is selected from least one of good metal materials of thermal conductivity such as copper, aluminium, alloy.
Wherein, the glue material of the double-sided adhesive is to have sticking material；The transparency of the double-sided adhesive is transparent, translucent
Or it is opaque.
Wherein, the type of the double-sided adhesive is any one in pressure-sensitive, responsive to temperature type and light intensity sensitive
Kind.
Wherein, the packaging method of the sandwich type structural, further includes following steps: in step 2 and step 4 by the packaging
After the step of bag pressurizes after vacuumizing or while pressurization, heating or illumination are carried out to the packaging bag.
Wherein, the chip is identical with the shape of cover plate, specially circle, rectangle, annular or sector.
In conclusion by adopting the above-described technical solution, the beneficial effects of the present invention are:
1, the present invention, by being vacuumized encapsulation twice step by step, is kept away when cover plate two sides has the sandwich type structural of chip
Exempt from have the phenomenon that leakage when disposably vacuumizing encapsulation.
2, in the packaging method of chip of the invention, the process that vacuumizes can improve the fastness of chip after encapsulation,
It can guarantee that micro-fluidic chip bonding plane does not occur bubble again, making it not only realizes the aesthetics of micro-fluidic chip product appearance,
The bonding plane securely high usability without leakage is realized again.It solves chip product simultaneously to need to be vacuum-packed so as to long-term preservation
The problem of
3, in the packaging method of chip of the invention, punching press again is first packed, it is issuable to core to avoid subsequent punching press link
The scuffing on piece surface；The production line of chip has also been widened simultaneously, that is, the chip punching press link after packing can be in normal circumstances
If chip punching press must be carried out in ultra-clean chamber if equally can ensure that the cleanliness of chip, not packing.
4, in the packaging method of chip of the invention, chip finished product seal-packed work is completed while the chip package
Sequence, it is simple process, time saving and energy saving, the purpose of micro-fluidic chip scale, high-volume, low cost production may be implemented.
5, in the packaging method of chip of the invention, the cover plate is silicon or the good metal material of thermal conductivity, one side
The thermal conductivity of its material is good, for whole chip using when warming and cooling rate and each reaction tank between temperature difference have
It is obviously improved；Second aspect can paste upper disk due to not being transparent material with two sides, so that the entirety for improving chip is logical
Amount；The third aspect can be improved the signal strength of chip entirety and detect sensitive since surface can reflect detection signal
Degree.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 is packaging technology process figure of the invention.
The chip structure exploded view of packaged one side when Fig. 2 is using packaging technology of the invention.
Fig. 3 a is the chip structure exploded view packaged using packaging technology of the invention.
Fig. 3 b is the chip structure front schematic view packaged using packaging technology of the invention.
Fig. 3 c is the chip structure reverse side schematic diagram packaged using packaging technology of the invention.
Fig. 4 a is the chip front side pictorial diagram packaged using packaging technology of the invention.
Fig. 4 b is the chip reverse side pictorial diagram packaged using packaging technology of the invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that described herein, specific examples are only used to explain the present invention, not
For limiting the present invention, i.e., described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is logical
The component for the embodiment of the present invention being often described and illustrated herein in the accompanying drawings can be arranged and be designed with a variety of different configurations.
Therefore, the detailed description of the embodiment of the present invention provided in the accompanying drawings is not intended to limit below claimed
The scope of the present invention, but be merely representative of selected embodiment of the invention.Based on the embodiment of the present invention, those skilled in the art
Member's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
It should be noted that the relational terms of term " first " and " second " or the like be used merely to an entity or
Operation is distinguished with another entity or operation, and without necessarily requiring or implying between these entities or operation, there are any
This actual relationship or sequence.Moreover, the terms "include", "comprise" or its any other variant be intended to it is non-exclusive
Property include so that include a series of elements process, method, article or equipment not only include those elements, but also
Further include other elements that are not explicitly listed, or further include for this process, method, article or equipment it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including described
There is also other identical elements in the process, method, article or equipment of element.
Inventive concept of the invention are as follows:
A kind of packaging method of sandwich type structural, includes the following steps:
S1, by chip with micro-structure with cover plate while be bonded with double-sided adhesive；
S2, the chip handled through step S1 is packed into packaging bag, pressurizeed after then vacuumizing the packaging bag；
S3, the chip handled through step S2 is taken out from packaging bag, then by another chip with micro-structure one side with
The another side of cover plate is bonded with double-sided adhesive；
S4, the chip handled through step S3 is packed into packaging bag, pressurizeed after then vacuumizing the packaging bag, complete encapsulation.
The present invention vacuumizes pressurization method after being bonded by double-sided adhesive had both solved present in conventional pressurization bonding method
Bonding plane loosely cause to come unglued leakage and bonding plane bubble the problem of, also synchronize solve chip product need be vacuum-packed so as to
The problem of long-term preservation.Also, the present invention is when chip two sides has substrate, by being vacuumized encapsulation twice step by step,
Avoiding when disposably vacuumizing encapsulation has the phenomenon that chip leakage.
Feature and performance of the invention are described in further detail with reference to embodiments.
Embodiment 1
The packaging method for a kind of sandwich type structural that present pre-ferred embodiments provide, to encapsulate the miniflow of three-layer sandwich type structure
For controlling chip, specifically:
The upper surface of the chip I of micro-fluidic chip and the lower surface of chip II are processed by reaction tank, microchannel, sample introduction using milling cutter
The micro-structures such as hole get through hole in the micro-structure sample holes corresponding position of chip I and chip II with perforator, which is gas vent.
The material of the chip I and chip II, in resin, plastics, silicon rubber, glass, ceramics, silicon and metal extremely
Few one kind；The plastics are selected from least one of PMMA, PC, COC, PET and COP.
The cover plate of the chip is thermal conductance cover plate, and material is selected from least one of silicon and metal；The metal is selected from
At least one of good metal material of the thermal conductivity such as copper, aluminium, alloy.
Then chip I is directed at fitting with double-sided adhesive with the one side of cover plate, the mode of fitting can paste for automatic or manual
Film, chip is packed into packaging bag and vacuumizes packaging after fitting, and then packaging bag is placed on stamping equipment and is carried out to chip in bag
Stamping process completes the encapsulation of the one side of micro-fluidic chip, and the microfluidic chip structure of packaged one side decomposes such as Fig. 2 at this time
It is shown.
Then the micro-fluidic chip of packaged one side is taken out from packaging bag, then by the another side of chip II and cover plate
Alignment fitting, the mode of fitting equally can be automatic or manual pad pasting, and the micro-fluidic chip after fitting is packed into packaging bag and takes out
Then packaging bag is placed on stamping equipment and carries out stamping process to chip in bag, completes the envelope of micro-fluidic chip by vacuum packaging
Dress, microfluidic chip structure packaged at this time are as shown in Figure 3a, 3b and 3c as shown in.
The glue material of the double-sided adhesive is to have sticking material；The transparency of the double-sided adhesive is transparent, translucent or not
It is transparent.
The shape of the chip I, chip II and cover plate can be identical or different, can be various shape, it is generally preferable to, institute
It is identical with the shape of cover plate to state chip I, chip II, specially circle, rectangle, annular or sector.
Below by taking the chip in kind of encapsulation one as an example, the shape of the chip I, chip II and cover plate is annular:
Firstly, chip I is directed at fitting with double-sided adhesive with the one side of cover plate, the mode of fitting can be automatic or manual pad pasting,
Be packed into after fitting and packaging bag and vacuumize packaging, then by packaging bag be placed on stamping equipment with the pressure of 0.7MPa in bag into
Row punching press is simultaneously kept for 1 minute, closely bonds the chip I of micro-fluidic chip and cover plate.
Then the micro-fluidic chip of packaged one side is taken out from packaging bag, then by the another side of chip II and cover plate
Fitting is directed at chip II, the mode of fitting equally can be automatic or manual pad pasting, and packaging bag is packed into after fitting and is vacuumized
Then packaging bag is placed on stamping equipment with the pressure of 0.7MPa to punching press and holding 1 minute is carried out in bag, completes micro- by packaging
The encapsulation of fluidic chip；Micro-fluidic chip after encapsulation is as shown in Figs. 4a and 4b, by photo it can be observed that according to the present invention
The chip of packaging process production do not occur bubble and micro-channels securely without leakage phenomena such as, make it not only and realize and is micro-
The aesthetics of fluidic chip product appearance, and realize the bonding plane securely high usability without leakage.
Embodiment 2
While packaging bag being placed on stamping equipment after carrying out stamping process to chip in bag, or carries out stamping process,
Packaging technology is selected according to the type of double-sided adhesive:
When the type of the double-sided adhesive is pressure-sensitive, packaging bag is placed on stamping equipment, chip in bag is carried out at punching press
Reason；
When the type of the double-sided adhesive is responsive to temperature type, packaging bag is placed on stamping equipment, chip in bag is carried out at punching press
After reason, or while progress stamping process, the packaging bag is heated；
When the type of the double-sided adhesive is light intensity sensitive, packaging bag is placed on stamping equipment, chip in bag is carried out at punching press
After reason, or while progress stamping process, illumination is carried out to the packaging bag.Generally preferably use common ultraviolet lighting
Packaging bag is placed on stamping equipment after carrying out stamping process to chip in bag, or carries out at punching press by responsive type double-sided adhesive
While reason, UV Light is carried out to the packaging bag.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (10)
1. a kind of packaging method of sandwich type structural, which comprises the steps of:
Step 1, by chip with micro-structure with cover plate while be bonded with double-sided adhesive；
The chip handled through step 1 is packed into packaging bag by step 2, is pressurizeed after then vacuumizing the packaging bag；
Step 3 takes out the chip handled through step 2 from packaging bag, then another chip is had to the one side of micro-structure
It is bonded with the another side of cover plate with double-sided adhesive；
The chip handled through step 3 is packed into packaging bag by step 4, is pressurizeed after then vacuumizing the packaging bag, is completed envelope
Dress.
2. the packaging method of sandwich type structural as described in claim 1, which is characterized in that the chip is with micro-structure
Micro-fluidic chip；The micro-structure includes reaction tank, microchannel, sample holes and gas vent.
3. the packaging method of sandwich type structural as described in claim 1, which is characterized in that the material of the chip, selected from tree
At least one of rouge, plastics, silicon rubber, glass, ceramics, silicon and metal.
4. the packaging method of sandwich type structural as claimed in claim 3, which is characterized in that the plastics be selected from PMMA, PC,
At least one of COC, PET and COP.
5. the packaging method of sandwich type structural as described in claim 1, which is characterized in that the cover plate is thermal conductance cover plate,
Material is selected from least one of silicon and metal.
6. the packaging method of sandwich type structural as claimed in claim 5, which is characterized in that the metal is selected from copper, aluminium, alloy
Etc. at least one of the good metal material of thermal conductivity.
7. the packaging method of sandwich type structural as described in claim 1, which is characterized in that the glue material of the double-sided adhesive be with
The material of viscosity；The transparency of the double-sided adhesive is transparent, translucent or opaque.
8. the packaging method of sandwich type structural as claimed in claim 1 or 7, which is characterized in that the type of the double-sided adhesive is selected
From any one in pressure-sensitive, responsive to temperature type and light intensity sensitive.
9. the packaging method of sandwich type structural as claimed in claim 8, which is characterized in that further include following steps: in step 2
After the packaging bag is vacuumized with step 4 pressurize the step of after or pressurization while, to the packaging bag carry out heating or
Illumination.
10. the packaging method of sandwich type structural as described in claim 1, which is characterized in that the shape of the chip and cover plate
It is identical, specially circle, rectangle, annular or sector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811265060.0A CN109365012A (en) | 2018-10-29 | 2018-10-29 | A kind of packaging method of sandwich type structural |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811265060.0A CN109365012A (en) | 2018-10-29 | 2018-10-29 | A kind of packaging method of sandwich type structural |
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| CN109365012A true CN109365012A (en) | 2019-02-22 |
Family
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| CN201811265060.0A Pending CN109365012A (en) | 2018-10-29 | 2018-10-29 | A kind of packaging method of sandwich type structural |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103263950A (en) * | 2013-05-27 | 2013-08-28 | 苏州扬清芯片科技有限公司 | Manufacture method of glass base heterozygosis micro-fluidic chip |
| US20130302947A1 (en) * | 2011-01-30 | 2013-11-14 | Nantong Fujitsu Microelectronics Co., Ltd. | Packaging method |
| CN105460888A (en) * | 2015-11-19 | 2016-04-06 | 博奥生物集团有限公司 | Chip packaging method |
| CN106423319A (en) * | 2016-11-07 | 2017-02-22 | 北京博奥晶典生物技术有限公司 | Specimen analysis chip and application method thereof |
-
2018
- 2018-10-29 CN CN201811265060.0A patent/CN109365012A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130302947A1 (en) * | 2011-01-30 | 2013-11-14 | Nantong Fujitsu Microelectronics Co., Ltd. | Packaging method |
| CN103263950A (en) * | 2013-05-27 | 2013-08-28 | 苏州扬清芯片科技有限公司 | Manufacture method of glass base heterozygosis micro-fluidic chip |
| CN105460888A (en) * | 2015-11-19 | 2016-04-06 | 博奥生物集团有限公司 | Chip packaging method |
| CN106423319A (en) * | 2016-11-07 | 2017-02-22 | 北京博奥晶典生物技术有限公司 | Specimen analysis chip and application method thereof |
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Application publication date: 20190222 |