CN109275263A - A kind of preparation method and FPC plate of FPC plate - Google Patents
A kind of preparation method and FPC plate of FPC plate Download PDFInfo
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- CN109275263A CN109275263A CN201811408288.0A CN201811408288A CN109275263A CN 109275263 A CN109275263 A CN 109275263A CN 201811408288 A CN201811408288 A CN 201811408288A CN 109275263 A CN109275263 A CN 109275263A
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- fpc plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
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- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a kind of preparation method of FPC plate and FPC plates, comprising: the size for determining FPC plate to be prepared selectes flexible base board according to the size of FPC plate；On flexible substrates surface setting top layer, in the lower surface of flexible base board, bottom is set, in top layer, bottom wherein one layer be signals layer, another layer is that signal flows back reference layer；The first cover film is set in signal layer surface, the second cover film is set with reference to layer surface in signal reflux, and windowing processing is carried out to the first cover film, the second cover film, the conductively network of conductively network and signal the reflux reference layer of signals layer is exposed；The first electromagnetic shielding film is set in the first covering film surface, and the second electromagnetic shielding film is set in the second covering film surface, to obtain FPC plate.Above-mentioned technical proposal disclosed in the present application plays the role of electromagnetic shielding using electromagnetic shielding film, to solve electromagnetic compatibility problem, to avoid generating electromagnetic interference in signals transmission as far as possible.
Description
Technical field
The present invention relates to smart electronics product technical fields, a kind of preparation method more specifically to FPC plate and
FPC plate.
Background technique
With the development of science and technology, powerful, compact smart electronics product has become people's life and work not
One of the important component that can lack.It is limited by physical size and space, product needs to be divided into multiple independent feature boards
Card is to make full use of physical space, and therefore, this just needs the soft arranging wire of various specifications (different length and number of signals) to connect
Connector on functional cards, to realize the connection between functional cards, to realize the transmission of signal.
Referring to Fig. 1 and Fig. 2, wherein Fig. 1 shows the top view of existing soft arranging wire, and Fig. 2 shows the sides of existing soft arranging wire
View comprising substrate, the signal transmitting layer positioned at substrate upper and lower surfaces and signal reflux layer.Due to not deposited on soft arranging wire
In shielded layer, therefore, in signals transmission, signal be easy to cause electromagnetic radiation, generates electromagnetic interference, and this then can be to production
The performance and normal work of product bring adverse effect.
In conclusion how to avoid generating electromagnetic interference in signals transmission as far as possible, to reduce the performance to product
It is influenced with brought by normal work, is current those skilled in the art technical problem urgently to be resolved.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of preparation method of FPC plate and FPC plate, to avoid believing as far as possible
Electromagnetic interference is generated in number transmission process, so that reduce electromagnetic interference influences on the performance of product and brought by working normally.
To achieve the goals above, the invention provides the following technical scheme:
A kind of preparation method of FPC plate, comprising:
The size for determining FPC plate to be prepared selectes flexible base board according to the size of the FPC plate；
Top layer is set in the flexible base board upper surface and bottom is set in the lower surface of the flexible base board, wherein institute
State top layer, in the bottom wherein one layer be signals layer, another layer is signal reflux reference layer；
The first cover film is set in the signal layer surface, in signal reflux with reference to the second covering of layer surface setting
Film, and windowing processing is carried out to first cover film, second cover film, by the conductively network of the signals layer and
The conductively network of the signal reflux reference layer exposes；
The first electromagnetic shielding film is set in the first covering film surface, and in the second covering film surface setting second
Electromagnetic shielding film, wherein first electromagnetic shielding film is connected with the conductively network of the signals layer, second electromagnetic screen
It covers film to be connected with the conductively network of the signal reflux layer, to obtain the FPC plate.
Preferably, windowing processing is carried out to first cover film, second cover film, by the signals layer and institute
The conductively network for stating signal reflux reference layer exposes, comprising:
Windowing processing is carried out to the first cover film at the signals layer conductively network site, with obtain for it is described
The first connected tie point of first electromagnetic shielding film；
Windowing processing is carried out to the second cover film at signal reflux reference layer conductively network site, to be used
In the second tie point being connected with second electromagnetic shielding film.
Preferably, the first electromagnetic shielding film is set in the first covering film surface, and in the second covering film surface
It is arranged after the second electromagnetic shielding film, further includes:
It is handled by surface of the golden finger processing method to the FPC plate.
Preferably, first electromagnetic shielding film, second electromagnetic shielding film are any one in Al, Cu, Ni, Ti
Kind or any a variety of combination.
A kind of FPC plate, comprising: flexible base board, is arranged described the top layer being arranged on the upper surface of the flexible base board
Bottom on the lower surface of flexible base board, any layer in the top layer, the bottom are signals layer, and another layer is that signal flows back
Reference layer, further includes:
The first electromagnetic screen that first cover film of the signal layer surface is set, the first covering film surface is set
Film is covered, signal reflux is set with reference to the second cover film of layer surface and is arranged in the of the second covering film surface
Two electromagnetic shielding films；
Wherein, first electromagnetic shielding film is connected with the conductively network of the signals layer, second electromagnetic shielding
Film is connected with the conductively network of the signal reflux layer.
Preferably, first electromagnetic shielding film is connected with the signals layer by the first tie point, second electromagnetism
Screened film is connected with signal reflux reference layer by the second tie point；
Wherein, the position that the signals layer conductively network is corresponded on first cover film is arranged in first tie point
Set place, the position that the signal reflux reference layer conductively network is corresponded on second cover film is arranged in second tie point
Set place.
Preferably, first tie point, second tie point are round or rectangular, and first tie point it
Between center be respectively less than away from the center between S and second tie point away from S and be equal to λ/20；
Wherein, λ is the wavelength of signal, and λ=c/F, c are the velocity of wave of signal, and F is the highest transmission frequency of signal.
Preferably, the size of first tie point, the size of second tie point are all larger than equal to 0.8mm.
Preferably, the width of the conductively network of the signals layer is more than or equal to the size of first tie point.
Preferably, the signal reflux reference layer is reticular structure.
The present invention provides a kind of preparation method of FPC plate and FPC plates, wherein this method comprises: prepared by determination
FPC plate size, according to the size of FPC plate select flexible base board；Surface is arranged top layer and in flexible base on flexible substrates
Bottom is arranged in the lower surface of plate, wherein in top layer, bottom wherein one layer be signals layer, another layer is that signal flows back reference layer；
Signal layer surface be arranged the first cover film, signal reflux with reference to layer surface be arranged the second cover film, and to the first cover film,
Second cover film carries out windowing processing, and the conductively network of conductively network and signal the reflux reference layer of signals layer is exposed
Out；The first electromagnetic shielding film is set in the first covering film surface, and the second electromagnetic shielding film is set in the second covering film surface,
Wherein, the first battery screened film is connected with the conductively network of signals layer, the conduction of the second electromagnetic shielding film and signal reflux layer
Ground network is connected, to obtain FPC plate.
Top layer and bottom is respectively set on the surface of flexible base board in above-mentioned technical proposal disclosed in the present application, by top layer and
Wherein one layer of conduct signals layer in bottom uses, and other one layer is used as signal reflux reference layer, in signals layer table
The first cover film is arranged in face, the second cover film is arranged with reference to layer surface in signal reflux, and carry out windowing processing to cover film, with
By signals layer and signal reflux reference layer conductively network expose, then, the first cover film surface setting with
The first connected electromagnetic shielding film of the conductively network of signals layer, and in the second covering film surface setting and signal reflux reference layer
Connected the second electromagnetic shielding film of conductively network, to play the role of electromagnetic shielding using electromagnetic shielding film, to solve electricity
Magnetic compatibling problem to avoid generating electromagnetic interference in signals transmission as far as possible, and then is reduced to the performance of product and just
Often influenced brought by work.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the top view of existing soft arranging wire；
Fig. 2 is the side view of existing soft arranging wire；
Fig. 3 is the flow chart of the preparation method of FPC plate provided in an embodiment of the present invention；
Fig. 4 is the structural schematic diagram of prepared FPC plate provided in an embodiment of the present invention；
Fig. 5 is the schematic diagram of signal layer surface provided in an embodiment of the present invention；
Fig. 6 is the schematic diagram of signal provided in an embodiment of the present invention reflux reference layer；
Fig. 7 is the schematic diagram of set tie point provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Refer to Fig. 3 and Fig. 4, wherein Fig. 3 shows the process of the preparation method of FPC plate provided in an embodiment of the present invention
Figure, Fig. 4 show the structural schematic diagram of prepared FPC plate provided in an embodiment of the present invention.It is provided in an embodiment of the present invention
A kind of preparation method of FPC plate may include:
S11: determining the size of FPC plate to be prepared, selectes flexible base board according to the size of FPC plate.
According to FPC plate (Flexible Printed Circuit Board, the flexible circuit board) soft arranging wire to be substituted
Size (by taking the dimension line of Fig. 1 and soft row illustrated in fig. 2 as an example) or the specification of the FPC plate connector to be connected want
Seek the size of book design FPC plate.Wherein, the size of FPC plate to be prepared includes but is not limited to length L, the FPC plate of FPC plate
The thickness T of width W, FPC plate, substrate thickness Ct, connect PAD (pad) length S1, connect PAD width C w, connection
Center spacing P between PAD, the quantity for connecting PAD, circuit board port support band 6 length d1 and d2 (d1 and d2 are all larger than
S1 exerts oneself in order to install plug).
After the size for determining FPC plate to be prepared, according to the size selection flexible base board 1 of FPC plate as preparation
The substrate of FPC plate.
It should be noted that the application does not do any restriction to the concrete model or specification of 1 material therefor of flexible base board,
But its flexibility need to meet curvature requirement of the soft arranging wire to be substituted in product normal mounting and maintenance, be specifically as follows
Polyimides or polyester film etc..
S12: surface is arranged top layer and bottom is arranged in the lower surface of flexible base board on flexible substrates, wherein top layer,
In bottom wherein one layer be signals layer, another layer be signal reflux reference layer.
After selected flexible base board 1, then top layer (top layers) are set in the upper surface of flexible base board 1, and in flexible base board
Bottom (bottom layers) are arranged in 1 lower surface, wherein top layer and bottom are conductive material.
It is used any layer in top layer, bottom as signals layer 2 (i.e. transmission signal), and another layer is returned as signal
Reference layer 3 (i.e. signal reflux) is flowed to use.Specifically, it can use top layer as signals layer 2, and be returned bottom as signal
Reference layer 3 is flowed to use；Or it is used bottom as signals layer 2, and used top layer as signal reflux reference layer 3.Wherein,
Here it is illustrated so that top layer is signals layer 2, bottom is signal reflux reference layer 3 as an example, is signals layer 2, top layer as bottom
For signal flow back reference layer 3 the case where it is then similar with above situation, specifically can refer to above situation, details are not described herein.
After determining signals layer 2 and signal reflux reference layer 3, signals layer 2 and signal reflux reference layer 3 can be carried out
Design, design can specifically include design connection PAD, circuit board port support band 6, transmit signal cabling and for
The connected conductively network (GND) of the ground network (GND) of product, wherein the size of set connection PAD, the number for connecting PAD
Amount, the size of circuit board port support band 6 may refer to foregoing description.
Wherein, for the ease of the production and processing of signal reflux reference layer 3, and in order to improve prepared FPC plate
Degree of flexibility, the then reference layer 3 that signal can flow back are set as reticular structure.It is of course also possible to be set to solid construction etc..
S13: being arranged the first cover film in signal layer surface, and the second cover film is arranged with reference to layer surface in signal reflux, and
Windowing processing is carried out to the first cover film, the second cover film, by conductively network and signal the reflux reference layer of signals layer
Conductively network exposes.
In view of subsequent set electromagnetic shielding film is (conductive) being prepared by conductive material, in order to avoid
Electromagnetic shielding film has an impact the normal transmission of signal when being directly in contact with signals layer 2 and signal reflux reference layer 3, then
After to signals layer 2 and signal reflux 3 complete design of reference layer, first cover film can be set on the surface of signals layer 2, and
On the surface of signal reflux reference layer 3, the second cover film is set.Wherein, the first cover film and the second cover film are insulating properties
Material.
Windowing processing is carried out to the first cover film, the conductively network of signals layer 2 is exposed, and is covered to second
Film carries out windowing processing, the conductively network of signal reflux reference layer 3 is exposed, consequently facilitating conductively network is with after
Continue the connection between set electromagnetic shielding film.
S14: the first electromagnetic shielding film is set in the first covering film surface, and the second electromagnetism is set in the second covering film surface
Screened film, wherein the first electromagnetic shielding film is connected with the conductively network of signals layer, the second electromagnetic shielding film and signal reflux layer
Conductively network be connected, to obtain FPC plate.
After carrying out windowing processing to the first cover film, the second cover film, then it can be set on the surface of the first cover film
The first electromagnetic shielding film 4 is set, and the second electromagnetic shielding film 5 is set on the surface of the second cover film, so that the first electromagnetic shielding film 4
It can be connected with the conductively network of signals layer 2, and the second electromagnetic shielding film 5 and signal are flowed back the leading of reference layer 3
Electric ground network is connected, to obtain FPC plate.
Wherein, specifically electromagnetic shielding film can be set on the surface of cover film in the following way: on the surface of cover film
Then electromagnetic shielding film is pressed to the surface of cover film by process for pressing etc. by covering electromagnetic shielding film.It is of course also possible to
By sputtering method or galvanoplastic etc., electromagnetic shielding film is set.
Electromagnetic shielding film that is set, being connected with conductively network can be on signals layer 2 and signal reflux reference layer 3
Play the role of electromagnetic shielding.Specifically, electromagnetic shielding film plays suction to generated interference electromagnetic wave and internal electromagnetic wave
It receives energy (eddy-current loss), reflected energy (the interface reflection of electromagnetic wave on an electro-magnetic shielding film) and offsets energy (electromagnetic induction
Generate reversed electromagnetic field on an electro-magnetic shielding film, can offset part interference electromagnetic wave) effect, therefore, electromagnetic shielding film tool
There is the function of weakening and interfere, so that can then reduce as far as possible influences brought by electromagnetic interference.
Top layer and bottom is respectively set on the surface of flexible base board in above-mentioned technical proposal disclosed in the present application, by top layer and
Wherein one layer of conduct signals layer in bottom uses, and other one layer is used as signal reflux reference layer, in signals layer table
The first cover film is arranged in face, the second cover film is arranged with reference to layer surface in signal reflux, and carry out windowing processing to cover film, with
By signals layer and signal reflux reference layer conductively network expose, then, the first cover film surface setting with
The first connected electromagnetic shielding film of the conductively network of signals layer, and in the second covering film surface setting and signal reflux reference layer
Connected the second electromagnetic shielding film of conductively network, to play the role of electromagnetic shielding using electromagnetic shielding film, to solve electricity
Magnetic compatibling problem to avoid generating electromagnetic interference in signals transmission as far as possible, and then is reduced to the performance of product and just
Often influenced brought by work.
A kind of preparation method of FPC plate provided in an embodiment of the present invention, opens a window to the first cover film, the second cover film
The conductively network of signals layer and signal reflux reference layer is exposed, may include: by processing
Windowing processing is carried out to the first cover film at signals layer conductively network site, with obtain for the first electromagnetism
The first connected tie point of screened film；
Windowing processing is carried out to second cover film of the signal reflux reference layer conductively at network site, with obtain for
The second connected tie point of second electromagnetic shielding film.
Windowing processing is being carried out to the first cover film and the second cover film, by signals layer 2 and signal reflux reference layer 3
When conductively network exposes, tie point can be set on the first cover film and the second cover film, so that electromagnetic shielding film
It is connected with the conductively network of signals layer 2 by set tie point, and makes electromagnetic shielding film and signal reflux reference layer 3
Conductively network is connected by set tie point.Referring to Fig. 5 to Fig. 7, wherein Fig. 5 shows offer of the embodiment of the present invention
Signal layer surface schematic diagram, Fig. 6 shows the schematic diagram of signal provided in an embodiment of the present invention reflux reference layer, and Fig. 7 shows
The schematic diagram of set tie point provided in an embodiment of the present invention is gone out, wherein Fig. 6 is netted with signal reflux reference layer 3
It is illustrated for structure, and Fig. 5 to Fig. 7 is illustrated so that tie point is circle as an example.
Specifically, windowing processing can be carried out to the first predeterminated position of the first cover film, with obtain for first electricity
The first connected tie point 7 of magnetic shield film 4, wherein the first predeterminated position is corresponding with the conductively network of signals layer 2
Position；Likewise, windowing processing can be carried out to the second predeterminated position of the second cover film, with obtain for the second electromagnetic screen
Cover the second connected tie point 8 of film 5, wherein the second predeterminated position is opposite with the signal reflux conductively network of reference layer 3
The position answered.That is, to the first predetermined position on the first cover film and the second predeterminated position on the second cover film
Place carries out exposed processing, and the conductively network at these positions is exposed, consequently facilitating the connection with electromagnetic shielding film,
So that electromagnetic shielding film can play preferable shield effectiveness.
Wherein, the first tie point 7, the second tie point 8 number be multiple, and the first tie point 7, the second tie point
8 shape all can be round or rectangular etc., and in order to make electromagnetic shielding film have preferable effectiveness, then
Can be set center between tie point away from S (center between the first tie point 7 away from and the second tie point 8 between center
Away from) be respectively less than equal to λ/20, wherein λ is the wavelength of signal, and λ=c/F, c are the velocity of wave of signal, and F is the signal for needing to transmit
Highest transmission frequency.
In addition, when the first tie point 7 and the second tie point 8 is arranged, for the ease of the first tie point 7 and the second tie point
8 production, and in order to improve the effectiveness of electromagnetic shielding film, then set the first tie point 7 and the second tie point 8
Size C can be all larger than equal to 0.8mm.Certainly, the size C of set tie point is also greater than equal to 1.2mm (value can
To be adjusted correspondingly according to production technology or FPC design requirement).
After the size C for determining the first tie point 7, in order to make the conductive earth mat of the first electromagnetic shielding film 4 and signals layer 2
There is preferable connection between network, so that the first electromagnetic shielding film 4 can have better effectiveness, then setting signal
(the conductive earth mat of signals layer 2 also can be set in the size C that the width S 2 of the conductively network of layer 2 is more than or equal to the first tie point 7
The width S 2 of network is more than or equal to 1.5mm).
It should be noted that be used for transmission the cabling of signal due to being provided on signals layer 2, then signals layer 2 is conductively
Network is generally located at two side positions in 2 longitudinal direction of signals layer (as shown in Figure 5), and therefore, the first tie point 7 then can be with
It is arranged in any position of the conductively network in longitudinal direction.And signal reflux reference layer 3 is used to due to flood
Signal reflux, therefore, this flood can be used as the conductively Web vector graphic of signal reflux reference layer 3, then the second tie point 8
It can be set in any position of this layer.
The first electromagnetic screen is arranged in the first covering film surface in a kind of preparation method of FPC plate provided in an embodiment of the present invention
Film is covered, and after the second electromagnetic shielding film is arranged in the second covering film surface, further includes:
It is handled by surface of the golden finger processing method to FPC plate.
After setting up the first electromagnetic shielding film 4 and the second electromagnetic shielding film 5, signals layer 2 and signal in order to prevent
Reflux reference layer 3 on connection PAD be oxidized, and in order to prevent plug FPC plate when to connection PAD cause to damage, then can be right
FPC plate is surface-treated, i.e., handles the connection PAD of FPC board ends.
Specifically, it can be handled by connection PAD of the golden finger processing method to FPC board ends.It is of course also possible to logical
Cross gold-plated (flash gold) technique, chemical nickel gold (electroless Ni/Au) technique carrys out connection PAD to FPC board ends
It is handled.
A kind of preparation method of FPC plate provided in an embodiment of the present invention, the first electromagnetic shielding film, the second electromagnetic shielding film are equal
For any one or any a variety of combination in Al, Cu, Ni, Ti.
The electromagnetic shielding performance and electromagnetic screen of the first set electromagnetic shielding film 4, the second electromagnetic shielding film 5 in FPC plate
Covering parameter can specifically be selected according to the electromagnetic shielding requirements of product.
Any one or any a variety of combination in Al, Cu, Ni, Ti specifically be can use as the first electromagnetic shielding film
4 and second electromagnetic shielding film 5, to play preferable effectiveness.
The embodiment of the invention also provides a kind of FPC plates, may include: flexible base board 1, the upper of flexible base board 1 is arranged in
Top layer on surface, the bottom being arranged on the lower surface of flexible base board, any layer in top layer, bottom is signals layer 2, another
Layer is signal reflux reference layer 3, can also include:
Be arranged in first cover film on 2 surface of signals layer, be arranged in first covering film surface the first electromagnetic shielding film 4,
Second cover film on signal reflux 3 surface of reference layer is set and the second electromagnetic shielding film of the second covering film surface is set
5；
Wherein, the first electromagnetic shielding film 4 is connected with the conductively network of signals layer 2, and the second electromagnetic shielding film 5 is returned with signal
The conductively network of fluid layer is connected.
A kind of FPC plate provided in an embodiment of the present invention, the first electromagnetic shielding film 4 pass through 7 phase of the first tie point with signals layer 2
Even, the second electromagnetic shielding film 5 is connected with signal reflux reference layer 3 by the second tie point 8；
Wherein, the first tie point 7, which is arranged on the first cover film, corresponds to signals layer 2 conductively at the position of network, and second
Tie point 8 is arranged on the second cover film at induction signal reflux the reference layer 3 conductively position of network.
A kind of FPC plate provided in an embodiment of the present invention, the first tie point 7, the second tie point 8 are round or rectangular, and
Center between first tie point 7, which is respectively less than away from the center between S and the second tie point 8 away from S, is equal to λ/20；
Wherein, λ is the wavelength of signal, and λ=c/F, c are the velocity of wave of signal, and F is the highest transmission frequency of signal.
A kind of FPC plate provided in an embodiment of the present invention, the size of the first tie point 7, the size of the second tie point 8 are all larger than
Equal to 0.8mm.
A kind of FPC plate provided in an embodiment of the present invention, the width of the conductively network of signals layer 2 are more than or equal to the first connection
The size of point 7.
A kind of FPC plate provided in an embodiment of the present invention, signal flow back reference layer 3 as reticular structure.
Illustrating for relevant portion may refer to the embodiment of the present invention and mention in a kind of FPC plate provided in an embodiment of the present invention
The detailed description of corresponding part in a kind of FPC plate preparation method supplied, details are not described herein.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the element that the process, method, article or equipment including a series of elements is intrinsic.?
Do not have in the case where more limiting, the element limited by sentence "including a ...", it is not excluded that including the element
There is also other identical elements in process, method, article or equipment.In addition, above-mentioned technology provided in an embodiment of the present invention
In scheme with correspond to the consistent part of technical solution realization principle and unspecified in the prior art, in order to avoid excessively repeat.
The foregoing description of the disclosed embodiments can be realized those skilled in the art or using the present invention.To this
A variety of modifications of a little embodiments will be apparent for a person skilled in the art, and the general principles defined herein can
Without departing from the spirit or scope of the present invention, to realize in other embodiments.Therefore, the present invention will not be limited
It is formed on the embodiments shown herein, and is to fit to consistent with the principles and novel features disclosed in this article widest
Range.
Claims (10)
1. a kind of preparation method of FPC plate characterized by comprising
The size for determining FPC plate to be prepared selectes flexible base board according to the size of the FPC plate；
Top layer is set in the flexible base board upper surface and bottom is set in the lower surface of the flexible base board, wherein the top
Layer, in the bottom wherein one layer be signals layer, another layer is that signal flows back reference layer；
The first cover film is set in the signal layer surface, the second cover film is set with reference to layer surface in signal reflux, and
Windowing processing is carried out to first cover film, second cover film, by the conductively network of the signals layer and described
The conductively network of signal reflux reference layer exposes；
The first electromagnetic shielding film is set in the first covering film surface, and the second electromagnetism is set in the second covering film surface
Screened film, wherein first electromagnetic shielding film is connected with the conductively network of the signals layer, second electromagnetic shielding film
It is connected with the conductively network of the signal reflux layer, to obtain the FPC plate.
2. the preparation method of FPC plate according to claim 1, which is characterized in that first cover film, described second
Cover film carries out windowing processing, and the conductively network of the signals layer and signal reflux reference layer is exposed, is wrapped
It includes:
Windowing processing is carried out to the first cover film at the signals layer conductively network site, to obtain for described first
The first connected tie point of electromagnetic shielding film；
Windowing processing is carried out to second cover film of the signal reflux reference layer conductively at network site, with obtain for
The second connected tie point of second electromagnetic shielding film.
3. the preparation method of FPC plate according to claim 2, which is characterized in that in the first covering film surface setting
First electromagnetic shielding film, and after the second electromagnetic shielding film is arranged in the second covering film surface, further includes:
It is handled by surface of the golden finger processing method to the FPC plate.
4. the preparation method of FPC plate according to any one of claims 1 to 3, which is characterized in that first electromagnetic shielding
Film, second electromagnetic shielding film are any one or any a variety of combination in Al, Cu, Ni, Ti.
5. a kind of FPC plate characterized by comprising flexible base board, the top layer being arranged on the upper surface of the flexible base board,
Bottom on the lower surface of the flexible base board is set, and any layer in the top layer, the bottom is signals layer, another layer
For signal reflux reference layer, further includes:
The first electromagnetic shielding that first cover film of the signal layer surface is set, the first covering film surface is set
Film is arranged in signal reflux with reference to the second cover film of layer surface and is arranged in the second of the second covering film surface
Electromagnetic shielding film；
Wherein, first electromagnetic shielding film is connected with the conductively network of the signals layer, second electromagnetic shielding film with
The conductively network of the signal reflux layer is connected.
6. FPC plate according to claim 5, which is characterized in that first electromagnetic shielding film passes through with the signals layer
First tie point is connected, and second electromagnetic shielding film is connected with signal reflux reference layer by the second tie point；
Wherein, the position that the signals layer conductively network is corresponded on first cover film is arranged in first tie point
Place, second tie point, which is arranged in, correspond to the signal and flows back the position of reference layer conductively network on second cover film
Place.
7. FPC plate according to claim 6, which is characterized in that first tie point, second tie point are circle
Shape is rectangular, and the center between first tie point away from the center between S and second tie point away from S be respectively less than etc.
In λ/20；
Wherein, λ is the wavelength of signal, and λ=c/F, c are the velocity of wave of signal, and F is the highest transmission frequency of signal.
8. FPC plate according to claim 7, which is characterized in that the size of first tie point, second tie point
Size be all larger than equal to 0.8mm.
9. FPC plate according to claim 8, which is characterized in that the width of the conductively network of the signals layer be greater than etc.
In the size of first tie point.
10. FPC plate according to claim 6, which is characterized in that the signal reflux reference layer is reticular structure.
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| CN201811408288.0A CN109275263A (en) | 2018-11-23 | 2018-11-23 | A kind of preparation method and FPC plate of FPC plate |
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