CN102131340B - The manufacture method of flexible printed wiring board, flexible printed wiring board, there is the electronic equipment of flexible printed wiring board - Google Patents
The manufacture method of flexible printed wiring board, flexible printed wiring board, there is the electronic equipment of flexible printed wiring board Download PDFInfo
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- CN102131340B CN102131340B CN201110020628.4A CN201110020628A CN102131340B CN 102131340 B CN102131340 B CN 102131340B CN 201110020628 A CN201110020628 A CN 201110020628A CN 102131340 B CN102131340 B CN 102131340B
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Abstract
Problem of the present invention is the electronic equipment providing the manufacture method of a kind of flexible printed wiring board, this flexible printed wiring board and have described flexible printed wiring board, it is in double sided wired portion, required wiring circuit can be constructed fully on substrate positive and negative, and can the wiring circuit be formed on substrate positive and negative be electrically connected fully, for bend, bendability can be improved further, and the durability for alternating bending can be improved.This flexible printed wiring board (200) has and is formed with the region in the double sided wired portion (210) of wiring circuit at the positive and negative of substrate (20) and repeatedly carries out the region of the bend (220) bent, weld-ring through hole (21) is formed in double sided wired portion (210), the wiring circuit being configured to the substrate positive and negative of described double sided wired portion (210) is thus electrically connected, in bend (220), a face only in substrate positive and negative is formed with wiring circuit.
Description
Technical field
The present invention relates to a kind of flexible printed wiring board, this flexible printed wiring board manufacture method and there is the electronic equipment of described flexible printed wiring board.
Background technology
The flexible printed wiring board that the electronic equipments such as mobile phone use, owing to being configured in narrow space, so require to improve distribution density, raising bendability and flexibility and the durability etc. for alternating bending.
Current, as the flexible printed wiring board that the electronic equipments such as mobile phone use, there is following flexible printed wiring board, it forms through hole on substrate, and substrate two-sided on form electrolytic copper plated layer, namely implement so-called through hole plating.
Be applied with on the flexible printed wiring board of through hole plating this, because the Copper Foil forming wiring circuit is thickening, so lower for the durability of alternating bending.
In order to make up this shortcoming, use in the electronic equipments such as mobile phone and be formed with the flexible printed wiring board of weld-ring through hole, this weld-ring through hole is by sheltering bend or covering etc. to make it not carry out through hole plating, only have region enforcement plating (so-called salient point plating) of through hole and formed.
As above-mentioned flexible printed wiring board, such as, there is Japanese Unexamined Patent Publication 11-195849 publication (hereinafter referred to patent documentation 1).
In patent documentation 1, disclose the prior art relevant to the flexible printed wiring board being formed with weld-ring through hole.
In recent years, along with the miniaturization of electronic equipment, the multifunction with flexible printed wiring board, the space holding flexible printed wiring board obviously narrows.
Especially, in the mobile phone of so-called slidingtype, due to lightening (slim) of mobile phone, make the remarkable stricturization in the gap between side frame body and lower frame.
The flexible printed wiring board that this sliding mobile telephone uses, in gap between upper side frame body and lower frame, with the bend of U-shaped configuration flexible printed wiring board, but due to the stricturization in the gap between upper side frame body and lower frame, flexible printed wiring board is diminished with the radius of curvature that U-shaped is bending, and bending condition obviously becomes harsh.
Flexible printed wiring board disclosed in above-mentioned patent documentation 1, adopt substrate two-sided on form the structure of wiring circuit.When this flexible printed wiring board is used for sliding mobile telephone, there is following problems, that is, bending condition in recent years cannot be met, particularly cannot meet durability for alternating bending.Thus, the problem in flexible printed wiring board is, exploitation particularly improves relevant technology to the durability for alternating bending in bend.
Therefore, problem of the present invention is to solve above-mentioned the problems of the prior art point, the manufacture method of a kind of flexible printed wiring board, this flexible printed wiring board is provided and there is the electronic equipment of described flexible printed wiring board, this flexible printed wiring board is in double sided wired portion, required wiring circuit can be constructed fully on substrate positive and negative, and, the wiring circuit be formed on substrate positive and negative can be electrically connected fully, for bend, bendability can be improved further, and the durability for alternating bending can be improved.
Summary of the invention
Flexible printed wiring board of the present invention has: the region being formed with the double sided wired portion of wiring circuit at substrate positive and negative; And for repeatedly carrying out the region of the bend bent, the 1st of this flexible printed wiring board is characterised in that, weld-ring through hole is formed in described double sided wired portion, this weld-ring through hole by carrying out plating on the whole surface of the endoporus of the through hole running through substrate, and only the peripheral edge margin of the positive and negative peristome of through hole carried out plating as weld-ring and form, thus, the positive and negative wiring circuit being configured to described double sided wired portion is electrically connected, in described bend, only on a face of substrate positive and negative, be formed with wiring circuit.
According to the 1st feature of the invention described above, flexible printed wiring board has: the region being formed with the double sided wired portion of wiring circuit at substrate positive and negative, and for repeatedly carrying out the region of the bend bent, weld-ring through hole is formed in described double sided wired portion, this weld-ring through hole by carrying out plating on the whole surface of the endoporus of the through hole running through substrate, and only the peripheral edge margin of the positive and negative peristome of through hole carried out plating as weld-ring and form, thus, the positive and negative wiring circuit being configured to described double sided wired portion is electrically connected, in described bend, only on a face of substrate positive and negative, be formed with wiring circuit, therefore, in double sided wired portion, required wiring circuit can be constructed fully on substrate positive and negative, and, the wiring circuit be formed on substrate positive and negative can be electrically connected fully.
In addition, in bend, by only forming wiring circuit on a face of substrate positive and negative, the thinner thickness of bend can be made.Thus, the bendability of bend can be improved further, and the durability for alternating bending can be improved.
The 2nd of flexible printed wiring board of the present invention is characterized as, and on the basis of the 1st feature of the invention described above, the wiring circuit layer of described bend is coated by electromagnetic wave shielding.
According to the 2nd feature of the invention described above, due on the basis of action effect that produces in the 1st feature of the invention described above, the wiring circuit layer of the described bend of flexible printed wiring board is coated by electromagnetic wave shielding, so the wiring circuit being formed at bend place can be prevented to be subject to the harmful effects such as the malfunction caused by electromagnetic wave noise.
In addition, the flexible printed wiring board manufactured by manufacture method of flexible printed wiring board of the present invention has: the region being formed with the double sided wired portion of wiring circuit on the conductive layer of substrate positive and negative; And for repeatedly carrying out the region of the bend bent, the 3rd of the manufacture method of this flexible printed wiring board is characterised in that to have following operation: through hole formation process, in this operation, in described double sided wired portion, form the through hole running through described substrate; Corrosion-resisting pattern formation process, in this operation, except the peristome neighboring area of this through hole, substrate two-sided on form corrosion-resisting pattern; Weld-ring through hole plating operation, in this operation, carries out plating using the whole surface of the endoporus of described through hole and peristome peripheral edge margin as weld-ring and coated; And wiring circuit formation process, in this operation, in described double sided wired portion, the conductive layer of substrate positive and negative forms wiring circuit, and in described bend, remove the conductive layer in a face in substrate positive and negative, and only on another face remaining, form wiring circuit.
According to the 3rd feature of the present invention, for having the region in the double sided wired portion being formed with wiring circuit on the conductive layer of substrate positive and negative and the flexible printed wiring board for the region of repeatedly carrying out the bend bent, the manufacture method of this flexible printed wiring board has following operation: through hole formation process, in this operation, in described double sided wired portion, form the through hole running through described substrate; Corrosion-resisting pattern formation process, in this operation, except the peristome neighboring area of this through hole, substrate two-sided on form corrosion-resisting pattern; Weld-ring through hole plating operation, in this operation, carries out plating using the whole surface of the endoporus of described through hole and peristome peripheral edge margin as weld-ring and coated; And wiring circuit formation process, in this operation, in described double sided wired portion, the conductive layer of substrate positive and negative forms wiring circuit, and in described bend, removes the conductive layer in a face in substrate positive and negative, and only on another face remaining, form wiring circuit, therefore, utilize through hole formation process, the through hole running through substrate can be formed in double sided wired portion.In addition, utilize corrosion-resisting pattern formation process, can except the peristome neighboring area of through hole, substrate two-sided on form corrosion-resisting pattern.In addition, utilize weld-ring through hole plating operation, can form weld-ring through hole, this weld-ring through hole is formed in the following manner, that is, the whole surface of the endoporus of through hole and peristome peripheral edge margin are carried out plating as weld-ring and coated.In addition, utilize wiring circuit formation process, can in double sided wired portion, the conductive layer of substrate positive and negative forms wiring circuit, and in described bend, the conductive layer in a face of substrate positive and negative can be removed, and only on another face remaining, form wiring circuit.
In addition, the of the present invention 4th is characterized as, and electronic equipment of the present invention has the flexible printed wiring board described in the 1st or the 2nd feature.
According to the 4th feature of the invention described above, because electronic equipment has the flexible printed wiring board described in the 1st or the 2nd feature, so the electronic equipment with following flexible printed wiring board can be formed, this flexible printed wiring board is in double sided wired portion, required wiring circuit can be constructed fully on substrate positive and negative, and, the wiring circuit be formed on substrate positive and negative can be electrically connected fully, for bend, bendability can be improved further, and the durability for alternating bending can be improved.
In addition, can form the electronic equipment with following flexible printed wiring board, this flexible printed wiring board can prevent the wiring circuit being formed at bend place to be subject to the harmful effects such as the malfunction caused by electromagnetic wave noise.
According to flexible printed wiring board of the present invention, the manufacture method of this flexible printed wiring board and there is the electronic equipment of described flexible printed wiring board, a kind of flexible printed wiring board can be provided, the manufacture method of this flexible printed wiring board and there is the electronic equipment of described flexible printed wiring board, this flexible printed wiring board is in double sided wired portion, required wiring circuit can be constructed fully on substrate positive and negative, and, the wiring circuit be formed on substrate positive and negative can be electrically connected fully, for bend, bendability can be improved further, and the durability that can improve for alternating bending.
Accompanying drawing explanation
Fig. 1 is the figure of the mobile phone represented involved by the 1st execution mode of the present invention, and (a) is overall oblique view, and (b) is the right side view that important part is shown.
Fig. 2 is the figure of the flexible printed wiring board represented involved by the 1st execution mode of the present invention, a () is vertical view, b () is the important part profile in the A-A line direction in (a), (c) is the amplification plan view of the important part of dotted portion in (a).
Fig. 3 is the profile of the manufacture method of the flexible printed wiring board represented involved by the 1st execution mode of the present invention.
Fig. 4 is the profile of the manufacture method of the flexible printed wiring board represented involved by the 1st execution mode of the present invention.
Fig. 5 is the profile of the manufacture method of the flexible printed wiring board represented involved by the 1st execution mode of the present invention.
Fig. 6 is the profile of the manufacture method of the flexible printed wiring board represented involved by the 1st execution mode of the present invention.
Fig. 7 is the important part profile of the flexible printed wiring board represented involved by the 2nd execution mode of the present invention.
Fig. 8 is the important part profile of the variation of the flexible printed wiring board represented involved by the 2nd execution mode of the present invention.
Embodiment
With reference to following accompanying drawing, enumerate the flexible printed wiring board that so-called sliding mobile telephone uses, as electronic equipment involved in the present invention and flexible printed wiring board example and be described, for understanding the present invention.But the invention described in claims of the present invention does not limit by following explanation.
First, with reference to Fig. 1, Fig. 2, the 1st execution mode involved in the present invention is described.
As shown in Figure 1, mobile phone 1 is so-called sliding mobile telephone.
This mobile phone 1 is formed primarily of framework 100 and flexible printed wiring board 200.
Described framework 100 forms the main part of mobile phone 1, as shown in Figure 1, is formed by a pair framework be made up of the 1st framework 110 and the 2nd framework 120.
In addition, as shown in Fig. 1 (a), the 1st framework 110 has the display parts such as liquid crystal display screen 111, and the 2nd framework 120 has the operating portion 121 be made up of action button etc.
In addition, in the inside of the 1st framework 110 and the 2nd framework 120, the various inscapes that the mobile phones such as not shown LED have usually are built-in with.
Described flexible printed wiring board 200, as shown in Fig. 1 (b), is between 1 pair of framework and the flexible printed wiring board of the circuit of connection two frameworks.
More particularly, being the flexible printed wiring board be electrically connected between the circuit substrate 122 that has of the inside of circuit substrate 112 for having the inside of the 1st framework 110 in a pair framework and the 2nd framework 120, being configured between the 1st framework 110 and the 2nd framework 120 with bending state.
In addition, in Fig. 1 (b), although do not illustrate in detail, but by the connector portion that will be arranged in circuit substrate 112 and circuit substrate 122, be connected with the connector portion be arranged in flexible printed wiring board 200, thus circuit substrate 112 and circuit substrate 122 are electrically connected via flexible printed wiring board 200.
This flexible printed wiring board 200 as shown in Figure 2, has the region in double sided wired portion 210 and the region of bend 220 as its region.
The region in described double sided wired portion 210 is in flexible printed wiring board 200, is formed with the region of wiring circuit at substrate positive and negative.
This double sided wired portion 210, as shown in Fig. 2 (b), is made up of substrate 20, weld-ring through hole (1andthroughhole) 21 and cover layer 22.
Described substrate 20 forms the circuit part of flexible printed wiring board 200, as shown in Fig. 2 (b), by insulating barrier 20a two-sided stacked conductive layer 20b and being formed.
In addition, as insulating barrier 20a, as long as the material that polyimides etc. use usually used as the insulating barrier of the substrate of formation flexible printed wiring board, can be any materials.
In addition, as conductive layer 20b, as long as the material that Copper Foil etc. use usually used as the conductive layer of the substrate of formation flexible printed wiring board, can be any materials.
Described weld-ring through hole 21 applies so-called salient point plating and is formed on through hole 21a, and the wiring circuit on the conductive layer 20b of the positive and negative by being formed in substrate 20 is electrically connected.
This weld-ring through hole 21 is as shown in Fig. 2 (b), there is the through hole 21a running through substrate 20 and formation, by carrying out plating on the whole surface of the endoporus P of through hole 21a, and only the peripheral edge margin of the positive and negative peristome Q of through hole 21a carried out plating as weld-ring R and formed.The part consisted of this plating forms electric conductor 21b.
Here, so-called " weld-ring " refers in weld-ring through hole 21, in the part that the surface of substrate 20 is protruded with convex dot shape.
Be formed as by making the structure in above-mentioned double sided wired portion 210, weld-ring through hole 21 is utilized the wiring circuit be formed on the conductive layer 20b of the positive and negative of substrate 20 to be carried out the structure be electrically connected, thus double sided wired portion 210 can guarantee fully in one face and electrical connection between circuit substrate 112 and circuit substrate 122, constructs required wiring circuit fully on another face of carrying out being electrically connected via weld-ring through hole 21 simultaneously.
Described cover layer 22, for the protection of the wiring circuit be formed on conductive layer 20b, as shown in Fig. 2 (b), is made up of coverlay film 22a and cover layer bonding agent 22b.
As coverlay film 22a, as long as polyimides etc. have the film of insulating properties, it can be any film.
In addition, as cover layer bonding agent 22b, being fitted on the base plate 20 and the material of use by coverlay film 22a as long as thermosetting resin etc. generally for, can be any materials.
In addition, as shown in Fig. 2 (c), the diameter S of preferred through hole 21a is the diameter T of about 0.1mm, weld-ring R is about 0.3mm, be formed in the wiring circuit on conductive layer 20b, the diameter U being formed in the wiring circuit of the circular in weld-ring R-portion is about 0.5mm.
The region of described bend 220 is as shown in Fig. 1 (b), in flexible printed wiring board 200, to expose state configuration in the space produced between a pair framework 100 be made up of the 1st framework 110 and the 2nd framework 120, and repeatedly carry out the region that bends.
This bend 220, as shown in Fig. 2 (b), is made up of substrate 20 and cover layer 22.
In addition, for substrate 20 and cover layer 22, owing to being the parts identical with the substrate 20 in the double sided wired portion of described formation 210 and cover layer 22, so mark identical label, further instruction is omitted.
In addition, in the present embodiment, bend 220, as shown in Fig. 2 (b), is configured to only form wiring circuit in the front of substrate 20, and removes the state of the conductive layer 20b of remaining reverse side.
By forming said structure, the wiring circuit being used for circuit substrate 112 and circuit substrate 122 are electrically connected only can be concentrated on the front of substrate 20, the lower thickness of bend 220 can be made.Thus, the bendability of bend 220 can be improved further.
Thus, following bend 220 can be formed, that is, it can tackle the path of the radius of curvature of narrowing the caused bend in the gap between upper side frame body in sliding mobile telephone and lower frame, and can improve the durability for alternating bending.
In addition, in the present embodiment, bend 220 adopts the structure only forming wiring circuit in the front of substrate 20, but might not be limited to this structure, also can be the structure only forming wiring circuit at reverse side.
Below, with reference to Fig. 3 ~ Fig. 6, the manufacture method of the flexible printed wiring board 200 involved by the 1st execution mode of the present invention is described.
Flexible printed wiring board 200 involved by embodiments of the present invention, manufactures via through hole formation process 300, corrosion-resisting pattern formation process 400, weld-ring through hole plating operation 500, wiring circuit formation process 600 and cover layer lamination process 700.
First, through hole formation process 300 is the operations forming through hole on the base plate 20.
Specifically, as shown in Fig. 3 top, for insulating barrier 20a two-sided stacked conductive layer 20b and the substrate 20 that formed, utilize Drilling operation etc. to form through hole 21a.
In addition, the diameter of preferred through hole 21a is about 0.1mm.
Ensuing corrosion-resisting pattern formation process 400 is the operations for utilizing the coated substrate 20 of corrosion-resisting pattern, contacts with plating solution with the part only making hope form weld-ring through hole 21.
Specifically, as shown in the middle part of Fig. 3, be formed through hole 21a substrate 20 two-sided stacked film 410 against corrosion.Then, as shown in the black arrow of Fig. 3 bottom, by utilizing ultraviolet to carry out exposing, developing for the front of substrate 20 and reverse side across pattern mask 420, thus remove the unwanted part of film 410 against corrosion.Thus, as shown in Fig. 4 topmost, except the part that hope forms weld-ring through hole 21, the positive and negative of substrate 20 is coated by corrosion-resisting pattern 430.
Ensuing weld-ring through hole plating operation 500 only the peripheral edge margin of the whole surface of the endoporus P of through hole 21a and positive and negative peristome Q is carried out plating and coated operation as weld-ring R.
Specifically, although portion does not illustrate in detail in the diagram, only using the peripheral edge margin of the whole surface of the endoporus P of through hole 21a and positive and negative peristome Q as weld-ring R, carry out the 1st plating operation and electroless plating.By this operation, only in the peripheral edge margin of the whole surface of the endoporus P of through hole 21a and positive and negative peristome Q, form not shown conductive film covering.
Then, only using the peripheral edge margin of the whole surface of the endoporus P of through hole 21a and positive and negative peristome Q as weld-ring R, carry out the 2nd plating operation and electrolytic copper plating.
In addition, in the present embodiment, formed and utilize electroless plating to carry out the structure of the 1st plating operation, but this structure might not be defined as.Such as, the structure using carbonaceous conductive process can be formed.
Then, as shown in the middle part of Fig. 4, peel off corrosion-resisting pattern 430.Thus, form following weld-ring through hole 21, the peripheral edge margin of the positive and negative peristome Q of through hole 21a by carrying out plating on the whole surface of the endoporus P of through hole 21a, and is only carried out plating as weld-ring R and forms by it.
In addition, in weld-ring R, the length V of the part preferably protruded on the surface of substrate 20 is 5 μm ~ 20 μm.
Ensuing wiring circuit formation process 600, be in double sided wired portion 210, the conductive layer 20b of substrate positive and negative forms wiring circuit, simultaneously in bend 220, the conductive layer 20b of the reverse side of removing substrate 20, and the operation of wiring circuit is only formed in remaining front.
Specifically, as shown in Fig. 4 foot, under the state defining weld-ring through hole 21, substrate 20 two-sided stacked film 610 against corrosion.
Then, as shown in the black arrow at Fig. 5 top and middle part, by utilizing ultraviolet to expose the front of substrate 20 and reverse side, develop across pattern mask 620, thus as shown in the middle part of Fig. 5, only shielding layer be stacked in bend 220 reverse side on film against corrosion 610.Thus, the positive and negative of substrate 20 is coated by corrosion-resisting pattern 630.
Then, as shown in Fig. 5 foot, by etching, in double sided wired portion 210, the conductive layer 20b of substrate positive and negative forms wiring circuit, and in bend 220, the conductive layer 20b of the reverse side of removing substrate 20, and only on remaining front, form wiring circuit.
In addition, in the present embodiment, becoming following structure, that is, in bend 220, only form wiring circuit in the front of substrate 20, but might not be defined as this structure, also can be the structure only forming wiring circuit at reverse side.
Then, as in fig. 6 upper, corrosion-resisting pattern 630 is peeled off.
Ensuing cover layer lamination process 700 is operations of coated cover layer 22 on the positive and negative at substrate 20, to insulate to the wiring circuit be formed on conductive layer 20b, to protect.
Specifically, as shown in the lower part of Figure 6, via cover layer bonding agent 22b, the positive and negative of substrate 20 is fitted coverlay film 22a.
Via above-mentioned operation, manufacture flexible printed wiring board 200.
Below, with reference to Fig. 7, the flexible printed wiring board 200 involved by the 2nd execution mode of the present invention is described.
2nd execution mode of the present invention is configured to, and utilizes electromagnetic wave shielding coated on the wiring circuit layer of bend 220.Other structures are identical with described the 1st execution mode of the present invention.For identical parts, the part realizing identical function, mark identical label, omit further instruction.
As shown in Figure 7, the layer of the formation wiring circuit in the coated bend 220 of electromagnetic wave shielding 800, is made up of bond layer 810, screen 820 and insulating barrier 830.
Described bond layer 810 is the layers for electromagnetic wave shielding 800 and cover layer 22 being fitted.
This bond layer 810 is formed by conductive adhesive, and as shown in Figure 7, its part, via the circuit connection hole 22c be formed on cover layer 22, is connected with the not shown earthed circuit be formed on conductive layer 20b.
In addition, the thickness of preferred bond layer 810 is 5 μm ~ about 25 μm.
In addition, as conductive adhesive, as long as the material that epoxy resin etc. use usually used as conductive adhesive, it can be any materials.
Described screen 820 is the layers be made up of conductive material.
In addition, in the present embodiment, use silver as conductive material, utilize physical vapor deposition to form screen 820.
In addition, the thickness of preferable mask layer 820 is about 0.1 μm.
In addition, as conductive material, be not limited to silver, also can use other conductive metal such as gold, copper, aluminium, nickel or electroconductive particle, conducting fibre, electroconductive resin etc. and form, but preferably using silver.
In addition, as the physical vapor deposition of conductivity, as long as the method that sputtering method, ion-beam evaporation etc. use usually used as physical vapor deposition, it can be any means.
Described insulating barrier 830, as the insulating barrier of electromagnetic wave shielding 800, is formed by insulation film.
As insulation film, as long as the film that polyimides etc. use usually used as insulation film, it can be any film.
In addition, the thickness of preferred insulating barrier 830 is 3 μm ~ about 10 μm.
By described bond layer 810, screen 820 and insulating barrier 830 is integrated, and in bend 220, fit with the cover layer 22 in the front being formed with wiring circuit, thus form electromagnetic wave shielding 800.
Utilize electromagnetic wave shielding 800 coated by the wiring circuit layer by bend 220 described above, thus the wiring circuit be formed on bend 220 can be prevented to be subject to the harmful effects such as the malfunction caused by electromagnetic wave noise.
Further, at bend 220 place, by only forming wiring circuit in face side, and make the thickness of the electromagnetic wave shielding 800 of coated wiring circuit layer be 8 μm ~ about 35 μm, thus the lower thickness of bend 220 can be made.Thus, following bend 220 can be formed, that is, it can tackle the path of the radius of curvature of narrowing the caused bend in the gap between upper side frame body in sliding mobile telephone and lower frame, and can improve the durability for alternating bending.
Below, with reference to Fig. 8, the variation of the flexible printed wiring board 200 involved by the 2nd execution mode of the present invention is described.
This variation makes the structural change of electromagnetic wave shielding be formed.Other structures are identical with described the 2nd execution mode of the present invention.For identical parts, the part realizing identical function, mark identical label, omit further instruction.
As shown in Figure 8, the layer being formed with wiring circuit in the coated bend 220 of electromagnetic wave shielding 800, is made up of screen 820 and insulating barrier 830.
Described screen 820 is the layers be made up of conductive material.
In the present embodiment, use silver paste as conductive material, utilize silk screen printing to form screen 820 on cover layer 22.
In addition, as shown in Figure 8, a part for screen 820, via the circuit connection hole 22c be formed on cover layer 22, is connected with the not shown earthed circuit be formed on conductive layer 20b.
In addition, the thickness of preferable mask layer 820 is 15 μm ~ about 20 μm.
In addition, as conductive material, be not limited to silver paste, also can use other conductive metal cream such as gold, copper, aluminium, nickel and form, but preferably using silver paste.
Described insulating barrier 830, as the insulating barrier of electromagnetic wave shielding 800, is use insulation coating agent, utilizes silk screen printing to be formed on screen 820.
In addition, as insulation coating agent, as long as the coating agent that silicon class, ceramic-like etc. use usually used as insulation coating agent, can be any coating agent.
In addition, the thickness of preferred insulating barrier 830 is 15 μm ~ about 20 μm.
By after described screen 820 is formed on cover layer 22, insulating barrier 830 is formed on screen 820, thus forms electromagnetic wave shielding 800.
Utilize electromagnetic wave shielding 800 coated by the wiring circuit layer by bend 220 described above, thus the wiring circuit be formed on bend 220 can be prevented to be subject to the harmful effects such as the malfunction caused by electromagnetic wave noise.
Further, at bend 220 place, by only forming wiring circuit in front, and make the thickness of the electromagnetic wave shielding 800 of coated wiring circuit layer be 30 μm ~ about 40 μm, thus the lower thickness of bend 220 can be made.Thus, following bend 220 can be formed, that is, it can tackle the path of the radius of curvature of narrowing the caused bend in the gap between upper side frame body in sliding mobile telephone and lower frame, and can improve the durability for alternating bending.
The present invention can be used as the manufacture method of flexible printed wiring board that the electronic equipment such as mobile phone or hard disk unit uses and this flexible printed wiring board.
Claims (3)
1. a flexible printed wiring board, it has: the region being formed with the double sided wired portion of wiring circuit at substrate positive and negative; And for repeatedly carrying out the region of the bend bent,
The feature of this flexible printed wiring board is,
In described double sided wired portion, form weld-ring through hole, the peripheral edge margin of the positive and negative peristome of through hole by carrying out plating on the whole surface of the endoporus of the through hole running through substrate, and is only carried out plating as weld-ring and forms by this weld-ring through hole,
In described weld-ring, the length of the part that the surface of described substrate is protruded is 5 μm ~ 20 μm,
Thus, the positive and negative wiring circuit being configured to described double sided wired portion is electrically connected,
In described bend, only on a face of substrate positive and negative, be formed with wiring circuit,
The wiring circuit layer of described bend is coated by electromagnetic wave shielding, and the thickness of described electromagnetic wave shielding is 8 μm ~ 35 μm.
2. a manufacture method for flexible printed wiring board, this flexible printed wiring board has: the region being formed with the double sided wired portion of wiring circuit on the conductive layer of substrate positive and negative; And for repeatedly carrying out the region of the bend bent,
The feature of the manufacture method of this flexible printed wiring board is,
There is following operation:
Through hole formation process, in this operation, forms the through hole running through described substrate in described double sided wired portion;
Corrosion-resisting pattern formation process, in this operation, except the peristome neighboring area of this through hole, substrate two-sided on form corrosion-resisting pattern;
Weld-ring through hole plating operation, in this operation, the whole surface of the endoporus of described through hole and peristome peripheral edge margin are carried out plating as weld-ring and coated, in described weld-ring, the length of the part that the surface of described substrate is protruded is 5 μm ~ 20 μm;
Wiring circuit formation process, in this operation, in described double sided wired portion, the conductive layer of substrate positive and negative forms wiring circuit, and in described bend, remove the conductive layer in a face in substrate positive and negative, and only on another face remaining, form wiring circuit; And
By coated by electromagnetic wave shielding for the wiring circuit layer of described bend, the thickness of described electromagnetic wave shielding is the operation of 8 μm ~ 35 μm.
3. an electronic equipment, is characterized in that,
There is flexible printed wiring board according to claim 1.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010003943A JP2011146427A (en) | 2010-01-12 | 2010-01-12 | Flexible printed wiring board, method of manufacturing flexible printed wiring board, and electronic equipment with flexible printed wiring board |
| JP2010-003943 | 2010-01-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102131340A CN102131340A (en) | 2011-07-20 |
| CN102131340B true CN102131340B (en) | 2016-03-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110020628.4A Active CN102131340B (en) | 2010-01-12 | 2011-01-12 | The manufacture method of flexible printed wiring board, flexible printed wiring board, there is the electronic equipment of flexible printed wiring board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2011146427A (en) |
| CN (1) | CN102131340B (en) |
| TW (1) | TW201136467A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015038908A (en) * | 2012-03-06 | 2015-02-26 | イビデン株式会社 | Flex-rigid wiring board |
| JP2015038907A (en) * | 2012-03-06 | 2015-02-26 | イビデン株式会社 | Flex-rigid wiring board |
| CN105636334A (en) * | 2015-12-29 | 2016-06-01 | 广东欧珀移动通信有限公司 | Flexible printed circuit board and mobile terminal |
| CN110970729B (en) * | 2019-09-06 | 2021-08-27 | 深圳科诺桥科技股份有限公司 | Omnidirectional shielding antenna structure and antenna |
| CN115700009A (en) | 2020-06-04 | 2023-02-03 | 住友电工印刷电路株式会社 | Printed wiring board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201282594Y (en) * | 2008-07-03 | 2009-07-29 | 比亚迪股份有限公司 | Flexible circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11195849A (en) * | 1997-12-26 | 1999-07-21 | Fujikura Ltd | Flexible printed wiring board and method for manufacturing it |
| JP4751187B2 (en) * | 2005-11-30 | 2011-08-17 | 株式会社東芝 | Wiring board manufacturing method |
-
2010
- 2010-01-12 JP JP2010003943A patent/JP2011146427A/en active Pending
-
2011
- 2011-01-10 TW TW100100800A patent/TW201136467A/en unknown
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201282594Y (en) * | 2008-07-03 | 2009-07-29 | 比亚迪股份有限公司 | Flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201136467A (en) | 2011-10-16 |
| CN102131340A (en) | 2011-07-20 |
| JP2011146427A (en) | 2011-07-28 |
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