CN109257904B - Heat abstractor and machine case - Google Patents
Heat abstractor and machine case Download PDFInfo
- Publication number
- CN109257904B CN109257904B CN201710569575.9A CN201710569575A CN109257904B CN 109257904 B CN109257904 B CN 109257904B CN 201710569575 A CN201710569575 A CN 201710569575A CN 109257904 B CN109257904 B CN 109257904B
- Authority
- CN
- China
- Prior art keywords
- heat
- air duct
- heat pipe
- independent
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000010354 integration Effects 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 7
- 239000000428 dust Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat dissipating device, which comprises an independent air channel module and at least one heat pipe radiator, wherein the heat pipe radiator comprises a heat collecting sheet, a heat pipe and a heat dissipating fin which are sequentially connected, a cavity is formed in the independent air channel module, a fan is integrated on the independent air channel module, an opening is formed on the side part of the independent air channel module, and the heat dissipating fin extends into the cavity from the opening; the invention also discloses a case with the heat dissipating device, and the heat dissipating device has a simple structure through the design of the modularized air duct and can effectively dissipate heat of a heat source far away from the inside of the case by combining a heat pipe radiator to form an integral scheme.
Description
Technical Field
The present disclosure relates to heat dissipation devices, and particularly to a heat dissipation device and a chassis.
Background
With the rapid development of electronic and electric technologies, the modularization and integration level of electronic elements are greatly improved, the higher the integration level is, the higher the heat generated by the electronic elements is, if the heat cannot be timely dissipated, the reliability of the operation of electronic equipment is greatly reduced, even the electronic equipment cannot normally operate, and in order to ensure that the heating electronic elements can normally operate, a heat dissipating device is usually arranged on the heating electronic elements, and the generated heat is exhausted.
CN203225987 discloses a heat abstractor with independent wind channel, and this patent adopts the heat dissipation mode of updraft, and the form of updraft down induced draft can avoid dust or other pollution medium to fall into heat abstractor, causes the loss, and the fan adopts the confined mode in top of airing exhaust all around also can avoid dust and dielectric dust etc. to fall into in addition, improves the radiating effect, reduces the potential safety hazard equally.
However, the above scheme is too complicated in structure, not easy to produce and assemble, and the high-power chassis is complex in structure, the heat source and the radiator are often far away from each other, and the independent air duct design of the scheme cannot effectively dissipate heat of the heat source at a far distance, so that the problem of heat dissipation of the high-power chassis cannot be solved.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the heat dissipation device and the chassis.
In order to achieve the above purpose, the present invention proposes the following technical scheme: the utility model provides a heat abstractor, heat abstractor includes independent wind channel module and at least one heat pipe radiator, the heat pipe radiator is including heat collecting fin, heat pipe and the radiating fin that connects gradually, form the cavity in the independent wind channel module, the integration has the fan on the independent wind channel module, independent wind channel module lateral part forms the opening, radiating fin is followed the opening extends into in the cavity.
Preferably, the heat dissipation fins seal the openings such that the independent air duct modules form sealed heat dissipation channels.
Preferably, the independent air duct module comprises at least two air duct sub-modules, and a heat pipe radiator is arranged in each air duct sub-module.
Preferably, a plurality of the heat pipe radiators are stacked.
Preferably, the radiating fins comprise a plurality of sub-fins, an air guide channel is formed between every two adjacent sub-fins, and the fan is arranged at a position opposite to the air guide channel.
Preferably, the heat dissipating device according to claim 5, wherein an air outlet is provided on a side of the independent air duct module opposite to the fan.
The invention also provides another scheme, namely the chassis, which comprises the heat dissipation device.
Preferably, at least one mounting hole is formed on the side wall of the case, and the independent air duct modules of the heat dissipation device are respectively arranged in the mounting holes.
The beneficial effects of the invention are as follows:
1) The modularized air duct is simple in structure, high in universality and convenient to assemble and disassemble.
2) The independent air duct has good sealing effect, effectively avoids air leakage and has high forced air cooling efficiency.
3) The heat pipe radiator is combined to form an integral scheme, so that heat sources far away from the inside of the case can be effectively radiated.
Drawings
FIG. 1 is a schematic diagram illustrating an assembled heat dissipating device according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a heat dissipating device according to an embodiment of the invention;
FIG. 3 is a schematic diagram of an assembled chassis with a heat sink according to the first embodiment;
FIG. 4 is a schematic diagram of a heat dissipating device according to a second embodiment of the present invention;
Fig. 5 is a schematic diagram of an assembly of a chassis in which a heat dissipating device according to the second embodiment is installed.
The reference numerals of the invention are as follows:
1. The heat pipe type air conditioner comprises a case, 11, mounting holes, 2, a heat pipe radiator, 21, radiating fins, 211, sub-fins, 212, an air guide channel, 22, a heat pipe, 23, a heat collecting plate, 3, an independent air channel module, 31, an air channel sub-module, 32, an opening, 33, an air outlet, 4 and a fan.
Detailed Description
The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.
As shown in fig. 1, the heat dissipating device of the present invention comprises a heat pipe radiator 2 and an independent air duct module 3, wherein the independent air duct module 3 is integrated with a fan 4, one end of the heat pipe radiator 2 is connected to the independent air duct module 3, and the other end forms heat exchange with an electronic component, so that the universality of components is effectively improved by realizing modularized production and modularized assembly, the heat source far away can be effectively dissipated by combining the property of heat pipe radiator that the heat is remotely transmitted, and the device universality is greatly improved.
Specifically, as shown in fig. 1 and 2, the heat pipe radiator 2 includes a heat dissipating fin 21, a heat pipe 22 and a heat collecting fin 23, the heat collecting fin 23 exchanges heat with an electronic component in the chassis, the heat pipe 22 connects the heat dissipating fin 21 and the heat collecting fin 23, one end of the heat pipe 22 is connected to the heat collecting fin 23 in a contact manner, the other end extends into the heat dissipating fin 21 and forms a thermal connection with the heat dissipating fin 21, the heat pipe 22 plays a role of heat transfer, the heat is transferred from the heat collecting block 23 to the heat pipe 22 and then transferred to the heat dissipating fin 21, and the heat dissipating fin 21 dissipates heat by forced convection through a fan. The heat dissipation fin 21 includes a plurality of sub-fins 211, each of which is in a fin-shaped structure, and an air guiding channel 212 is formed between every two adjacent sub-fins.
As shown in fig. 1 and fig. 2, the independent air duct module 3 is a rectangular cavity structure, a cavity is formed in the independent air duct module, an opening 32 is formed on each of the left side and the right side of the rectangle, a fan 4 is embedded in the rear side of the rectangle, and a netlike air outlet 33 is formed in the front side of the rectangle. In this embodiment, the structure of the independent air duct module is not limited to a rectangular structure, but may be other regular or irregular cavity structures, such as other elongated cavity structures.
During installation, the heat pipe radiator 2 stretches into the cavity from one of the openings 32, the sub fins 211 at two ends of the radiating fins 21 play a role in sealing the two openings, in addition, the fan 4 is arranged to face the air guide channel 212 of the radiating fins 21, so that the air guide channels of the fan, the radiating fins 21, the air guide channel 212 and the air outlet 33 are in the same air direction, an independent air channel is formed in a sealed environment, the air flow is smooth, the air leakage is effectively avoided, the forced air cooling efficiency is high, the radiating effect is improved, an integral scheme is formed by combining the heat pipe radiator, and the heat source with a far distance can be effectively radiated.
Fig. 3 shows a case structure, in which a plurality of mounting holes 11 are formed in a side wall of the case 1, for mounting the heat dissipating device in this embodiment, during mounting, the independent air duct module 3 is firstly mounted in the mounting holes 11, then the heat pipe radiator 2 is mounted in the independent air duct module 3, and finally the front door and the rear door of the case are closed to form a relatively closed case.
Fig. 4 shows a schematic structural diagram of a second embodiment of the heat dissipating device according to the present invention, and the difference between the first embodiment is that the independent air duct module 3 is designed into a multi-layer structure (fig. 3 shows a schematic diagram of a two-layer structure), and two air duct sub-modules 31 are formed in each independent air duct module 3 by layering up and down, one heat pipe radiator is disposed in each air duct sub-module, and the two heat pipe radiators share a fan structure, and at this time, the two air duct sub-modules between the upper layer and the lower layer may be separated by a partition board, or may be opened. Alternatively, the air duct sub-module in this embodiment may be configured in a three-layer or more structure, so that a plurality of heat sinks share one fan.
Fig. 5 shows another schematic view of a chassis, which is different from the first chassis of the above embodiment in that a heat dissipating device according to the second embodiment of the present invention is disposed in each mounting hole 11, two heat pipe radiators are disposed in each independent air duct module 3 in an upper and lower layer, and the two heat pipe radiators share a fan structure, and also, alternatively, three or more heat pipe radiators may be disposed in each independent air duct module in an upper and lower layer. In this embodiment, the independent air duct module may be matched with two or more heat pipe radiators, and the independent air duct module may be matched with a larger fan to cooperate with two or more radiators for heat dissipation, so that the usage amount of the fan may be saved.
According to the invention, through realizing modularized production and modularized assembly, the universality of components is effectively improved, the heat source far away can be effectively radiated by combining the property of heat pipe radiator for long-distance heat transmission, the equipment universality is greatly improved, the sealed air duct is combined with the heat pipe radiator and the whole machine shell to form an integral machine case radiating scheme with strong applicability and universality, the air leakage can be effectively reduced by relatively sealed independent radiating air duct, and the practice proves that the average heat pipe temperature is reduced by more than 20 degrees, and the convection heat exchange efficiency is effectively improved.
While the foregoing has been disclosed in the specification and drawings, it will be apparent to those skilled in the art that various substitutions and modifications may be made without departing from the spirit of the invention, and it is intended that the scope of the invention be limited not by the specific embodiments disclosed, but by the appended claims.
Claims (7)
1. The utility model provides a heat abstractor, its characterized in that, heat abstractor includes independent wind channel module and at least one heat pipe radiator, the heat pipe radiator is including heat collecting fin, heat pipe and the radiating fin that connects gradually, form the cavity in the independent wind channel module, the integration has the fan on the independent wind channel module, on the independent wind channel module for one side of fan is provided with the air outlet, independent wind channel module lateral part forms the opening, the opening is located between fan and the air outlet, radiating fin from the opening extends into in the cavity, just radiating fin seals the opening.
2. The heat sink of claim 1, wherein the heat dissipating fins seal the opening such that the individual air duct modules form a sealed heat dissipating channel.
3. The heat dissipating device of claim 1, wherein said independent air duct module comprises at least two air duct sub-modules, one heat pipe heat sink being disposed within each of said air duct sub-modules.
4. A heat sink according to claim 3, wherein a plurality of said heat pipe radiators are arranged in a stack.
5. The heat dissipating device of claim 1, wherein the heat dissipating fin comprises a plurality of sub-fins, each adjacent two of the sub-fins forming an air guide channel therebetween, and the fan is disposed opposite to the air guide channel.
6. A chassis comprising a heat sink according to any one of claims 1 to 5.
7. The cabinet of claim 6, wherein the cabinet side walls are formed with at least one mounting hole, and the independent air duct modules of the heat sink are respectively disposed in the mounting holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710569575.9A CN109257904B (en) | 2017-07-13 | 2017-07-13 | Heat abstractor and machine case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710569575.9A CN109257904B (en) | 2017-07-13 | 2017-07-13 | Heat abstractor and machine case |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109257904A CN109257904A (en) | 2019-01-22 |
| CN109257904B true CN109257904B (en) | 2024-06-25 |
Family
ID=65051142
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710569575.9A Active CN109257904B (en) | 2017-07-13 | 2017-07-13 | Heat abstractor and machine case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109257904B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109729702B (en) * | 2019-01-29 | 2020-07-03 | 西安微电子技术研究所 | Multi-heat pipe flow channel air-cooled sealing case structure |
| CN112333984B (en) * | 2020-11-02 | 2022-04-22 | 珠海格力电器股份有限公司 | Electrical box, water heater and air conditioner |
| CN113643616A (en) * | 2021-08-13 | 2021-11-12 | 宁波视睿迪光电有限公司 | Display device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101420838A (en) * | 2008-06-19 | 2009-04-29 | 江苏永昇空调有限公司 | Highly efficient cooling device for electronic module |
| CN207135415U (en) * | 2017-07-13 | 2018-03-23 | 罗森伯格技术（昆山）有限公司 | A kind of heat abstractor and cabinet |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4807441A (en) * | 1987-07-17 | 1989-02-28 | Allied-Signal Inc. | Cooling system for a sealed enclosure |
| TW543828U (en) * | 2001-07-12 | 2003-07-21 | Foxconn Prec Components Co Ltd | Assembly of heating-tube heat sink |
| JP2005322757A (en) * | 2004-05-07 | 2005-11-17 | Sony Corp | Cooling device and electronic equipment |
| CN101056526A (en) * | 2006-04-14 | 2007-10-17 | 鸿富锦精密工业（深圳）有限公司 | Heat radiator |
| CN102141348A (en) * | 2010-01-29 | 2011-08-03 | 上海宝勒特压缩机有限公司 | Compressor air cooler system with unbalanced arrangement of fin gaps |
| CN102355149A (en) * | 2011-10-18 | 2012-02-15 | 华为技术有限公司 | Inverter, sealing air flue and heat dissipation system |
| CN206042662U (en) * | 2016-09-20 | 2017-03-22 | 罗森伯格技术（昆山）有限公司 | Heat dissipation device |
| CN106714525B (en) * | 2017-02-27 | 2019-04-19 | 华为机器有限公司 | Radiator and electronic equipment |
-
2017
- 2017-07-13 CN CN201710569575.9A patent/CN109257904B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101420838A (en) * | 2008-06-19 | 2009-04-29 | 江苏永昇空调有限公司 | Highly efficient cooling device for electronic module |
| CN207135415U (en) * | 2017-07-13 | 2018-03-23 | 罗森伯格技术（昆山）有限公司 | A kind of heat abstractor and cabinet |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109257904A (en) | 2019-01-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2016165504A1 (en) | Cabinet and cooling system | |
| CN101600325B (en) | Combination heat sink of closed shell electronic equipment | |
| CN109257904B (en) | Heat abstractor and machine case | |
| CN110996635A (en) | Case heat radiation structure | |
| CN101453856B (en) | Communication equipment | |
| JP7511621B2 (en) | Photography lights | |
| CN207604129U (en) | A kind of PCB circuit board cabinet cooling device | |
| CN2791583Y (en) | Plate-type heat exchanger | |
| JP2017005010A (en) | Electronic device | |
| WO2024045981A1 (en) | Power device and photovoltaic system | |
| CN220156945U (en) | Radiating assembly, electric control box and air conditioner | |
| CN206165085U (en) | Special good LED display screen box structure of thermal diffusivity | |
| CN205452264U (en) | Heat radiator of chip | |
| CN207135415U (en) | A kind of heat abstractor and cabinet | |
| CN212032825U (en) | Oil-immersed transformer oil tank with efficient heat dissipation | |
| CN212628953U (en) | Heat radiation structure of display device | |
| CN210274966U (en) | Heat radiation structure | |
| CN211128733U (en) | Heat abstractor and customer premises equipment | |
| CN103917074B (en) | The display of special purpose | |
| CN208191122U (en) | The terminal service cabinet of perfect heat-dissipating | |
| CN110799017A (en) | Fully-sealed case heat dissipation structure with cold plate provided with air duct | |
| CN109725695B (en) | Computer heat abstractor | |
| CN213480418U (en) | Outer quick-witted right handle device of air conditioner | |
| CN211702710U (en) | Sealed heat dissipation case | |
| CN102056432B (en) | Outdoor heat exchange cabinet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 215300 No.6 Shen'an Road, Dianshanhu Town, Kunshan City, Suzhou City, Jiangsu Province Applicant after: ProLogis Communication Technology (Suzhou) Co.,Ltd. Address before: 215345 No. 6 Shen'an Road, Dianshan Lake Town, Kunshan City, Suzhou City, Jiangsu Province Applicant before: ROSENBERGER TECHNOLOGY ( KUNSHAN) Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |