CN210274966U - Heat radiation structure - Google Patents
Heat radiation structure Download PDFInfo
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- CN210274966U CN210274966U CN201920873503.8U CN201920873503U CN210274966U CN 210274966 U CN210274966 U CN 210274966U CN 201920873503 U CN201920873503 U CN 201920873503U CN 210274966 U CN210274966 U CN 210274966U
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- heat dissipation
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Abstract
The utility model discloses a heat radiation structure, it includes heat dissipation main part, fan and housing, and the heat dissipation main part includes a bottom plate and fixed a plurality of heat radiation fins who sets up on the bottom plate, and a plurality of heat radiation fins are longitudinal separation and set up, form a heat dissipation channel between the adjacent heat radiation fins respectively, the fan sets up in the one side that heat dissipation main part is relative with heat dissipation channel, the housing shroud is outside fan and heat dissipation main part, and the both ends that the housing is relative with heat dissipation channel form the opening. The utility model discloses the housing with heat dissipation main part and fan shroud, and the housing corresponds heat dissipation channel's double-phase opposite terminal and forms the opening, makes the wind channel of forming the circulation in the housing, and at fan during operation, wind can all concentrate on in the wind channel to improve heat radiation fins's radiating rate and radiating effect.
Description
Technical Field
The utility model relates to a heat radiation structure of electronic product, in particular to sound system's heat radiation structure.
Background
Along with the development of science and technology, electronic products have increasingly strong functions, in the process of using electronic products such as mobile phones, computers, power amplifiers and the like, electronic components of the products such as CPUs, MOS tubes, transformers and the like can generate a large amount of heat during working, if the heat is not timely dissipated, the electronic components are halted, and the electronic components such as the CPUs, the MOS tubes, the transformers and the like can be burnt out seriously, so that the service life of the electronic products is shortened. Therefore, a good heat sink for electronic components plays a crucial role in stable operation of electronic products.
In the existing electronic product radiator, such as a sound box, a computer and the like, a radiating fin is fixed on a chip main board of an electronic product, a fan is locked at one side position of a chip, heat generated by electronic components on the chip is conducted out by using the radiating fin, and then heat is taken away by heat exchange between air and the radiating fin by using the fan, so that a radiating mode of forced convection is realized.
Because the fan is arranged on one side of the radiating fin, the radiating fin is used for radiating, a certain gap is formed between the radiating fin and the fan, the radiating fin and the fan are not completely sealed, and therefore wind flows out of the gap when the fan works and cannot be completely concentrated on the radiator, and the radiating effect is poor.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome the not good defect of electronic components radiating effect among the prior art and provide a rational in infrastructure, radiating effect good heat radiation structure and use this heat radiation structure's power amplifier.
In order to achieve the above purpose, the solution of the present invention is:
a heat dissipation structure comprises a heat dissipation main body, a fan and a housing, wherein the heat dissipation main body comprises a bottom plate and a plurality of heat dissipation fins fixedly arranged on the bottom plate, the heat dissipation fins are longitudinally arranged at intervals, heat dissipation channels are respectively formed between every two adjacent heat dissipation fins, the fan is arranged on one side of the heat dissipation main body opposite to the heat dissipation channels, the housing covers the fan and the heat dissipation main body, and openings are formed at two ends of the housing opposite to the heat dissipation channels.
Furthermore, two side surfaces of each radiating fin are respectively wave-shaped.
Furthermore, the bottom plate of the heat dissipation main body is arranged on a PCB, the fan is locked on the PCB, the housing comprises a top plate and two side plates arranged on two sides of the bottom end of the top plate, the bottom end of each side plate is at least provided with a convex block, the PCB is provided with a slot corresponding to each convex block of the housing, and the two side plates of the housing are arranged on two sides of the heat dissipation main body and the fan at intervals.
Furthermore, one end of the fan faces the heat dissipation channel, two sides of the other end of the fan are respectively connected with a longitudinally arranged heat dissipation aluminum plate, and a heat dissipation flow channel is formed between the two heat dissipation aluminum plates.
Furthermore, two heat dissipation aluminum plates are locked on the PCB, one side of each heat dissipation aluminum plate, which corresponds to the fan, is provided with a locking edge facing the fan, and the fan is locked on the locking edge.
Furthermore, a heating electronic component is arranged between the two heat-radiating aluminum plates.
Furthermore, the outer sides of the two heat-radiating aluminum plates are provided with heating electronic components.
After the structure of the oil-gas separator is adopted, the utility model discloses heat radiation structure is through setting up the housing with heat dissipation main part and fan shroud, and the housing corresponds heat dissipation channel's double-phase opposite terminal and forms the opening, makes the wind channel of formation circulation in the housing, and at fan during operation, wind can all concentrate on in the wind channel to improve heat radiation fins's radiating rate and radiating effect.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural view in another direction of the present invention.
Fig. 3 is a schematic structural view of the present invention for removing the cover.
Fig. 4 is a schematic structural view of the present invention taken down from another direction.
Detailed Description
In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following embodiments.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
As shown in fig. 1 to 4, the present invention discloses a heat dissipation structure applied to an electronic product, in this embodiment, the electronic product is described by taking a power amplifier as an example, the heat dissipation structure includes a heat dissipation main body 1, a fan 2 and a housing 3, the heat dissipation main body 1 includes a bottom plate 11 and a plurality of heat dissipation fins 12 fixedly disposed on the bottom plate 11, and the heat dissipation fins 12 and the bottom plate 11 can be integrally formed or respectively locked. A plurality of heat sink fins 12 are longitudinally arranged on the bottom plate 11 at intervals, a heat sink channel 13 is formed between adjacent heat sink fins 12, and both side walls of each heat sink fin 12 are wavy to maximize the heat conduction effect.
The fan is arranged on one side of the heat dissipation main body 1 opposite to the heat dissipation channel 13, the housing 3 covers the fan 2 and the heat dissipation main body 1, the two opposite ends of the housing 3 and the heat dissipation channel 13 form through openings 31, the housing 3 comprises a top plate 32 and two side plates 33 arranged on two sides of the bottom end of the top plate 32, the housing 3 covers the fan 2 and the heat dissipation main body 1 to form a circulating air channel, and when the fan 2 works, air can be completely concentrated in the air channel of the housing 3, so that the heat dissipation speed and the heat dissipation effect of the heat dissipation fins are improved.
The utility model discloses during heat radiation structure used, install the bottom plate 11 of main part 1 that will dispel the heat on power amplifier's PCB board 4's power amplifier chip, fan 2 lock solid is on PCB board 4 and corresponds one side of heat dissipation channel 13, and the both sides board 33 interval of housing 3 sets up in the both sides of main part 1 and fan 2 that dispel the heat, and each curb plate 33 bottom of this housing 3 is equipped with a lug 34 at least, be equipped with the slot 41 that corresponds with each lug 34 of this housing 3 on PCB board 4, fix housing 3 on PCB board 4 through lug 34 and slot 41's cooperation.
Because the power amplifier is not only provided with the power amplifier chip which can generate heat, the transformer 5, the MOS tube (not shown in the figure) and the inductor which are arranged on the PCB 4 can also generate heat, in order to improve the heat dissipation effect, two sides of one end of the fan 2, which are opposite to the heat dissipation channel 13, are respectively connected with a heat dissipation aluminum plate 6 which is longitudinally arranged, the two heat dissipation aluminum plates 6 are locked on the PCB 4, one side of each heat dissipation aluminum plate 6, which corresponds to the fan 2, is provided with a locking edge 61 facing the fan 2, the fan 2 is locked on the locking edge 61, and a heat dissipation flow channel 62 is formed between the two heat dissipation aluminum plates 6. The transformer 5 may be installed in the heat dissipation channel 62, the MOS transistor may be installed on both sides of the heat dissipation channel 62 of the heat dissipation aluminum plate 6, and the inductor may be installed on both sides of the heat dissipation channel 62. When the transformer 5 and the MOS transistor operate, heat is conducted out to the heat dissipation channel 62 through the heat dissipation aluminum plate 6, and the fan 2 blows out the heat in the heat dissipation channel 62 together when rotating, so that the heat dissipation effect is improved.
The above embodiments and drawings are not intended to limit the form and style of the present invention, and any suitable changes or modifications made by those skilled in the art should not be construed as departing from the scope of the present invention.
Claims (7)
1. A heat dissipation structure, comprising: the heat dissipation device comprises a heat dissipation main body, a fan and a housing, wherein the heat dissipation main body comprises a bottom plate and a plurality of heat dissipation fins fixedly arranged on the bottom plate, the heat dissipation fins are longitudinally arranged at intervals, a heat dissipation channel is formed between every two adjacent heat dissipation fins, the fan is arranged on one side of the heat dissipation main body opposite to the heat dissipation channel, the housing covers the fan and the heat dissipation main body, and openings are formed at two ends of the housing opposite to the heat dissipation channel.
2. A heat dissipating structure according to claim 1, wherein: the two side surfaces of each radiating fin are respectively wave-shaped.
3. A heat dissipating structure according to claim 1, wherein: the bottom plate of the heat dissipation main body is arranged on a PCB, the fan is locked on the PCB, the housing comprises a top plate and two side plates arranged on two sides of the bottom end of the top plate, the bottom end of each side plate is at least provided with a convex block, the PCB is provided with a slot corresponding to each convex block of the housing, and the two side plates of the housing are arranged on two sides of the heat dissipation main body and the fan at intervals.
4. A heat dissipating structure according to claim 3, wherein: one end of the fan faces the heat dissipation channel, two sides of the other end of the fan are respectively connected with a longitudinally arranged heat dissipation aluminum plate, and a heat dissipation flow channel is formed between the two heat dissipation aluminum plates.
5. A heat dissipating structure according to claim 4, wherein: two heat dissipation aluminum plates are locked on the PCB, one end of each heat dissipation aluminum plate, which corresponds to the fan, is provided with a locking edge facing the fan, and the fan is locked on the locking edge.
6. A heat dissipating structure according to claim 4, wherein: and a heating electronic component is arranged between the two heat-radiating aluminum plates.
7. A heat dissipating structure according to claim 4 or 6, wherein: and the outer sides of the two heat-radiating aluminum plates are provided with heating electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920873503.8U CN210274966U (en) | 2019-06-11 | 2019-06-11 | Heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920873503.8U CN210274966U (en) | 2019-06-11 | 2019-06-11 | Heat radiation structure |
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| Publication Number | Publication Date |
|---|---|
| CN210274966U true CN210274966U (en) | 2020-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920873503.8U Active CN210274966U (en) | 2019-06-11 | 2019-06-11 | Heat radiation structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112271428A (en) * | 2020-10-28 | 2021-01-26 | 北京遥感设备研究所 | Phased array subarray and satellite communication receiver |
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2019
- 2019-06-11 CN CN201920873503.8U patent/CN210274966U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112271428A (en) * | 2020-10-28 | 2021-01-26 | 北京遥感设备研究所 | Phased array subarray and satellite communication receiver |
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