CN109238650A - The equipment of test environment is provided for optical electrical device - Google Patents
The equipment of test environment is provided for optical electrical device Download PDFInfo
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- CN109238650A CN109238650A CN201710558064.7A CN201710558064A CN109238650A CN 109238650 A CN109238650 A CN 109238650A CN 201710558064 A CN201710558064 A CN 201710558064A CN 109238650 A CN109238650 A CN 109238650A
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- heat
- electrical device
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- optical electrical
- heat exchange
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The equipment of test environment is provided present invention discloses a kind of for optical electrical device, wherein the equipment includes air stream transportation device, at least one heat-exchange system and carrier for putting optical electrical device to be measured, gas after the heat-exchange system heat exchange is delivered to the carrier for being used to put optical electrical device by the air stream transportation device, the heat-exchange system includes heat exchange core, liquid circulation channel and the semiconductor cooler between the heat exchange core and liquid circulation channel, the heat exchange core is used for the air-flow for conveying the heat transfer that semiconductor cooler one side generates to air stream transportation device, the semiconductor cooler is for freezing or heating, the liquid circulation channel is for taking away the heat that semiconductor cooler another side generates.The device structure is simplified, small volume, low noise and energy consumption are small, and production and maintenance cost are all very low.
Description
Technical field
The equipment of test environment is provided the present invention relates to a kind of for optical electrical device.
Background technique
In optical module production process, usually require that producer can test related ginseng of the optical module under different temperatures environment
Number.As depicted in figs. 1 and 2, existing temperature environment provides scheme and technology includes the hot-fluid of the mechanical, electrical auxiliary thermotectonics of conventional compression
The contact TEC equipment of instrument and semiconductor refrigerating heating construction.
Wherein the primary structure of heat flow appearance includes: the compressor for refrigeration, the auxiliary heat of resistance wire for heating, and control
The control circuit of system refrigeration and heating, constant temperature gas hood etc..But using heat flow appearance equipment there are more problem, 1, for the pressure of refrigeration
Contracting body product is larger, to occupy larger space, and cost is costly;2, when heat flow appearance equipment works, compressor can be produced
Raw loud noise, to have larger impact to enterprise employee health;3, the energy consumption of heat flow appearance equipment is larger.
In addition, the structure of contact TEC Temperature-controlled appliance includes: semiconductor chilling plate, conduction cooling metal, auxiliary heat dissipation water
Circulation, control circuit etc..Using contact TEC Temperature-controlled appliance, there are the following problems: 1, heat transfer rate is slow, so that rising
Cooling rate is slower;2, treating test object has pressure, therefore is easy to damage shell, furthermore test article surface temperature unevenness causes
The temperature difference is big, to influence measuring accuracy;3, the space TEC long-time open working, test environment are easy frosting.
Summary of the invention
The equipment of test environment is provided for optical electrical device the purpose of the present invention is to provide a kind of, which simplifies,
Small volume, low noise and energy consumption are small, and production and maintenance cost are all very low.
One of for achieving the above object, an embodiment of the present invention provides one kind and provides test wrapper for optical electrical device
The equipment in border, wherein the equipment includes air stream transportation device, at least one heat-exchange system and for putting optical electrical device to be measured
Gas after the heat-exchange system heat exchange is delivered to and described is used to put by the carrier of part, the air stream transportation device
The carrier of optical electrical device, the heat-exchange system include heat exchange core, liquid circulation channel and be set to the heat exchange core
Semiconductor cooler between liquid circulation channel, the heat exchange core are used for the heat for generating semiconductor cooler one side
Amount passes to the air-flow of air stream transportation device conveying, and the semiconductor cooler is for freezing or heating, the liquid circulation
Channel is for taking away the heat that semiconductor cooler another side generates.
As the further improvement of embodiment of the present invention, the equipment further includes for optical electrical device enclosure to be measured to exist
Constant temperature gas hood on carrier, the air stream transportation device will import the perseverance with the air-flow after the semiconductor cooler heat exchange
Wet cover simultaneously blows to optical electrical device to be measured.
As the further improvement of embodiment of the present invention, the heat-exchange system is serially connected including at least two one
The semiconductor cooler risen.
As the further improvement of embodiment of the present invention, the equipment includes at least two heat exchange series being serially connected
System, the air stream transportation device by the gas successively after the heat-exchange system heat exchange be delivered to it is described be used to put to
Survey the carrier of optical electrical device.
As the further improvement of embodiment of the present invention, the equipment includes at least two heat exchange series parallel with one another
System, the air stream transportation device by the gas respectively after the heat-exchange system heat exchange be delivered to it is described be used to put to
Survey the carrier of optical electrical device.
As the further improvement of embodiment of the present invention, the equipment includes receiving external heating agent and exporting the of refrigerant
One heat-exchange system and the second heat-exchange system for receiving external cold media and output heating agent, first heat-exchange system and institute
The second heat-exchange system is stated to be in parallel, what the refrigerant or second heat-exchange system that first heat-exchange system exports exported
Heating agent is transmitted to the carrier.
As the further improvement of embodiment of the present invention, the liquid circulation channel phase of at least two heat-exchange system
It is intercommunicated together.
As the further improvement of embodiment of the present invention, the liquid circulation channel phase of at least two heat-exchange system
It is intercommunicated together.
As the further improvement of embodiment of the present invention, the equipment further includes lift cylinder, and the lift cylinder drives
The constant temperature gas hood is moved to move in a straight line relative to the carrier so that the constant temperature gas hood far from or close to the carrier.
As the further improvement of embodiment of the present invention, the constant temperature gas hood is including two layers of tempered glass and for receiving
The air stream transportation device transmits the air inlet of the gas come, and the temperature for detecting temperature is additionally provided in the constant temperature gas hood and is passed
Sensor.
As the further improvement of embodiment of the present invention, the equipment further includes by the liquid of at least two heat-exchange systems
Body circulation channel is connected with the recirculation system of withdrawal liquid.
As the further improvement of embodiment of the present invention, the optical electrical device is optical module, and the optical module includes light
Emitting module and/or light-receiving component.
Compared with prior art, the beneficial effects of the present invention are technical solution provided by the invention, the heat exchange series
It unites and provides the gas of relevant temperature to the carrier for putting the optical electrical device, the heat-exchange system includes heat exchange core, liquid
Body circulation channel and the semiconductor cooler between the heat exchange core and liquid circulation channel.It is provided by the invention to set
Standby no longer to use compressor, volume significantly reduces, and greatly reduces noise.Additionally by the semiconductor cooler by institute
It states and carries out cold or heat exchange between heat exchange core and liquid circulation channel, power consumption only has original 20%, so that energy consumption is also significantly
It reduces.Furthermore use gas for medium, warming and cooling rate is very fast.
Furthermore constant temperature gas hood covers in optical electrical device on carrier, and air stream transportation device will be with semiconductor cooler heat exchange
Air-flow afterwards imports constant temperature gas hood, optical electrical device is not contacted, to will not cause to damage to optical electrical device.The test of the equipment
Environment is the airtight cavity that constant temperature gas hood and carrier are constituted, therefore steam is prevented to enter cavity, not will cause frosting.Finally should
The production of equipment and maintenance cost are also very low.
Detailed description of the invention
Fig. 1 is the schematic diagram of heat flow appearance in the prior art;
Fig. 2 is the schematic diagram of contact refrigeration equipment in the prior art;
Fig. 3 is to provide the stereoscopic schematic diagram of the equipment of test environment in first embodiment of the invention for optical electrical device;
Fig. 4 is that Fig. 3 is to provide another three-dimensional signal of the equipment of test environment in first embodiment of the invention for optical electrical device
Figure, removes shell at this time;
Fig. 5 is the schematic diagram of constant temperature gas hood in Fig. 4;
Fig. 6 is the Power Cycle of equipment, temperature control system, heat exchange core and constant temperature in first embodiment of the invention
The relation schematic diagram of gas hood;
Fig. 7 is the connection schematic diagram of the recirculation system and liquid circulation channel of equipment in first embodiment of the invention;
Fig. 8 is the liquid circulation channel, heat exchange core of equipment and the schematic diagram of refrigerator in first embodiment of the invention;
Fig. 9 is the flow chart of the temperature control system of equipment in first embodiment of the invention;
Figure 10 is the relationship signal of the liquid circulation channel, refrigerator and heat exchange core of equipment in second embodiment of the invention
Figure;
Figure 11 is the relationship signal of the liquid circulation channel, refrigerator and heat exchange core of equipment in third embodiment of the invention
Figure;
Figure 12 is the relationship signal of the liquid circulation channel, refrigerator and heat exchange core of equipment in four embodiment of the invention
Figure.
Specific embodiment
The application is described in detail below with reference to specific embodiment shown in the drawings.But these embodiments are simultaneously
The application is not limited, structure that those skilled in the art are made according to these embodiments, method or functionally
Transformation is all contained in the protection scope of the application.
In each diagram of the application, for the ease of illustration, structure or partial certain sizes can be relative to other knots
Structure or part are exaggerated, and therefore, are only used for the basic structure of the theme of diagram the application.
In addition, the term of the representation space relative position used herein such as "upper", " top ", "lower", " lower section " is
A unit as shown in the drawings or feature are described for the purpose convenient for explanation relative to another unit or feature
Relationship.The term of relative space position can be intended to include equipment in use or work other than orientation as shown in the figure not
Same orientation.For example, being described as being located at other units or feature " below " or " under " if the equipment in figure overturn
Unit will be located at other units or feature " top ".Therefore, exemplary term " lower section " can include above and below both
Orientation.Equipment can otherwise be directed (be rotated by 90 ° or other directions), and be interpreted accordingly it is used herein with it is empty
Between relevant description language.
Furthermore, it should be appreciated that although term first, second etc. can be used to describe herein various elements or
Structure, but these be described object should not be by the limitation of above-mentioned term.Above-mentioned term be only used for by these description objects that
This is distinguished.For example, the first heat exchange core can be referred to as the second heat exchange core, equally, the second heat exchange core can also
To be referred to as the first heat exchange core, the first liquid circulation channel can be referred to as second liquid circulation canal, equally, the second liquid
Body circulation channel can also be referred to as the first liquid circulation channel, this protection scope without departing from this application.
As shown in Figure 3 and Figure 4, first embodiment provided by the invention, it is optical electrical device which, which provides a kind of,
The equipment of test environment, including air stream transportation device, at least one heat-exchange system and for putting optical electrical device to be measured are provided
Carrier 12, the gas after heat-exchange system heat exchange is delivered to and is used to put optical electrical device by air stream transportation device
Carrier 12.Heat-exchange system include heat exchange core 16, liquid circulation channel 18 and be set to heat exchange core 16 and liquid circulation
Semiconductor cooler between channel 18, semiconductor cooler is for freezing or heating.Wherein heat exchange core 16 is used to incite somebody to action
The air-flow that the heat transfer that semiconductor cooler one side generates is conveyed to air stream transportation device, liquid circulation channel 18 is used for will be partly
The heat that conductor refrigerator another side generates is taken away.
Equipment provided in this embodiment no longer uses compressor, and volume significantly reduces, and greatly reduces noise.In addition
Cold and hot exchange will be carried out between heat exchange core 16 and liquid circulation channel 18 by semiconductor cooler, power consumption only has original
20%, so that energy consumption is greatly reduced.Furthermore use gas for medium, warming and cooling rate is very fast.
The equipment for providing test environment for optical electrical device further includes pedestal 10, for optical electrical device to be measured to be covered in carrier
Constant temperature gas hood 14 on 12, air stream transportation device will import constant temperature gas hood 14 with the air-flow after semiconductor cooler heat exchange and blow
To optical electrical device to be measured.In the present embodiment, carrier 12 and the mutually activity of constant temperature gas hood 14 are arranged, and carrier 12 is set to pedestal 10
On.Specifically, constant temperature gas hood 14 has first state and the second state, when first state, constant temperature gas hood 14 relative to carrier 12
The closed cavity that accommodating optical electrical device is formed with carrier 12, when the second state, constant temperature gas hood 14 is located remotely from each other with carrier 12.
In the present embodiment, optical electrical device is optical module, and optical module includes light emission component and/or light-receiving component.When
So, optical electrical device may be other tested devices.
In addition, equipment further includes lift cylinder 20, lift cylinder 20 drives constant temperature gas hood 14 to transport relative to carrier 12 straight line
It is dynamic, so that constant temperature gas hood 14 is far from or close to carrier 12.Equipment further includes set on pedestal 10 or column 22 on carrier 12, is set to
The shell 28 of the first support plate 24 and the second support plate 26, cladding heat exchange core 16 and lift cylinder 20 on column 22.Its
Middle constant temperature gas hood 14 is set in the first support plate 24, and constant temperature gas hood 14 is arranged in face of carrier 12.Lift cylinder 20 is set to
Second support plate 26, further, heat exchange core 16 are also disposed in the second support plate 26, heat exchange core 16 and constant temperature gas
It is connected between cover 14 by hose.Lift cylinder 20 can drive the first support plate 24 and constant temperature gas hood 14 together along column 22
Lower linear motion.
The equipment that present embodiment provides, carrier 12 and constant temperature gas hood 14 mutually activity setting, heat exchange core 16 are perseverance
The gas that wet cover 14 provides relevant temperature is placed on carrier 12 when testing optical electrical device, constant temperature gas
Cover 14 forms the closed cavity of accommodating optical electrical device with carrier 12, and when testing is complete, constant temperature gas hood 14 and carrier 12 are mutually remote
From replaceable optical electrical device.Sealed environment of the optical electrical device detection environment using constant temperature gas hood 14 and carrier 12 composition, sealing
Environment has slowed down the speed of heat exchange, and test environment is made to be rapidly reached the temperature of test request.Equipment provided in this embodiment is not
Optical electrical device is contacted, optical electrical device will not be caused to damage.In addition the test environment of the equipment is airtight cavity, therefore anti-
Stop steam and entered cavity, not will cause frosting.Finally the production of the equipment and maintenance cost are also very low.
With further reference to Fig. 5, constant temperature gas hood 14 includes two layers of tempered glass and comes for the transmission of receiving air-flow transmitting device
Gas air inlet, the temperature sensor 30 for detecting temperature is additionally provided in constant temperature gas hood 14.Constant temperature gas hood 14 uses double
The design of layer tempered glass middle vacuum, reduces heat radiation bring energy loss, to reduce energy loss.
With further reference to Fig. 6, equipment includes at least two heat-exchange systems parallel with one another, and air stream transportation device will be respectively
Gas after heat-exchange system heat exchange is delivered to the carrier 12 for putting optical electrical device to be measured.
Specifically, equipment includes receiving the first heat-exchange system and the second heat-exchange system of foreign gas, the first heat is handed over
It changes system to be in parallel with the second heat-exchange system, constant temperature gas hood includes the first constant temperature gas hood being connected with the first heat-exchange system
The second constant temperature gas hood being connected with the second heat-exchange system.
It is of course also possible to which more than two heat-exchange systems are arranged, which is respectively communicated with not
Same constant temperature gas hood.In this way, can be simultaneously to two and more than two optical electrical devices are tested.Certainly, the first heat exchange
It can be using connecting, it is hereby achieved that bigger refrigeration work consumption and lower refrigeration temperature between system and the second heat-exchange system
Degree.It is of course also possible to use more than two heat-exchange systems are serially connected, detailed Jie will be in later embodiment
It continues.
Specifically, the first heat-exchange system include for receiving the first heat exchange core of foreign gas, the first liquid follows
Ring channel and first group of semiconductor cooler between the first heat exchange core and the first liquid circulation channel;Second heat is handed over
The system of changing include the second heat exchange core being in parallel with the first heat exchange core, second liquid circulation canal and be set to second heat
Second group of semiconductor cooler between exchcange core and second liquid circulation canal;First heat exchange core and the first constant temperature gas
Cover is connected, thus by the gas transport of relevant temperature to the first constant temperature gas hood.Wherein the second heat exchange core is also used for receiving
Foreign gas and it is connected with the second constant temperature gas hood, thus by the gas transport of relevant temperature to the second constant temperature gas hood.
It is connected between first heat exchange core and the first constant temperature gas hood by the first airflow duct, the second heat exchange core
It is connected between the second constant temperature gas hood by the second airflow duct.
Further, the first liquid circulation channel is located at the two sides of the first heat exchange core, in the first heat exchange core
Simultaneously first group of semiconductor cooler is respectively set in two sides between the first liquid circulation channel and the first heat exchange core.Together
Sample, second liquid circulation canal are located at the two sides of the second heat exchange core, the second heat exchange core two sides and be located at second
Second group of semiconductor cooler is respectively set between liquid circulation channel and the second heat exchange core.
In present embodiment, using semiconductor cooler, the power consumption of the equipment is greatly reduced, according to experiment, with use
The scheme that compressor freezes is compared, and power consumption only has original 20%.
The liquid circulation channel of at least two heat-exchange systems is interconnected together.Specifically, the first liquid circulation is logical
Road is in parallel with second liquid circulation canal, and equipment further includes and the first liquid circulation channel and second liquid circulation canal phase
Connection is with the recirculation system of withdrawal liquid.
With further reference to Fig. 7, recirculation system includes water tank, the water pump being connected with water tank, liquid circulation channel with
Water pump is connected, and recirculation system further includes air cooling module.Refrigerating fluid in recirculation system is in water tank, water pump, liquid
It is flowed between body circulation channel and air cooling module to take away the heat of semiconductor cooler generation.Coolant flow is to air cooling module
When, heat can be turned again to by the refrigerating fluid of air-cooled cooling by fan cooling into open environment and continue band in circulation
Walk the heat of semiconductor cooler.
In the present embodiment, a recirculation system can carry Liang Tai and two or more liquid circulation channel and Re Jiao
Change core, Liang Tai and two or more liquid circulation channel and heat exchange core asynchronous working, wherein can when a heating
With the cooling refrigerating fluid that recovers energy, refrigerating fluid after cooling removes the heat generated when offsetting another refrigeration simultaneously.Multiple heat
The work of exchcange core high/low temperature asynchronous controlling is arranged in pairs or groups with recirculation system, to reach energy regenerating utilization and heat exchange core
Continual and steady refrigeration and heating.
Referring to Fig. 6 and 8, by taking first group of semiconductor cooler as an example, second group of semiconductor cooler and first group of semiconductor
Refrigerator is similar, is no longer discussed in detail.First group of semiconductor cooler 33 includes multiple semiconductor coolers, semiconductor cooler
Including cold and hot end, one of the first heat exchange core 34 and the first liquid circulation channel 36 are connected with cold end, and first
Heat exchange core 34 and 36 another one of the first liquid circulation channel are connected with hot end.Reach refrigerating fluid in this way to semiconductor
Refrigerator cooling, the purpose that semiconductor cooler cools down to gas, the gas after cooling cool down as medium to optical electrical device.
According further to the characteristic of semiconductor cooler, when the polarity of the control power supply of reversion semiconductor cooler, so that it may replace refrigeration
For heating.Second heat exchange core, second liquid circulation canal and second group of semiconductor cooler and the first heat exchange core 34,
First liquid circulation channel 36 is identical with the setting of first group of semiconductor cooler 33.
Specifically, liquid circulation channel includes the water-cooling head that a plurality of inside are bar structure.Heat exchange core includes grid
The gas delivery passage of shape structure.Wherein the first liquid circulation channel 36 includes the water-cooling head that a plurality of inside are bar structure,
First heat exchange core 34 includes the gas delivery passage of bar structure.Equally, second liquid circulation canal, which is also provided with into, includes
A plurality of inside are the water-cooling head of bar structure, and it is logical that the second heat exchange core is also provided with into the gas transport including bar structure
Road.Refrigerating fluid flows in bar structure, increases refrigerating fluid walking path, so that flow area is maximum, refrigerating fluid will be with most
Large area conducts and sufficiently takes away the heat of semiconductor cooler.And gas delivery passage is also provided with into bar structure, makes gas
Medium increases walking path, to sufficiently achieve cold and hot exchange.Certainly, liquid circulation channel and gas delivery passage can also be set
It is set to other structures shape.
Referring to Fig. 5 and Fig. 9, temprature control method includes the following steps, 1, temperature sensor 30 read the temperature of optical electrical device
Degree;2, the environment temperature of test parameter needed for judging, that is, program setting temperature;If 3, being unsatisfactory for the practical temperature of optical electrical device
Degree≤program setting temperature, humidity control system work, semiconductor cooler connect it is negative, to optical electrical device freeze;If meet light/
Electrical part actual temperature≤program setting temperature, humidity control system break-off, semiconductor cooler connects just, to optical electrical device
Part heating;4, the temperature of the optical electrical device after adjusting inputs to temperature sensor 30, is then again introduced into step 1.This method
In, environment temperature is detected by temperature sensor 30, judges whether semiconductor cooler starts work or switch polarity reversion
Temperature, humidity control system continue working to influence environment temperature, and then temperature sensor 30 persistently detects environment temperature simultaneously
It sends system to and forms closed loop.This method can accurately control the test temperature of optical electrical device.
As shown in Figure 10, the difference of second embodiment provided by the invention, the embodiment and first embodiment is,
Equipment includes at least two heat-exchange systems being serially connected, and air stream transportation device will be successively after heat-exchange system heat exchange
Gas be delivered to the carrier 12 (ginseng Fig. 1) for putting optical electrical device to be measured.
Specifically, equipment includes receiving the first heat-exchange system of foreign gas and being connected in series with the first heat-exchange system
Second heat-exchange system, the second heat-exchange system provide the gas of relevant temperature to the carrier 12 for putting optical electrical device to be measured.
First heat-exchange system is used to receive foreign gas, and the second heat-exchange system is connected in series with the first heat-exchange system,
And second heat-exchange system to optical electrical device periphery provide relevant temperature gas.In this way, external hot and cold gas medium is first
Into the first heat-exchange system, the hot and cold gas medium by the first heat-exchange system enters back into the second heat-exchange system, carries out
Second level heat exchange finally blows to the periphery of optical electrical device from the hot and cold gas medium that the second heat-exchange system exports.Certainly,
The heat-exchange system of two-stage or more can be set.In present embodiment, hot and cold gas medium passes through two-stage heat exchange, can obtain
Bigger refrigeration work consumption and lower cryogenic temperature.
Specifically, the first heat-exchange system include for receiving the first heat exchange core of foreign gas, the first liquid follows
Ring channel and first group of semiconductor cooler between the first heat exchange core and the first liquid circulation channel, the second heat are handed over
System is changed to include the second heat exchange core, second liquid circulation canal and lead to set on the second heat exchange core and second liquid circulation
Second group of semiconductor cooler between road, wherein the second heat exchange core is connected in series with the first heat exchange core, and the second heat
Exchcange core provides the gas of relevant temperature to the periphery of optical electrical device.
Further, the second heat exchange core is connected with constant temperature gas hood (not shown), thus by the gas of relevant temperature
It is transferred in constant temperature gas hood.
Specifically, the first heat exchange core on the outside of be equipped with the first liquid circulation channel, the two sides of the first heat exchange core with
First group of semiconductor cooler is equipped between first liquid circulation channel.Specifically, first group of semiconductor cooler may include
One semiconductor cooler, may also comprise two or more semiconductor coolers.
Second liquid circulation canal, the two sides of the second heat exchange core and second liquid are equipped on the outside of second heat exchange core
Second group of semiconductor cooler is equipped between circulation canal.Specifically, second group of semiconductor cooler may include one and half leading
Body refrigerator may also comprise two or more semiconductor coolers.
In addition, the liquid circulation channel of at least two heat-exchange systems is interconnected together.Specifically, the first liquid follows
Ring channel and second liquid circulation canal can be respectively communicated in two mutually independent recirculation systems.Certainly, the first liquid
Circulation canal and second liquid circulation canal can also be connected to the same recirculation system jointly.Specifically, the first liquid follows
Ring channel and second liquid circulation canal are connected to the same recirculation system after can connecting, and can be configured as the first liquid and follow
Ring channel and second liquid circulation canal parallel communication are in the same recirculation system.
As shown in figure 11, third embodiment provided by the invention, in the embodiment, heat-exchange system includes at least two
A semiconductor cooler being serially connected together.Specifically, the two sides of heat exchange core and be located at liquid circulation channel and heat
Semiconductor cooler is respectively set between exchcange core.Hot and cold gas medium enters heat exchange core, by heat exchange core into
Hot and cold gas medium after row heat exchange enters constant temperature gas hood.Specifically, the side at least within of heat exchange core and liquid
Two groups of semiconductor coolers are set parallel between circulation canal.Further, heat exchange core two sides and liquid circulation channel it
Between be arranged in series two groups of semiconductor coolers.That is two groups of refrigerators are mutually stacked together, wherein one group of refrigerator
Hot face be in contact with the huyashi-chuuka (cold chinese-style noodles) of another group of semiconductor cooler, two groups of semiconductor coolers form cascaded structures.Certainly, heat is handed over
Semiconductor cooler more than two can also be arranged in series by changing between core two sides and liquid circulation channel.Heat exchange core with
Two groups and semiconductor cooler more than two are set between liquid circulation channel, the invention is enabled to obtain bigger refrigeration function
Rate and lower cryogenic temperature.
It is other to be identical with the first embodiment, no longer it is discussed in detail.In addition, heat-exchange system can be set to it is multiple,
In multiple heat-exchange systems can be set into and be connected in series, can be configured as being in parallel.
As shown in figure 12, the 4th embodiment provided by the invention, in the embodiment, equipment includes receiving external heating agent
And export the first heat-exchange system of refrigerant and receive external refrigerant and export the second heat-exchange system of heating agent, wherein the first heat
Exchange system is in parallel with the second heat-exchange system, what the refrigerant or the second heat-exchange system that the first heat-exchange system exports exported
Heating agent is transmitted to carrier.
In the present embodiment, the first heat-exchange system and the second heat-exchange system are alternatively open-minded, and the first heat-exchange system is defeated
The heating agent of refrigerant or the output of the second heat-exchange system out is transmitted to the carrier for putting optical electrical device, to the periphery of optical electrical device
Diffusion.Other parts being identical with the first embodiment no longer are discussed in detail.
Specifically, needing hot gas medium being converted into cold air when providing hot gas medium to heat-exchange system
When medium, the first heat-exchange system is opened, the second heat-exchange system is closed, hot gas medium is transported to the first heat exchange series
System, carrying out cold exchange by the first heat-exchange system makes it export cold air medium, and cold air medium is then transported to optical electrical
The periphery of device.And when providing cold air medium to heat-exchange system, it needs cold air medium being converted into hot gas matchmaker
When Jie, the second heat-exchange system is opened, the first heat-exchange system is closed, cold air medium is transported to the second heat-exchange system,
Carrying out heat exchange by the second heat-exchange system makes its heat outputting gaseous mediums, and hot gas medium is then transported to optical electrical device
The periphery of part.If an exchange system had not only carried out the conversion of cold air medium to hot gas medium, but also carried out hot gas medium
To the conversion of cold air medium, the temperature difference is larger, and conversion rate is slower.And in the present embodiment, the first heat-exchange system or the second heat
When exchange system is closed, it is in normal temperature state, gaseous mediums are cooled down or risen when carrying out cold or heat exchange as needed
Wen Shi selectively opens the first heat-exchange system or the second heat-exchange system, it is only necessary to be cooled down from normal temperature state or be risen
Temperature, therefore cold or rate of heat exchange is very fast.
First heat-exchange system includes for receiving the first heat exchange core of external hot gas medium, the first liquid circulation
Channel and first group of semiconductor cooler between the first heat exchange core and the first liquid circulation channel, the second heat exchange
System includes the second heat exchange core being in parallel with the first heat exchange core, cool guiding block and set on the second heat exchange core and leads
Second group of semiconductor cooler between cold piece.
Specifically, the first liquid circulation channel is located at the two sides of the first heat exchange core, the two sides of the first heat exchange core
First group of semiconductor cooler is respectively equipped between the first liquid circulation channel.Wherein first group of semiconductor cooler includes one
A semiconductor cooler or two or more semiconductor coolers, setting are identical with the first embodiment, no longer in detail
It introduces.
The two sides of first heat exchange core are equipped with cool guiding block, between the cool guiding block of two sides and the second heat exchange core respectively
Equipped with second group of semiconductor cooler.Wherein second group of semiconductor cooler includes a semiconductor cooler or two or two
A above semiconductor cooler.
It should be appreciated that although this specification is described in terms of embodiments, but not each embodiment only includes one
A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will say
As a whole, the technical solution in each embodiment may also be suitably combined to form those skilled in the art can for bright book
With the other embodiments of understanding.
The series of detailed descriptions listed above only for feasible embodiment of the invention specifically
Protection scope bright, that they are not intended to limit the invention, it is all without departing from equivalent implementations made by technical spirit of the present invention
Or change should all be included in the protection scope of the present invention.
Claims (12)
1. it is a kind of for optical electrical device provide test environment equipment, which is characterized in that the equipment include air stream transportation device,
At least one heat-exchange system and carrier for putting optical electrical device to be measured, the air stream transportation device will pass through the heat
Gas after exchange system heat exchange is delivered to the carrier for being used to put optical electrical device, and the heat-exchange system includes heat
Exchcange core, liquid circulation channel and the semiconductor cooler between the heat exchange core and liquid circulation channel, institute
The air-flow that heat transfer of the heat exchange core for generating semiconductor cooler one side is conveyed to air stream transportation device is stated, it is described
For semiconductor cooler for freezing or heating, the liquid circulation channel is used for the heat for generating semiconductor cooler another side
Amount is taken away.
2. according to claim 1 provide the equipment of test environment for optical electrical device, which is characterized in that the equipment is also
Including for the constant temperature gas hood by optical electrical device enclosure to be measured on carrier, the air stream transportation device will be caused with the semiconductor
Air-flow after cooler heat exchange imports the constant temperature gas hood and blows to optical electrical device to be measured.
3. according to claim 1 provide the equipment of test environment for optical electrical device, which is characterized in that the heat exchange
System includes at least two being serially connected semiconductor cooler together.
4. according to any one of claim 1 to 3 provide the equipment of test environment for optical electrical device, which is characterized in that
The equipment includes at least two heat-exchange systems being serially connected, and the air stream transportation device will successively pass through the heat exchange
Gas after system heat exchange is delivered to described for putting the carrier of optical electrical device to be measured.
5. according to any one of claim 1 to 3 provide the equipment of test environment for optical electrical device, which is characterized in that
The equipment includes at least two heat-exchange systems parallel with one another, and the air stream transportation device will pass through the heat exchange respectively
Gas after system heat exchange is delivered to described for putting the carrier of optical electrical device to be measured.
6. according to any one of claim 1 to 3 provide the equipment of test environment for optical electrical device, which is characterized in that
The equipment includes receiving external heating agent and exporting the first heat-exchange system of refrigerant and receive external cold media and output heating agent
The second heat-exchange system, first heat-exchange system is in parallel with second heat-exchange system, first heat exchange
The refrigerant of system output or the heating agent of second heat-exchange system output are transmitted to the carrier.
7. according to claim 4 provide the equipment of test environment for optical electrical device, which is characterized in that described at least two
The liquid circulation channel of a heat-exchange system is interconnected together.
8. according to claim 5 provide the equipment of test environment for optical electrical device, which is characterized in that described at least two
The liquid circulation channel of a heat-exchange system is interconnected together.
9. according to claim 2 provide the equipment of test environment for optical electrical device, which is characterized in that the equipment is also
Including lift cylinder, the lift cylinder drives the constant temperature gas hood to move in a straight line relative to the carrier, so that the perseverance
Wet cover is separate or close to the carrier.
10. according to claim 2 provide the equipment of test environment for optical electrical device, which is characterized in that the constant temperature gas
Cover includes two layers of tempered glass and the air inlet for receiving the gas that the air stream transportation device transmission comes, the constant temperature gas hood
Inside it is additionally provided with the temperature sensor for detecting temperature.
11. according to claim 1 provide the equipment of test environment for optical electrical device, which is characterized in that the equipment is also
Including being connected the liquid circulation channel of at least two heat-exchange systems with the recirculation system of withdrawal liquid.
12. according to claim 1 provide the equipment of test environment for optical electrical device, which is characterized in that the optical electrical
Device is optical module, and the optical module includes light emission component and/or light-receiving component.
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CN201710558064.7A CN109238650A (en) | 2017-07-10 | 2017-07-10 | The equipment of test environment is provided for optical electrical device |
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CN201710558064.7A CN109238650A (en) | 2017-07-10 | 2017-07-10 | The equipment of test environment is provided for optical electrical device |
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CN201710558064.7A Pending CN109238650A (en) | 2017-07-10 | 2017-07-10 | The equipment of test environment is provided for optical electrical device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN115333619A (en) * | 2022-10-14 | 2022-11-11 | 武汉普赛斯电子技术有限公司 | Temperature testing device of optical module |
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CN103149955A (en) * | 2013-01-31 | 2013-06-12 | 中国科学院合肥物质科学研究院 | Temperature accurate control device used for integrated cavity spectrum technology isotope analysis |
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CN101650374A (en) * | 2008-08-12 | 2010-02-17 | 中茂电子(深圳)有限公司 | Semiconductor component test base provided with temperature-changing device and test machine platform |
CN101504478A (en) * | 2009-03-04 | 2009-08-12 | 群邦电子(苏州)有限公司 | Novel jig for optical receiving-transmitting module test |
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