CN109212621A - Electronic component handling apparatus and electronic component inspection device - Google Patents

Electronic component handling apparatus and electronic component inspection device Download PDF

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Publication number
CN109212621A
CN109212621A CN201810674961.9A CN201810674961A CN109212621A CN 109212621 A CN109212621 A CN 109212621A CN 201810674961 A CN201810674961 A CN 201810674961A CN 109212621 A CN109212621 A CN 109212621A
Authority
CN
China
Prior art keywords
electronic component
image
equipment
inspection
mounting portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810674961.9A
Other languages
Chinese (zh)
Inventor
实方崇仁
石田浩和
石田大辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
North Star Technology Co.,Ltd.
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN109212621A publication Critical patent/CN109212621A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/14—Digital output to display device ; Cooperation and interconnection of the display device with other functional units
    • G06F3/147—Digital output to display device ; Cooperation and interconnection of the display device with other functional units using display panels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/14—Digital output to display device ; Cooperation and interconnection of the display device with other functional units
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2200/00—Indexing scheme for image data processing or generation, in general
    • G06T2200/32—Indexing scheme for image data processing or generation, in general involving image mosaicing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10016—Video; Image sequence
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20212—Image combination
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Abstract

The application provides the electronic component handling apparatus and electronic component inspection device that can be easy to hold the state of electronic component mounting portion.Electronic component handling apparatus of the invention has: can configure the region of the electronic component mounting portion of power supply subassembly mounting；Delivery section, with the holding electronic component and the first in command conveyed and second handle；Illumination part can project light towards the electronic component mounting portion and can adjust the injection direction of light；Shoot part can be shot via the electronic component mounting portion being irradiated between the first in command and the second handle to the light；And control unit, the electronic component mounting portion is carried out based on image taken by the shoot part, and whether there is or not the judgement of electronic component processing.

Description

Electronic component handling apparatus and electronic component inspection device
Technical field
The present invention relates to electronic component handling apparatus and electronic component inspection devices.
Background technique
Conventionally, there is known carrying out the check device of electric checking (for example, ginseng to electronic component as such as IC equipment etc. According to patent document 1).In the check device documented by the patent document 1, it is configured to, when checking IC equipment, by IC Equipment is delivered to inspection socket, and is placed in inspection socket, to check it.In addition, being remembered in patent document 1 In the check device of load, before checking IC equipment, judge whether remain IC equipment in inspection socket, that is, sentence It is disconnected that whether there is or not IC equipment.Necessity as the judgement, it is assumed for example that in the case where inspection socket remains IC equipment, connect down It is Chong Die with the residual equipment to carry out the IC equipment to be checked, it is possible to accurate inspection result can not be obtained.Also, in patent document In check device documented by 1, in the state of towards inspection socket illumination slit light, the different (IC of shooting timing is obtained Equipment conveying front and back) two images, detect the difference (image difference) of this two images, and carried out based on its testing result whether there is or not The judgement of IC equipment.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2014-196908 bulletin
But in the check device documented by patent document 1, made due to the restriction etc. in design coverage by In the case where limit, coverage becomes narrow.Accordingly, it is difficult to be used according to the image obtained as described above inspection is held in Which kind of phenomenon socket produces.
Summary of the invention
The present invention is at least part in order to solve the above problems and makes, and can be come as technical solution below It realizes.
Electronic component handling apparatus of the invention has: can configure the electronic component mounting portion of power supply subassembly mounting Region；
Delivery section holds the electronic component and the first in command conveyed and second handle；
Illumination part can project light towards the electronic component mounting portion and can adjust the injection direction of light；
Shoot part, can be to the light via the electricity being irradiated between the first in command and the second handle Subassembly mounting portion is shot；
Display unit shows image taken by the shoot part；And
Control unit controls the delivery section, the illumination part and the shoot part, and is based on the shooting Image taken by portion carries out in the electronic component mounting portion whether there is or not the judgement of electronic component processing,
In the delivery site when first position, the shoot part shoots the first image, the delivery site in When the different second position in the first position, the shoot part shoots the second image,
The first image and second image are shown in the display unit by the control unit.
In via the structure shot between the first in command and second handle, it is difficult to shoot electronic component mounting portion Whole region, coverage is narrow.In the present invention, by delivery site when the first position to electronic component mounting portion into First image and delivery site obtained from row shooting are when the second position different from first position to electronic component mounting portion Second image obtained from being shot is shown in display unit.Thereby, it is possible to show electronic component mounting portion more in display unit Large-scale image.Therefore, operator is able to confirm that the wider of electronic component mounting portion.
In electronic component handling apparatus of the invention, it is preferred that the control unit is by the first image and institute It states the composograph that the second image is synthesized into and is shown in the display unit.
Thereby, it is possible to the larger range of image of electronic component mounting portion is shown in display unit as composograph.Cause This, operator can clearly and efficiently confirm the wider of electronic component mounting portion.
In electronic component handling apparatus of the invention, it is preferred that the shot shape of the light is in long strip,
The composograph is the long side along the shot shape in the first image and second image It direction will be made of the first image and second image mosaic.
Operator can clearly and efficiently confirm the wider of electronic component mounting portion as a result,.
In electronic component handling apparatus of the invention, it is preferred that the control unit is by the first image and institute It states the second graphical arrangement and is independently shown in the display unit.
Thereby, it is possible to the larger range of image of electronic component mounting portion is shown in display unit.Therefore, operator can Confirm the wider of electronic component mounting portion.
In electronic component handling apparatus of the invention, it is preferred that in the first image and second image In the case where photographing the same section in the electronic component mounting portion, the control unit is in the first image and described The same section is removed in any image in two images and is shown.
As a result, for example, the image for the state for deleting unwanted part is shown in display unit.Therefore, to operator For, it can be easier to be shown with knowing the situation of electronic component mounting portion.
In electronic component handling apparatus of the invention, it is preferred that in the first image and second image In the case where photographing the same section in the electronic component mounting portion, the control unit is in the first image and described The same section is removed in the image of two image both sides and is shown.
As a result, for example, display unit can be shown in the image for deleting the state of unwanted part.Therefore, for For operator, it can be easier to be shown with knowing the situation of electronic component mounting portion.
In electronic component handling apparatus of the invention, it is preferred that the electronic component mounting portion has multiple recess portions, The multiple recess portion is configured in ranks shape, stores the electronic component,
The first image and second image are the column different from each other taken in the column of the recess portion respectively Image.
Thereby, it is possible to the image of the column of recess portion different from each other is shown in display unit.
In electronic component handling apparatus of the invention, it is preferred that carried out before judgement processing to described aobvious Show the display in portion.
Thereby, it is possible to the presence or absence of the electronic components in accurately detection electronics mounting portion.
In electronic component handling apparatus of the invention, it is preferred that the electronic component mounting portion is can to load institute The inspection portion for stating electronic component and being checked.
Operator can clearly and efficiently confirm the wider of inspection portion as a result,.Therefore, the ministry of electronics industry is being detected In the case where remaining on inspection portion to the non-original idea of part, operator can more broadly confirm the inspection portion, can be more clearly Know the situation in inspection portion.As a result, inspection portion can more broadly be observed, and quickly respond to exception.Therefore, it helps In the raising for the treatment of capacity.
Electronic component inspection device of the invention has: can configure the electronic component mounting portion of power supply subassembly mounting Region；
Delivery section holds the electronic component and the first in command conveyed and second handle；
Illumination part can project light towards the electronic component mounting portion and can adjust the injection direction of light；
Shoot part, can be to the light via the electronics being irradiated between the first in command and the second handle Component mounting portion is shot；
Display unit shows image taken by the shoot part；And
Control unit controls the delivery section, the illumination part and the shoot part, is based on the shoot part Taken image carries out in the electronic component mounting portion whether there is or not the judgement of electronic component processing,
In the delivery site when first position, the shoot part shoots the first image, the delivery site in When the different second position in the first position, the shoot part shoots the second image,
The first image and second image are shown in the display unit by the control unit,
The electronic component mounting portion is the inspection portion that can be loaded the electronic component and be checked.
In via the structure shot between the first in command and second handle, it is difficult to shoot electronic component mounting portion Whole region, coverage is narrow.In the present invention, by delivery site when the first position to electronic component mounting portion into First image and delivery site obtained from row shooting are when the second position different from first position to electronic component mounting portion Second image obtained from being shot is shown in display unit.Thereby, it is possible to by the larger range of figure of electronic component mounting portion As being shown in display unit.Therefore, operator is able to confirm that the wider of electronic component mounting portion.
Detailed description of the invention
Fig. 1 is the approximate stereogram of the first embodiment of electronic component inspection device of the invention from face side.
Fig. 2 is the approximate vertical view for indicating the action state of electronic component inspection device shown in FIG. 1.
Fig. 3 is the block diagram of electronic component inspection device shown in FIG. 1.
Fig. 4 is the perspective view for indicating the inspection area of electronic component inspection device shown in FIG. 1.
Fig. 5 is the perspective view for indicating the inspection area of electronic component inspection device shown in FIG. 1, is that equipment conveying is omitted The figure of the diagram of head.
Fig. 6 is the perspective view for the detection unit that electronic component inspection device shown in FIG. 1 has.
Fig. 7 is the figure for the detection unit that electronic component inspection device shown in FIG. 1 has from downside.
Fig. 8 is the side view for the light irradiation unit that electronic component inspection device shown in FIG. 1 has.
Fig. 9 is the figure for the position for illustrating the rotation axis of reflecting mirror that light irradiation unit shown in Fig. 8 has.
Figure 10 is for illustrating showing for the testing principle of detection unit that electronic component inspection device shown in FIG. 1 has It is intended to.
Figure 11 is the enlarged cross-sectional view in the inspection portion that electronic component inspection device has.
Figure 12 is image (the first figure of the recess portion in the inspection portion for indicating that electronic component inspection device shown in FIG. 1 has Picture) a part figure, be the figure for indicating Restzustand.
Figure 13 is image (the first figure of the recess portion in the inspection portion for indicating that electronic component inspection device shown in FIG. 1 has Picture) a part figure, be the figure for indicating removing state.
Figure 14 is the side view of the equipment delivery head of electronic component inspection device shown in FIG. 1, is for illustrating that equipment is defeated Send the figure of the positional relationship of head and detection unit.
Figure 15 is the side view of the equipment delivery head of electronic component inspection device shown in FIG. 1, is for illustrating that equipment is defeated Send the figure of the positional relationship of head and detection unit.
Figure 16 is the side view of the equipment delivery head of electronic component inspection device shown in FIG. 1, is for illustrating that equipment is defeated Send the figure of the positional relationship of head and detection unit.
Figure 17 is the side view of the equipment delivery head of electronic component inspection device shown in FIG. 1, is for illustrating that equipment is defeated Send the figure of the positional relationship of head and detection unit.
Figure 18 is the top view in inspection portion shown in Fig. 2.
Figure 19 be show inspection portion shown in Figure 18 is shot obtained from image display unit main view.
Figure 20 is the flow chart of the control action for the control unit for indicating that electronic component inspection device shown in FIG. 1 has.
Figure 21 is provided at the inspection portion of the inspection area of the second embodiment of electronic component inspection device of the invention Top view.
Figure 22 is to indicate the first image and the second figure obtained from shoot part shoots inspection portion shown in Figure 21 The figure of picture.
Figure 23 is to indicate the first image and the second figure obtained from shoot part shoots inspection portion shown in Figure 21 The figure of picture.
Figure 24 be show inspection portion shown in Figure 21 is shot obtained from image display unit main view.
Figure 25 is the top view in the inspection portion of the third embodiment of electronic component inspection device of the invention.
Figure 26 is to indicate the first image and the second figure obtained from shoot part shoots inspection portion shown in Figure 25 The figure of picture.
Figure 27 be show inspection portion shown in Figure 25 is shot obtained from image display unit main view.
Figure 28 is to show to shoot the inspection portion of the 4th embodiment of electronic component inspection device of the invention Obtained from image display unit main view.
Figure 29 is the top view in the inspection portion that the 5th embodiment of electronic component inspection device of the invention has.
Figure 30 be illumination part in the sixth embodiment of electronic component inspection device of the invention and shoot part when Sequence figure.
Figure 31 is the top view in the inspection portion in the 7th embodiment of electronic component inspection device of the invention.
Figure 32 is the side view of the light irradiation unit in the 7th embodiment of electronic component inspection device of the invention.
Figure 33 is the top view in the inspection portion in the 8th embodiment of electronic component inspection device of the invention, is to indicate The figure in region captured by first photographing unit and the second shoot part.
Figure 34 is the top view in the inspection portion in the 9th embodiment of electronic component inspection device of the invention.
Figure 35 is the top view in the inspection portion in the 9th embodiment of electronic component inspection device of the invention.
Description of symbols
1 ... electronic component inspection device, 2 ... detection units, 2A ... detection unit, 2B ... detection unit, 3 ... shootings are single Member, 4 ... light irradiation units, 10 ... electronic component handling apparatus, 11A ... conveyor pallet structure, 11B ... conveyor pallet structure, 12 ... temperature adjustment sections, 13 ... equipment delivery heads, 14 ... equipment supply units, 15 ... conveyor pallet structures, 16 ... inspection portions, 17 ... Equipment delivery head, 17A ... equipment delivery head, 17B ... equipment delivery head, 18 ... equipment recoverers, 19 ... recycling pallets, 20 ... Equipment delivery head, 21 ... conveyor pallet structures, 22A ... conveyor pallet structure, 22B ... conveyor pallet structure, 23 ... encoders, 24 ... notification units, 27 ... labels, 28 ... display units, 31 ... first cameras, 32 ... second cameras, 33 ... photo-emission parts, 41 ... laser light sources, 41A ... laser light source, 41B ... laser light source, 41C ... laser light source, 41D ... laser light source, 42 ... reflections Mirror, 43 ... motors, 90 ... IC equipment, 160 ... upper surfaces, 161 ... recess portions, 161A ... column, 161B ... column, 161D ... recess portion, 161a ... column, 161b ... column, 161c ... column, 161d ... column, 162 ... inner peripheral surfaces, 163 ... first recess portions, 164 ... bottoms, 165 ... Second recess portion, 166 ... bottoms, 167 ... gutters, 200 ... pallets, 231 ... first next doors, 232 ... second next doors, 233 ... Three next doors, 234 ... the 4th next doors, 235 ... the 5th next doors, 241 ... front shrouds, 242 ... side covers, 243 ... side covers, 244 ... back covers, 245 ... overhead guards, 300 ... monitors, 301 ... display pictures, 331 ... first light reflection surfaces, 332 ... second light reflection surfaces, 400 ... Signal lamp, 421 ... reflectings surface, 500 ... loudspeakers, 600 ... Mouse tables, 700 ... operation panels, 800 ... control units, 802 ... deposit Reservoir, A1 ... pallet supply area, the supply area A2 ..., the inspection area A3 ..., the recovery zone A4 ..., A5 ... pallet remove area Domain, D ... composograph, D1 ... image, D2 ... image, D31A ... image, D31B ... image, D32A ... image, D32B ... image, L1 ... laser, L42 ... extended line, O ... rotation axis, O32 ... optical axis, the first position P1 ..., the second position P2 ..., Pc ... centre bit It sets, the gap S ..., d1 ... image, d2 ... image, t1 ... shooting start time, t2 ... shooting finish time, Δ D1 ... offset, Δ D2 ... offset, Δ α ... angle, α 11A ... arrow, α 11B ... arrow, α 13X ... arrow, α 13Y ... arrow, α 14 ... arrow, α 15 ... arrow, α 17Y ... arrow, α 18 ... arrow, α 20X ... arrow, α 20Y ... arrow, α 21 ... arrow, α 22A ... arrow, α 22B ... arrow, α 90 ... arrow, β ... angle, θ 1 ... incidence angle, θ 2 ... angle.
Specific embodiment
Hereinafter, preferred embodiment based on the figure come the electronic component handling apparatus that the present invention will be described in detail with And electronic component inspection device.
<first embodiment>
Hereinafter, referring to Fig.1~Figure 20, to the of electronic component handling apparatus and electronic component inspection device of the invention One embodiment is illustrated.In addition, hereinafter, for ease of description, as shown in Figure 1, three orthogonal axis are set as X Axis, Y-axis and Z axis.In addition, the X/Y plane including X-axis and Y-axis is level, Z axis is vertical.In addition, also will be parallel with X-axis Direction be known as " X-direction (first direction) ", also by the direction parallel with Y-axis be known as " Y-direction (second direction) ", also will be with Z The parallel direction of axis is known as " Z-direction (third direction) ".In addition, the direction of the arrow institute direction of all directions is known as " just ", it will Its opposite direction referred to as " negative ".In addition, "horizontal" described in present specification is not limited to fully horizontally, as long as not hindering The conveying of electronic component, also comprising relative to horizontal slightly (being, for example, less than 5 ° of degree) inclined state.In addition, sometimes will figure 1, the upside in Fig. 4, Fig. 5, Fig. 6, Figure 14~Figure 17, that is, Z-direction positive side is known as "upper" or " top ", by downside, that is, Z axis Direction negative side is known as "lower" or " lower section ".
Electronic component handling apparatus 10 of the invention has appearance shown in FIG. 1.The electronic component of the invention conveys dress It sets 10 to have: capableing of the inspection area A3 (region) in configuration inspection portion 16, inspection portion 16 is the ministry of electronics industry of power supply subassembly mounting Part mounting portion；Equipment delivery head 17 (delivery section) has the equipment delivery head 17A (first for holding electronic component and being conveyed Handle) and equipment delivery head 17B (second handle)；Light irradiation unit 4, can be towards inspection portion 16 (electronic component mounting portion) Light is projected, and the injection direction of light can be adjusted；Shooting unit 3, can be to light via equipment delivery head 17A and equipment delivery head The inspection portion 16 being irradiated between 17B is shot；As the monitor 300 of display unit, to taken by shooting unit 3 Image is shown；And the control unit 800 as processor, to equipment delivery head 17, light irradiation unit 4 and shooting unit 3 are controlled, and the judgement processing of the presence or absence of electronic component in inspection portion 16 is carried out based on the image that shooting unit 3 takes.Separately Outside, shooting unit 3 shoots image d1 (the first image) when equipment delivery head 17 is located at first position P1, in equipment delivery head 17 Image d2 (the second image) is shot when positioned at the second position P2 different from first position P1.Also, control unit 800 is by image d1 And image d2 is shown to monitor 300.
In via the structure shot between equipment delivery head 17A and equipment delivery head 17B, it is difficult to which shooting checks The whole region in portion 16, coverage are narrow.In the present invention, shooting is examined when equipment delivery head 17 being located at first position P1 The image d2 that inspection portion 16 is shot when the image d1 and equipment delivery head 17 for looking into portion 16 are located at second position P2 is shown to monitor 300.Thereby, it is possible to the image of the broader range in inspection portion 16 is shown to monitor 300.Therefore, operator can be true Recognize the broader range in inspection portion 16.
In addition, as shown in Fig. 2, electronic component inspection device 1 of the invention has: capableing of the test zone in configuration inspection portion 16 Domain A3 (region), inspection portion 16 are the electronic component mounting portions of power supply subassembly mounting；Equipment delivery head 17 (delivery section), has The equipment delivery head 17A (first in command) and equipment delivery head 17B (second handle) for holding electronic component and being conveyed；Make For the light irradiation unit 4 of illumination part, light can be projected towards inspection portion 16 (electronic component mounting portion), and light can be adjusted Project direction；As the shooting unit 3 of shoot part, can to light via between equipment delivery head 17A and equipment delivery head 17B and The inspection portion 16 being irradiated to is shot；As the monitor 300 of display unit, image taken by shooting unit 3 is carried out Display；And the control unit 800 as processor, equipment delivery head 17, light irradiation unit 4 and shooting unit 3 are controlled System, and the judgement processing of the presence or absence of electronic component that inspection portion 16 is carried out based on image taken by shooting unit 3.Separately Outside, shooting unit 3 shoots image d1 (the first image) when equipment delivery head 17 is located at first position P1, in equipment delivery head 17 Image d2 (the second image) is shot when positioned at the second position P2 different from first position P1.Also, control unit 800 is by image d1 And image d2 is shown to monitor 300.As previously mentioned, electronic component mounting portion is that power supply subassembly loads and is able to carry out inspection The inspection portion 16 looked into.
Thereby, it is possible to obtain the electronic component inspection device 1 with electronic component handling apparatus 10 above-mentioned.Separately Outside, electronic component can be transported to inspection portion 16, therefore, the inspection to the electronic component can be carried out using inspection portion 16. In addition, the electronic component after checking can be conveyed from inspection portion 16.
Hereinafter, the structure to each section is illustrated.
As shown in Figure 1 and Figure 2, the electronic component inspection device 1 of built-in electronic component conveying apparatus 10 is to convey such as BGA (Ball Grid Array: ball grid array) encapsulation is the electronic components such as IC equipment, and to electronic component in the transmission process Electrical characteristic carries out the device of checkout facility (following only referred to as " to check ").In addition, hereinafter, for ease of description, it is representative Ground is set to " IC equipment 90 " to the case where IC equipment is as electronic component explanation is used.
In addition, in addition to the foregoing, such as can also enumerate " LSI (Large Scale as IC equipment Integration: large scale integrated circuit) ", " CMOS (Complementary MOS: complementary metal oxide semiconductor) ", " CCD (Charge Coupled Device: charge-coupled device) ", by " the module I C " of multiple IC EM equipment module encapsulations, this " crystal equipment ", " pressure sensor ", " inertial sensor (acceleration transducer) ", " gyro sensor ", " fingerprint sensing outside Device " etc..
In addition, type of (electronic component handling apparatus 10) assembled in advance of electronic component inspection device 1 according to IC equipment 90 The component for being referred to as " replacement external member " replaced and use.The replacement external member has the mounting portion loaded for IC equipment 90, As the mounting portion, such as have aftermentioned temperature adjustment section 12, equipment supply unit 14 etc..In addition, being loaded as IC equipment 90 Mounting portion, the inspection portion 16 prepared there are also, user different from the replacement external member, pallet 200.
Electronic component inspection device 1 has pallet supply area A1, (following is known as " drainage area for equipment supply area Domain ") A2, inspection area A3, equipment recovery zone (following to be only known as " recovery zone ") A4 and pallet removing region A5, this A little regions are separated by each wall portion as described later.Also, region A5 is removed from pallet supply area A1 to pallet along arrow α90 Successively via each region, the inspection area A3 in midway checks IC equipment 90 in direction.So, electronic component Check device 1 become have each region conveying IC equipment 90 electronic component handling apparatus 10 i.e. automatic letter sorting machine, checking The device in the inspection portion 16 and control unit 800 that are checked in the A3 of region.In addition, electronic component inspection device 1 is also equipped with prison Visual organ 300, signal lamp 400 and operation panel 700.
In addition, being disposed with pallet supply area A1 in electronic component inspection device 1, pallet removes the place of region A5 That is as face side, the upside being disposed in place i.e. Fig. 2 of inspection area A3 is made the downside in Fig. 2 as back side With.
Pallet supply area A1 is supplied with the feed portion for being arranged with the pallet 200 of multiple IC equipment 90 of non-inspection state. In pallet supply area A1, multiple pallets 200 can be made to be laminated.
Supply area A2 is conveyed respectively from multiple IC equipment 90 on the pallet 200 that A1 conveying in pallet supply area comes And it supplies to the region of inspection area A3.In addition, being equipped in a manner of across pallet supply area A1 and supply area A2 will hold in the palm Conveyor pallet structure 11A, 11B that disk 200 one by one conveys in the horizontal direction.Conveyor pallet structure 11A is can to make pallet 200 The arrow α into the positive side of Y-direction i.e. Fig. 2 corresponding to the IC equipment 90 for being each placed in the pallet 20011ADirection movement Moving portion.Thereby, it is possible to IC equipment 90 is steadily fed through supply area A2.In addition, conveyor pallet structure 11B makes sky Arrow α of the pallet 200 into negative side, that is, Fig. 2 of Y-direction11BThe mobile moving portion in direction.Thereby, it is possible to make empty pallet 200 from Supply area A2 is mobile to pallet supply area A1.
In supply area, A2 is equipped with temperature adjustment section (as an example, soak plate: temperature-uniforming plate) 12, equipment delivery head 13 and conveyor pallet structure 15.
Temperature adjustment section 12 is configured to referred to as set the IC of the mounting for the mounting portion of multiple IC equipment 90 mounting Standby 90 carry out concentrating " temperature-uniforming plate " being heated or cooled.By the temperature-uniforming plate to by inspection portion 16 check before IC equipment 90 into Row is heated or cooled in advance, can be adjusted to the temperature suitable for the inspection (high temperature inspection or low temperature inspection).Knot shown in Fig. 2 In structure, temperature adjustment section 12 configures two along Y-direction, and is fixed.Also, it is supplied by conveyor pallet structure 11A from pallet The IC equipment 90 on pallet 200 being sent into region A1 is transported to arbitrary temperature adjustment section 12.In addition, as the mounting portion Temperature adjustment section 12 and being fixed can to the IC equipment 90 in the temperature adjustment section 12 carry out steadily temperature adjust.
Equipment delivery head 13 is supported to further have in the A2 of supply area in X direction and Y-direction is mobile Having can also be along the part that Z-direction moves.Equipment delivery head 13 is able to carry out the pallet being sent into from pallet supply area A1 as a result, Between the conveying of IC equipment 90 between 200 and temperature adjustment section 12 and temperature adjustment section 12 and aftermentioned equipment supply unit 14 IC equipment 90 conveying.In addition, using arrow α in Fig. 213XThe movement for indicating the X-direction of equipment delivery head 13, uses arrow α13YIndicate the movement of the Y-direction of equipment delivery head 13.
Conveyor pallet structure 15 is the empty pallet 200 of the state after being removed all IC equipment 90 in supply area To positive side, that is, arrow α of X-direction in A215The mechanism of direction conveying.Also, after the conveying, empty pallet 200 is defeated by pallet It send mechanism 11B and returns to pallet supply area A1 from supply area A2.
Inspection area A3 is the region for checking IC equipment 90.It is equipped in inspection area A3 and IC equipment 90 is checked Inspection portion 16 and equipment delivery head 17.It is moved in a manner of across supply area A2 and inspection area A3 in addition, being additionally provided with Equipment supply unit 14 and the equipment recoverer 18 moved in a manner of across inspection area A3 and recovery zone A4.
Equipment supply unit 14 is configured to for carrying out the mounting that temperature IC equipment 90 adjusted loads by temperature adjustment section 12 Portion is known as that the IC equipment 90 can be delivered to " supply shuttle plate " near inspection portion 16, or is only known as " supply shuttle " Component.
In addition, be supported to can be between supply area A2 and inspection area A3 for the equipment supply unit 14 as mounting portion It is along the X direction arrow α14Direction moves back and forth.Equipment supply unit 14 can stablize IC equipment 90 from supply area A2 as a result, Ground is delivered near the inspection portion 16 of inspection area A3, in addition, can make to remove IC by equipment delivery head 17 in inspection area A3 Supply area A2 is again returned to after equipment 90.
In structure shown in Fig. 2, equipment supply unit 14 along Y-direction configure there are two, the IC in temperature adjustment section 12 is set Standby 90 are transported to arbitrary equipment supply unit 14.In addition, equipment supply unit 14 and temperature adjustment section 12 are similarly configured to energy It is enough that the IC equipment 90 for being placed in the equipment supply unit 14 is heated or cooled.It is carried out accordingly, for by temperature adjustment section 12 Temperature IC equipment 90 adjusted is able to maintain that its temperature adjusts state, and is delivered near the inspection portion 16 of inspection area A3.
Equipment delivery head 17 is to maintain the IC equipment 90 of temperature adjustment state to be held and in the A3 of inspection area Convey the operating member of the IC equipment 90.The equipment delivery head 17 is supported in the A3 of inspection area can in the Y direction and the side Z It moves back and forth upwards, a part as the mechanism for being referred to as " guiding arm ".Equipment delivery head 17 can will be from drainage area as a result, The IC equipment 90 on equipment supply unit 14 that domain A2 is sent into is transported in inspection portion 16 and is placed in inspection portion 16.In addition, in Fig. 2 In, use arrow α17YIndicate the reciprocating movement of the Y-direction of equipment delivery head 17.In addition, be supported to can be for equipment delivery head 17 It is moved back and forth in Y-direction, however, not limited to this, can also be supported to also move back and forth in the X direction.
In addition, equipment delivery head 17 can be Z-direction and the second direction, that is, Y-direction different from Z-direction in a first direction Upper movement, and include the equipment delivery head 17A as the first in command that can hold IC equipment 90；And IC can be held and set Standby 90 second handle, that is, equipment delivery head 17B, equipment delivery head 17B can be relative to equipment delivery head 17A and independently in Y It is moved in direction and Z-direction.In particular, as shown in Figure 16 and Figure 17, it is defeated by being set as equipment delivery head 17A and equipment The structure for sending a 17B to move in z-direction independently of one another, equipment delivery head 17A and equipment delivery head 17B both sides decline, Can prevent aftermentioned first camera 31 and the second camera 32 can shooting area become smaller.
Equipment delivery head 17A as the first in command and the equipment delivery head 17B as second handle are configured to second In direction, that is, Y-direction arrangement and away from each other.As a result, for example, can be using such as flowering structure: equipment delivery head 17A be checked The conveying of IC equipment 90 between the equipment supply unit 14 or equipment recoverer 18 and inspection portion 16 of the side-Y in portion 16, equipment conveying IC equipment 90 between the equipment supply unit 14 or equipment recoverer 18 and inspection portion 16 of the side+Y that carries out inspection portion 16 head 17B Conveying.Therefore, it can reduce moving distance when equipment delivery head 17 is observed on the whole, transfer efficiency is excellent.
In addition, the equipment delivery head 17A as the first in command and the equipment delivery head 17B as second handle can be simultaneously It is moved in second direction, that is, Y-direction.As a result, for example, when equipment delivery head 17A presses IC equipment 90, equipment delivery head 17B It is able to carry out different movements (handover etc. of the IC equipment 90 between equipment supply unit 14 or equipment recoverer 18), or It is able to carry out movement in contrast.Therefore, it can be improved transfer efficiency, check efficiency.
In addition, as shown in Figure 1, electronic component handling apparatus 10 has the encoder 23 as position detection part, the coding The position of the detection of the device 23 equipment delivery head 17A as the first in command or equipment delivery head 17B as second handle.In this reality It applies in mode, the position in 23 detection device delivery head 17A of encoder and the respective Y-direction of equipment delivery head 17B and Z-direction It sets.As a result, as described later, such as the first camera 31 and the second camera 32 are able to detect inspection portion 16 can be clapped The position of equipment delivery head 17A and equipment delivery head 17B when taking the photograph.As shown in figure 3,800 electricity of the encoder 23 and control unit The location information of connection, equipment delivery head 17A and equipment delivery head 17B are sent to control unit 800.
Such equipment delivery head 17 and temperature adjustment section 12 be similarly configured to can to the IC equipment 90 held into Row is heated or cooled.Thereby, it is possible to the temperature tune of IC equipment 90 is constantly maintained until from equipment supply unit 14 to inspection portion 16 Whole state.
Inspection portion 16 is mounting as the IC equipment 90 of electronic component and is checked the electrical characteristics of the IC equipment 90 Electronic component mounting portion.The inspection portion 16 forms the rectangular plate extended in X direction when from Z-direction.In addition, inspection Look into multiple (being 16 in present embodiment) recess portions 161 that portion 16 has storage IC equipment 90.Each recess portion 161 is configured in the side X It is disposed with eight upwards and this eight column is equipped with clathrate made of two column in the Y direction.
In addition, as shown in figure 11, recess portion 161 is formed as step configuration, there is the first recess portion 163 and be set to first recessed Second recess portion 165 of the bottom 164 in portion 163.In addition, the second recess portion 165 be formed in mounting IC equipment 90 when to IC equipment 90 into The cone cell of row guidance.That is, the inner peripheral surface 162 of the second recess portion 165 is relative to the X-direction inclination as third direction.
In addition, the depth D163 (from the upper surface 160 in inspection portion 16 to the distance of bottom 164) of the first recess portion 163 is preferred For 3mm or more and 7mm hereinafter, more preferably 4mm or more and 6mm or less.Even if the inclining relative to X-direction in laser L1 as a result, In the case that rake angle is smaller, laser L1 can also reach the bottom 166 of the second recess portion 165.As a result, as described later, It is able to detect whether IC equipment 90 remains in recess portion 161.
In addition, the depth D165 (distance from bottom 164 to bottom 166) of the second recess portion 165 be preferably 3mm or more and 7mm is hereinafter, more preferably 4mm or more and 6mm or less.Even if smaller relative to the tilt angle of X-direction in laser L1 as a result, In the case where, laser L1 can also reach the bottom 166 of the second recess portion 165.As a result, as described later, being able to detect IC and setting Whether standby 90 remain in recess portion 161.
In addition, the inner peripheral surface 162 of recess portion 161 is preferably 20 ° or more and 30 ° hereinafter, more excellent with Z-direction angulation θ 2 23 ° or more and 27 ° are selected as hereinafter, particularly preferably 25 °.Even if comparing as a result, in laser L1 relative to the tilt angle of X-direction In the case where small, laser L1 can also reach the bottom 166 of the second recess portion 165.As a result, as described later, being able to detect IC Whether equipment 90 remains in recess portion 161.
In addition, being equipped with the multiple spies being electrically connected with the terminal (not shown) of IC equipment 90 in the bottom 166 of the second recess portion 165 Needle (not shown).Also, the end of IC equipment 90 is electrically connected with probe, contacts, and thus, it is possible to carry out the inspection of IC equipment 90. The inspection of IC equipment 90 be based on the program for being stored in the inspection control unit that the verifier connecting with inspection portion 16 has and into Capable.In addition, inspection portion 16 is also heated or cooled IC equipment 90 in the same manner as temperature adjustment section 12, which can be set Standby 90 are adjusted to the temperature suitable for checking.
Here, IC equipment 90 is formed as tabular in the present embodiment, be formed as rectangle in plan view.In addition, The size when vertical view of IC equipment 90 is bigger, the presence or absence of easier detection IC equipment 90, but in the present invention, even if IC equipment 90 Vertical view when size it is smaller, also can accurately detect the presence or absence of IC equipment 90, compared with the past, effect of the invention is more Add significant.Also depend on as the minimum value of specific IC equipment 90 in the case where the plan view shape of IC equipment 90 is square In the width of the shot shape (line) of laser L1, but when length on each side is 1mm or more, 3mm or less, can obtain this significantly The effect of invention, the length on each side can obtain more significantly when being 1.5mm or more, 2.5mm or less makes effect of the invention, The length on each side can obtain effect of the invention when being 2.0mm especially significantly.The plan view shape of IC equipment 90 is rectangle In the case where, also rely on the width of the shot shape (line) of laser L1, but energy when the length of short side is 1mm or more, 3mm or less Effect significantly of the invention is reached, the length of short side can obtain this hair when being 1.5mm or more, 2.5mm or less more significantly Bright effect, the length of short side can obtain effect of the invention when being 2.0mm especially significantly.So, by using Smaller IC equipment 90 can obtain effect of the invention more significantly.In addition, as previously mentioned, the vertical view of IC equipment 90 When size it is bigger, the presence or absence of easier detection IC equipment 90, this is self-evident.
In addition, the constituent material of the terminal of IC equipment 90 is preferably the metal material such as aluminium, copper.In addition, IC equipment 90 Upper surface (face of the side opposite with the face for being formed with terminal) be, for example, resin etc., surface roughness Ra is preferably 7 μm More than, more it is selected as 10 μm or more.The shot shape of laser L1 becomes distinct as a result, can more accurately detect IC equipment Whether 90 remain in recess portion 161.
Equipment recoverer 18 is configured to for the mounting of IC equipment 90 after the inspection that is carried out by inspection portion 16 and by the IC Equipment 90 is delivered to the mounting portion of recovery zone A4, referred to as " recycles shuttle plate " or is only known as " recycling shuttle ".
In addition, equipment recoverer 18 be supported to can between inspection area A3 and recovery zone A4 i.e. arrow in X direction Head α18Direction moves back and forth.In addition, equipment recoverer 18 is in the same manner as equipment supply unit 14 along the side Y in structure shown in Fig. 2 To configuration two, the IC equipment 90 in inspection portion 16 is transported to arbitrary equipment recoverer 18, and is loaded.The conveying be by What equipment delivery head 17 carried out.
Recovery zone A4 is recycled to multiple IC equipment 90 in inspection area A3 after the examined and inspection Region.Recycling pallet 19, equipment delivery head 20 and conveyor pallet structure 21 are equipped in recovery zone A4.In addition, Recovery zone A4 also prepares free pallet 200.
Recycling pallet 19 is the mounting portion loaded for the IC equipment 90 after being checked by inspection portion 16, and is fixed to returning It receives and is not moved in the A4 of region.Even if as a result, in the recovery zone configured with various movable parts such as more equipment delivery heads 20 A4 also can steadily load the IC equipment 90 for checking and finishing on recycling pallet 19.In addition, in structure shown in Fig. 2, There are three recycling pallet 19 configures in X direction.
In addition, empty pallet 200 is also in X direction there are three configurations.The pallet 200 of the sky by inspection portion 16 also as being examined The mounting portion that IC equipment 90 after looking into loads.Also, it is moved to 90 quilt of IC equipment on the equipment recoverer 18 of recovery zone A4 It is delivered to any one in the pallet 200 of recycling pallet 19 and sky, and is loaded.IC equipment 90 is according to inspection as a result, As a result it is classified and is recovered.
Equipment delivery head 20 is supported in the A4 of recovery zone to move in X-direction and Y-direction, has into one Step ground is in the part that Z-direction can also move.Equipment delivery head 20 can convey IC equipment 90 from equipment recoverer 18 as a result, To recycling pallet 19, empty pallet 200.In addition, using arrow α in Fig. 220XIndicate the shifting of the X-direction of equipment delivery head 20 It is dynamic, use arrow α20YIndicate the movement of the Y-direction of equipment delivery head 20.
Conveyor pallet structure 21 is will to remove empty pallet 200 that region A5 is sent into the A4 of recovery zone to X from pallet Direction, that is, arrow α21The mechanism of direction conveying.Also, after the conveying, empty pallet 200 becomes configuration and returns for IC equipment 90 The position of receipts, i.e., any one in described three empty pallets 200.
It is to be arranged with to check that the pallet 200 for the multiple IC equipment 90 for finishing state is recovered and is removed that pallet, which removes region A5, That goes removes material portion.Region A5 is removed in pallet, it being capable of multiple pallets 200.
In addition, being equipped in a manner of removing region A5 across recovery zone A4 and pallet by pallet 200 one by one in the Y direction Conveyor pallet structure 22A, 22B of upper conveying.Conveyor pallet structure 22A is can to make the i.e. arrow α in the Y direction of pallet 20022ASide The moving portion moved back and forth upwards.Thereby, it is possible to will check that the IC equipment 90 finished removes region from recovery zone A4 to pallet A5 conveying.In addition, conveyor pallet structure 22B be able to use positive side from the empty pallet 200 in recycling IC equipment 90 to Y-direction i.e. Arrow α22BDirection is mobile.Thereby, it is possible to so that empty pallet 200 is removed region A5 to recovery zone A4 movement from pallet.
Control unit 800 (processor) can control such as conveyor pallet structure 11A, conveyor pallet structure 11B, temperature adjustment Portion 12, equipment delivery head 13, equipment supply unit 14, conveyor pallet structure 15, inspection portion 16, equipment delivery head 17, equipment recycling Portion 18, equipment delivery head 20, conveyor pallet structure 21, conveyor pallet structure 22A and conveyor pallet structure 22B each section Work.In addition, control unit 800 has the CPU (Central for being placed outside PC (Personal Computer: personal computer) Processing Unit: central processing unit), MPU (micro Processing Unit: microprocessing unit) or FPGA At least one processors such as (Field Programmable Gate Array: field programmable gate array), the processor are read Various instructions, judgement, the order etc. being stored in control unit 800, processor carry out various instructions, various judgements, various orders Deng.In addition, control unit 800 is also possible to be built in CPU (the Central Processing Unit: central processing list of shoot part Member), MPU (micro Processing Unit: microprocessing unit) or FPGA (Field Programmable Gate Array: field programmable gate array).
In addition, as shown in figure 3, control unit 800 has memory 802 (storage unit).Memory 802 has conduct for example non- A kind of EEPROM (Electrically Erasable Programmable Read-Only of volatile semiconductor memory Memory: band Electrically Erasable Programmable Read-Only Memory) etc., it is stored with various programs such as above-mentioned inspection etc..
Operator can set or confirm via operation condition etc. of the monitor 300 to electronic component inspection device 1. The monitor 300 has the display picture 301 being made of such as liquid crystal panel, which configures in electronic component inspection The front upper lateral part of device 1.As shown in Figure 1, the right side in the figure that pallet removes region A5 is equipped with the Mouse table of mounting mouse 600.Mouse use when operation is shown in the picture of monitor 300.
In addition, being configured with operation panel 700 in the lower right of Fig. 1 relative to monitor 300.It is different from monitor 300, 700 order electronic component inspection device 1 of operation panel carries out desired movement.
In addition, signal lamp 400 can notify the work shape of electronic component inspection device 1 by the combination of luminous color State etc..Signal lamp 400 is configured at the top of electronic component inspection device 1.It is raised in addition, being built-in in electronic component inspection device 1 Sound device 500 can also notify the working condition etc. of electronic component inspection device 1 by the loudspeaker 500.
Whether these monitors 300, signal lamp 400 and loudspeaker 500 are as described later as in inspection portion 16 The notification unit 24 that is notified of result of judgement of the recess portion 161 configured with IC equipment 90 and function.Thereby, it is possible to make electronics The result of the operator notification judgement of component conveying apparatus 10.
In electronic component inspection device 1, separated between pallet supply area A1 and supply area A2 by the first next door 231, It is separated between supply area A2 and inspection area A3 by the second next door 232, by third between inspection area A3 and recovery zone A4 Next door 233 separates, and recovery zone A4 and pallet are removed and separated between the A5 of region by the 4th next door 234.In addition, supply area A2 with It is also separated by the 5th next door 235 between the A4 of recovery zone.
The most exterior of electronic component inspection device 1 is covered by cover, and the cover is for example including front shroud 241, side cover 242, side cover 243, back cover 244, overhead guard 245.
Next, being illustrated to detection unit 2.
As shown in Figure 4 and 5, detection unit 2 has detection unit 2A and detection unit 2B.Detection unit 2A and Detection unit 2B is set to the side+Z (referring to Fig. 5) of equipment delivery head 17, with the sequence of detection unit 2A and detection unit 2B from+ X-direction is arranged.
Detection unit 2A and detection unit 2B is respectively provided with shooting unit 3 and light irradiation unit 4.Detection unit 2A and Detection unit 2B in addition to the allocation position of shooting unit 3 and light irradiation unit 4 relative to Y-axis in line it is symmetrical other than, be identical Structure, therefore, hereinafter, being illustrated using detection unit 2A as representative.
As shown in Fig. 6 and Fig. 7, shooting unit 3 has the first camera 31 (first photographing unit), the second camera 32 (the second shoot part) and photo-emission part 33.
First camera 31 is for example able to use CCD (Charge Coupled Device: charge-coupled device) photograph Machine.In addition, the first camera 31 is configured towards -Y direction, the p- side Y is shot.As shown in figure 3, first camera 31 with Control unit 800 is electrically connected, to control its work.
Second camera 32 can use structure identical with the first camera 31.In addition, the second camera 32 is towards+Y Direction configuration, the right side+Y is shot.As shown in figure 3, second camera 32 is electrically connected with control unit 800, to control it Work.
Photo-emission part 33 is set between the first camera 31 and the second camera 32.The photo-emission part 33 makes inspection portion 16 As being reflected towards the first camera 31 and the second camera 32.
Second light of first light reflection surface 331 (first photo-emission part) and reflected light of the photo-emission part 33 with reflected light is anti- Penetrate face 332 (the second photo-emission part).The photo-emission part 33 when in terms of X-direction for isosceles triangle (in the present embodiment, directly Angle isosceles triangle) triangular prism component, be configured to apex angle and be located at the side-Z.
In addition, the face of the side+Y is functioned as the first light reflection surface 331 in photo-emission part 33, the face of the side-Y is as Two light reflection surfaces 332 function.
First light reflection surface 331 is set to the first camera 31 (first photographing unit) and the second camera 32 (the second shoot part) Between, reflect the picture in inspection portion 16 (electronic component mounting portion) towards the first camera 31.First camera 31 can pass through First light reflection surface 331 and to inspection between equipment delivery head 17A (first in command) and equipment delivery head 17B (second handle) The picture in portion 16 is shot.Second light reflection surface 332 is set to the second camera 32 (the second shoot part) and the first light reflection surface 331 Between, reflect the picture in inspection portion 16 (electronic component mounting portion) towards the second camera 32.Second camera 32 can pass through Second light reflection surface 332 and to inspection between equipment delivery head 17A (first in command) and equipment delivery head 17B (second handle) The picture in portion 16 is shot.Even if equipment delivery head 17A and the gap S of equipment delivery head 17B are narrow as a result, the first photograph Machine 31 and the second camera 32 can also shoot inspection portion 16 respectively.In addition, the first camera 31 in this specification and The shooting direction of second camera 32 is Z-direction.
In addition, the optical axis to the first light reflection surface 331 (the first photo-emission part) of the first camera 31 (first photographing unit) Along the Y direction (second direction) with the optical axis of the second camera 32 (the second shoot part).That is, 31 (the first shooting of the first camera Portion) to the first light reflection surface 331 (the first photo-emission part) optical axis it is parallel with the optical axis of the second camera 32 (the second shoot part). Thereby, it is possible to be easy to carry out the setting of the first camera 31, the second camera 32 and photo-emission part 33.
The incident direction of the light of first camera 31 (first photographing unit) and the second camera 32 (the second shoot part) is that This opposite direction.That is, the first camera 31 and the second camera 32 shoot opposite direction with facing each other Configuration.Even if equipment delivery head 17A and the gap S of equipment delivery head 17B are narrow as a result, by the first camera 31 with Photo-emission part 33 is set between second camera 32, and the first camera 31 and the second camera 32 can also shoot inspection portion respectively 16。
By using this structure, the first camera 31 (first photographing unit) and the second camera 32 (the second shoot part) It can be to the different region in position is shot each other in inspection portion 16 (electronic component mounting portion).It therefore, can be to inspection portion 16 more regions are shot.
In addition, as shown in fig. 7, the optical axis O32 of the first camera 31 as first photographing unit be configured to as aftermentioned Each photo-emission part the direction (X-direction) that is arranged of reflecting mirror 42 extended line L42 intersection.First camera, 31 energy as a result, It is enough that the part for being irradiated to inspection portion 16 the laser L1 reflected by each reflecting mirror 42 is shot.
Light irradiation unit 4 tool there are four laser light source (illumination part) 41, with each laser light source 41 be correspondingly arranged and to from Four reflecting mirrors 42 that the laser L1 that laser light source 41 projects is reflected and four motors for rotating each reflecting mirror 42 43.That is, the laser light source 41 as illumination part and the reflecting mirror 42 as photo-emission part are respectively set in light irradiation unit 4 It is equipped with multiple (four).
As laser light source 41, it is able to use well known laser light source, the color of the laser L1 of injection is not particularly limited.Separately Outside, irradiation destination (the IC equipment 90 in inspection portion 16 or inspection portion 16) is radiated at as the laser light source of illumination part 41 Shot shape is the linear laser L1 (light) extended along Y-direction (second direction).It as a result, as described later, can be according to the Whether there is or not IC equipment 90 in image taken by one camera 31 and the second camera 32, and are easy to know irradiated laser The variation of the position of L1.Therefore, it can more accurately detect whether IC equipment 90 remains on inspection portion 16.
In addition, as shown in Figure 4 and 5, the laser L1 that laser light source 41 irradiates is configured to, the inspection in irradiation destination Portion 16 includes two recess portions 161 arranged in the Y direction.That is, a laser light source 41 is summarized in two arranged in the Y direction A recess portion 161 and irradiate laser L1.This laser light source 41 (illumination part) sets there are four (multiple), and along as third party To X-direction be arranged, thereby, it is possible to irradiate laser L1 to eight recess portions 161 using four laser light sources 41.Also, Detection unit 2A and detection unit 2B is equipped with eight laser light sources 41 of supply, and thus, it is possible to the respective photographs to 16 recess portions 161 Penetrate laser L1.
In addition, as shown in figure 8, each laser light source 41 is arranged obliquely relative to X-direction when in terms of Y-direction.Therefore, energy Enough prevent laser light source 41 and adjacent reflecting mirror 42 from interfering.As a result, laser light source 41 and anti-can be reduced as much as possible The distance in the X-direction of mirror 42 is penetrated, the miniaturization of light irradiation unit 4 is facilitated.In particular, in electronic component handling apparatus 10 In, the space of the side+Z of equipment delivery head 17 is limited, and by realizing the miniaturization of light irradiation unit 4, it is defeated to facilitate electronic component Send the miniaturization of the entirety of device 10.
This laser light source 41 is electrically connected with control unit 800, to control its work (referring to Fig. 3).
As shown in Fig. 6 and Fig. 7, light irradiation unit 4 has to swash to emitted by the laser light source 41 as illumination part The reflecting mirror 42 as photo-emission part that light L1 is reflected.It is sharp thereby, it is possible to configure with not limiting the direction of laser light source 41 Radiant 41.Therefore, it can be improved the freedom degree of the configuration of laser light source 41.
As shown in figure 8, the reflecting mirror 42 has the reflecting surface 421 reflected laser L1, and it is configured to reflecting surface 421 Towards 41 side of laser light source.
In addition, each reflecting mirror 42 is in the X-direction (third intersected with Z-direction (first direction) and Y-direction (second direction) Direction) on be arranged.Thereby, it is possible to cooperate the configuration mode of each laser light source 41, and matching for each reflecting mirror 42 can be made The mode of setting becomes simple.
In addition, light irradiation unit 4 has rotate the reflecting mirror 42 as photo-emission part to be used as photo-emission part driving portion Four motors 43.Reflecting mirror 42 is configured to rotate, and thus, it is possible to adjust the direction of the reflecting surface 421 of reflecting mirror 42, energy Enough adjust the irradiation position of laser L1.
In addition, as shown in figure 9, reflecting mirror 42 is located at mode and the company of motor 43 on the light reflection surface with its rotation axis O It connects.It rotates reflecting mirror 42 when adjusting the direction of illumination of laser L1 as a result, can accurately carry out its adjustment.
So, in electronic component handling apparatus 10, since the laser light source 41 as illumination part can be adjusted The direction of the laser L1 of irradiation, so laser L1 can be adjusted in the irradiation position in inspection portion 16 or the configuration section of recess portion 161 Position can also correspond to the inspection portion different from Fig. 4 and structure shown in fig. 5.
In addition, the laser light source 41 as illumination part be adjusted to at least with the Z-direction as first direction it is inclined Laser L1 is irradiated in direction, i.e. intersection and non-orthogonal direction can be easy to know according to the presence or absence of IC equipment 90 as described later The variation of the position of the laser L1 irradiated.
In addition, each motor 43 as photo-emission part driving portion is arranged along the X-direction as third direction.And And adjacent motor 43 is in staggered configuration in the Y-direction as second direction in the X direction, becomes so-called interconnected.By This can also prevent from mutually interfering between motor 43 adjacent in X-direction even if the interval of the X-direction between motor 43 is smaller. As a result, can be realized the miniaturization of light irradiation unit 4.
According to this detection unit 2, the presence or absence of the IC equipment 90 that is able to detect in the recess portion 161 in inspection portion 16.Hereinafter, right It in the principle, is illustrated using Figure 10~Figure 13, but due to similarly being detected in each recess portion 161, so at one The representative that is detected as of recess portion 161 is illustrated.In addition, hereinafter, with the image of recess portion 161 taken by the first camera 31 One is illustrated for representative, but the image of recess portion 161 taken by the second camera 32 is also able to carry out similarly Control.
Figure 10 is the figure for showing schematically detection unit 2, is the figure of the detection unit 2 from Y-direction.In addition, in Figure 10 In, laser L1 is irradiated from laser light source 41 towards inspection portion 16.In the case where IC equipment 90 is placed in inspection portion 16 (with Under, which is known as " Restzustand "), laser L1 is irradiated to the position P1 in IC equipment 90, and P1, which is formed, in the position shines Penetrate the line of the linear laser L1 of shape.On the other hand, in the case where IC equipment 90 is not present in inspection portion 16 (hereinafter, will The state is known as " removing state "), laser L1 is irradiated to the position P2 of the bottom 166 of second recess portion 165 in inspection portion 16, Position P2 forms the line of the linear laser L1 of shot shape.In addition, " threadiness " in this specification refer to straight line, that This leave aggregate, ellipse, rectangle of point etc., elongate in shape along direction arrangement.
In addition, the first camera 31 shoots image under Restzustand and removing state respectively.It is shown in FIG. 12 A part of image D1 taken by first camera 31 under Restzustand shows under removing state first in Figure 13 and shines A part of image D2 taken by camera 31.These images D1 and image D2 is the necessary portion in taken image Point (breaking forth has the part of recess portion 161) is trimmed to about and is used.
As shown in figure 12, in image D1, the position P1 of the line of the laser L1 in IC equipment 90 is relative to recessed first The position P of the line of the laser L1 of the bottom 164 in portion 163 is deviated to the side-X (left and right directions in figure).This is because IC equipment 90 Upper surface is lower than the bottom 164 of the first recess portion 163, that is, is located at the side-Z.In addition, the X-direction of position P and position P1 is (in figure left Right direction) on offset be set as offset Δ D1.
On the other hand, as shown in figure 13, in image D2, the line of the laser L1 on the bottom 166 of the second recess portion 165 Position P2 is deviated relative to the position P of the line of the laser L1 in the bottom 164 of the first recess portion 163 to the side-X.This is because second The bottom 164 of 166 to the first recess portion 163 of bottom of recess portion 165 is low, that is, is located at the side-Z.In addition, by the X of position P and position P2 Offset on direction (left and right directions in figure) is set as offset Δ D2.
In addition, offset Δ D1 is smaller than offset Δ D2.This is because the upper surface of IC equipment 90 is relative to the second recess portion 165 bottom 166 is located at the side+Z.In electronic component handling apparatus 10, for example, according to the offset in image D1 and image D2 It is offset Δ D1 or offset Δ D2, being able to detect (judgement) is Restzustand or removes state.
Here, the thickness deltat d of IC equipment 90 is thinner, the difference of offset Δ D1 and offset Δ D2 are smaller, are more difficult to distinguish It is offset Δ D1 or offset Δ D2.Therefore, in than relatively thin IC equipment 90, to judge Restzustand or removing State is needed using with more high-resolution first camera 31.Specifically, in Figure 10, coupling position P1 and The line segment institute at the center (optical axis) of the line segment at the center (optical axis) of one camera 31 and coupling position P2 and the first camera 31 at Angle be Δ α, if using have can identify angle delta α resolution ratio the first camera 31, can judge it is residual State is stayed still to remove state.For example, in order to know which kind of journey use can identify after the thickness deltat d for being realised that IC equipment 90 The camera of the angle delta α of degree is better and after the resolution ratio for being realised that the first camera 31 in the thickness deltat d of which kind of degree IC equipment 90 in just can be carried out above-mentioned judgement, the present inventor is derived two mathematical expressions (1) below and mathematical expression (2).
Coupling position P2 and the line segment at the center (optical axis) of the first camera 31 and X-axis angulation are being set as α, it will The optical axis and X-axis angulation of laser L1 is set as β, by the bottom 166 of the optical axis of the first camera 31 and the second recess portion 165 It leaves distance and is set as dcamWhen, the thickness deltat d of IC equipment 90 can be indicated that angle delta α can be by mathematical expression by mathematical expression (1) (2) it indicates.
Mathematical expression (1)
Mathematical expression (2)
For example, mathematical expression (1) is updated to after knowing angle delta α, it can thus be appreciated that the IC that dawn is able to carry out above-mentioned judgement is set Standby 90 the smallest thickness deltat d.In addition, mathematical expression (2) are updated to after being realised that thickness deltat d, it can thus be appreciated that the first photograph of dawn Resolution ratio needed for machine 31.
Moreover it is preferred that above-mentioned judgement can be carried out to the IC equipment 90 that thickness deltat d is 0.2mm or more, more there is choosing It is that can carry out above-mentioned judgement to the electronic component of 0.1mm or more.Even can also be examined than relatively thin IC equipment 90 as a result, It surveys and whether remains IC equipment 90 in inspection portion 16.In addition, needing when thickness deltat d is excessively thin using relatively high resolution ratio First camera 31, thus increased costs.
In addition, the optical axis and X-axis angulation β of laser L1 are smaller, offset Δ D1 and offset Δ D2 are bigger, are scheming As in, easier can distinguish it is offset Δ D1 or offset Δ D2.When angle beta is too small, there are laser L1 be difficult to Incident situation in recess portion 161.
Therefore, as shown in figure 11, the incidence angle θ 1 as the laser L1 of the injection of the laser light source of illumination part 41 is preferably It is smaller than the inner peripheral surface 162 of recess portion 161 and Z-direction angulation θ 2.Thereby, it is possible to laser L1 is irradiated in recess portion 161.Its As a result, it is possible to detect whether IC equipment 90 remains in recess portion 161.
In this electronic component handling apparatus 10, it is difficult to ensure the space of setting detection unit 2.For example, in inspection portion Near 16, that is, in terms of Z-direction, even if configuring detection unit 2 in the position deviateed from inspection portion 16, laser L1's irradiates Range is also limited, the first camera 31 and the second camera 32 can shooting area be also limited.In view of such circumstances, preferably Be will test unit 2 be configured at the surface in inspection portion 16, i.e. inspection portion 16 the side+Z and shot, but in inspection portion 16 The side+Z be equipped with equipment delivery head 17.
Therefore, in electronic component handling apparatus 10, be formed as such as flowering structure: will test unit 2 and be configured at equipment conveying The first side 17+Z is detected via the gap S between two equipment delivery head 17A and equipment delivery head 17B.That is, being formed as Such as flowering structure: irradiate laser L1 towards inspection portion 16 via gap S, using the first camera 31 and the second camera 32 via Gap S shoots image to be judged.Even above structure as a result, also can accurately detect (judgement) be Restzustand also It is removing state.
Here, gap S is narrow, and equipment delivery head 17 in the Y direction with moved in Z-direction, accordingly, there exist be difficult to benefit With complete in the whole region in 32 pairs of inspection portions 16 of the first camera 31 and the second camera, particularly the Y-direction in inspection portion 16 The case where portion region is shot.
For example, when equipment delivery head 17 is located at (first position) position P1 shown in Figure 14, it can be to 16 recess portions Eight recess portions 161 of the side-Y in 161 are shot, but eight recess portions 161 for being difficult to pair side+Y are shot.
In addition, when equipment delivery head 17 is located at (second position) position P2 shown in figure 15, it can be to 16 recess portions Eight recess portions 161 of the side-Y in 161 are shot, but eight recess portions 161 for being difficult to pair side+Y are shot.
In addition, in the structure shown in Figure 18, each recess portion 161 in inspection portion 16 can be divided for arrange in X direction eight Column 161A, the column 161B of a recess portion 161.It arranges 161A and column 161B is sequentially arranged from -Y direction with this.In addition, gap S is narrow, Therefore, it is difficult to arrange 161A and column 161B bat by the whole region in inspection portion 16, i.e. using the first camera 31 and the second camera 32 It takes the photograph as an image.
Therefore, as shown in figure 14, in the movement of equipment delivery head 17, can be to the column in 16 recess portions 161 It when 161B is shot, i.e., when equipment delivery head 17 is located at first position P1, is shot, and obtains image d1 (the first figure Picture).Also, as shown in figure 15, when that can be shot to column 161A, i.e., when equipment delivery head 17 is located at second position P2, It is shot, and obtains image d2 (the second image).
The shooting unit 3 of detection unit 2A carries out the side+X in four recess portions 161 and column 161B of the side+X in column 161A Four recess portions 161 shooting.
In electronic component handling apparatus 10, judgement as described above can be carried out based on these images d1 and image d2. Even if being difficult to carry out the shooting of the whole region of the Y-direction in inspection portion 16 as a result, can also be carried out based on multiple images each recessed The shooting in portion 161, can detect (judgement) in all recess portions 161 is Restzustand or removes state.
In addition, the position of the equipment delivery head 17 in the state of can shooting is detected by encoder 23, coding when can shoot Device value is stored in memory 802.
In addition, in electronic component handling apparatus 10, equipment delivery head 17A (first in command) by IC equipment 90 relative to When inspection portion 16 (electronic component mounting portion) presses, there are equipment delivery head 17A to be located at the first camera 31 (shoot part) and IC The case where between equipment 90 (referring to Fig.1 6).In this case, equipment delivery head 17A blocks and is difficult to carry out eight of the side-Y The shooting of recess portion 161.On the other hand, in equipment delivery head 17B (second handle) by IC equipment 90 relative to 16 (electronics of inspection portion Component mounting portion) pressing when, there are feelings of the equipment delivery head 17B between the first camera 31 (shoot part) and IC equipment 90 Condition (referring to Fig.1 7).In this case, equipment delivery head 17B is blocked and is difficult to carry out the shooting of eight recess portions 161 of the side+Y. Using this problem, for example, in the feelings of the structure only shot when IC equipment 90 can be shot using the first camera 31 Under condition, due to the timing for knowing to be difficult to be shot, which timing the setting of shooting is omitted in so can easily be done.Its As a result, it is possible to prevent from shooting useless image.
In addition, the first camera 31 and the second camera 32 be during from shooting start time to shooting finish time, Can via between equipment delivery head 17A (first in command) and equipment delivery head 17B (second handle) to the 16 (ministry of electronics industry of inspection portion Part mounting portion) it is shot.That is, shooting when curtailed inspection portion 16 is blocked by equipment delivery head 17A or equipment delivery head 17B. Therefore, it can not lavishly be shot, and can prevent from increasing useless image data.
In addition, in the case where detecting Restzustand, remaining in recess portion 161 to the non-original idea of IC equipment 90, in electricity In subassembly conveying device 10, image d1 above-mentioned (the first image) and image d2 (the second image) are shown in by control unit 800 Monitor 300 (referring to Fig.1 9).At this point, in the present embodiment, showing at monitor 300 (display unit) by image d1 (first Image) and image d2 (the second image) synthesis after composograph D.Thereby, it is possible to by the larger range of image in inspection portion 16 Monitor 300 is shown in as composograph D.Therefore, operator can define and efficiently confirm the bigger model in inspection portion 16 It encloses.In particular, operator can be wider in the case where remaining in recess portion 161 with detecting the non-original idea of IC equipment 90 Ground confirms around the recess portion 161, can more clearly know the situation in inspection portion 16.
In addition, " synthesis " in this specification refers to, by multiple image mosaics at the image of the number fewer than its, Huo Zhejin Exercise the processing of at least part overlapping.
In addition, as previously mentioned, inspection portion 16 (electronic component mounting portion) is configured as line column-shaped, and there is storage electronic component Multiple recess portions 161.Also, image d1 (the first image) and image d1 (the second image) are the column for taking recess portion 161 respectively The image of column different from each other in (column 161A and column 161B).Thereby, it is possible to by the image of the column of recess portion 161 different from each other It is shown in monitor 300.
In addition, as previously mentioned, inspection portion 16 (electronic component mounting portion) is mounting IC equipment 90 (electronic component) and can The inspection portion 16 checked.Operator can clearly and efficiently confirm the wider of inspection portion 16 as a result,.Therefore, In the case where remaining in recess portion 161 with detecting the non-original idea of IC equipment 90, operator can more broadly confirm that this is recessed Around portion 161, the situation in inspection portion 16 can be more clearly known.As a result, remaining IC while non-original idea can be observed The recess portion 161 of equipment 90 around it, and quickly responds to exception.Therefore, facilitate the raising for the treatment of capacity.Moreover, can prevent The case where multiple IC equipment 90 are loaded by overlapping in recess portion 161.As a result, being able to carry out accurate inspection.
Next, illustrating the control action of control unit 800 based on flow chart shown in Figure 20.
Firstly, in step s101, laser light source 41 is made to work, to each recess portion 161 irradiation laser L1 (referring to Fig. 5).
Then, in step s 102, shot using 31 pairs of inspection portions 16 of the first camera.Thereby, it is possible to obtain figure 12 or image D1 as shown in Figure 13.In addition, the shooting in step S102 is can to shoot shape shown in Figure 16 and Figure 17 It is carried out when state.In addition, stopping the irradiation of laser L1 at the end of shooting.
Then, in step s 103, judgement is Restzustand or removes state.In the present embodiment, it obtains in advance The image D2 of offset Δ D2 is simultaneously stored in memory 802, carries out being residual shape based on the offset of the laser L1 of image D2 State still removes the judgement of state.
In step s 103, in the case where being judged as YES Restzustand, in step S104, arrestment delivery head 17 Work.Then, in step s105, composograph D shown in Figure 19 is made, in step s 106, is shown in monitor 300 Composograph D.Operator can clearly and efficiently confirm the wider of inspection portion 16 as a result,.In particular, detecting In the case where remaining on to the non-original idea of IC equipment 90 in recess portion 161, operator can more broadly confirm the week of the recess portion 161 It encloses, can more clearly know the situation in inspection portion 16.
In addition, can also be notified the case where being Restzustand in step S104~step S106.The notice is It is carried out and making notification unit 24 work.According to the notice, operator can remove the IC equipment 90 in inspection portion 16 to disappear Except Restzustand.Also, operator for example can press the button that conveying restores by operation panel 700.
Then, in step s 107, in the case where being judged as that recovery button is pressed, in step S108, restore defeated It send.
As described above, via the structure shot between equipment delivery head 17A and equipment delivery head 17B In, it is difficult to the whole region in inspection portion 16 is shot, coverage is narrow.It is in electronic component handling apparatus 10, equipment is defeated Send first 17 inspection portion 16 is shot when being located at first position P1 obtained from image d1 and equipment delivery head 17 be located at second Image d2 obtained from shooting when the P2 of position to inspection portion is shown in monitor 300.Thereby, it is possible to by inspection portion 16 more Large-scale image is shown in monitor 300.Therefore, operator is able to confirm that the wider of inspection portion 16.
<second embodiment>
Hereinafter, referring to Figure 21~Figure 24 to the of electronic component handling apparatus and electronic component inspection device of the invention Two embodiments are illustrated, but are illustrated centered on the difference of embodiment above-mentioned, for same item, are saved Slightly its explanation.
Other than the structure main difference of picture of the present embodiment in addition to being shown in monitor, with the first embodiment It is identical.
As shown in figure 21, in the present embodiment, each recess portion 161 in inspection portion 16 can be divided to arrange along the X direction Eight recess portions 161 column 161a, column 161b and column 161c.161a, column 161b and column 161c are arranged with this sequentially from the side-Y To arrangement.
In addition, in present embodiment, when equipment delivery head 17 is located at first position P1, the shooting unit of detection unit 2A 3 can shoot eight recess portions 161 of the side+X in column 161a and column 161b, be located at the second position in equipment delivery head 17 When P2, the shooting unit 3 of detection unit 2A can shoot eight recess portions 161 of the side+X in column 161b and column 161c.
In addition, the shooting unit 3 of detection unit 2B can be to column 161a when equipment delivery head 17 is located at first position P1 It is shot with eight recess portions 161 of the side-X in column 161b, when equipment delivery head 17 is located at second position P2, detection unit The shooting unit 3 of 2B can shoot eight recess portions 161 of the side-X in column 161b and column 161c.
In addition, as shown in figure 22, column 161a had been photographed in the image d1 taken by the shooting unit 3 of detection unit 2A With eight recess portions 161 of the side+X in column 161b, photographed in the image d1 taken by the shooting unit 3 of detection unit 2B It arranges 161a and arranges eight recess portions 161 of the side-X in 161b.
In addition, having been photographed in the image d2 taken by the shooting unit 3 of detection unit 2A in column 161b and column 161c The side+X eight recess portions 161, column 161b and column had been photographed in the image d2 taken by the shooting unit 3 of detection unit 2B Eight recess portions 161 of the side-X in 161c.
So, in image d1 and image d2, the column 161b of recess portion 161 was jointly photographed.
In the present embodiment, inspection portion 16 had been photographed in image d1 (the first image) and image d2 (the second image) In the case where same section (the column 161b of recess portion 161) in (electronic component mounting portion), control unit 800 (processor) is in image Same section (the column 161b of recess portion 161) is removed in image either in d1 (the first image) and image d2 (the second image) It goes and is shown.That is, control unit 800 is by the image of the side in image d1 (the first image) and image d2 (the second image) It deletes and is shown (referring to Figure 23 in the part of the column 161b for photographing recess portion 161 of (in the present embodiment, being image d1) Section line).As a result, to delete the status display of unwanted part in monitor 300.Therefore, for operator, It can be more easier to be shown with knowing the situation in inspection portion 16.
In addition, as shown in figure 24, in the present embodiment, control unit 800 (processor) by image d1 (the first image) with And image d2 (the second image) is arranged and is independently shown in monitor 300 (display unit).That is, omitting image d1 and image d2 Processing, only image d1 and image d2 is all shown.Thereby, it is possible to simply to control the bigger model in inspection portion 16 The image enclosed is shown in monitor 300.Therefore, operator is able to confirm that the wider of inspection portion 16.
<third embodiment>
Hereinafter, referring to Figure 25~Figure 27 to the of electronic component handling apparatus and electronic component inspection device of the invention Three embodiments are illustrated, but are illustrated centered on the difference of embodiment above-mentioned, for same item The description thereof will be omitted.
Other than the structure main difference of picture of the present embodiment in addition to being shown in monitor with the second embodiment It is identical.
As shown in figure 25, in the present embodiment, each recess portion 161 in inspection portion 16 can be divided to arrange along the X direction Eight recess portions 161 column 161a, column 161b, column 161c and column 161d.Arrange 161a, column 161b, column 161c and column 161d It is sequentially arranged from -Y direction with this.
In addition, in the present embodiment, being formed with gutter 167 between the column 161b and column 161c of recess portion 161, arranging The distance of leaving of 161b and column 161c is left with column 161d's apart from big than arranging leave distance, the column 161c of 161a and column 161b.
In addition, in the present embodiment, when equipment delivery head 17 is located at first position P1, the shooting list of detection unit 2A Member 3 can shoot eight recess portions 161 of the side+X in column 161a and column 161b, be located at second in equipment delivery head 17 When setting P2, the shooting unit 3 of detection unit 2A can clap eight recess portions 161 of the side+X in column 161c and column 161d It takes the photograph.
In addition, the shooting unit 3 of detection unit 2B can be to column 161a when equipment delivery head 17 is located at first position P1 It is shot with eight recess portions 161 of the side-X in column 161b, when equipment delivery head 17 is located at second position P2, detection unit The shooting unit 3 of 2B can shoot eight recess portions 161 of the side-X in column 161c and column 161d.
In addition, as shown in figure 25, the image d1 taken by the shooting unit 3 of detection unit 2A photographed column 161a and Eight recess portions 161 of the side+X in 161b are arranged, had photographed column in the image d1 taken by the shooting unit 3 of detection unit 2B Eight recess portions 161 of 161a and the side-X in column 161b.
In addition, having been photographed in the image d2 taken by the shooting unit 3 of detection unit 2A in column 161c and column 161d The side+X eight recess portions 161, column 161c and column had been photographed in the image d2 taken by the shooting unit 3 of detection unit 2B Eight recess portions 161 of the side-X in 161d
In addition, jointly having photographed gutter 167 in image d1 and image d2.
In the present embodiment, inspection portion 16 had been photographed in image d1 (the first image) and image d2 (the second image) In the case where same section (gutter 167) in (electronic component mounting portion), control unit 800 (processor) is in image d1 ( One image) and the image of image d2 (the second image) both sides in by same section (gutter 167) remove and shown (reference Figure 26).That is, having photographed the image of the both sides in image d1 (the first image) and image d2 (the second image) of control unit 800 It deletes (referring to Figure 26 section line) part of gutter 167.It as a result, as shown in figure 27, can be to delete unwanted portion The status display divided is in monitor 300.Therefore, it for operator, can be easier to carry out with knowing the situation in inspection portion 16 Display.
<the 4th embodiment>
Hereinafter, implementing referring to Figure 28 to the 4th of electronic component handling apparatus and electronic component inspection device of the invention the Mode is illustrated, but is illustrated centered on the difference of embodiment above-mentioned, omits it for same item Explanation.
Present embodiment is other than the structure in inspection portion and the control action main difference of control unit with described first Embodiment is identical.
Inspection portion 16 will lead to the configuration quantity of recess portion 161, configuration mode sometimes according to such as type of IC equipment 90 (mutual spacing of recess portion 161 configured in the X direction etc.) is different.In this case it is necessary to adjust swashing towards recess portion 161 The direction of illumination of light L1.As the method for adjustment of direction of illumination, it can enumerate and directly be connect by manual working and photo-emission part 33 It touches to change the method for the posture of photo-emission part 33, change the posture of photo-emission part 33 by 700 operation screen of operation panel Method etc..
Also, after adjustment, in arbitrary timing, composograph D is shown in monitor 300.In addition it is also possible to It is adjusted while observing the composograph D for being shown in monitor 300.
The shot shape of light L1 is in long strip, and composograph D is along image d1 (the first image) and image d2 (second Image) in the longitudinal direction (Y-direction) of shot shape image d1 (the first image) and image d2 (the second image) are spliced And synthesize.Thereby, it is possible to obtain effect same as the first embodiment.Moreover, as shown in figure 28, for example, scheming In the case that the laser L1 of the middle leftmost side obliquely irradiates, according to the quantity of recess portion 161, the size in inspection portion 16, it is possible to produce The raw state not being irradiated in recess portion 161.For example, the case where recess portion 161 of downside is shown in monitor 300 in only Figure 28 Under, it is possible to the 161 laser L1 of recess portion for omitting the upside in Figure 28 is not irradiated to this case in recess portion 161.Relative to This, in electronic component handling apparatus 10, since whole composograph D is shown in monitor 300, so can prevent aforementioned Such omission.Therefore, it is capable of the adjustment of direction of illumination that is more acurrate and more reliably carrying out laser L1.
So, the display to monitor 300 (display unit) is carried out before judgement (judgement processing).Even if as a result, The case where starting to check, multiple IC equipment 90 can also be prevented to be overlapped mounting in recess portion 161, is able to carry out accurate inspection.
<the 5th embodiment>
Hereinafter, implementing referring to Figure 29 to the 5th of electronic component handling apparatus and electronic component inspection device of the invention the Mode is illustrated, but is illustrated centered on the difference of embodiment above-mentioned, omits it for same item Explanation.
Present embodiment is in addition to identical as the first embodiment other than inspection portion is equipped with label and display unit.
As shown in figure 29, in the present embodiment, label 27 and display unit 28 are equipped in the upper surface in inspection portion 16.
Label 27 is set to the edge of each recess portion 161, indicates the center Pc of the X-direction in recess portion 161.Make laser L1's Irradiation position and the label 27 are consistent, and thus, it is possible to realize the simplification of the adjustment process of the irradiation position of laser L1.
In addition, display unit 28 is for example made of two dimensional code.After the adjustment process of the irradiation position of laser L1, read aobvious Show portion 28, the irradiation position of laser L1 can be associated with the foundation of the information of display unit 28 and is pre-stored within memory 802.By This, for example, even if inspection portion 16 different using the configuration mode of recess portion 161 when checking every time, it can also be by reading display unit 28 know the irradiation position of laser L1.That is, can be improved the reproducibility of the irradiation position of laser L1.It therefore, can be simply Carry out the adjustment of the irradiation position of laser L1.
<sixth embodiment>
Hereinafter, implementing referring to Figure 30 to the 6th of electronic component handling apparatus and electronic component inspection device of the invention the Mode is illustrated, but is illustrated centered on the difference of embodiment above-mentioned, omits it for same item Explanation.
Present embodiment is identical as the first embodiment other than the injection of light timing is different.
In the present embodiment, laser light source 41 intermittently irradiates laser L1.That is, 41 use of laser light source is alternately anti- The structure of irradiation and the stopping of laser L1 is carried out again.In addition, the laser power in present embodiment is according to IEC 60825-1: 2014 or JIS C 6802:2014 and set.Thus, it can be ensured that the safety of operator.
In the timing diagram shown in Figure 30, the figure of upside indicates the first camera 31 and the second camera 32 in figure, in figure The figure of downside indicates laser light source 41.As shown in figure 30, in the present embodiment, as the laser light source of illumination part 41 prior to It shoots start time t1 and irradiates laser L1, be later than the irradiation that shooting finish time t2 stops laser L1.As a result, in the first camera During 31 are shot, it can be set as irradiating laser L1 into the state in inspection portion 16.
Moreover, the laser light source 41 as illumination part uses the structure that laser L1 is irradiated when that can shoot, thereby, it is possible to Prevent the case where being shot when inspection portion is blocked by equipment delivery head 17.Therefore, it can not lavishly be shot.
<the 7th embodiment>
Hereinafter, referring to Figure 31 and Figure 32 to electronic component handling apparatus and electronic component inspection device of the invention 7th embodiment is illustrated, but is illustrated centered on the difference of embodiment above-mentioned, for same thing The description thereof will be omitted for item.
Present embodiment other than the configuration mode of the control action of control unit and the recess portion in inspection portion is different with institute It is identical to state first embodiment.
As shown in figure 31, in the present embodiment, eight recess portions 161 are equipped in inspection portion 16.In inspection portion 16, four Recess portion 161 is arranged in a column in X direction, and being further arranged in the side+Y of the column in a column, there are four recess portions 161。
In this inspection portion 16, detection unit 2A carries out four recess portions of the side+X at the center of the X-direction in inspection portion 16 The irradiation and shooting of laser L1 in 161, detection unit 2B carry out the side-X at the center of the X-direction in inspection portion 16 four are recessed The irradiation and shooting of laser L1 in portion 161.Hereinafter, with the side+X of detection unit 2A and the center of the X-direction in inspection portion 16 Four recess portions 161 be illustrated for representative.
As described in the first embodiment, laser light source 41 there are four setting in detection unit 2A, utilizes a laser light Laser L1 is irradiated to two recess portions 161 arranged along Y-direction in source 41.Therefore, when for the configuration of recess portion 161 as shown in Figure 31 When mode, so that two laser light sources 41 is worked, therefore, in detection unit 2A, select two in four laser light sources 41 A laser light source 41 works.In addition, four laser light sources 41 are successively set as laser light source 41A, laser light source from the side+X 41B, laser light source 41C and laser light source 41D.
In the selection, as previously mentioned, more increasing the incidence angle θ 1 of laser L1, more can accurately be judged.Therefore, The laser light source 41A and laser light source 41B of the side+X in detection unit 2A are selected (referring to Figure 32).
In addition, for example, laser light source 41A laser L1 incidence angle θ 1 than recess portion 161 inner peripheral surface 162 and Z-direction In the case that angulation θ 2 is big, the selection to laser light source 41A is omitted, and selects laser light source 41B and laser light source 41C (not shown).
So, in the present embodiment, to meet 1 < angle, θ of incidence angle θ 2 and the side as big as possible of incidence angle θ 1 The selection of formula progress laser light source 41.The configuration mode of recess portion 161 regardless of inspection portion 16 as a result, can be accurately Judged.
It is that laser light source 41A to the recess portion 161 of the side+X irradiates laser L1, laser light source 41B in addition, in said structure Laser is irradiated to the recess portion 161 of the side-X but it is also possible to be laser light source 41A to the structure of the recess portion 161 of the side-X irradiation laser L1 The structure of L1, laser light source 41B to the recess portion 161 of the side+X irradiation laser L1.In addition, even if selected laser light source 41A~swash Certain two laser light source in radiant 41D, two laser light sources can also project laser L1 to arbitrary recess portion 161.
<the 8th embodiment>
Hereinafter, implementing referring to Figure 33 to the 8th of electronic component handling apparatus and electronic component inspection device of the invention the Mode is illustrated, but is illustrated centered on the difference of embodiment above-mentioned, omits it for same item Explanation.
Bat of the present embodiment in addition to the configuration mode and first photographing unit and the second shoot part of the recess portion in inspection portion It is different identical as the first embodiment in addition to take the photograph range.
As shown in figure 33, in the present embodiment, 14 recess portions 161 are equipped in inspection portion 16.In inspection portion 16, seven A recess portion 161 is arranged in a column in X direction, and being further arranged in the side+Y of the column in a column has seven recess portions 161.In addition, recess portion 161 is equipped with the recess portion 161 of odd number, therefore the X-direction in inspection portion 16 in a column along the X direction Central part be configured with recess portion 161.
In addition, in the present embodiment, first of the first camera 31 and detection unit 2B with detection unit 2A is shone The overlapping portion that the coverage of camera 31 overlaps each other.Specifically, the first camera 31 of detection unit 2A is from the side+X to four A recess portion 161 is shot, and the first camera 31 of detection unit 2B shoots four recess portions 161 from the side-X.Therefore, just Intermediate recess portion 161 (recess portion 161D) is detected the first camera 31 of unit 2A and 31 pairs, the first camera of detection unit 2B Side's shooting.That is, the recess portion 161 (recess portion 161D) of middle had both been appeared before one's eyes in the image of the first camera 31 shooting of detection unit 2A D31A, and appear before one's eyes in the image D31B of the first camera 31 shooting of detection unit 2B.In addition, about this point, it is single in detection In the image D32B of the second camera 32 shooting of the image D32A and detection unit 2B of the second camera 32 shooting of first 2A Equally.
It according to this structure, also can be reliably right even recess portion 161 is located at the inspection portion 16 of the central part of X-direction Recess portion 161D positioned at central part is shot.That is, the side that recess portion 161D can be prevented to be located at image D31A and image D31B Portion of boundary (also the same for image D32A and image D32B).Therefore, the IC equipment 90 in recess portion 16 can accurately be carried out Whether there is or not judgement.
In addition, the judgement in recess portion 161D can be carried out based on at least one party in image D31A and image D31B (also the same for image D32A and image D32B).
In addition, using CCD camera as the first camera 31 and the second camera 32, along Figure 33 Left and right directions is successively exposed, and up and down direction is successively read out along Figure 33.In the present embodiment, the first camera 31 And second camera 32 shoot image construction be therefore able to suppress figure using left and right directions in scheming as the shape of longitudinal direction The reading times of middle up and down direction increase.As a result, reading the time it takes of taken image, energy can be shortened It is enough successfully to carry out the judgement based on image.
<the 9th embodiment>
Hereinafter, referring to Figure 34 and Figure 35 to electronic component handling apparatus and electronic component inspection device of the invention 9th embodiment is illustrated, but is carried out centered on the difference of embodiment above-mentioned, is saved for same item Slightly its explanation.
Present embodiment is identical as the first embodiment other than the movement of equipment delivery head is different.
As shown in Figure 34 and Figure 35, in the present embodiment, equipment delivery head 17A and equipment delivery head 17B difference With adsorption section (not shown) corresponding with the recess portion 161 in inspection portion 16, IC equipment 90 (not shown) is alternately carried out to inspection The conveying in portion 16.
That is, as shown in figure 34, when equipment delivery head 17B conveys IC equipment 90 to inspection portion 16, equipment delivery head 17A be located to inspection portion 16-Y lateral deviation from position.On the other hand, as shown in figure 35, in equipment delivery head 17A to inspection Look into portion 16 convey IC equipment 90 when, equipment delivery head 17B be located to inspection portion 16+Y lateral deviation from position.
So, in the present embodiment, the equipment delivery head 17 for becoming a side conveys IC equipment 90 to inspection portion 16 And alternate repetition carries out the structure of this movement.
Effect same as the first embodiment can be also obtained according to this 9th embodiment.
More than, based on embodiment illustrated to electronic component handling apparatus of the invention and electronic component inspection dress It sets and is illustrated, but the present invention is not limited thereto, constitute each of electronic component handling apparatus and electronic component inspection device Part can be replaced with the arbitrary structures that can play same function.Alternatively, it is also possible to add any works.
In addition, electronic component handling apparatus and electronic component inspection device of the invention is also possible to each embodiment party What structures (feature) more than any two in formula was composed.
It is by the column of common recess portion in the first image and the second image from the first figure in the second embodiment The structure that the image of a side in picture and the second image removes is in the third embodiment by the blank in inspection portion The structure that portion is removed from the image of the both sides in the first image and the second image, but it is not limited to this in the present invention, for example, It can be the structure for removing the part (part other than recess portion) that the mark etc. for being additional to inspection portion is not used in judgement, it can also be with It is the structure for removing the nonuseable parts such as the edge of the first in command or second handle.
In addition, illustrating that a processor carries out judgement processing, the shooting of image (shooting in each embodiment The control in portion) and to display unit display (control of display unit) the case where but it is also possible to be multiple processors share each control The structure of system.
In addition, being inspection portion in each embodiment, but not as the electronic component mounting portion for carrying out residue detection Be defined in this, for example, it can be temperature adjustment section, equipment supply unit, equipment recoverer, recycling pallet, pallet etc. other Electronic component mounting portion.
It, can also be in addition, shoot part can also shoot the image of full color in electronic component handling apparatus of the invention Shoot monochromatic image.
In addition, when carrying out judgement processing, being illustrated to the bottom for being irradiated to the first recess portion in each embodiment The line of laser and the structure that is compared of the line of the laser that is irradiated to the bottom of the second recess portion or the upper surface of electronic component, That is, the structure on the basis of the line of the laser for the bottom for being irradiated to the first recess portion, but it is not limited to this in the present invention, for example, The line that the laser of the upper surface in inspection portion can also be emitted onto is used as benchmark.
In addition, in each embodiment, the case where illustrating motor as photo-emission part driving portion, but It is not limited to this in the present invention, for example, it is also possible to use solenoid, MEMS (Micro Electro Mechanical System: MEMS) tectosome etc..

Claims (10)

1. a kind of electronic component handling apparatus, which is characterized in that have:
Region can configure the electronic component mounting portion of power supply subassembly mounting；
Delivery section, with the holding electronic component and the first in command conveyed and second handle；
Illumination part can project light towards the electronic component mounting portion and can adjust the injection direction of light；
Shoot part, can be to the light via the ministry of electronics industry being irradiated between the first in command and the second handle Part mounting portion is shot；
Display unit shows image taken by the shoot part；And
Control unit controls the delivery section, the illumination part and the shoot part, and is based on the shoot part institute The image taken carries out in the electronic component mounting portion whether there is or not the judgement of electronic component processing,
In the delivery site when first position, the shoot part shoots the first image, the delivery site in it is described When the different second position in first position, the shoot part shoots the second image,
The first image and second image are shown in the display unit by the control unit.
2. electronic component handling apparatus according to claim 1, which is characterized in that
The composograph that the first image and second image are synthesized into is shown in described aobvious by the control unit Show portion.
3. electronic component handling apparatus according to claim 2, which is characterized in that
The shot shape of the light is in long strip,
The composograph is the longitudinal direction along the shot shape in the first image and second image It will be made of the first image and second image mosaic.
4. electronic component handling apparatus according to claim 1, which is characterized in that
The control unit by the first image and second graphical arrangement and is independently shown in the display unit.
5. electronic component handling apparatus according to claim 1, which is characterized in that
The case where photographing the same section in the electronic component mounting portion in the first image and second image Under, the control unit in any image in the first image and second image by the same section remove and into Row display.
6. electronic component handling apparatus according to claim 1, which is characterized in that
The case where photographing the same section in the electronic component mounting portion in the first image and second image Under, the same section is removed in the image of the first image and the second image both sides and is carried out by the control unit Display.
7. electronic component handling apparatus according to claim 1, which is characterized in that
The electronic component mounting portion has multiple recess portions, and the multiple recess portion is configured in ranks shape, stores the electronic component,
The first image and second image are the figure for taking the column different from each other in the column of the recess portion respectively Picture.
8. electronic component handling apparatus according to claim 1, which is characterized in that
The display to the display unit is carried out before judgement processing.
9. electronic component handling apparatus according to claim 1, which is characterized in that
The electronic component mounting portion is the inspection portion that can be loaded the electronic component and be checked.
10. a kind of electronic component inspection device, which is characterized in that have:
Region can configure the electronic component mounting portion of power supply subassembly mounting；
Delivery section, with the holding electronic component and the first in command conveyed and second handle；
Illumination part can project light towards the electronic component mounting portion and can adjust the injection direction of light；
Shoot part, can be to the light via the ministry of electronics industry being irradiated between the first in command and the second handle Part mounting portion is shot；
Display unit shows image taken by the shoot part；And
Control unit controls the delivery section, the illumination part and the shoot part, and is based on the shoot part institute The image taken carries out in the electronic component mounting portion whether there is or not the judgement of electronic component processing,
In the delivery site when first position, the shoot part shoots the first image, the delivery site in it is described When the different second position in first position, the shoot part shoots the second image,
The first image and second image are shown in the display unit by the control unit,
The electronic component mounting portion is the inspection portion that can be loaded the electronic component and be checked.
CN201810674961.9A 2017-06-29 2018-06-27 Electronic component handling apparatus and electronic component inspection device Pending CN109212621A (en)

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JP2019011960A (en) 2019-01-24
US20190005639A1 (en) 2019-01-03

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