CN109188237B - Circuit board heat dissipation simulation assembly - Google Patents
Circuit board heat dissipation simulation assembly Download PDFInfo
- Publication number
- CN109188237B CN109188237B CN201810603693.1A CN201810603693A CN109188237B CN 109188237 B CN109188237 B CN 109188237B CN 201810603693 A CN201810603693 A CN 201810603693A CN 109188237 B CN109188237 B CN 109188237B
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- circuit board
- printed circuit
- frame
- side wall
- sidewall
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2817—Environmental-, stress-, or burn-in tests
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the invention provides a circuit board heat dissipation simulation assembly, which comprises: the air conditioner comprises a frame, a front panel, a rear panel and a base, wherein one end of the frame is connected with the base, and the other end of the frame is provided with an air outlet; a first opening is formed in a first side wall of the frame, a second opening is formed in a second side wall of the frame, and the first side wall and the second side wall are arranged oppositely to form an accommodating space for accommodating the printed circuit board; the front panel is detachably connected with the first side wall, can cover the first opening and is provided with a temperature measuring hole corresponding to a heating device on the front side of the printed circuit board; the rear panel is detachably connected with the second side wall, the rear panel can be covered on the second opening, and a temperature measuring hole corresponding to a heating device on the back of the printed circuit board is formed in the rear panel; a fan is arranged in the base and used for blowing out generated air from the air outlet. The embodiment can realize physical simulation and has high data reliability.
Description
Technical Field
The invention relates to the technical field of circuit simulation, in particular to a circuit board heat dissipation simulation assembly.
Background
With the development of semiconductor technology, the circuit integration is higher and higher, the volume of the current electronic equipment is smaller and smaller, and the power consumption is increased. Therefore, in the design stage of the electronic device, the heat dissipation of the product is simulated by using the heat dissipation simulation tool, so that the failure rate is reduced, the reliability of the product is improved, and the design of the electronic product becomes the key point.
In the prior art, simulation software such as ANSYS, SolidWorks and the like is adopted as a heat dissipation simulation tool, so that the heat radiation, heat conduction, heat convection, fluid temperature, fluid speed and motion vector of a printed circuit board can be simulated in a three-dimensional structure model, and forced heat dissipation, vacuum state, natural heat dissipation and the like can also be simulated. The heat dissipation simulation tool models the printed circuit board as a simulation object, sets an environment variable, and outputs related data through iterative computation simulation of the variable.
However, in the prior art, heat dissipation simulation is adopted, actual working conditions of the printed circuit board cannot be completely presented through modeling, and simulated data are often chosen or rejected according to related experience, so that the reliability of the data is influenced.
Disclosure of Invention
The embodiment of the invention provides a circuit board heat dissipation simulation assembly, which aims to solve the problems that simulated data need to be accepted or rejected according to experience and the reliability of the data is low.
In a first aspect, an embodiment of the present invention provides a circuit board heat dissipation simulation assembly, including: a frame, a front panel, a back panel and a base, wherein
One end of the frame is connected with the base, and the other end of the frame is provided with an air outlet;
a first opening is formed in a first side wall of the frame, a second opening is formed in a second side wall of the frame, and the first side wall and the second side wall are arranged oppositely to form an accommodating space for accommodating a printed circuit board;
the front panel is detachably connected with the first side wall, the front panel can be covered on the first opening, and a temperature measuring hole corresponding to a heating device on the front side of the printed circuit board is formed in the front panel;
the rear panel is detachably connected with the second side wall, the rear panel can be covered on the second opening, and a temperature measuring hole corresponding to a heating device on the back of the printed circuit board is formed in the rear panel;
a fan is arranged in the base and used for blowing out generated wind from the air outlet.
In a possible design, the third sidewall and the fourth sidewall of the frame are respectively provided with a socket, the third sidewall and the fourth sidewall are arranged oppositely, and two ends of the third sidewall and the fourth sidewall are respectively connected with the first sidewall and the second sidewall.
In one possible design, further comprising: and the opening type buckling structure extends into the socket from the socket to fix the printed circuit board. The socket can also be externally connected with a power supply and used for acquiring and inputting signals and outputting signals, so that the function normal use of the printed circuit board is ensured, the working state of the printed circuit board is completely simulated, and the reliability of data is improved.
In one possible design, the front panel is bolted to the first side wall and the rear panel is bolted to the second side wall. Through bolted connection, the setting mode is simple and fixed reliable, the operation of being convenient for.
In one possible design, the number of fans provided in the base is two.
In one possible design, the base has a trapezoidal longitudinal section, and the frame has a thickness equal to the length of the shorter side of the trapezoid. The base adopts the trapezium structure, can be right the fan gathers wind for the amount of wind can concentrate and blow to printed circuit board, increases air-out intensity, carries out better heat dissipation to printed circuit board.
In one possible design, further comprising: and the temperature measuring component is used for measuring the temperature at the temperature measuring hole. The temperature measuring component measures the temperature of the heating device on the printed circuit board at the temperature measuring hole, so that the temperature of the heating device on the printed circuit board can be accurately obtained, and the accuracy of data is improved.
In one possible design, the temperature measurement component is an infrared thermometer or a temperature measurement sticker.
In one possible design, the size of the temperature measuring hole is between 1.5mm and 3 mm. The size of the temperature measuring hole is small enough not to cause errors of simulation data.
In one possible design, further comprising: and the power supply controller is connected with the fan and used for controlling the rotating speed of the fan, is easy to operate and can accurately control the air quantity required by the heat dissipation simulation of the printed circuit board.
The circuit board heat dissipation simulation assembly provided by the embodiment of the invention comprises: the air conditioner comprises a frame, a front panel, a rear panel and a base, wherein one end of the frame is connected with the base, and the other end of the frame is provided with an air outlet; a first opening is formed in a first side wall of the frame, a second opening is formed in a second side wall of the frame, and the first side wall and the second side wall are arranged oppositely to form an accommodating space for accommodating the printed circuit board; the front panel is detachably connected with the first side wall, can cover the first opening and is provided with a temperature measuring hole corresponding to a heating device on the front side of the printed circuit board; the rear panel is detachably connected with the second side wall, and the rear panel can be covered on the second opening, so that the assembly ensures certain universality, the heat dissipation simulation can be realized only by replacing the front panel and the rear panel aiming at different printed circuit boards, and the rear panel is provided with a temperature measuring hole corresponding to a heating device on the back surface of the printed circuit board; the assembly provided by the embodiment of the invention adopts physical simulation, so that the actual working condition of the printed circuit board can be presented, the simulation data is real and effective, and the reliability of the data cannot be influenced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a circuit board heat dissipation simulation assembly according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a front panel according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a base according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a third sidewall and a fourth sidewall according to an embodiment of the present invention;
description of reference numerals:
10: a frame;
11: an air outlet;
12: a first side wall;
121: a first opening;
13: a second side wall;
131: a second opening;
14: a third side wall;
141: an interface;
142: an interface;
15: a fourth side wall;
151: an interface;
152: an interface;
20: a front panel;
21: a temperature measuring hole;
211: temperature measuring stickers;
212: an infrared thermometer;
221. 122: a screw hole;
30: a rear panel;
40: a base;
41: a fan.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, those skilled in the art can obtain it without creative efforts.
Fig. 1 is a schematic structural diagram of a circuit board heat dissipation simulation assembly according to an embodiment of the present invention. As shown in fig. 1, the assembly comprises: a frame 10, a front panel 20, a rear panel 30 and a base 40, wherein
One end of the frame 10 is connected with the base 40, and the other end is provided with an air outlet 11;
the first side wall 12 of the frame 10 is provided with a first opening 121, and the second side wall of the frame 10 is provided with a second openingWall(s)13 is provided with a second opening 131, and the first side wall 12 is arranged opposite to the second side wall 13 to form a containing space for containing the printed circuit board;
the front panel 20 is detachably connected with the first side wall 12, the front panel 20 can be covered on the first opening 121, and a temperature measuring hole 21 corresponding to a heating device on the front surface of the printed circuit board is arranged on the front panel 20;
the rear panel 30 is detachably connected with the second side wall 13, the rear panel 30 can be covered on the second opening 131, and a temperature measuring hole corresponding to a heating device on the back of the printed circuit board is arranged on the rear panel 30;
a fan 41 is provided in the base 40, and the fan 41 blows out generated wind from the outlet 11.
The frame 10 may be a frame structure, and the frame 10 may be made of alloy material, high-strength plastic, plastic steel, or the like. The material of the frame 10 is not limited herein, as long as the material can be made into a frame with a supporting function. The frame 10 may be integrally formed or assembled by a plurality of components, and the specific manufacturing process of the frame 10 is not particularly limited in this embodiment.
The frame 10 may be, for example, a rectangular parallelepiped frame, and the first side wall 12 and the second side wall 13 of the rectangular parallelepiped frame are disposed opposite to each other, that is, the first side wall 12 and the second side wall 13 are disposed facing each other, and a space therebetween forms a receiving space for receiving a printed circuit board.
The size of the printed circuit board is not limited, as long as the printed circuit board can be placed in the frame 10 and can correspond to the front and rear panels. For example, the circuit board heat dissipation simulation component provided by the embodiment of the invention relates to the realization of a generalized heat dissipation simulation scheme suitable for a standard 160 × 233mm universal small 6U printed circuit board.
Further, a first opening 121 is provided on the first side wall 12, and a second side of the frame 10Wall(s)A second opening 131 is provided in 13. Meanwhile, an air outlet 11 is provided at the other end of the frame 10.
In a specific implementation process, a printed circuit board can be placed in the frame 10 through the first opening 121 or the second opening 131 or the air outlet 11.
In order to simulate the heat dissipation of the printed circuit board, a front panel 20 is covered on the first opening 121. Wherein the front panel 20 is detachably connected to the first sidewall 12. A rear panel 30 is covered on the second opening 131, and the rear panel 30 is detachably connected to the second side wall 13. Wherein, the front panel 20 and the back panel 30 are provided with temperature measuring holes for measuring the temperature of the heating devices on the printed circuit board.
First, the temperature measurement method of the front panel 20 will be described in detail. Specifically, the front panel 20 and the first sidewall 12 may be detachably connected by screwing, clipping, riveting, or the like. The size of the front panel 20 may be the same as the size of the first opening 121, or may be larger than the first opening 121, as long as no gap is formed when the front panel 20 is covered on the first opening 121.
In the present embodiment, for example, fig. 1 shows the detachable connection of the front panel 20 and the first side wall 12 by means of a bolt connection. Specifically, referring to fig. 2, fig. 2 is a schematic structural diagram of a front panel according to an embodiment of the present invention. As shown in fig. 1, a screw hole 122 is formed around the first opening 121, and as shown in fig. 2, a screw hole 221 is formed in the front panel, and a bolt is inserted through the screw hole 122 and the screw hole 221 and fixed by a nut. Through bolted connection, the setting mode is simple and fixed reliable, the operation of being convenient for.
When the printed circuit board is subjected to heat dissipation simulation, in order to measure the temperature data of the heating device on the front surface of the printed circuit board conveniently, a round hole, namely a temperature measuring hole 21, is punched on the front panel 20 to measure the temperature of the heating device on the printed circuit board.
Specifically, the temperature measuring hole 21 faces the heating device on the front surface of the printed circuit board. The size of the temperature measurement aperture 21 should be small enough not to cause errors in the simulation data. In the embodiment, as shown in fig. 2, the diameter of the temperature measuring hole 21 is between 1.5mm and 3 mm.
Next, a temperature measuring method of the rear panel 30 will be described in detail. Specifically, the rear panel 30 is detachably attached to the second side wall 13. Specifically, the rear panel 30 and the second side wall 13 may be detachably connected by screwing, clipping, riveting, or the like.
In the present embodiment, for example, fig. 1 shows the detachable connection of the rear panel 30 and the second side wall 13 by means of bolt connection. The specific implementation manner is the same as the connection manner of the front panel 20 and the first sidewall 12, and the description of this embodiment is omitted here.
When the printed circuit board is subjected to heat dissipation simulation, in order to measure the temperature data of the heating device on the back surface of the printed circuit board conveniently, the back panel 30 is provided with a round hole, namely a temperature measuring hole, so that the heating device on the printed circuit board is subjected to temperature measurement.
Specifically, the temperature measuring hole is opposite to the heating device on the back of the printed circuit board. The size of the temperature measurement hole should be small enough not to cause errors in the simulation data. In the embodiment, the diameter of the temperature measuring hole is between 1.5mm and 3 mm.
By detachably arranging the front panel 20 and the rear panel 30, different printed circuit boards can be conveniently simulated in concrete implementation. When different printed circuit boards are simulated, only the front panel 20 and the rear panel 30 need to be replaced, the temperature measuring holes 21 on the front panel 20 are kept to correspond to the heating devices on the front side of the printed circuit board, the temperature measuring holes on the rear panel 30 are kept to correspond to the heating devices on the back side of the printed circuit board, and the frame 10 and the base 40 do not need to be replaced. A fan 41 is provided on the base 40 in order to provide an air volume for heat dissipation during the heat dissipation simulation of the printed circuit board. The top end of the base 40 is connected to the bottom end of the frame 10, and the bottom end of the frame 10 is hollowed out at a position opposite to the base 40, so as to ensure that the wind of the fan 41 can blow towards the printed circuit board.
The size of the area of the top end of the base 40 and the area of the bottom end of the frame 10 is not limited as long as the fan 41 installed on the base 40 can be ensured to wind upwards from the bottom of the frame 10. In the present embodiment, as shown in fig. 1, the vertical section of the base 40 is trapezoidal, and the thickness of the frame 10 is equal to the length of the short side of the vertical section of the base 40. The base 40 adopts the trapezium structure, can gather wind to fan 41 for the amount of wind can be concentrated and is blown to printed circuit board, increases air-out intensity, carries out better heat dissipation to printed circuit board.
The fan 41 is fixed on the base 40 through screws, and the size and the number of the fan 41 can be determined according to simulation conditions and heat dissipation requirements, and can be one or more, as long as the fan can be installed on the base 40 and can provide the required air volume for the heat dissipation simulation of the printed circuit board to meet the heat dissipation requirements of the printed circuit board. Specifically, referring to fig. 3, fig. 3 is a schematic structural diagram of a base according to an embodiment of the present invention. In the present embodiment, as shown in fig. 3, the number of the fans 41 is 2 and the size is the same.
When the printed circuit board is subjected to heat dissipation simulation, the fan 41 provides the printed circuit board with air volume meeting the heat dissipation requirement, and the air volume enters the space formed by the frame 10, the front panel 20 and the rear panel 30 from bottom to top, namely the position of the printed circuit board, so as to dissipate heat of the printed circuit board, and the heat is continuously blown upwards from the air outlet 11.
The assembly provided by the embodiment of the invention can be used for placing a printed circuit board which needs to be subjected to heat dissipation simulation, and provides the printed circuit board with the air quantity required by meeting the heat dissipation requirement. The heat dissipation mode of the printed circuit board is guaranteed to be the same as the actual working condition, namely the air flows from bottom to top, and heat is taken away.
When the assembly provided by the embodiment of the invention is applied to the realization of a generalized heat dissipation simulation scheme of a standard general small 6U printed circuit board with the size of 160 multiplied by 233mm, the assembly can realize the heat dissipation simulation of a single printed circuit board, and the minimum air volume required by the whole circuit board for keeping each heating device on the printed circuit board within the allowable working temperature range is obtained through simulation.
The specific simulation implementation process is as follows: after the printed circuit board is electrified and works for 5 minutes, the fan starts to work to provide air volume for heat dissipation of the printed circuit board, and meanwhile, the temperature of the heating devices on the front side and the back side of the printed circuit board is measured at the temperature measuring hole.
If the temperature of each heating device on the printed circuit board is kept within the range of the allowed working temperature, the fan provides the air quantity required by meeting the heat dissipation requirement of the printed circuit board.
If the temperature of the heating devices on the printed circuit board exceeds the allowable working temperature, the wind speed of the fan is increased, and the wind quantity is increased until the temperature of each heating device on the printed circuit board is kept within the allowable working temperature range, so that the wind quantity provided by the fan at the moment meets the wind quantity required by the heat dissipation requirement of the printed circuit board. And vice versa.
The method for calculating the air quantity required by the printed circuit board when the printed circuit board meets the heat dissipation requirement comprises the following steps: the heat dissipation requirement is met at the corresponding rotating speed, the air volume of the fan is V m3/min through proportion conversion, the total air volume provided by 2 fans is 2V m3/min, and therefore the air volume required by heat dissipation of the circuit board is 2V m 3/min.
The circuit board heat dissipation simulation assembly provided by the embodiment of the invention comprises: the air conditioner comprises a frame, a front panel, a rear panel and a base, wherein one end of the frame is connected with the base, and the other end of the frame is provided with an air outlet; a first opening is formed in a first side wall of the frame, a second opening is formed in a second side wall of the frame, and the first side wall and the second side wall are arranged oppositely to form an accommodating space for accommodating the printed circuit board; the front panel is detachably connected with the first side wall, can cover the first opening and is provided with a temperature measuring hole corresponding to a heating device on the front side of the printed circuit board; the rear panel is detachably connected with the second side wall, and the rear panel can be covered on the second opening, so that the assembly ensures certain universality, the heat dissipation simulation can be realized only by replacing the front panel and the rear panel aiming at different printed circuit boards, and the rear panel is provided with a temperature measuring hole corresponding to a heating device on the back surface of the printed circuit board; the assembly provided by the embodiment of the invention adopts physical simulation, so that the actual working condition of the printed circuit board can be presented, the simulation data is real and effective, and the reliability of the data cannot be influenced. Meanwhile, the assembly ensures certain universality, and heat dissipation simulation can be realized only by replacing the front panel and the rear panel aiming at different printed circuit boards.
On the basis of the above embodiment, the embodiment can realize the fixed installation of the printed circuit board by arranging the socket, and also meets the normal use of the slot on the printed circuit board.
Fig. 4 is a schematic structural diagram of a third sidewall and a fourth sidewall provided in the embodiment of the present invention. As shown in fig. 4, the third sidewall 14 and the fourth sidewall 15 are disposed opposite to each other, and two ends of the third sidewall 14 and the fourth sidewall 15 are respectively connected to the first sidewall 12 and the second sidewall 13 to form an integral structure, and meanwhile, the third sidewall 14 and the fourth sidewall 15 are respectively provided with a socket.
The number of each side wall interface can be one or more, so long as the fixed installation of the printed circuit board can be realized, and the normal use of the slot on the printed circuit board can be met. In the present embodiment, the number of each sidewall socket is 2.
Specifically, the socket of the present embodiment has a dual function of mounting and fixing the printed circuit board and the slot. During implementation, each interface can have two functions at the same time, and part of the interfaces can have the functions of installation and fixation and part of the interfaces can have the function of slots.
For example, in the present embodiment, the socket 141 on the third sidewall 14 and the socket 151 on the fourth sidewall 15 are used to mount an open type snap structure, which extends from the socket to fix the printed circuit board. As can be appreciated by those skilled in the art, the open type snap structure has an opening that can function as a slot. Meanwhile, the insertion ports 142 and 152 on the third and fourth side walls 14 and 15 are provided with slots on the printed circuit board, and can also be externally connected with a power supply and signal acquisition input and signal output, so that the normal use of the function of the printed circuit board is ensured, and the condition of completely simulating the working state of the printed circuit board is achieved. The specific role of the plug interface is not particularly limited in this embodiment.
This embodiment through the third lateral wall with the fourth lateral wall on the interface that sets up, can be used for the fixed printed circuit board of installation, easy to assemble, and fixed effect is obvious. Meanwhile, the normal work of the printed circuit board can be ensured, the phenomenon that a power supply line, an acquisition input signal line and an acquisition output signal line are obtained by manually welding the printed circuit board can be avoided, the simulation data are not subjected to error, and the reliability of the data is improved.
On the basis of the above embodiments, the present embodiment also adds a temperature measurement component and a power controller to assist the simulation.
First, the temperature measuring unit will be described in detail. As shown in fig. 2, the temperature measurement component may be a temperature measurement sticker 211 and an infrared thermometer 212, or may be other temperature measurement components as long as the temperature measurement can be performed on the heating device of the printed circuit board at the temperature measurement hole 21. The circuit board heat dissipation simulation component provided by the embodiment of the invention is used for measuring the temperature of a heating device of a printed circuit board, and the temperature measurement component is a temperature measurement sticker 211 and/or an infrared thermometer 212.
The specific temperature measuring method comprises the following steps: the temperature sticker 211 is directly pasted on the temperature measuring hole 21 to measure the temperature of the heating device of the printed circuit board, and the infrared thermometer 212 tests the temperature of the heating device of the printed circuit board through infrared imaging at the temperature measuring hole 21. In the concrete realization process, the temperature measurement sticker can be used in all temperature measurement holes, the infrared thermometer can be used in all temperature measurement holes, the temperature measurement sticker can be used in part of the temperature measurement holes, and the infrared thermometer is used in the other part of the temperature measurement holes.
In the embodiment, the temperature of the heating device on the printed circuit board is measured at the temperature measuring hole through the temperature measuring component, so that the temperature of the heating device on the printed circuit board can be accurately obtained, and the accuracy of data is improved.
Next, the power supply controller will be described in detail. As shown in fig. 2, the power controller is connected to the fan 41 for controlling the rotation speed of the fan 41.
Specifically, in the process of performing heat dissipation simulation on the printed circuit board, the output electrical signal of the power controller is adjusted to control the fan 41, so that the fan 41 reaches different rotating speeds.
In the circuit board heat dissipation simulation assembly provided by the embodiment of the invention, the power supply controller outputs rectangular electrical signals with different duty ratios to control the rotating speed of the fan 41.
The specific implementation process is as follows: when the printed circuit board is electrified and works for 5 minutes, the power supply controller is turned on, rectangular electric signals are output, the fan 41 is controlled to start working, air volume is provided for heat dissipation of the printed circuit board, and meanwhile, the temperature of heating devices on the front side and the back side of the printed circuit board are measured by the temperature measuring components at the temperature measuring holes.
If the temperature of each heating element on the printed circuit board measured by the temperature measuring component is kept within the respective allowable working temperature range, the fan 41 provides the air quantity required by meeting the heat dissipation requirement of the printed circuit board.
If the temperature of the heating devices on the printed circuit board exceeds the allowable working temperature, the power controller is adjusted to output a rectangular electric signal with a large duty ratio, the wind speed of the fan 41 is controlled to be increased, and the wind volume is increased until the temperature of each heating device on the printed circuit board measured by the temperature measuring component is kept within the allowable working temperature range, so that the wind volume provided by the fan 41 at the moment meets the wind volume required by the heat dissipation requirement of the printed circuit board. And vice versa.
The method for calculating the air quantity required by the printed circuit board when the printed circuit board meets the heat dissipation requirement comprises the following steps: the heat dissipation requirement is met at the corresponding rotating speed, the air volume of the fan is V m3/min through the electrical signal proportion conversion of the duty ratio, the total air volume provided by 2 fans is 2V m3/min, and therefore the air volume required by the heat dissipation of the circuit board is 2V m 3/min.
In the embodiment, the fan is controlled by using the power controller, so that the rotating speed of the fan can be quickly adjusted. The rectangular electric signals with different duty ratios are output by the adjusting power controller, the rotating speed of the fan is controlled, the operation is easy, and the air quantity required by the heat dissipation simulation of the printed circuit board can be accurately controlled.
To sum up, the circuit board heat dissipation simulation assembly provided by the embodiment of the invention comprises: frame, front panel and back panel and base. One end of the frame is connected with the base, and the other end of the frame is provided with an air outlet which can be used for placing a printed circuit board which needs to be subjected to heat dissipation simulation. The base is provided with the fan, can provide required amount of wind when satisfying the heat dissipation requirement for printed circuit board, guarantees simultaneously that printed circuit board's radiating mode is the same with the operating mode of reality, and the flow direction of air is from bottom to top promptly, takes away the heat. The assembly adopts physical simulation, can present the actual working condition of the printed circuit board, has real and effective simulation data, and does not influence the reliability of the data. Meanwhile, the assembly ensures certain universality, and heat dissipation simulation can be realized only by replacing the front panel and the rear panel aiming at different printed circuit boards.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
In addition, in the present invention, unless otherwise explicitly specified or limited, the terms "connected," "fixed," "mounted," and the like are to be construed broadly, e.g., as mechanical or electrical connections; the terms may be directly connected or indirectly connected through an intermediate, and may be used for communicating between two elements or for interacting between two elements, unless otherwise specifically limited, and the specific meaning of the terms in the present invention will be understood by those skilled in the art according to specific situations.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A circuit board heat dissipation simulation assembly, comprising: a frame, a front panel, a rear panel and a base, wherein
One end of the frame is connected with the base, and the other end of the frame is provided with an air outlet;
a first opening is formed in a first side wall of the frame, a second opening is formed in a second side wall of the frame, and the first side wall and the second side wall are arranged oppositely to form an accommodating space for accommodating a printed circuit board;
the front panel is detachably connected with the first side wall, the front panel can be covered on the first opening, and a temperature measuring hole corresponding to a heating device on the front side of the printed circuit board is formed in the front panel;
the rear panel is detachably connected with the second side wall, the rear panel can be covered on the second opening, and a temperature measuring hole corresponding to a heating device on the back of the printed circuit board is formed in the rear panel;
a fan is arranged in the base and used for blowing out generated wind from the air outlet.
2. The assembly of claim 1, wherein the third sidewall and the fourth sidewall of the frame are respectively provided with a socket, the third sidewall and the fourth sidewall are opposite to each other, and two ends of the third sidewall and the fourth sidewall are respectively connected to the first sidewall and the second sidewall.
3. The assembly of claim 2, further comprising: and the opening type buckling structure extends into the socket from the socket to fix the printed circuit board.
4. The assembly of claim 1, wherein the front panel is bolted to the first sidewall and the rear panel is bolted to the second sidewall.
5. The assembly of claim 1, wherein the number of fans disposed within the base is two.
6. The assembly of claim 1, wherein the base is trapezoidal in longitudinal cross-section, and the frame has a thickness equal to the length of the shorter side of the trapezoid.
7. The assembly of any one of claims 1 to 6, further comprising: and the temperature measuring component is used for measuring the temperature at the temperature measuring hole.
8. The assembly of claim 7, wherein the temperature measurement assembly is an infrared thermometer or a temperature measurement sticker.
9. An assembly according to claim 1, wherein the temperature sensing aperture is between 1.5mm and 3mm in size.
10. The assembly of claim 1, further comprising: and the power supply controller is connected with the fan and is used for controlling the rotating speed of the fan.
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| JP2005190180A (en) * | 2003-12-25 | 2005-07-14 | Honda Motor Co Ltd | Radiator heat radiation simulation system |
| CN101930951A (en) * | 2009-06-25 | 2010-12-29 | 鸿富锦精密工业（深圳）有限公司 | Radiator combination |
| CN201440775U (en) * | 2009-07-16 | 2010-04-21 | 加弘科技咨询(上海)有限公司 | Heat emission air guiding structure for electronic equipment |
| TWI506273B (en) * | 2013-01-09 | 2015-11-01 | Giga Byte Tech Co Ltd | Electronic unit testing jig and testing method |
| CN104251783A (en) * | 2013-06-26 | 2014-12-31 | 鸿富锦精密电子(天津)有限公司 | Simulated heat radiation apparatus |
| CN203519526U (en) * | 2013-10-22 | 2014-04-02 | 北京维通利电气有限公司 | Simulation heat source for radiator detection |
| CN105116009B (en) * | 2015-08-11 | 2017-12-08 | 上海原动力通信科技有限公司 | One kind heating analogue means and heat pipe heat radiation device for detecting performance |
| CN207423845U (en) * | 2017-11-27 | 2018-05-29 | 成都共同散热器有限公司 | A kind of thermal performance detection device |
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| CN106323663A (en) * | 2016-09-17 | 2017-01-11 | 上海新时达电气股份有限公司 | Radiator test platform and radiator test system |
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