CN201440775U - Heat emission air guiding structure for electronic equipment - Google Patents
Heat emission air guiding structure for electronic equipment Download PDFInfo
- Publication number
- CN201440775U CN201440775U CN2009200783824U CN200920078382U CN201440775U CN 201440775 U CN201440775 U CN 201440775U CN 2009200783824 U CN2009200783824 U CN 2009200783824U CN 200920078382 U CN200920078382 U CN 200920078382U CN 201440775 U CN201440775 U CN 201440775U
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- air
- electronic equipment
- wind scooper
- heat radiation
- fan group
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Abstract
The utility model relates to a heat emission air guiding structure for electronic equipment, which belongs to a heat emission technology. The prior art has the default of poor heat emission. The heat emission air guiding structure comprises a first fan group, a second fan group, a first air guiding hood which is relative to the first fan group and is provided with a first air inlet and a first air outlet and covers a first heating electronic component to guide the air of the first fan group into the first air inlet and guide the air out of the first air outlet via the first heating electronic component, and a second air guiding hood which is opposite to the second fan group, provided with a second air inlet and a second air outlet, and covers a second heating electronic component to guide the air of the second fan group into the second air inlet and guide the air out of the second air outlet via the second heating electronic component. By arranging the air guiding hoods, the cooling air generated by the fans can be directly guided to the rear-side elements, thereby improving the heat emission capacity of the equipment and better ensuring the normal operation of the elements.
Description
Technical field
The utility model relates to a kind of heat dissipation technology, specifically is a kind ofly to be used to store/the radiation wind-guiding hood structure of electronic equipments such as server.
Background technology
Storage/server generally comprises modules such as mainboard, memory, power supply.Mainboard mainly is made of processor, memory bar, south/north bridge chips etc.Along with improving constantly of memory space and processor processing ability, the power density of storage/server is increasing, and the increase unit of the causing caloric value of power density rises.Current most of storage/server mainly adopts the wind-cooling heat dissipating mode, promptly uses plurality of fans to adopt the mode of blowing or exhausting that system thermal is led out.
The layout of common 2U storage/server as shown in Figure 1, plurality of fans 3 forms cross-ventilation and dispels the heat facing to first processor 11, second processor 12, first memory group 21,22 blowings of second memory group in cabinet.Owing to reasons such as device signal cablings, there is tandem situation between these devices, be positioned at first memory group, 21 rear sides as second processor 12, second memory group 22 is positioned at first processor 11 rear sides, can bring two problems like this: one, device has certain altitude, and the device of front side can stop a part of wind, causes the air quantity at rear side device place to reduce, circulation of air speed is slow, the influence heat radiation; Two, be heated behind the device of cold wind through the front side that fan blows out, the temperature that arrives rear side device place wind is higher, influences the radiating and cooling and the operate as normal of rear side device equally.
The utility model content
In order to solve the problem of the poor heat radiation that exists in the prior art, the utility model provides a kind of heat radiation air guide structure that is used for electronic equipment, by the design of special air channel cold wind can directly be blown on the rear side electronic device, the purpose that improve heat radiation to reach, guarantees the device operate as normal.
For this reason, the utility model is by the following technical solutions: the heat radiation air guide structure that is used for electronic equipment, wherein, described electronic equipment comprises the first heating electronic building brick and the second heating electronic building brick at least, the described heat radiation air guide structure that is used for electronic equipment comprises the first fan group and the second fan group at least, also comprise simultaneously: be provided with respect to the described first fan group, has first air intake vent, first air outlet, and the described first heating electronic building brick is covered so that the wind of the described first fan group is concentrated introducing from described first air intake vent, and by behind the described first heating electronic building brick, by first wind scooper of described first air outlet derivation; And with respect to the described second fan group setting,, have second air intake vent, second air outlet and the described second heating electronic building brick covered with wind that will the described second fan group and concentrate introducing from described second air intake vent, and by behind the described second heating electronic building brick, by second wind scooper of described second air outlet derivation.Concentrated each heat generating component accordingly that is directed into of cold wind that this programme produces by each fan of wind scooper energy is set reduces the bypass loss.
As to the improving and replenishing of technique scheme, the utility model is further taked the following technical measures or the combination in any of these measures:
Described second air outlet and described first wind scooper connect, and can strengthen the wind-force by the described first heating electronic building brick thus, and then accelerate heat radiation.
Described first wind scooper comprises the biside plate that is in the described first heating electronic building brick both sides and by the top board that described biside plate supported, the side plate in described second air outlet and the described biside plate connects.The cooling air that wind scooper produces fan is concentrated through device surface, reduces the bypass loss of cooling air.
Described first wind scooper and the shared side plate of described second wind scooper, and shared side plate and described second air outlet connect.Described second wind scooper cooperates closed channel that has only two mouths of formation with the original circuit board of equipment (part of mainboard), the cooling air major part that the described second fan group produces is transported in described first wind scooper by this closed channel.Shared side plate can make compact conformation, economical with materials.
The length of described second wind scooper is less than first wind scooper.
Described first wind scooper and described second wind scooper are integral structure.Integral structure is firm, and is easy for installation.
The top board of described first wind scooper comprises two horizontal parts and the ramp that is connected these two horizontal parts with difference in height, and highly high horizontal position is in the described first air inlet place.The fan height is bigger, with highly bigger horizontal part air quantity as much as possible is introduced, reduce the cross-sectional area in air channel gradually by ramp, improve wind speed, the corresponding device that specifically needs cooling of highly lower horizontal part, at this position, cooling air through device surface, reaches better cooling-down effect with better speed.
Perforation place on the described shared side plate can be square, circular or other shapes, cooperates difform device.
Beneficial effect: the utility model is concentrated respectively by the cooling air that first wind scooper and second wind scooper is set, each fan is produced and is delivered directly to the electronic building brick that respectively generates heat, reduced the bypass loss of wind, improve the heat-sinking capability of equipment, can guarantee the device operate as normal better.
Description of drawings
Fig. 1 is existing fan radiator structure and chassis arrangement schematic diagram;
Fig. 2 is heat radiation air guide structure and the chassis arrangement schematic diagram that is used for electronic equipment of the present utility model;
Fig. 3 is a kind of structural representation of the utility model wind scooper;
Fig. 4 is another view of Fig. 3;
Fig. 5 is the vertical section structure schematic diagram of the utility model first wind scooper.
Embodiment
The heat radiation air guide structure that is used for electronic equipment as shown in Figure 2, main being covered by first wind scooper 42 and second wind scooper 41 forms the main air duct with first air intake vent and first air outlet and has second air intake vent and the crosswind road of second air outlet on the mainboard.The part that main air duct covers front side member forms first air duct sections, and the part that covers the rear side parts forms second air duct sections.First air inlet in main air duct and crosswind road and second air inlet close on first fan group (being main stem fan 31) and the second fan group (being side line fan 32) respectively, second air outlet in crosswind road connects and is connected on the sidewall of main air duct second air duct sections, and the cooling air of crosswind road output mixes the electronic device cooling of back to rear side on the mainboard with the wind in the main air duct.
The position of close end plate 413 has ventilating opening 431 (being second air outlet and described first wind scooper perforation place) cooling air and enters second air duct sections of main air duct by ventilating opening 431 on the shared side plate 43.The shape of air outlet is selected according to actual needs.
As shown in Figure 5, the cooling air in the main air duct is through after the ramp 422, because cross-sectional area reduces, wind speed is accelerated, after flowing through front side device first processor 11, mix, realized effective cooling rear side device second memory group 22 with the cooling air of crosswind road output.
Below be device (processor) the temperature test data before and after employing the utility model heat radiation air guide structure,
| Experimental project | Requirement | Do not add the heat radiation air guide structure | Add the heat radiation air guide structure |
| Front side processor shell temperature | ＜74℃ | 80℃ | 69℃ |
| Rear side processor shell temperature | ＜74℃ | 99℃ | 72℃ |
| By rear side processor air quantity | - | 14CFM | 36CFM |
Can obviously draw, after employing the utility model technology, the electronic device particularly shell temperature of rear side electronic device obviously reduces, and the ventilation quantity at rear side electronic device place increases, and has improved heat dispersion well.
Should be pointed out that present embodiment just lists expressivity principle of the present invention and effect are described, but not be used to limit the present invention.Any personnel that are familiar with this technology all can make amendment to the foregoing description under spirit of the present invention and scope.Therefore, the scope of the present invention should be listed as claims.
Claims (9)
1. the heat radiation air guide structure that is used for electronic equipment, wherein, described electronic equipment comprises the first heating electronic building brick and the second heating electronic building brick at least, and the described heat radiation air guide structure that is used for electronic equipment comprises the first fan group and the second fan group at least, and it is characterized in that: it also comprises:
With respect to the described first fan group setting, have first air intake vent, first air outlet and the described first heating electronic building brick covered with wind that will the described first fan group and concentrate introducing from described first air intake vent, and by behind the described first heating electronic building brick, by first wind scooper of described first air outlet derivation; And
With respect to the described second fan group setting, have second air intake vent, second air outlet and the described second heating electronic building brick covered with wind that will the described second fan group and concentrate introducing from described second air intake vent, and by behind the described second heating electronic building brick, by second wind scooper of described second air outlet derivation.
2. the heat radiation air guide structure that is used for electronic equipment according to claim 1 is characterized in that: described second air outlet and described first wind scooper connect.
3. the heat radiation air guide structure that is used for electronic equipment according to claim 1, it is characterized in that: described first wind scooper comprises the biside plate that is in the described first heating electronic building brick both sides and by the top board that described biside plate supported, the side plate in described second air outlet and the described biside plate connects.
4. the heat radiation air guide structure that is used for electronic equipment according to claim 3 is characterized in that: described first wind scooper and the shared side plate of described second wind scooper, and shared side plate and described second air outlet connect.
5. the heat radiation air guide structure that is used for electronic equipment according to claim 4, it is characterized in that: the length of described second wind scooper is less than first wind scooper.
6. according to claim 3 or the 4 or 5 described heat radiation air guide structures that are used for electronic equipment, it is characterized in that: described first wind scooper and described second wind scooper are integral structure.
7. according to claim 3 or the 4 or 5 described heat radiation air guide structures that are used for electronic equipment, it is characterized in that: the top board of described first wind scooper comprises two horizontal parts and the ramp that is connected these two horizontal parts with difference in height, and highly high horizontal position is in the described first air inlet place.
8. according to claim 4 or the 5 described heat radiation air guide structures that are used for electronic equipment, it is characterized in that: perforation place on the described shared side plate is square.
9. it is characterized in that according to claim 4 or the 5 described heat radiation air guide structures that are used for electronic equipment: perforation place on the described shared side plate is rounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200783824U CN201440775U (en) | 2009-07-16 | 2009-07-16 | Heat emission air guiding structure for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200783824U CN201440775U (en) | 2009-07-16 | 2009-07-16 | Heat emission air guiding structure for electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201440775U true CN201440775U (en) | 2010-04-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200783824U Expired - Lifetime CN201440775U (en) | 2009-07-16 | 2009-07-16 | Heat emission air guiding structure for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201440775U (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102651953A (en) * | 2011-02-23 | 2012-08-29 | 鸿富锦精密工业（深圳）有限公司 | Air guide cover and electronic device with same |
| CN103037665A (en) * | 2011-09-29 | 2013-04-10 | 华为技术有限公司 | Electronic device cooling system with auxiliary cooling device |
| CN103941832A (en) * | 2013-01-23 | 2014-07-23 | 鸿富锦精密工业（深圳）有限公司 | Air guide device and radiating system |
| CN103984396A (en) * | 2014-03-21 | 2014-08-13 | 苏州佳世达光电有限公司 | Electronic device |
| CN104657317A (en) * | 2015-03-06 | 2015-05-27 | 北京百度网讯科技有限公司 | Server |
| CN104898814A (en) * | 2015-06-29 | 2015-09-09 | 北京百度网讯科技有限公司 | Ventilation device for ventilation source cluster and server |
| CN106339054A (en) * | 2016-08-29 | 2017-01-18 | 浪潮电子信息产业股份有限公司 | Heat dissipation system and heat dissipation method |
| CN106672861A (en) * | 2016-12-27 | 2017-05-17 | 柳州柳工叉车有限公司 | Low-noise high-efficiency heat-dissipation air-guide system of forklift |
| CN108268103A (en) * | 2017-12-28 | 2018-07-10 | 曙光信息产业(北京)有限公司 | Server air guiding cover |
| CN109188237A (en) * | 2018-06-12 | 2019-01-11 | 中车大连电力牵引研发中心有限公司 | Heat dissipation for circuit board emulation component |
| CN109448767A (en) * | 2018-12-21 | 2019-03-08 | 郑州云海信息技术有限公司 | A kind of simulation air duct detected for storing equipment |
| CN110131677A (en) * | 2018-12-28 | 2019-08-16 | 马瑞利汽车零部件(芜湖)有限公司 | A kind of car light cooling system and the car light using this system |
| CN111031767A (en) * | 2019-12-31 | 2020-04-17 | 联想(北京)有限公司 | Electronic equipment and heat dissipation module |
| CN111338448A (en) * | 2020-03-31 | 2020-06-26 | 联想(北京)有限公司 | Electronic equipment and cooling system |
| CN111447799A (en) * | 2020-04-29 | 2020-07-24 | 水氪(北京)科技发展有限公司 | Heat dissipation system for food purifier |
-
2009
- 2009-07-16 CN CN2009200783824U patent/CN201440775U/en not_active Expired - Lifetime
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102651953A (en) * | 2011-02-23 | 2012-08-29 | 鸿富锦精密工业（深圳）有限公司 | Air guide cover and electronic device with same |
| CN103037665A (en) * | 2011-09-29 | 2013-04-10 | 华为技术有限公司 | Electronic device cooling system with auxiliary cooling device |
| CN103037665B (en) * | 2011-09-29 | 2015-09-09 | 华为技术有限公司 | A kind of electronic device cooling system with radiator cooler |
| US9357679B2 (en) | 2011-09-29 | 2016-05-31 | Huawei Technologies Co., Ltd. | Electronic equipment cooling system with auxiliary cooling device |
| CN103941832A (en) * | 2013-01-23 | 2014-07-23 | 鸿富锦精密工业（深圳）有限公司 | Air guide device and radiating system |
| CN103984396A (en) * | 2014-03-21 | 2014-08-13 | 苏州佳世达光电有限公司 | Electronic device |
| CN104657317B (en) * | 2015-03-06 | 2017-12-26 | 北京百度网讯科技有限公司 | Server |
| CN104657317A (en) * | 2015-03-06 | 2015-05-27 | 北京百度网讯科技有限公司 | Server |
| CN104898814A (en) * | 2015-06-29 | 2015-09-09 | 北京百度网讯科技有限公司 | Ventilation device for ventilation source cluster and server |
| CN106339054A (en) * | 2016-08-29 | 2017-01-18 | 浪潮电子信息产业股份有限公司 | Heat dissipation system and heat dissipation method |
| WO2018040363A1 (en) * | 2016-08-29 | 2018-03-08 | 浪潮电子信息产业股份有限公司 | Heat dissipation system and heat dissipation method |
| US10416733B2 (en) | 2016-08-29 | 2019-09-17 | Inspur Electronic Information Industry Co., Ltd | Heat dissipation system and heat dissipation method |
| CN106672861A (en) * | 2016-12-27 | 2017-05-17 | 柳州柳工叉车有限公司 | Low-noise high-efficiency heat-dissipation air-guide system of forklift |
| CN108268103A (en) * | 2017-12-28 | 2018-07-10 | 曙光信息产业(北京)有限公司 | Server air guiding cover |
| CN109188237A (en) * | 2018-06-12 | 2019-01-11 | 中车大连电力牵引研发中心有限公司 | Heat dissipation for circuit board emulation component |
| CN109448767B (en) * | 2018-12-21 | 2024-04-26 | 郑州云海信息技术有限公司 | A simulation wind channel for storage device detects |
| CN109448767A (en) * | 2018-12-21 | 2019-03-08 | 郑州云海信息技术有限公司 | A kind of simulation air duct detected for storing equipment |
| CN110131677A (en) * | 2018-12-28 | 2019-08-16 | 马瑞利汽车零部件(芜湖)有限公司 | A kind of car light cooling system and the car light using this system |
| CN111031767B (en) * | 2019-12-31 | 2021-01-15 | 联想(北京)有限公司 | Electronic equipment and heat dissipation module |
| CN111031767A (en) * | 2019-12-31 | 2020-04-17 | 联想(北京)有限公司 | Electronic equipment and heat dissipation module |
| CN111338448A (en) * | 2020-03-31 | 2020-06-26 | 联想(北京)有限公司 | Electronic equipment and cooling system |
| CN111447799A (en) * | 2020-04-29 | 2020-07-24 | 水氪(北京)科技发展有限公司 | Heat dissipation system for food purifier |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100421 |
|
| CX01 | Expiry of patent term |