CN109188237A - Heat dissipation for circuit board emulation component - Google Patents
Heat dissipation for circuit board emulation component Download PDFInfo
- Publication number
- CN109188237A CN109188237A CN201810603693.1A CN201810603693A CN109188237A CN 109188237 A CN109188237 A CN 109188237A CN 201810603693 A CN201810603693 A CN 201810603693A CN 109188237 A CN109188237 A CN 109188237A
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- China
- Prior art keywords
- circuit board
- side wall
- printed circuit
- frame
- fan
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2817—Environmental-, stress-, or burn-in tests
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the present invention provides a kind of heat dissipation for circuit board emulation component, comprising: one end of frame, front panel, rear panel and pedestal, frame is connect with pedestal, and air outlet is provided on the other end；It is provided with the first opening on the first side wall of frame, the second opening is provided in the second sidewall of frame, the first side wall is oppositely arranged with second sidewall, to form the accommodation space for accommodating printed circuit board；Front panel is detachably connected with the first side wall, and front panel can be covered and is located in the first opening, the corresponding thermometer hole of the heating device being provided on the front with printed circuit board on front panel；Rear panel is detachably connected with second sidewall, and rear panel can cover and be located at the second opening, the corresponding thermometer hole of the heating device being provided on the back side with printed circuit board on rear panel；Fan is provided in pedestal, the wind that fan is used to generate is blown out from air outlet.Matter emulation may be implemented in the present embodiment, and data reliability is high.
Description
Technical field
The present invention relates to simulation technology field more particularly to a kind of heat dissipation for circuit board emulation components.
Background technique
With the development of semiconductor technology, circuit integration is higher and higher, and present electronic equipment volume is also smaller and smaller,
Power consumption increased instead.Therefore it in the electronic device design stage, is radiated using heat dissipation emulation tool analog equipment, reduces failure
Rate improves product reliability, it has also become the emphasis of design of electronic products.
In the prior art, heat dissipation emulation tool, can be in three-dimensional using simulation softwares such as ANSYS, SolidWorks
Heat radiation, heat transfer, thermal convection, fluid temperature (F.T.), fluid velocity and the motion vector of printed circuit board are simulated in structural model,
It can simulate and force heat dissipation, vacuum state and natural heat dissipation etc..The emulation tool that radiates passes through using printed circuit board as emulation pair
As modeling, setting to it, pass through the iterative calculation simulation data related data of variable.
But using the prior art using heat dissipation emulation, the actual working condition of printed circuit board can not pass through modeling
It shows completely, the data after emulation are often accepted or rejected according to relevant experience, and the reliability of data is influenced.
Summary of the invention
The embodiment of the present invention provides a kind of heat dissipation for circuit board emulation component, to overcome the data after emulation to need rule of thumb
It is accepted or rejected, the low problem of data reliability.
In a first aspect, the embodiment of the present invention provides a kind of heat dissipation for circuit board emulation component, comprising: frame, front panel and
Rear panel and pedestal, wherein
One end of the frame is connect with the pedestal, and air outlet is provided on the other end；
It is provided with the first opening on the first side wall of the frame, second is provided in the second sidewall of the frame and is opened
Mouthful, the first side wall is oppositely arranged with the second sidewall, to form the accommodation space for accommodating printed circuit board；
The front panel is detachably connected with the first side wall, and the front panel can cover and be located at first opening
On, thermometer hole corresponding with the heating device on the front of the printed circuit board is provided on the front panel；
The rear panel is detachably connected with the second sidewall, and the rear panel can cover and be located at second opening,
Thermometer hole corresponding with the heating device on the back side of the printed circuit board is provided on the rear panel；
Fan is provided in the pedestal, the wind that the fan is used to generate is blown out from the air outlet.
In a kind of possible design, it is respectively arranged with interface on the third side wall and the 4th side wall of the frame, institute
Third side wall is stated to be oppositely arranged with the 4th side wall, and the both ends of the third side wall, the 4th side wall respectively with it is described
The first side wall is connect with the second sidewall.
In a kind of possible design, further includes: open type buckle structure, the open type buckle structure is from the grafting
Mouth is protruded into the fixation printed circuit board.The interface can also external power supply and signal acquisition input and signal it is defeated
Out, guarantee the printed circuit board function normal use, reach and simulate the printed circuit board working condition completely, increase data
Reliability.
In a kind of possible design, the front panel is bolted with the first side wall, the rear panel with it is described
Second sidewall is bolted.It is bolted, set-up mode is simple and fixed reliable, convenient for operation.
In a kind of possible design, the quantity for the fan being arranged in the pedestal is two.
In a kind of possible design, the longitudinal section of the pedestal is trapezoidal, the thickness of the frame and described trapezoidal
The equal length of short side.The pedestal uses trapezium structure, can carry out wind gathering to the fan, air quantity is concentrated and is blowed to
Printed circuit board increases monsoon intensity out, is preferably radiated to printed circuit board.
In a kind of possible design, further includes: for measuring the temperature measurement component of the temperature at the thermometer hole.Thermometric group
Part carries out thermometric to the heating device on printed circuit board at thermometer hole, can accurately obtain the fever on printed circuit board
The temperature of device increases the accuracy of data.
In a kind of possible design, the temperature measurement component is infrared radiation thermometer or thermometric paster.
In a kind of possible design, the size of the thermometer hole is between 1.5 millimeters to 3 millimeters.The thermometer hole
Size should be sufficiently small, not to emulation data cause error.
In a kind of possible design, further includes: power-supply controller of electric, the power-supply controller of electric are connect with the fan, are used
It is easy to operate in the revolving speed for controlling the fan, air quantity needed for the printed circuit board heat dissipation emulation can be accurately controlled.
Heat dissipation for circuit board emulation component provided in an embodiment of the present invention, comprising: frame, front panel and rear panel and bottom
Seat, one end of frame are connect with pedestal, and air outlet is provided on the other end；The first opening is provided on the first side wall of frame,
The second opening is provided in the second sidewall of frame, the first side wall is oppositely arranged with second sidewall, to be formed for accommodating printing
The accommodation space of circuit board；Front panel is detachably connected with the first side wall, and front panel can be covered and is located in the first opening, front panel
On the corresponding thermometer hole of the heating device that is provided on the front with printed circuit board；Rear panel detachably connects with second sidewall
It connects, and rear panel can cover and be located at the second opening, so that the component guarantees certain versatility, only for different printed circuit boards
It replaces front panel and heat dissipation emulation, the hair being provided on the back side with printed circuit board on rear panel can be realized in rear panel
The corresponding thermometer hole of thermal device；Fan is provided in pedestal, the wind that fan is used to generate is blown out from air outlet, by emulating
Each electronic device of sening as an envoy to is held in the circuit board that allows in operating temperature range, and integrally required minimum air quantity, the present invention are real
The component of example offer is applied using matter emulation, the actual working condition of printed circuit board can be showed, emulation data are true
Effectively, it will not influence the reliability of data.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is this hair
Bright some embodiments for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of heat dissipation for circuit board emulation component provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of front panel provided in an embodiment of the present invention；
Fig. 3 is the structural schematic diagram of pedestal provided in an embodiment of the present invention；
Fig. 4 is the structural schematic diagram of third side wall and the 4th side wall provided in an embodiment of the present invention；
Description of symbols:
10: frame；
11: air outlet；
12: the first side wall；
121: the first openings；
13: second sidewall；
131: the second openings；
14: third side wall；
141: interface；
142: interface；
15: the four side walls；
151: interface；
152: interface；
20: front panel；
21: thermometer hole；
211: thermometric paster；
212: infrared radiation thermometer；
221,122: screw hole；
30: rear panel；
40: pedestal；
41: fan.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is
A part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art
It is obtained without creative efforts.
Fig. 1 is the structural schematic diagram of heat dissipation for circuit board emulation component provided in an embodiment of the present invention.As shown in Figure 1, the group
Part includes: frame 10, front panel 20 and rear panel 30 and pedestal 40, wherein
One end of frame 10 is connect with pedestal 40, and air outlet 11 is provided on the other end；
The first opening 121, second side of frame 10 are provided on the first side wall 12 of frame 10WallSecond is provided on 13
Opening 131, the first side wall 12 is oppositely arranged with second sidewall 13, to form the accommodation space for accommodating printed circuit board；
Front panel 20 is detachably connected with the first side wall 12, and front panel 20 can be covered and is located in the first opening 121, front panel
The corresponding thermometer hole 21 of the heating device being provided on 20 on the front with printed circuit board；
Rear panel 30 is detachably connected with second sidewall 13, and rear panel 30 can cover and be located at the second opening 131, rear panel 30
On the corresponding thermometer hole of the heating device that is provided on the back side with printed circuit board；
Fan 41 is provided in pedestal 40, fan 41 is for blowing out the wind of generation from air outlet 11.
Wherein, frame 10 can be tower structure, specifically can be using materials such as alloy material, highstrenghtpiston, plastic-steels
Matter etc. makes the frame 10.For the material that frame 10 specifically uses, the present embodiment herein with no restrictions, as long as the material energy
The frame with supporting role is enough made.The frame 10 can be integrally formed, and can also be assembled by multiple components,
The present embodiment is not particularly limited the specific manufacture craft of frame 10.
The frame 10 for example can be cuboid framework, and the first side wall 12 and second sidewall 13 of the cuboid framework are opposite
Setting, i.e. the first side wall 12 and second sidewall 13 are arranged face-to-face, and space between the two is formd for accommodating printed circuit
The accommodation space of plate.
Wherein, the size of printed circuit board without limitation, as long as frame 10 can be put into and can be corresponding with front and back panel.
For example, heat dissipation for circuit board emulation component provided in an embodiment of the present invention, is related to a kind of leading to for 160 × 233mm suitable for standard
With the realization of the generalization heat dissipation simulating scheme of small 6U printed circuit board.
Further, the first opening 121, second side of frame 10 are provided on the first side wall 12WallIs provided on 13
Two openings 131.Meanwhile air outlet 11 is provided on the other end of the frame 10.
It, can be by first opening 121 or the second opening 131 or air outlet 11 by printed circuit during specific implementation
Plate is put into the frame 10.
In order to carry out heat dissipation emulation to printed circuit board, front panel 20 is equipped in the first 121 upper covers of opening.Wherein, before
Plate 20 is detachably connected with the first side wall 12.Rear panel 30, rear panel 30 and second sidewall 13 are equipped in the second 131 upper covers of opening
It is detachably connected.Wherein, it is provided on front panel 20 and rear panel 30 for being surveyed to the heating device on printed circuit board
The thermometer hole of temperature.
Firstly, the thermometric mode to front panel 20 is described in detail.Specifically, between front panel 20 and the first side wall 12
It can be realized by the modes such as being spirally connected, be clamped, rivet and be detachably connected.Size of the size of front panel 20 with the first opening 121
It can be consistent, can also be bigger than the first opening 121, as long as guaranteeing seamless when the lid of front panel 20 is located in the first opening 121
Gap.
In the present embodiment, such as Fig. 1 gives front panel 20 and realizes by bolted connection with the first side wall 12
Be detachably connected.Specifically, as shown in connection with fig. 2, Fig. 2 is the structural schematic diagram of front panel provided in an embodiment of the present invention.Such as
Shown in Fig. 1, it is provided with screw hole 122 around the first opening 121, as shown in Fig. 2, being provided with screw hole 221 on front panel, bolt is worn
Screw hole 122 and screw hole 221 are crossed, is fixed by nut.It is bolted, set-up mode is simple and fixed reliable, convenient for operation.
When carrying out heat dissipation emulation to printed circuit board, the heating device on printed circuit board front is measured for convenience
Temperature data beats circular hole i.e. thermometer hole 21 in front and carries out thermometric to the heating device on printed circuit board on plate 20.
Specifically, the heating device on 21 face printed circuit board front of thermometer hole.The size of thermometer hole 21 should be enough
It is small, error is not caused to emulation data.As shown in Fig. 2, the diameter of thermometer hole 21 is between 1.5mm-3mm in the present embodiment.
Secondly, the thermometric mode to rear panel 30 is described in detail.Specifically, rear panel 30 and second sidewall 13 are removable
Unload connection.Specifically, it can be realized detachably by the modes such as being spirally connected, being clamped, rivet between rear panel 30 and second sidewall 13
Connection.
In the present embodiment, such as Fig. 1 gives rear panel 30 and realizes by bolted connection with second sidewall 13
Be detachably connected.Specific implementation is identical as the connection type of the first side wall 12 with front panel 20, and the present embodiment is herein not
It repeats again.
When carrying out heat dissipation emulation to printed circuit board, the heating device in printed circuit back is measured for convenience
Temperature data beats circular hole i.e. thermometer hole on plate 30 below and carries out thermometric to the heating device on printed circuit board.
Specifically, the heating device in thermometer hole face printed circuit back.The size of thermometer hole should be sufficiently small, no
Error is caused to emulation data.In the present embodiment, the diameter of thermometer hole is between 1.5mm-3mm.
By the way that front panel 20 and rear panel 30 is removably arranged, so that being emulated with can be convenient when specific implementation different
Printed circuit board.When emulating different printed circuit boards, front panel 20 and rear panel 30 are only needed to change, and keep front panel 20
On thermometer hole 21 and the positive heating device of printed circuit board it is corresponding, thermometer hole and printed circuit backboard on rear panel 30
Face heating device is corresponding, no replacement is required frame 10 and pedestal 40.For the heat dissipation radiated when emulating to printed circuit board
Air quantity is provided, is provided with fan 41 on the base 40 it.Wherein the top of pedestal 40 is connect with 10 bottom end of frame, and 10 bottom end of frame
The position of face pedestal 40 hollows out, to guarantee that the wind of fan 41 can blow to printed circuit board.
The size of 40 apex area of pedestal and 10 bottom end area of frame with no restriction, is installed on pedestal 40 as long as can guarantee
Fan 41 can be from the upward outlet air in 10 bottom of frame.In the present embodiment, as shown in Figure 1, the longitudinal section of pedestal 40 is ladder
Shape, the equal length of the short side of the longitudinal section of the thickness and pedestal 40 of frame 10.Pedestal 40 uses trapezium structure, can be to fan
41 carry out wind gathering, and air quantity is concentrated and blows to printed circuit board, increases monsoon intensity out, is preferably dissipated to printed circuit board
Heat.
Fan 41 is fixed by screws on pedestal 40, and the size and number of fan 41 can according to simulated conditions and dissipate
Heat demand is determined, can be for one or multiple, as long as can install on the base 40 it and can be the heat dissipation of printed circuit board
Air quantity needed for emulation offer meets printed circuit board cooling requirements.Specifically, as shown in connection with fig. 3, Fig. 3 is that the present invention is real
The structural schematic diagram of the pedestal of example offer is provided.In the present embodiment, as shown in figure 3, the quantity of fan 41 is 2 and size phase
Together.
When carrying out heat dissipation emulation to printed circuit board, fan 41 is supplied to the wind that printed circuit board meets cooling requirements
Amount from bottom to top enters position locating for space, that is, printed circuit board that frame 10 and front panel 20, rear panel 30 are formed from pedestal 40
It sets, radiates to printed circuit board, heat is continued up to be blown out by air outlet 11.
Component provided in an embodiment of the present invention can be used for placing the printed circuit board for carrying out heat dissipation emulation, and
When that meets cooling requirements institute's required airflow is provided for printed circuit board.The radiating mode of guarantee printed circuit board and actual operating condition phase
Together, i.e., the flow direction of air is from bottom to top, to take away heat.
Component provided in an embodiment of the present invention, such as the general small 6U printed circuit board of 160 × 233mm suitable for standard
Generalization heat dissipation simulating scheme realization when, which may be implemented the emulation of the heat dissipation to single printed circuit board, by imitative
The each heating device on printed circuit board that must very send as an envoy to is held in needed for the circuit board entirety allowed in operating temperature range
Minimum air quantity.
Specific the Realization of Simulation process are as follows: printed circuit board works on power after five minutes, and fan is started to work, for printing electricity
Plate heat dissipation in road provides air quantity, while the temperature of the heating device of printed circuit board on the front and back is measured at thermometer hole.
If the temperature of each heating device on printed circuit board, which is held in, respectively to be allowed in operating temperature range,
Fan offer air quantity at this time meets printed circuit board cooling requirements when institute required airflow.
If there is the temperature of the heating device on printed circuit board is more than that it allows operating temperature, then the wind of fan is increased
Speed increases air quantity, respectively allows operating temperature range until the temperature of each heating device on printed circuit board is held in
Interior, then the air quantity that fan at this time provides meets printed circuit board cooling requirements when institute required airflow.Vice versa.
It calculates printed circuit board and meets cooling requirements when institute required airflow method: meeting cooling requirements in corresponding revolving speed,
The air quantity that fan is obtained by ratiometric conversion is V m3/min, then the total blast volume that 2 fans provide is 2V m3/min, so electric
Air quantity needed for the heat dissipation of road plate is 2V m3/min.
Heat dissipation for circuit board emulation component provided in an embodiment of the present invention, comprising: frame, front panel and rear panel and bottom
Seat, one end of frame are connect with pedestal, and air outlet is provided on the other end；The first opening is provided on the first side wall of frame,
The second opening is provided in the second sidewall of frame, the first side wall is oppositely arranged with second sidewall, to be formed for accommodating printing
The accommodation space of circuit board；Front panel is detachably connected with the first side wall, and front panel can be covered and is located in the first opening, front panel
On the corresponding thermometer hole of the heating device that is provided on the front with printed circuit board；Rear panel detachably connects with second sidewall
It connects, and rear panel can cover and be located at the second opening, so that the component guarantees certain versatility, only for different printed circuit boards
It replaces front panel and heat dissipation emulation, the hair being provided on the back side with printed circuit board on rear panel can be realized in rear panel
The corresponding thermometer hole of thermal device；Fan is provided in pedestal, the wind that fan is used to generate is blown out from air outlet, by emulating
Each electronic device of sening as an envoy to is held in the circuit board that allows in operating temperature range, and integrally required minimum air quantity, the present invention are real
The component of example offer is applied using matter emulation, the actual working condition of printed circuit board can be showed, emulation data are true
Effectively, it will not influence the reliability of data.The component guarantees certain versatility simultaneously, as long as different printed circuit boards
Heat dissipation emulation can be realized in replacement front panel and rear panel.
On the basis of the above embodiments, the present embodiment can realize the fixation of printed circuit board by setting interface
Installation, also meets the normal use of the slot on printed circuit board.
Fig. 4 is the third side wall of the embodiment of the present invention provided and the structural schematic diagram of the 4th side wall.As shown in figure 4, the
Three side walls 14 are oppositely arranged with the 4th side wall 15, and the both ends of third side wall 14, the 4th side wall 15 respectively with the first side wall 12 with
Second sidewall 13 connects, and forms overall structure, while being respectively arranged with interface on third side wall 14 and the 4th side wall 15.
The quantity of every one side wall interface can be one or more, as long as being able to achieve the fixed installation of printed circuit board,
Also meet the normal use of the slot on printed circuit board.In the present embodiment, the quantity of every one side wall interface is 2
It is a.
Specifically, the interface of the present embodiment has the double action for installing fixed printed circuit board and slot.It is realizing
When, can each interface have simultaneously there are two types of function, can also part interface there is installation fixed function, part interface
With slot effect.
For example, in the present embodiment, the interface 151 on the interface 141 and the 4th side wall 15 on third side wall 14 is used
Carry out construction opening formula buckle structure, open type buckle structure is protruded into from interface to fix printed circuit board.Those skilled in the art
Member is it is appreciated that the opening that the open type buckle structure has can play the role of slot.Meanwhile inserting on third side wall 14
There are the slots on printed circuit board on interface 152 on interface 142, the 4th side wall 15, can also external power supply and letter
Number acquisition input and signal output, guarantee printed circuit board function normal use, reach completely simulation printed circuit board work
The case where state.The present embodiment is not particularly limited the specific effect of interface.
The present embodiment by third side wall with the interface that is arranged on the 4th side wall, can be used to that fixed printing to be installed
Circuit board facilitates installation, and fixed effect is obvious.The normal work that can guarantee printed circuit board simultaneously can be avoided manually
Welding obtains power supply line and acquisition input signal cable and acquisition output signal line on a printed circuit board, not to emulation data
The phenomenon that causing error increases the reliability of data.
On the basis of the above embodiments, the present embodiment also assists imitating by increasing temperature measurement component and power-supply controller of electric
Very.
Firstly, temperature measurement component is described in detail.As shown in Fig. 2, temperature measurement component can be thermometric paster 211 and infrared
Temperature measurer 212, or other temperature measurement components, as long as can be surveyed at thermometer hole 21 to the heating device of printed circuit board
Temperature.The heat dissipation for circuit board emulation component of the offer of the embodiment of the present invention is used to measure the temperature of the heating device of printed circuit board
Degree, the temperature measurement component are thermometric paster 211 and/or infrared radiation thermometer 212.
The method of specific measurement temperature are as follows: temperature paster 211 is placed directly against the fever on thermometer hole 21 to printed circuit board
Device carries out thermometric, the temperature of the infrared imaging test printed circuit board heating device at thermometer hole 21 of infrared radiation thermometer 212.?
During specific implementation, can whole thermometer holes use thermometric paster, can also whole thermometer holes use infrared radiation thermometer,
Can also part thermometer hole use thermometric paster, another part use infrared radiation thermometer.
The present embodiment carries out thermometric, Ke Yizhun to the heating device on printed circuit board at thermometer hole by temperature measurement component
The temperature for really obtaining the heating device on printed circuit board increases the accuracy of data.
Secondly, power-supply controller of electric is described in detail.As shown in Fig. 2, power-supply controller of electric is connect with fan 41, for controlling
The revolving speed of fan 41 processed.
Specifically, in the output electric signal for carrying out adjusting power-supply controller of electric in heat dissipation simulation process to printed circuit board
Fan 41 is controlled, fan 41 is made to reach different revolving speeds.
The heat dissipation for circuit board emulation component of the offer of the embodiment of the present invention, power-supply controller of electric export the rectangle of different duty
The electric signal of form controls the revolving speed of fan 41.
Specific implementation process are as follows: when printed circuit board works on power after five minutes, power-supply controller of electric is opened, output rectangle electricity
Signal, control fan 41 are started to work, and provide air quantity for printed circuit board heat dissipation, while being measured at thermometer hole with temperature measurement component
The temperature of the heating device of printed circuit board on the front and back.
If the temperature of each device heat generating member on the printed circuit board measured with temperature measurement component is held in respective permission
In operating temperature range, then what fan 41 at this time provided air quantity meets printed circuit board cooling requirements when institute required airflow.
If there is the temperature of the heating device on printed circuit board is more than that it allows operating temperature, then power supply control is adjusted
Device, the rectangular telecommunication number for keeping its output duty cycle big, control increase the wind speed of fan 41, improve air quantity, until with temperature measurement component
The temperature of each heating device on the printed circuit board measured, which is held in, respectively to be allowed in operating temperature range, then at this time
The air quantity that fan 41 provides meets printed circuit board cooling requirements when institute required airflow.Vice versa.
It calculates printed circuit board and meets cooling requirements when institute required airflow method: meeting cooling requirements in corresponding revolving speed,
The air quantity that fan is obtained by the electric signal ratiometric conversion of the duty ratio is V m3/min, then the total blast volume that 2 fans provide is
2V m3/min, so air quantity needed for heat dissipation for circuit board is 2V m3/min.
The present embodiment can quickly adjust the revolving speed of fan by controlling fan using power-supply controller of electric.Pass through tune
The rectangular telecommunication number for saving power-supply controller of electric output different duty, controls the revolving speed of fan, easy to operate, can accurately control printing
Air quantity needed for heat dissipation for circuit board emulation.
To sum up, heat dissipation for circuit board emulation component provided in an embodiment of the present invention, comprising: frame, front panel and rear panel
And pedestal.One end of frame is connect with pedestal, and air outlet is provided on the other end, be can be used for placing radiate and be imitated
Genuine printed circuit board.Pedestal is provided with fan, when that meets cooling requirements institute's required airflow can be provided for printed circuit board, simultaneously
Guarantee that the radiating mode of printed circuit board is identical as actual operating condition, i.e., the flow direction of air is from bottom to top, to take away heat.The group
Part uses matter emulation, can show the actual working condition of printed circuit board, and emulation data are authentic and valid, will not influence
The reliability of data.The component guarantees certain versatility simultaneously, if for different printed circuit board replacement front panels and
Heat dissipation emulation can be realized in rear panel.
In the description of the present invention, it is to be understood that, term " on ", "lower", "front", "rear", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "top", "bottom", "inner", "outside" is orientation based on the figure or position
Relationship is set, is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning are necessary
It with specific orientation, is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.
In addition, in the present invention unless specifically defined or limited otherwise, term " connection ", " connected ", " fixation ", " peace
Dress " etc. shall be understood in a broad sense, such as can be mechanical connection, be also possible to be electrically connected；It can be and be directly connected to, can also pass through
Intermediary is indirectly connected, and can be the connection inside two elements or the interaction relationship of two elements, unless otherwise bright
True restriction, for the ordinary skill in the art, can understand as the case may be above-mentioned term in the present invention
Concrete meaning.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of heat dissipation for circuit board emulation component characterized by comprising frame, front panel, rear panel and pedestal, wherein
One end of the frame is connect with the pedestal, and air outlet is provided on the other end；
It is provided with the first opening on the first side wall of the frame, the second opening, institute are provided in the second sidewall of the frame
It states the first side wall to be oppositely arranged with the second sidewall, to form the accommodation space for accommodating printed circuit board；
The front panel is detachably connected with the first side wall, and the front panel can be covered and is located in first opening, institute
It states and is provided with thermometer hole corresponding with the heating device on the front of the printed circuit board on front panel；
The rear panel is detachably connected with the second sidewall, and the rear panel can cover and be located at second opening, described
Thermometer hole corresponding with the heating device on the back side of the printed circuit board is provided on rear panel；
Fan is provided in the pedestal, the wind that the fan is used to generate is blown out from the air outlet.
2. component according to claim 1, which is characterized in that set respectively on the third side wall of the frame and the 4th side wall
It is equipped with interface, the third side wall is oppositely arranged with the 4th side wall, and the two of the third side wall, the 4th side wall
End is connect with the first side wall with the second sidewall respectively.
3. component according to claim 2, which is characterized in that further include: open type buckle structure, the open type buckle
Structure is protruded into from the interface with the fixation printed circuit board.
4. component according to claim 1, which is characterized in that the front panel is bolted with the first side wall, institute
Rear panel is stated to be bolted with the second sidewall.
5. component according to claim 1, which is characterized in that the quantity for the fan being arranged in the pedestal is two.
6. component according to claim 1, which is characterized in that the longitudinal section of the pedestal is trapezoidal, the thickness of the frame
The equal length of degree and the trapezoidal short side.
7. component according to any one of claims 1 to 6, which is characterized in that further include: for measuring at the thermometer hole
Temperature temperature measurement component.
8. component according to claim 7, which is characterized in that the temperature measurement component is infrared radiation thermometer or thermometric paster.
9. component according to claim 1, which is characterized in that the size of the thermometer hole between 1.5 millimeters to 3 millimeters it
Between.
10. component according to claim 1, which is characterized in that further include: power-supply controller of electric, the power-supply controller of electric with
The fan connection, for controlling the revolving speed of the fan.
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| CN201810603693.1A CN109188237B (en) | 2018-06-12 | 2018-06-12 | Circuit board heat dissipation simulation assembly |
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| CN201810603693.1A CN109188237B (en) | 2018-06-12 | 2018-06-12 | Circuit board heat dissipation simulation assembly |
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| CN109188237B CN109188237B (en) | 2021-07-27 |
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| CN109188237B (en) | 2021-07-27 |
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