CN108707447A - Highly conductive solder paste is bonded by force - Google Patents

Highly conductive solder paste is bonded by force Download PDF

Info

Publication number
CN108707447A
CN108707447A CN201810605386.7A CN201810605386A CN108707447A CN 108707447 A CN108707447 A CN 108707447A CN 201810605386 A CN201810605386 A CN 201810605386A CN 108707447 A CN108707447 A CN 108707447A
Authority
CN
China
Prior art keywords
solder paste
force
highly conductive
bisphenol
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810605386.7A
Other languages
Chinese (zh)
Inventor
杨建锋
小菅正
朱昀
彭杰
邵亚逢
叶坤龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kunshan Jian Huang Photoelectric Technology Co Ltd
Original Assignee
Kunshan Jian Huang Photoelectric Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kunshan Jian Huang Photoelectric Technology Co Ltd filed Critical Kunshan Jian Huang Photoelectric Technology Co Ltd
Priority to CN201810605386.7A priority Critical patent/CN108707447A/en
Publication of CN108707447A publication Critical patent/CN108707447A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0837—Bismuth
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

The invention belongs to be conductively connected technical field, be related to it is a kind of bonding highly conductive solder paste by force, formula includes 5~15% tin, 10~20% bismuths, 5~15% naphthalene nucleus oxygen, 10~20% acrylic resin modified, 1~3% phenolic resin, 0.5~1.5% fumed silica, 0.5~1.5% adipic acid, 0.1~0.5% silane coupling agent, 5~15% curing agent and the epoxy resin of surplus in mass ratio.Not only caking property is more preferable compared to existing similar product for solder paste of the present invention, but also has excellent electric conductivity, can avoid cracking and bringing short circuit problem under the conditions of high temperature and humidity, be highly suitable for the limited electronic product in space.

Description

Highly conductive solder paste is bonded by force
Technical field
It is the present invention relates to technical field is conductively connected, more particularly to a kind of to bond highly conductive solder paste by force.
Background technology
It connect with FPC in some electronic products PCB, in order to improve junction turn-on effect and intensity, generally can all make It is connected with connector, it is also necessary to have simple operation.However traditional method can all use connector, connector volume larger And production cost is higher, is easy to loosen, especially turn-on effect is poor, be easy to cause open circuit.
With the universal use of the rapid development welding technique of electronic technology, more and more electronic products are in order to save now About assembling space, in order to preferably fix and protect high frequency turn-on effect, the tin cream that generally can all use conduction relatively good And the stronger glue of viscosity is combined into solder paste, that is, solder grain is dispersed in glue, one kind is made respectively to different The conductive slurry of property.But solder paste adhesion strength at present on the market is not high enough, easily short circuit under resistance height and extreme condition.
Invention content
Highly conductive solder paste is bonded by force the main purpose of the present invention is to provide a kind of, for realizing the electrode of connectorless Connection, had both reached the adhesion strength of needs, and had also reached excellent electric conductivity.
The present invention is achieved through the following technical solutions above-mentioned purpose：
It is a kind of by force bond highly conductive solder paste, formula in mass ratio include 5~15% tin, 10~20% bismuths, 5~ 15% naphthalene nucleus oxygen, 10~20% acrylic resin modified, 1~3% phenolic resin, 0.5~1.5% fumed silica, 0.5~1.5% adipic acid, 0.1~0.5% silane coupling agent, 5~15% curing agent and the epoxy resin of surplus.
Specifically, the epoxy resin includes bisphenol-f type liquid epoxies and bisphenol-A liquid epoxy resin.
Further, the mass ratio of the bisphenol-f type liquid epoxies and bisphenol-A liquid epoxy resin is 1~5: 1。
Using above-mentioned technical proposal, the advantageous effect of technical solution of the present invention is：
Not only caking property is more preferable compared to existing similar product for solder paste of the present invention, but also has excellent electric conductivity, It can avoid cracking and bringing short circuit problem under the conditions of high temperature and humidity, be highly suitable for the limited electronic product in space.
Specific implementation mode
With reference to specific embodiment, invention is further described in detail.
Examples 1 to 6：
It is formulated the solder paste that mixing modulates Examples 1 to 6 according to table 1：
Table 1
Then between two electrodes by the fitting of gained solder paste, tested after compression is solid.
Test condition is：
1. peel strength test：180 ° of peel tests are carried out with the speed of 25.4mm/min, record peeling force peak value；
2. electric conductivity is tested：It is carried out being conductively connected measurement resistance with the electrode of 1cm × 1cm；
3. THB is tested：It is placed 24 hours under 85 DEG C, 85% humidity environment, detects appearance and electric conductivity.
With existing solder paste, example is compared as a contrast, as shown in table 2：
Table 2
As shown in Table 2, solder paste of the present invention possesses the caking property for being substantially better than reference examples and lower resistance, illustrates to use There is excellent electric conductivity in solder paste, the short circuit cracked and brought can also be avoided to ask under the extreme condition of high temperature and humidity Topic, is highly suitable for the limited electronic product in space.
Above-described is only some embodiments of the present invention.For those of ordinary skill in the art, not Under the premise of being detached from the invention design, various modifications and improvements can be made, these belong to the protection model of the present invention It encloses.

Claims (3)

1. a kind of bonding by force highly conductive solder paste, it is characterised in that：Formula is in mass ratio including 5~15% tin, 10~20% Bismuth, 5~15% naphthalene nucleus oxygen, 10~20% acrylic resin modified, 1~3% phenolic resin, 0.5~1.5% fumed oxygen SiClx, 0.5~1.5% adipic acid, 0.1~0.5% silane coupling agent, 5~15% curing agent and the epoxy of surplus Resin.
2. solder paste according to claim 1, it is characterised in that：The epoxy resin includes bisphenol-f type liquid epoxy tree Fat and bisphenol-A liquid epoxy resin.
3. solder paste according to claim 2, it is characterised in that：The bisphenol-f type liquid epoxies and bisphenol A-type liquid The mass ratio of body epoxy resin is 1~5:1.
CN201810605386.7A 2018-06-13 2018-06-13 Highly conductive solder paste is bonded by force Pending CN108707447A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810605386.7A CN108707447A (en) 2018-06-13 2018-06-13 Highly conductive solder paste is bonded by force

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810605386.7A CN108707447A (en) 2018-06-13 2018-06-13 Highly conductive solder paste is bonded by force

Publications (1)

Publication Number Publication Date
CN108707447A true CN108707447A (en) 2018-10-26

Family

ID=63872610

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810605386.7A Pending CN108707447A (en) 2018-06-13 2018-06-13 Highly conductive solder paste is bonded by force

Country Status (1)

Country Link
CN (1) CN108707447A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1831073A (en) * 2005-03-07 2006-09-13 国家淀粉及化学投资控股公司 Low stress conductive adhesive
CN101426875A (en) * 2006-04-27 2009-05-06 住友电木株式会社 Adhesive tape, semiconductor package, and electronic device
CN103372730A (en) * 2012-04-20 2013-10-30 日东电工株式会社 Joining sheet, electronic component, and producing method thereof
CN104718234A (en) * 2013-01-17 2015-06-17 积水化学工业株式会社 Curable composition for electronic component and connection structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1831073A (en) * 2005-03-07 2006-09-13 国家淀粉及化学投资控股公司 Low stress conductive adhesive
CN101426875A (en) * 2006-04-27 2009-05-06 住友电木株式会社 Adhesive tape, semiconductor package, and electronic device
CN103372730A (en) * 2012-04-20 2013-10-30 日东电工株式会社 Joining sheet, electronic component, and producing method thereof
CN104718234A (en) * 2013-01-17 2015-06-17 积水化学工业株式会社 Curable composition for electronic component and connection structure

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
李永河等: "《橡胶硫化技术》", 31 May 2012, 黄河水利出版社 *
王久芬等: "《高聚物合成工艺》", 31 January 2013, 国防工业出版社 *

Similar Documents

Publication Publication Date Title
CN102408858A (en) Stable type conductive adhesive and preparation method thereof
CN102876270B (en) Epoxy resin conducting adhesive with high bonding strength
CN102559118B (en) High-temperature-resistant conductive adhesive and preparation method thereof
CN107236485B (en) A kind of dendritic heat curing type pastes conducting resinl and preparation method thereof
CN113265210A (en) Adhesive with high electric and heat conductivity and preparation method thereof
CN101613585A (en) A kind of epoxy copper adhesive and its production and application
CN107219949A (en) A kind of binding technique of touch-screen
CN103170757A (en) Solder paste and preparation method thereof
CN108707447A (en) Highly conductive solder paste is bonded by force
JPH0652715A (en) Anisotropic conductive adhesive composite
CN102807838A (en) Double-component electric conduction adhesive and preparation method thereof
CN104266149A (en) LED lamp bulb and lamp holder connecting process
CN104371616A (en) Preparation method of phenolic resin conductive adhesive
CN106281102A (en) Conducting resinl
CN109181558A (en) Adhesive process is welded in precuring
JP2001164232A (en) Thermosetting adhesive material
CN209822681U (en) Flip SMD LED packaging structure
WO2008001283A3 (en) Flip-chip interconnection with formed couplings
CN210745653U (en) Metal substrate grounding structure of circuit board module
CN107369872B (en) Processing method of improved ceramic coupler
CN201657499U (en) Pad through hole structure of printed circuit board
CN105001708A (en) Transparent electric-conduction ink
JP2009132798A (en) Adhesive for connecting electrode and method for producing the same
CN204145887U (en) The assembly structure of a kind of PBGA packaging and ltcc substrate
CN203013975U (en) Novel flexible flat cable

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20181026