CN109175720A - A kind of machine cuts laser high-precision labelling apparatus - Google Patents
A kind of machine cuts laser high-precision labelling apparatus Download PDFInfo
- Publication number
- CN109175720A CN109175720A CN201811331892.8A CN201811331892A CN109175720A CN 109175720 A CN109175720 A CN 109175720A CN 201811331892 A CN201811331892 A CN 201811331892A CN 109175720 A CN109175720 A CN 109175720A
- Authority
- CN
- China
- Prior art keywords
- laser
- polarizer
- focus lamp
- reflective
- reflective mirror
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of machine cuts laser high-precision labelling apparatus, including laser oscillator, polarizer and focus lamp, polarizer is arranged in laser oscillator side, polarizer side is equipped with reflective mirror, focus lamp is installed below reflective mirror, Cutting platform is installed below focus lamp, workpiece to be cut is placed on Cutting platform, it is reflective that the multiple laser that laser oscillator issues is transmitted to reflective mirror progress after polarizer polarisation, laser beam after reflective enters focus lamp and is focused to a laser beam and is irradiated on workpiece be marked, structure of the invention principle is simple, it can be realized the high-precision scale designation to product, and laser labelling is high-efficient, it can be improved working efficiency.
Description
Technical field
The present invention relates to technical field of laser mark, specially a kind of machine cuts laser high-precision labelling apparatus.
Background technique
Laser is a kind of and the completely different coherent source of ordinary light source.It is just standby since early 1960s occur
It is concerned, due to having the characteristics that high directivity, high monochromaticity and high-energy.It is straight that laser in press is mainly used in computer
Connect forme-producing system, laser photocomposing machine, laser printer, hologram image printing, electronic publishing, laser labelling printing etc..Its
In, 45.3% and the application field that laser labelling printing has accounted for laser processing industry are still developing and are expanding.
Laser marking technology is to realize picture and text printing the basic principle is that being given birth to by laser generator by laser marking machine
At the continuous laser light beam of high-energy.When laser action is when printable fabric, the atomic transition in ground state to higher-energy shape
State；Atom in higher-energy state is that unstable meeting very quick returns to ground state, when atom returns to ground state, can with photon or
The form of quantum releases additional energy, and is converted to thermal energy by luminous energy, melts surfacing moment, or even gasification, from
And form graphic context label.
Existing laser marking device is directly marked on object after issuing laser generally by laser emitter,
It is easy that object is caused to damage, therefore, it is necessary to improve.
Summary of the invention
The purpose of the present invention is to provide a kind of machine cuts laser high-precision labelling apparatus, to solve above-mentioned background skill
The problem of being proposed in art.
To achieve the above object, the invention provides the following technical scheme: a kind of machine cuts mark dress with laser high-precision
It sets, including laser oscillator, polarizer and focus lamp, the polarizer is arranged in laser oscillator side, the polarizer one
Side is equipped with reflective mirror, and focus lamp is installed below the reflective mirror, installs Cutting platform, the Cutting platform below the focus lamp
On be placed with workpiece to be cut, the multiple laser that the laser oscillator issues be transmitted to after polarizer polarisation reflective mirror into
Row is reflective, it is reflective after laser beam enter focus lamp and be focused to a laser beam and be irradiated on workpiece be marked.
Preferably, the polarizer is sequentially overlapped and is formed by upper plate, middle plate and lower plate, and the upper plate and lower plate have PC material
Material is made, and the middle plate uses light polarizing film.
Preferably, the focus lamp includes metal shell, and the metal shell is internally provided with vacuum metal film plating, described
It is disposed with hyperbolicity face, focusing lens and optical glass sheet, the metal shell from left to right on the right side of vacuum metal film plating
Using cylindrical structure.
Preferably, the reflective mirror slant setting, the reflective mirror tilt angle are 45 °.
Compared with prior art, the beneficial effects of the present invention are:
(1) structure of the invention principle is simple, can be realized the high-precision scale designation to product, and laser labelling is high-efficient, can
Improve working efficiency.
(2) polarizer that the present invention uses can filter light laser, reduce the power of laser, can be improved subsequent mark
Remember effect.
(3) focus lamp that the present invention uses can reduce spherical aberration of the laser beam in specific incidence angle, effectively improve focusing
Efficiency.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention；
Fig. 2 is polarized light plate structure schematic diagram of the present invention；
Fig. 3 is focus lamp structural schematic diagram of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Fig. 1-3 is please referred to, the present invention provides a kind of technical solution: a kind of machine cuts laser high-precision labelling apparatus,
Including laser oscillator 1, polarizer 2 and focus lamp 3, the polarizer 2 is arranged in 1 side of laser oscillator, the polarizer 2
Side is equipped with reflective mirror 4,4 slant setting of reflective mirror, and 4 tilt angle of reflective mirror is 45 °；It is installed below the reflective mirror 4
Focus lamp 3 installs Cutting platform 5 below the focus lamp 3, is placed with workpiece 6 to be cut on the Cutting platform 5.
In the present invention, polarizer 2 is sequentially overlapped and is formed by upper plate 7, middle plate 8 and lower plate 9, and the upper plate 7 and lower plate 9 have
PC material is made, and the middle plate 8 uses light polarizing film.The polarizer that the present invention uses can filter light laser, reduce laser
Power can be improved subsequent label effect.
In the present invention, focus lamp 3 includes metal shell 10, and the metal shell 10 is internally provided with vacuum metal film plating
11,11 right side of vacuum metal film plating is disposed with hyperbolicity face 12, focusing lens 13 and optical glass sheet from left to right
14, the metal shell 10 uses cylindrical structure.The focus lamp that the present invention uses can reduce laser beam in specific incidence angle
When spherical aberration, effectively improve focusing efficiency.
Laser oscillator 1 issue multiple laser be transmitted to after 2 polarisation of polarizer reflective mirror 4 carry out it is reflective, it is reflective
Laser beam afterwards enters focus lamp 3 and is focused to a laser beam and is irradiated on workpiece be marked.
In conclusion structure of the invention principle is simple, the high-precision scale designation to product can be realized, and laser labelling is imitated
Rate is high, can be improved working efficiency.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (4)
1. a kind of machine cuts laser high-precision labelling apparatus, including laser oscillator (1), polarizer (2) and focus lamp
(3), it is characterised in that: in laser oscillator (1) side, polarizer (2) side is equipped with reflective for polarizer (2) setting
Mirror (4), reflective mirror (4) lower section installs focus lamp (3), installs Cutting platform (5) below the focus lamp (3), described to cut
It cuts and is placed with workpiece to be cut (6) on platform (5), the multiple laser that the laser oscillator (1) issues is inclined by polarizer (2)
Be transmitted to after light reflective mirror (4) carry out it is reflective, it is reflective after laser beam enter focus lamp (3) and be focused to a laser beam and be irradiated to
It is marked on workpiece.
2. a kind of machine cuts laser high-precision labelling apparatus according to claim 1, it is characterised in that: the polarisation
Plate (2) is sequentially overlapped and is formed by upper plate (7), middle plate (8) and lower plate (9), and the upper plate (7) and lower plate (9) have PC material system
At the middle plate (8) uses light polarizing film.
3. a kind of machine cuts laser high-precision labelling apparatus according to claim 1, it is characterised in that: the focusing
Mirror (3) includes metal shell (10), and the metal shell (10) is internally provided with vacuum metal film plating (11), the vacuum metal
It is disposed with hyperbolicity face (12), focusing lens (13) and optical glass sheet (14) from left to right on the right side of plated film (11), it is described
Metal shell (10) uses cylindrical structure.
4. a kind of machine cuts laser high-precision labelling apparatus according to claim 1, it is characterised in that: described reflective
Mirror (4) slant setting, reflective mirror (4) tilt angle are 45 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811331892.8A CN109175720A (en) | 2018-11-09 | 2018-11-09 | A kind of machine cuts laser high-precision labelling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811331892.8A CN109175720A (en) | 2018-11-09 | 2018-11-09 | A kind of machine cuts laser high-precision labelling apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109175720A true CN109175720A (en) | 2019-01-11 |
Family
ID=64938851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811331892.8A Pending CN109175720A (en) | 2018-11-09 | 2018-11-09 | A kind of machine cuts laser high-precision labelling apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109175720A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020166845A1 (en) * | 2001-03-29 | 2002-11-14 | Cordingley James J. | Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure |
| CN103212786A (en) * | 2012-01-20 | 2013-07-24 | 灿美工程股份有限公司 | Laser processing apparatus and laser processing method |
| CN203197464U (en) * | 2013-04-24 | 2013-09-18 | 伊欧激光科技（苏州）有限公司 | Multiple-laser processing device using polarization characteristics |
| CN203198410U (en) * | 2013-02-25 | 2013-09-18 | 伊欧激光科技（苏州）有限公司 | Laser mark device |
| CN206057671U (en) * | 2016-08-31 | 2017-03-29 | 武汉优光科技有限责任公司 | A kind of hyperbolicity reflects focus lamp |
| CN107931866A (en) * | 2017-11-10 | 2018-04-20 | 吉林大学 | The device and method of pattern processing is carried out in ceramic ball surface using femtosecond laser |
-
2018
- 2018-11-09 CN CN201811331892.8A patent/CN109175720A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020166845A1 (en) * | 2001-03-29 | 2002-11-14 | Cordingley James J. | Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure |
| CN103212786A (en) * | 2012-01-20 | 2013-07-24 | 灿美工程股份有限公司 | Laser processing apparatus and laser processing method |
| CN203198410U (en) * | 2013-02-25 | 2013-09-18 | 伊欧激光科技（苏州）有限公司 | Laser mark device |
| CN203197464U (en) * | 2013-04-24 | 2013-09-18 | 伊欧激光科技（苏州）有限公司 | Multiple-laser processing device using polarization characteristics |
| CN206057671U (en) * | 2016-08-31 | 2017-03-29 | 武汉优光科技有限责任公司 | A kind of hyperbolicity reflects focus lamp |
| CN107931866A (en) * | 2017-11-10 | 2018-04-20 | 吉林大学 | The device and method of pattern processing is carried out in ceramic ball surface using femtosecond laser |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190111 |
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| WD01 | Invention patent application deemed withdrawn after publication |