CN109149302A - 线缆适配器 - Google Patents

线缆适配器 Download PDF

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CN109149302A
CN109149302A CN201810673428.0A CN201810673428A CN109149302A CN 109149302 A CN109149302 A CN 109149302A CN 201810673428 A CN201810673428 A CN 201810673428A CN 109149302 A CN109149302 A CN 109149302A
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sfp
mechanical framework
connector
socket
standard
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CN109149302B (zh
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雅尼夫·卡扎夫
安德雷·盖尔
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Mellanox Technologies Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/94Holders formed as intermediate parts for linking a counter-part to a coupling part
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • G02B6/4284Electrical aspects of optical modules with disconnectable electrical connectors
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4246Bidirectionally operating package structures
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4256Details of housings
    • G02B6/426Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • G02B6/4261Packages with mounting structures to be pluggable or detachable, e.g. having latches or rails
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4266Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268Cooling
    • G02B6/4269Cooling with heat sinks or radiation fins
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4274Electrical aspects
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/88Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof adapted for simultaneous co-operation with two or more identical counterparts
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4256Details of housings
    • G02B6/426Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/721Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00Connectors or connections adapted for particular applications
    • H01R2201/06Connectors or connections adapted for particular applications for computer periphery
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00Coupling parts supported only by co-operation with counterpart
    • H01R31/06Intermediate parts for linking two coupling parts, e.g. adapter

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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
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  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

一种通信设备,包括机械框架,所述机械框架被配置用于***到符合第一SFP标准的多通道小型可插拔插座中,以及在所述框架内接收符合第二SFP标准的SFP连接器,所述第二SFP标准不同于所述第一SFP标准。由所述机械框架保持的第一电气端子被配置用于与所述SFP插座的相应的第一引脚配合,并且在所述机械框架内电耦合到所述第一电气端子的第二电气端子被配置用于与所述SFP连接器的相应的第二引脚配合。散热器安装在所述机械框架中,并且被配置用于当所述SFP连接器***到所述机械框架中时与所述SFP连接器形成正接触。

Description

线缆适配器
技术领域
本发明总体上涉及数据通信,并且具体涉及用于在不同类型的连接器之间桥接的适配器。
背景技术
小型可插拔(small form-factor pluggable,SFP)模块在各种电信和数据网络应用中用于在网络设备中的印刷电路板与网络线缆(其可能是电缆或光缆)之间接合。通常,SFP插座安装在印刷电路板上且具有与板上的电路迹线的适当电连接,并且线缆末端的连接器***到插座中。连接器本身通常包含信号转换电路,并且因此被称为“收发器”。
各种SFP模块的机械特性和电气特性已由行业组织所定义。例如,四通道小型可插拔(quad small form-factor pluggable,QSFP)模块支持处于10Gb/s下的4个并行通信信道。在SFF-8436Specification for QSFP+Copper and Optical Module(修订版3.4,2009年11月)中描述了QSFP模块的机械特性和电气特性。
其他类型的SFP模块可具有如相应的标准所定义的不同机械特性和电气特性。例如,八通道小型可插拔(octal small form factor pluggable,OSFP)模块是一种具有8个高速电气线路的新型小型可插拔模块,其最初将会支持400Gbps(8x50G)。OSFP的电气规范和机械规范最近由OSF多源协议(Multi Source Agreement,MSA)小组发布,并且可从osfpmsa.org在线获得。根据该规范,OSFP连接器比QSFP模块稍微更宽和更深,并且具有据称会改善热性能的集成式散热器。OSFP MSA网站建议,有可能构建在OSFP箱笼中支持现有100G QSFP光学模块的适配器。
用于将给定类型的SFP插头连接到不同类型的SFP插座的适配器在本领域中是已知的。例如,公开内容通过引用并入于此的美国专利7,934,959描述了一种适配器,其包括机械框架,所述机械框架被配置用于***到四通道小型可插拔(SFP)插座中,以及在该框架内接收单通道SFP线缆连接器。由机械框架保持的第一电气端子被配置用于与插座的相应的第一引脚配合。在机械框架内保持的第二电气端子被配置用于与连接器的相应的第二引脚配合。电路将第一电气端子和第二电气端子相连接,以便实现连接器与插座的一个通道之间的通信,同时终止插座的其余通道。
发明内容
本发明的实施方式提供了实现将一种类型的多通道连接器***到不同类型的多通道连接器中的适配器和方法。
因此,根据本发明的实施方式,提供了一种通信设备,其包括机械框架,所述机械框架被配置用于***到符合第一SFP标准的多通道小型可插拔(small form-factorpluggable,SFP)插座中,以及在所述框架内接收符合第二SFP标准的SFP连接器,所述第二SFP标准不同于所述第一SFP标准。第一电气端子由所述机械框架保持,并且被配置用于与所述SFP插座的相应的第一引脚配合。第二电气端子在所述机械框架内电耦合到所述第一电气端子,并且被配置用于与所述SFP连接器的相应的第二引脚配合。散热器安装在所述机械框架中,并且被配置用于当所述SFP连接器***到所述机械框架中时与所述SFP连接器形成正接触。
在一些实施方式中,所述设备包括弹簧加载夹具,所述弹簧加载夹具将所述散热器连接到所述机械框架,同时对所述散热器施加力以便按压所述散热器使其与所述SFP连接器正接触。在公开的实施方式中,所述机械框架包含敞开的窗口,并且所述散热器安装在所述窗口的上方并且由所述弹簧加载夹具按压穿过所述窗口,以便与所述SFP连接器形成正接触。
附加地或备选地,所述机械框架包括邻近所述散热器的唇缘,其中所述唇缘是倾斜的,以便引导所述SFP插座与所述散热器之间的空气流动。
在公开的实施方式中,所述第一电气端子和所述第二电气端子通过相应的边缘连接器的接合而与相应的第一引脚和第二引脚配合。
附加地或备选地,所述机械框架具有被配置用于***到所述SFP插座中的第一端和被配置用于从中接收所述SFP连接器的第二端,并且所述机械框架包括弹性导电元件,所述弹性导电元件从所述机械框架的所述第二端向外突出并且被配置用于当所述设备完全***到所述SFP插座中时接触所述SFP插座的导电内表面。
在一个实施方式中,所述第一SFP标准是八通道SFP(octal SFP,OSFP)标准,而所述第二SFP标准是四通道小型可插拔(quad small form-factor pluggable,QSFP)标准。
根据本发明的实施方式,还提供了一种用于通信的方法,其包括将适配器***到符合第一SFP标准的多通道小型可插拔(SFP)插座中。所述适配器包括机械框架,所述机械框架被配置用于***到所述插座中,以及在所述框架内接收符合第二SFP标准的SFP连接器,所述第二SFP标准不同于所述第一SFP标准。第一电气端子由所述机械框架保持,并且被配置用于与所述SFP插座的相应的第一引脚配合。第二电气端子在所述机械框架内电耦合到所述第一电气端子,并且被配置用于与所述SFP连接器的相应的第二引脚配合。散热器安装在所述机械框架中,并且被配置用于当所述SFP连接器***到所述机械框架中时与所述SFP连接器形成正接触。将所述SFP连接器***到所述适配器中。
从下面连同附图对本发明实施方式的详细描述中,将会更全面地理解本发明,在附图中:
附图说明
图1是根据本发明实施方式,示出线缆连接器向***到插座中的线缆连接适配器的***的示意性图示;
图2是根据本发明实施方式的线缆连接适配器的分解图;
图3是根据本发明实施方式的线缆连接适配器的示意性截面图;以及
图4和图5是根据本发明实施方式的线缆连接适配器的示意性细节视图。
具体实施方式
虽然OSFP MSA网站上建议有可能构建在OSFP箱笼中支持现有QSFP光学模块的适配器,但在OSFP标准与QSFP标准之间存在多种不兼容性,因而在这样的适配器的实际实现中造成困难。例如,OSFP标准要求连接器具有集成式散热器,而这在常见QSFP设计中并不存在。
本文描述的本发明实施方式提供了一种适配器,其克服了标准间兼容性问题,尤其包括散热问题,以及满足所讨论的标准的机械、电气和射频(RF)屏蔽要求。下文描述的实施方式特别涉及解决在适配OSFP插座以接收QSFP线缆连接器时出现的问题,但本发明的原理在施以必要变更的情况下亦可类似地适用于生产用于随其他SFP标准一起使用的适配器。
在本实施方式中,用于作为标准间适配器使用的通信设备包括机械框架,该机械框架被配置用于***到符合一种SFP标准的SFP插座中,以及在框架内接收符合另一不同SFP标准的SFP线缆连接器(在下文中以及在权利要求中简称为“SFP连接器”)。该框架保持一组电气端子,该一组电气端子与SFP插座的相应引脚配合,并且在机械框架内电耦合到与SFP连接器的引脚配合的另一组电气端子。
散热器安装在机械框架中,以便在SFP连接器***到机械框架中时与该SFP连接器形成正接触,从而确保从整个设备的有效散热。术语“正接触”在本说明书和权利要求书中被用来意指散热器的表面对连接器的相邻表面在与所述表面垂直的方向上施加力。因此,所述表面彼此机械接触和热接触,而没有原本会妨碍从连接器到散热器的热传导的介于中间的空气层。例如,在一个实施方式中,该正接触借助于将散热器连接到机械框架的弹簧加载夹具来实现。夹具对散热器施加力,该力按压散热器穿过框架中的窗口,并从而在散热器与连接器之间产生期望的正接触。
图1是根据本发明实施方式,示出线缆连接器26向***到插座22中的线缆连接适配器20的***的示意性图示。在图示的示例中,插座22是符合OSFP标准的类型,而连接器26符合QSFP标准。插座22包括箱笼30,该箱笼30安装在通信设备的面板24后方的印刷电路板32上。
根据QSFP规范,连接器26通常包含合适的电或光纤收发器(未示出),并且连接到线缆28的末端,线缆28相应地包含电或光纤信号线。线缆28和连接器26可以如原始QSFP标准提供的那样包含4个信号线路,或者根据新QSFP-DD标准包含8个信号线路,该新QSFP-DD标准具有与QSFP相同的机械形状因子,但具有提供八线路电气接口的额外一排接触件。连接器26终止于一组引脚46,所述一组引脚46包括位于电路板的末端处的导电焊盘,该电路板的末端被***到适配器中的边缘连接器中(如下图所示)。
适配器20包括机械框架,该机械框架由上壳体34、下壳体36和箱笼40构成。框架被制成为要***到OSFP插座22中,如同适配器20是OSFP连接器那样,并且通过框架的另一端接收QSFP连接器26,如同箱笼40是QSFP插座那样。由机械框架保持的适配器20的电气端子38与插座22的箱笼30内的相应引脚(未示出)配合。具体而言,在本示例中,端子38包括位于适配器20内部的电路板的末端处的导电焊盘,该电路板的末端***到箱笼30中的边缘连接器中。整体闩锁42实现通过拉动闩锁而容易地从插座移除适配器20。散热器52安装在机械框架中,以便与箱笼40内的连接器26形成正接触。
现参考图2-图5,图中示意性地示出了根据本发明实施方式的适配器20的构造和操作的细节。图2是分解图,图3是截面图,而图4和图5是适配器20的图示细节图。
在这些图中可以看出,弹簧加载夹具54将散热器52连接到箱笼40,同时对散热器施加力。箱笼40包含敞开的窗口48(如图2中所示),散热器52安装在窗口48之上。因此,如图3中所示,夹具54按压散热器52穿过窗口48,以便与连接器26形成正接触。上壳体34包括唇缘56,该唇缘56在适配器20被组装时与散热器52相邻。如图5中所示,唇缘56是倾斜的,以便引导插座22与散热器52之间的空气流动。该设计利用通信设备中处于面板24后方的冷却***(未示出),该冷却***通过插座22吹出空气或者有可能吸入空气,并且因此冷却适配器20以及***到插座中的其他连接器。
如图3中所示,连接器26的引脚46与箱笼40内的边缘连接器44中的对应端子配合。边缘连接器44安装在电路板60的一端,电路板60安装在适配器20内部并且具有迹线(未示出),所述迹线将边缘连接器44中的端子连接到位于***到插座22中的板60的另一端处的对应的端子38。边缘连接器44和板60被布置用于将来自引脚46的QSFP信号路由到插座22中的对应的OSFP引脚,无论连接器26是具有4个线路的传统QSFP连接器还是具有8个线路的QSFP-DD连接器。板60和端子38被布置成使得在前一种情况下,利用传统QSFP连接器,插座22中的8个线路中仅4个实际上接收信号。
在图2和图4中可以看出,箱笼40包括弹簧或指状物58形式的弹性导电元件,该弹性导电元件从连接器26所***到的机械框架的端部向外突出。当适配器20完全***到插座中时,指状物58接触插座22的导电内表面,并且从而将箱笼40接地并且屏蔽面板24后方的通信设备内部和外部的电路免受由于连接器26中的电信号导致的可能的电磁干扰(electromagnetic interference,EMI)。
闩锁42通过弹簧50连接到下壳体36。在适配器20***到插座22中之后,弹簧50将闩锁42保持到位并且从而固定适配器与插座之间的连接。拉回闩锁42暂时地拉伸弹簧50并从插座22释放适配器20。因此,在使用期间,适配器20被牢固地保持在插座22中,并且连接器26被牢固地保持在适配器20中;但是当需要时,可以快速而容易地释放和拔出适配器20或连接器26,而没有损坏适配器或线缆28的风险。尽管附图示出了特定种类的闩锁,但该实施方式的原理同样适用于本领域已知的其他闩锁机构,诸如在标准QSFP连接器中使用的机构的类型。
应当理解,上文描述的实施方式是通过示例的方式引用的,并且本发明不限于上文具体示出和描述的内容。相反,本发明的范围包括上文描述的各种特征的组合和子组合,以及本领域技术人员在阅读前述描述时将会想到并且在现有技术中未公开的其变型和修改。

Claims (14)

1.一种通信设备,包括:
机械框架,其被配置用于***到符合第一SFP标准的多通道小型可插拔插座中,以及在所述框架内接收符合第二SFP标准的SFP连接器,所述第二SFP标准不同于所述第一SFP标准;
第一电气端子,其由所述机械框架保持,并且被配置用于与所述SFP插座的相应的第一引脚配合;
第二电气端子,其在所述机械框架内电耦合到所述第一电气端子,并且被配置用于与所述SFP连接器的相应的第二引脚配合;以及
散热器,其安装在所述机械框架中,并且被配置用于当所述SFP连接器***到所述机械框架中时与所述SFP连接器形成正接触。
2.根据权利要求1所述的设备,其包括弹簧加载夹具,所述弹簧加载夹具将所述散热器连接到所述机械框架,同时对所述散热器施加力以便按压所述散热器使其与所述SFP连接器正接触。
3.根据权利要求2所述的设备,其中所述机械框架包含敞开的窗口,并且其中所述散热器安装在所述窗口的上方,并且由所述弹簧加载夹具按压穿过所述窗口,以便与所述SFP连接器形成正接触。
4.根据权利要求1所述的设备,其中所述机械框架包括邻近所述散热器的唇缘,其中所述唇缘是倾斜的,以便引导所述SFP插座与所述散热器之间的空气流动。
5.根据权利要求1所述的设备,其中所述第一电气端子和所述第二电气端子通过相应的边缘连接器的接合而与相应的第一引脚和第二引脚配合。
6.根据权利要求1所述的设备,其中所述机械框架具有被配置用于***到所述SFP插座中的第一端和被配置用于从中接收所述SFP连接器的第二端,并且所述机械框架包括弹性导电元件,所述弹性导电元件从所述机械框架的所述第二端向外突出并且被配置用于当所述设备完全***到所述SFP插座中时接触所述SFP插座的导电内表面。
7.根据权利要求1所述的设备,其中所述第一SFP标准是八通道SFP标准,而所述第二SFP标准是四通道小型可插拔标准。
8.一种用于通信的方法,包括:
将适配器***到符合第一SFP标准的多通道小型可插拔插座中,所述适配器包括:
机械框架,其被配置用于***到所述插座中,以及在所述框架内接收符合第二SFP标准的SFP连接器,所述第二SFP标准不同于所述第一SFP标准;
第一电气端子,其由所述机械框架保持,并且被配置用于与所述SFP插座的相应的第一引脚配合;
第二电气端子,其在所述机械框架内电耦合到所述第一电气端子,并且被配置用于与所述SFP连接器的相应的第二引脚配合;以及
散热器,其安装在所述机械框架中,并且被配置用于当所述SFP连接器***到所述机械框架中时与所述SFP连接器形成正接触;以及
将所述SFP连接器***到所述适配器中。
9.根据权利要求8所述的方法,其包括应用弹簧加载夹具来将所述散热器连接到所述机械框架,同时对所述散热器施加力以便按压所述散热器使其与所述SFP连接器正接触。
10.根据权利要求9所述的方法,其中所述机械框架包含敞开的窗口,并且其中所述散热器安装在所述窗口的上方,并且由所述弹簧加载夹具按压穿过所述窗口,以便与所述SFP连接器形成正接触。
11.根据权利要求8所述的方法,其中将所述适配器***到所述SFP插座中包括引导所述SFP插座与所述散热器之间的空气流动,其中所述机械框架包括引导所述散热器之上的空气流动的倾斜的唇缘。
12.根据权利要求8所述的方法,其中所述第一电气端子和所述第二电气端子通过相应的边缘连接器的接合而与相应的第一引脚和第二引脚配合。
13.根据权利要求8所述的方法,其中***所述适配器包括将所述机械框架的第一端***到所述SFP插座中,并且其中***所述SFP连接器包括通过所述机械框架的第二端***所述SFP连接器,其中所述机械框架包括弹性导电元件,所述弹性导电元件从所述机械框架的所述第二端向外突出,并且当所述适配器完全***到所述SFP插座中时接触所述SFP插座的导电内表面。
14.根据权利要求8所述的方法,其中所述第一SFP标准是八通道SFP标准,而所述第二SFP标准是四通道小型可插拔标准。
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